US20140312322A1 - Organic light emitting diode display - Google Patents

Organic light emitting diode display Download PDF

Info

Publication number
US20140312322A1
US20140312322A1 US14/074,919 US201314074919A US2014312322A1 US 20140312322 A1 US20140312322 A1 US 20140312322A1 US 201314074919 A US201314074919 A US 201314074919A US 2014312322 A1 US2014312322 A1 US 2014312322A1
Authority
US
United States
Prior art keywords
sealing
light emitting
organic light
sealing frame
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/074,919
Inventor
Chang-Yong Jeong
Myung-Suk HAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Samsung Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Assigned to SAMSUNG DISPLAY CO., LTD. reassignment SAMSUNG DISPLAY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAN, MYUNG-SUK, JEONG, CHANG-YONG
Publication of US20140312322A1 publication Critical patent/US20140312322A1/en
Priority to US15/098,442 priority Critical patent/US9728743B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/126Shielding, e.g. light-blocking means over the TFTs
    • H01L51/5237
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements

Definitions

  • the present disclosure relates to an organic light emitting diode display. More particularly, the present disclosure relates to an organic light emitting diode display which partially reinforces a width of a sealing material formed in an area except for a display area and a non-display area.
  • a conventional organic light emitting diode display may include two electrodes and an organic emission layer positioned between the two electrodes. An electron injected from one electrode and a hole injected from the other electrode are coupled with each other in the organic emission layer to form an exciton, and the exciton emits energy to display light.
  • the conventional organic light emitting diode display may also include a display substrate with the organic emission layer, and an encapsulation substrate covering and sealing the display substrate.
  • a sealant may be formed between the display substrate and the encapsulation substrate to seal and attach the display substrate and the encapsulation substrate.
  • the present disclosure has been made in an effort to provide an organic light emitting diode display capable of preventing deformation of a cell seal structure.
  • An exemplary embodiment provides an organic light emitting diode display, including a display substrate including an organic light emitting element and a driving circuit part, an encapsulation substrate sealing the display substrate, and a sealing portion between the display substrate and the encapsulation substrate, the sealing portion including a plurality of sealing frame portions around the display substrate, and a first sealing frame portion of the plurality of sealing frame portions being adjacent to a pad portion, wherein at least one of a width of an edge of the sealing portion and a width of the first sealing frame portion is wider than a width of a sealing frame portion other than the first sealing frame portion.
  • the organic light emitting diode display may further include a sealing material at least at one inner edge of the sealing portion, the sealing material having a triangular shape.
  • the sealing material may be reinforced at two or more edges among inner edges of the sealing portion.
  • the sealing material may have a right-triangular shape, the sealing material fitting into an inner right-triangular shape of the inner edge of the sealing portion.
  • the sealing material may be only at edges of the sealing portion among all portions of the sealing portion, the sealing material being in direct contact with the inner edges of the sealing portion.
  • the width of the first sealing frame portion may be wider than the width sealing frame portions other than the first sealing frame portion by about 10% or more.
  • the organic light emitting diode display may further include a protruding portion on and protruding away from at least one of the sealing frame portions, a width of the protruding portion being wider than the sealing frame portions.
  • the protruding portion may have a semicircular shape.
  • the protruding portion may be at an opposite side.
  • the width of the edge of the sealing portion may be measured along a direction that is oblique with respect to a direction of the width of any adjacent sealing frame portion.
  • FIG. 1 illustrates a plan view of a unit cell of an organic light emitting diode display according to a first exemplary embodiment.
  • FIG. 2 illustrates a cross-sectional view taken along line II-II of FIG. 1 .
  • FIG. 3 illustrates a partially enlarged view of a portion A of FIG. 1 .
  • FIG. 4 illustrates a plan view of a unit cell of an organic light emitting diode display according to a second exemplary embodiment.
  • FIG. 5 illustrates a cross-sectional view taken along line V-V of FIG. 4 .
  • FIG. 6 illustrates a plan view of a unit cell of an organic light emitting diode display according to a third exemplary embodiment.
  • FIG. 7 illustrates a plan view of a unit cell of an organic light emitting diode display according to a fourth exemplary embodiment.
  • FIG. 1 illustrates a plan view of a unit cell of an organic light emitting diode display according to a first exemplary embodiment.
  • FIG. 2 is a cross-sectional view along line II-II of FIG. 1 .
  • FIG. 3 is a partially enlarged view of portion A in FIG. 1 .
  • An organic light emitting diode display is designed such that a width of a sealing portion is larger in an area to which increased stress is applied. That is, a sealing portion in a pad area or at an edge may have a larger width than in other regions for structural reinforcement. As a result, it may be possible to prevent releasing or rupturing of a cell seal structure, i.e., of the sealing portion.
  • a unit cell of an organic light emitting diode display may include a display substrate 10 and an encapsulation substrate 20 facing each other, and a sealing portion 15 .
  • the sealing portion 15 may be formed between the display substrate 10 and the encapsulation substrate 20 .
  • the display substrate 10 may include an organic light emitting element and a driving circuit part.
  • the organic light emitting element may include an anode, an organic emission layer, and a cathode
  • the driving circuit part may include at least two thin film transistors T 1 and T 2 , and at least one storage capacitor CAP 1 .
  • the encapsulation substrate 20 may be installed at an upper portion and at a side of the display substrate 10 .
  • the encapsulation substrate 20 serves to protect the organic light emitting elements and the driving circuit parts of the display substrate 10 from the outside by sealing the display substrate 10 .
  • the sealing portion 15 may include a sealing frame 11 and a reinforced sealing material 12 reinforcing the sealing frame 11 .
  • the sealing frame 11 and the reinforced sealing material 12 will be separately described below.
  • the sealing frame 11 is formed to adhere along edges of the display substrate 10 and the encapsulation substrate 20 , and to seal the display substrate 10 and the encapsulation substrate 20 , as illustrated in FIG. 1 .
  • the sealing frame 11 may extend continuously along an entire peripheral edge, e.g., en entire perimeter, of the display substrate 10 and/or the encapsulation substrate 20 .
  • the sealing frame 11 may have a quadrangular frame, so each edge of the sealing frame 11 may be configured at a right angle.
  • two portions of the sealing frame 11 may be configured perpendicularly to each other to define a corner at a right angle, such that a surface contact between the two perpendicular portions is at an oblique angle to a side surface of each of the perpendicular portions that faces a center of the sealing frame 11 .
  • a width W 1 ( FIG. 3 ) of the corner i.e., the surface contact, is larger than a width W 2 of either of the two perpendicular portions of the sealing frame defining the corner.
  • corners, i.e., edges, of the sealing frame 11 are reinforced to provide increased support against potential stress.
  • an entire sealing frame has a uniform width, e.g., if edges of the frame are curved to have a same width as side portions of the frame, when a relatively large stress is concentrated at edges of the sealing frame, a cell rupturing phenomenon may occur.
  • the reinforced sealing material 12 may be closely installed at an edge of the sealing frame 11 to further increase the width W 1 .
  • the reinforced sealing material 12 may have a right triangular shape.
  • the reinforced sealing material 12 may fit into, e.g., and contact, an inner edge of sealing frame 11 .
  • the sealing frame 11 has a shape of a quadrangular frame, e.g., a rectangular frame
  • the right-triangular reinforced sealing material 12 may fit into the right-angled inner edge of sealing frame 11 to further increase a total width of the sealing material 12 at the edge of the sealing frame 11 .
  • the reinforced sealing material 12 has a right-triangular shape that, e.g., directly, contacts portions of perpendicular sides of the sealing frame 11 , e.g., portions of the sealing frame that define the edge, a relatively large stress amount concentrated at the edge may be dispersed.
  • embodiments are not limited to the shape of the reinforced sealing material 12 described above.
  • the reinforced sealing material 12 may be installed at two or more edges among the four edges.
  • the reinforced sealing material 12 may be integrally configured, e.g., formed, with the sealing frame 11 or may be separately configured, e.g., formed, from the sealing frame 11 to be fastened with, e.g., physically attached to, the sealing frame 11 .
  • FIG. 4 illustrates a plan view of a unit cell of an organic light emitting diode display according to a second exemplary embodiment.
  • FIG. 5 is a cross-sectional view taken along line V-V of FIG. 4 .
  • a unit cell of the organic light emitting diode display according to the second exemplary embodiment may include the display substrate 10 , the encapsulation substrate 20 , and a sealing portion 15 ′.
  • the display substrate 10 and the encapsulation substrate 20 are the same as the configuration of the first exemplary embodiment described above, the same reference numerals are used and a duplicate description is omitted.
  • the sealing portion 15 ′ which is different from the configuration of the first exemplary embodiment, will be mainly described.
  • the sealing portion 15 ′ of the second exemplary embodiment may include the sealing frame 11 and a reinforced sealing material 13 reinforcing the sealing frame 11 .
  • sealing frame 11 is the same as in the first exemplary embodiment.
  • sealing frame portions positioned in a counter clockwise (CCW) direction from a sealing frame portion positioned at a lower side are illustrated as first to fourth sealing frames 11 a , 11 b , 11 c , and 11 d , respectively.
  • the reinforced sealing material 13 is formed at the lower side of the first sealing frame portion 11 a , among the first to fourth sealing frame portions 11 a , 11 b , 11 c , and 11 d , as illustrated in FIGS. 4 and 5 .
  • GATE/SD wires are concentrated in a pad area, e.g., in a region of the organic light emitting diode display overlapping the first sealing frame portion 11 a , so a step is non-uniformly formed in the pad area.
  • the cell seal structure may be relatively unstable in the pad area, and releasing or rupturing may easily occur.
  • the reinforced sealing material 13 is added in the pad area positioned at the lower side.
  • the reinforced sealing material 13 may contact, e.g., directly contact, and extend along, e.g., an entire length of, the first sealing frame portion 11 a .
  • a combined width PA of the first sealing frame portion 11 with the reinforced sealing material 13 is larger than a width L of each of the second through fourth sealing frame portions 11 b , 11 c , and 11 d .
  • the combined width PA of the first sealing frame portion 11 a with the reinforced sealing material 13 may be larger than the width L of each of the second through fourth sealing frame portions 11 b , 11 c , and 11 d by about 10% or more.
  • FIGS. 4 and 5 the size of the sealing material 13 is not to scale. That is, in order to emphasize the reinforced sealing material 13 , the width of the reinforced sealing material 13 is exaggerated.
  • FIG. 6 is a plan view of a unit cell of an organic light emitting diode display according to a third exemplary embodiment.
  • a unit cell of an organic light emitting diode display may include the display substrate, the encapsulation substrate, and a sealing portion 15 ′′.
  • the sealing portion 15 ′′ may include the sealing frame 11 and the reinforced sealing materials 12 and 13 reinforcing the sealing frame 11 .
  • the sealing frame 11 may include first to fourth sealing frame portions 11 a , 11 b , 11 c , and 11 d.
  • the reinforced sealing materials 12 and 13 in FIG. 6 include the reinforced sealing material 12 of the first exemplary embodiment and the reinforced sealing material 13 of the second exemplary embodiment.
  • the reinforced sealing material 12 according to the first exemplary embodiment may be closely installed at each upper edge to disperse stress concentrated at the edges.
  • the reinforced sealing material 13 may be formed in the pad area according to the second exemplary embodiment.
  • the reinforced sealing material 12 has a right triangular shape and is installed only at the upper side, but embodiments are not limited thereto.
  • the reinforced sealing material 12 may be integrally configured with the sealing frame 11 or may be separately configured from the sealing frame 11 to be fastened with the sealing frame 11 .
  • a width of the first sealing frame portion 11 a is larger than corresponding widths of the other second to fourth sealing frame portions 11 b , 11 c , and 11 d .
  • the combined width of the first sealing frame portion 11 a with the reinforced sealing material 13 may be larger than the widths of the second to fourth sealing frame portions 11 b , 11 c , and 11 d by about 10% or more.
  • FIG. 7 is a plan view of a unit cell of an organic light emitting diode display according to a fourth exemplary embodiment.
  • a unit cell of an organic light emitting diode display may include the display substrate, the encapsulation substrate, the sealing portion 15 ′′, and a protruding portion 14 .
  • the sealing portion 15 ′′ may include the sealing frame 11 and reinforced sealing materials 12 and 13 reinforcing the sealing frame 11
  • the sealing frame 11 may include first to fourth sealing frame portions 11 a , 11 b , 11 c , and 11 d.
  • the display substrate, the encapsulation substrate, the sealing frame 11 , and the reinforced sealing materials 12 and 13 are the same as the configurations of the first to third exemplary embodiments described above, a duplicate description is omitted.
  • the protruding portion 14 may be installed on at least one sealing frame portion among sealing frame portions of the sealing frame 11 where the reinforced sealing material 13 is not formed, e.g., on the second to fourth sealing frame portions 11 b through 11 d .
  • the protruding portion 14 may protrude from the sealing frame 11 in an outer direction and may have a larger width than a width of the sealing frame 11 .
  • the reinforced sealing materials 12 and 13 and the protruding portion 14 selectively, e.g., locally, increase a width of the sealing frame 11 , a place where stress is concentrated may be reinforced.
  • the protruding portion 14 is formed only at the second and fourth sealing frame portions 11 b and 11 d , but is not limited thereto. Further, in FIG. 7 , the protruding portion 14 is illustrated as a semicircular shape, but so long as the width of the protruding portion 14 extends in the outer direction, e.g., convex, the shape of the protruding portion is not limited thereto. Further, exemplary embodiments may include the display substrate, the encapsulation substrate, and the protruding portion 14 , without configuring the sealing portion 15 ′′.
  • a width of a sealing portion may be non-uniform, i.e., may be designed to be larger in a partial area to which a lot of stress is applied. As a result, it may be possible to prevent releasing or rupturing of the sealing portion.
  • a conventional organic light emitting diode display may include a sealing portion with a uniform width along an entire circumference of the display substrate, while four edges of the sealing portion may be curved to have a radius of R and a width of L, i.e., four sides and the widths L are the same as each other.
  • the conventional sealing portion may rupture. Further, when implementing a large size, the problem is further increased.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

An organic light emitting diode display includes a display substrate including an organic light emitting element and a driving circuit part, an encapsulation substrate sealing the display substrate, and a sealing portion between the display substrate and the encapsulation substrate, the sealing portion including a plurality of sealing frame portions around the display substrate, and a first sealing frame portion of the plurality of sealing frame portions being adjacent to a pad portion, wherein at least one of a width of an edge of the sealing portion and a width of the first sealing frame portion is wider than a width of a sealing frame portion other than the first sealing frame portion.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • The present application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2013-0043752, filed on Apr. 19, 2013, in the Korean Intellectual Property Office, and entitled: “Organic Light Emitting Diode Display,” which is incorporated by reference herein in its entirety.
  • BACKGROUND
  • 1. Field
  • The present disclosure relates to an organic light emitting diode display. More particularly, the present disclosure relates to an organic light emitting diode display which partially reinforces a width of a sealing material formed in an area except for a display area and a non-display area.
  • 2. Description of the Related Art
  • A conventional organic light emitting diode display may include two electrodes and an organic emission layer positioned between the two electrodes. An electron injected from one electrode and a hole injected from the other electrode are coupled with each other in the organic emission layer to form an exciton, and the exciton emits energy to display light.
  • The conventional organic light emitting diode display may also include a display substrate with the organic emission layer, and an encapsulation substrate covering and sealing the display substrate. In addition, a sealant may be formed between the display substrate and the encapsulation substrate to seal and attach the display substrate and the encapsulation substrate.
  • SUMMARY
  • The present disclosure has been made in an effort to provide an organic light emitting diode display capable of preventing deformation of a cell seal structure.
  • An exemplary embodiment provides an organic light emitting diode display, including a display substrate including an organic light emitting element and a driving circuit part, an encapsulation substrate sealing the display substrate, and a sealing portion between the display substrate and the encapsulation substrate, the sealing portion including a plurality of sealing frame portions around the display substrate, and a first sealing frame portion of the plurality of sealing frame portions being adjacent to a pad portion, wherein at least one of a width of an edge of the sealing portion and a width of the first sealing frame portion is wider than a width of a sealing frame portion other than the first sealing frame portion.
  • The organic light emitting diode display may further include a sealing material at least at one inner edge of the sealing portion, the sealing material having a triangular shape.
  • The sealing material may be reinforced at two or more edges among inner edges of the sealing portion.
  • The sealing material may have a right-triangular shape, the sealing material fitting into an inner right-triangular shape of the inner edge of the sealing portion.
  • The sealing material may be only at edges of the sealing portion among all portions of the sealing portion, the sealing material being in direct contact with the inner edges of the sealing portion.
  • The width of the first sealing frame portion may be wider than the width sealing frame portions other than the first sealing frame portion by about 10% or more.
  • The organic light emitting diode display may further include a protruding portion on and protruding away from at least one of the sealing frame portions, a width of the protruding portion being wider than the sealing frame portions.
  • The protruding portion may have a semicircular shape.
  • The protruding portion may be at an opposite side.
  • The width of the edge of the sealing portion may be measured along a direction that is oblique with respect to a direction of the width of any adjacent sealing frame portion.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Features will become apparent to those of ordinary skill in the art by describing in detail exemplary embodiments with reference to the attached drawings, in which:
  • FIG. 1 illustrates a plan view of a unit cell of an organic light emitting diode display according to a first exemplary embodiment.
  • FIG. 2 illustrates a cross-sectional view taken along line II-II of FIG. 1.
  • FIG. 3 illustrates a partially enlarged view of a portion A of FIG. 1.
  • FIG. 4 illustrates a plan view of a unit cell of an organic light emitting diode display according to a second exemplary embodiment.
  • FIG. 5 illustrates a cross-sectional view taken along line V-V of FIG. 4.
  • FIG. 6 illustrates a plan view of a unit cell of an organic light emitting diode display according to a third exemplary embodiment.
  • FIG. 7 illustrates a plan view of a unit cell of an organic light emitting diode display according to a fourth exemplary embodiment.
  • DETAILED DESCRIPTION
  • The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present disclosure. The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.
  • Hereinafter, a configuration of an organic light emitting diode display according to an exemplary embodiment will be described in more detail with reference to the accompanying drawings.
  • FIG. 1 illustrates a plan view of a unit cell of an organic light emitting diode display according to a first exemplary embodiment. FIG. 2 is a cross-sectional view along line II-II of FIG. 1. FIG. 3 is a partially enlarged view of portion A in FIG. 1.
  • An organic light emitting diode display according to an exemplary embodiment is designed such that a width of a sealing portion is larger in an area to which increased stress is applied. That is, a sealing portion in a pad area or at an edge may have a larger width than in other regions for structural reinforcement. As a result, it may be possible to prevent releasing or rupturing of a cell seal structure, i.e., of the sealing portion.
  • Referring to FIGS. 1 and 2, a unit cell of an organic light emitting diode display according to a first exemplary embodiment may include a display substrate 10 and an encapsulation substrate 20 facing each other, and a sealing portion 15. The sealing portion 15 may be formed between the display substrate 10 and the encapsulation substrate 20.
  • The display substrate 10 may include an organic light emitting element and a driving circuit part. In this case, the organic light emitting element may include an anode, an organic emission layer, and a cathode, and the driving circuit part may include at least two thin film transistors T1 and T2, and at least one storage capacitor CAP1.
  • The encapsulation substrate 20, as illustrated in FIG. 2, may be installed at an upper portion and at a side of the display substrate 10. The encapsulation substrate 20 serves to protect the organic light emitting elements and the driving circuit parts of the display substrate 10 from the outside by sealing the display substrate 10.
  • The sealing portion 15 may include a sealing frame 11 and a reinforced sealing material 12 reinforcing the sealing frame 11. The sealing frame 11 and the reinforced sealing material 12 will be separately described below.
  • The sealing frame 11 is formed to adhere along edges of the display substrate 10 and the encapsulation substrate 20, and to seal the display substrate 10 and the encapsulation substrate 20, as illustrated in FIG. 1. For example, the sealing frame 11 may extend continuously along an entire peripheral edge, e.g., en entire perimeter, of the display substrate 10 and/or the encapsulation substrate 20.
  • For example, the sealing frame 11 may have a quadrangular frame, so each edge of the sealing frame 11 may be configured at a right angle. In other words, as illustrated in FIGS. 1 and 3, two portions of the sealing frame 11 may be configured perpendicularly to each other to define a corner at a right angle, such that a surface contact between the two perpendicular portions is at an oblique angle to a side surface of each of the perpendicular portions that faces a center of the sealing frame 11. As a result, a width W1 (FIG. 3) of the corner, i.e., the surface contact, is larger than a width W2 of either of the two perpendicular portions of the sealing frame defining the corner. In other words, the width W1 can be defined as a diagonal of a square having a side that equals the width W2, so the width W1 equals W2*(√2), i.e., W1=W2*1.41421. As the width W1 is larger than the width W2, corners, i.e., edges, of the sealing frame 11 are reinforced to provide increased support against potential stress. In contrast, if an entire sealing frame has a uniform width, e.g., if edges of the frame are curved to have a same width as side portions of the frame, when a relatively large stress is concentrated at edges of the sealing frame, a cell rupturing phenomenon may occur.
  • In addition, as illustrated in FIGS. 1 and 3, the reinforced sealing material 12 may be closely installed at an edge of the sealing frame 11 to further increase the width W1. For example, the reinforced sealing material 12 may have a right triangular shape. For example, the reinforced sealing material 12 may fit into, e.g., and contact, an inner edge of sealing frame 11. For example, when the sealing frame 11 has a shape of a quadrangular frame, e.g., a rectangular frame, the right-triangular reinforced sealing material 12 may fit into the right-angled inner edge of sealing frame 11 to further increase a total width of the sealing material 12 at the edge of the sealing frame 11. As the reinforced sealing material 12 has a right-triangular shape that, e.g., directly, contacts portions of perpendicular sides of the sealing frame 11, e.g., portions of the sealing frame that define the edge, a relatively large stress amount concentrated at the edge may be dispersed. However, embodiments are not limited to the shape of the reinforced sealing material 12 described above.
  • The reinforced sealing material 12 may be installed at two or more edges among the four edges. The reinforced sealing material 12 may be integrally configured, e.g., formed, with the sealing frame 11 or may be separately configured, e.g., formed, from the sealing frame 11 to be fastened with, e.g., physically attached to, the sealing frame 11.
  • Hereinafter, various exemplary embodiments and modified embodiments of the sealing portion 15 for preventing releasing or rupturing of the cell seal structure will be described.
  • FIG. 4 illustrates a plan view of a unit cell of an organic light emitting diode display according to a second exemplary embodiment. FIG. 5 is a cross-sectional view taken along line V-V of FIG. 4.
  • Referring to FIGS. 4 and 5, a unit cell of the organic light emitting diode display according to the second exemplary embodiment may include the display substrate 10, the encapsulation substrate 20, and a sealing portion 15′. In this case, since the display substrate 10 and the encapsulation substrate 20 are the same as the configuration of the first exemplary embodiment described above, the same reference numerals are used and a duplicate description is omitted.
  • The sealing portion 15′, which is different from the configuration of the first exemplary embodiment, will be mainly described. The sealing portion 15′ of the second exemplary embodiment may include the sealing frame 11 and a reinforced sealing material 13 reinforcing the sealing frame 11.
  • In detail, the sealing frame 11 is the same as in the first exemplary embodiment. In FIG. 4, sealing frame portions positioned in a counter clockwise (CCW) direction from a sealing frame portion positioned at a lower side are illustrated as first to fourth sealing frames 11 a, 11 b, 11 c, and 11 d, respectively.
  • Meanwhile, the reinforced sealing material 13 is formed at the lower side of the first sealing frame portion 11 a, among the first to fourth sealing frame portions 11 a, 11 b, 11 c, and 11 d, as illustrated in FIGS. 4 and 5.
  • In more detail, GATE/SD wires are concentrated in a pad area, e.g., in a region of the organic light emitting diode display overlapping the first sealing frame portion 11 a, so a step is non-uniformly formed in the pad area. As a result, the cell seal structure may be relatively unstable in the pad area, and releasing or rupturing may easily occur.
  • However, according to embodiments, the reinforced sealing material 13 is added in the pad area positioned at the lower side. For example, as illustrated in FIGS. 4-5, the reinforced sealing material 13 may contact, e.g., directly contact, and extend along, e.g., an entire length of, the first sealing frame portion 11 a. As a result, a combined width PA of the first sealing frame portion 11 with the reinforced sealing material 13 is larger than a width L of each of the second through fourth sealing frame portions 11 b, 11 c, and 11 d. For example, the combined width PA of the first sealing frame portion 11 a with the reinforced sealing material 13 may be larger than the width L of each of the second through fourth sealing frame portions 11 b, 11 c, and 11 d by about 10% or more.
  • It is noted that in FIGS. 4 and 5 the size of the sealing material 13 is not to scale. That is, in order to emphasize the reinforced sealing material 13, the width of the reinforced sealing material 13 is exaggerated.
  • FIG. 6 is a plan view of a unit cell of an organic light emitting diode display according to a third exemplary embodiment.
  • Referring to FIG. 6, a unit cell of an organic light emitting diode display according to the third exemplary embodiment may include the display substrate, the encapsulation substrate, and a sealing portion 15″. The sealing portion 15″ may include the sealing frame 11 and the reinforced sealing materials 12 and 13 reinforcing the sealing frame 11. The sealing frame 11 may include first to fourth sealing frame portions 11 a, 11 b, 11 c, and 11 d.
  • In this case, since the display substrate, the encapsulation substrate, and the sealing frame 11 are the same as those described previously with respect to FIGS. 1-5 above, duplicate description thereof is omitted.
  • The reinforced sealing materials 12 and 13 in FIG. 6 include the reinforced sealing material 12 of the first exemplary embodiment and the reinforced sealing material 13 of the second exemplary embodiment. For example, as illustrated in FIG. 6, at an upper side of the sealing frame 11, the reinforced sealing material 12 according to the first exemplary embodiment may be closely installed at each upper edge to disperse stress concentrated at the edges. For example, as further illustrated in FIG. 6, at a lower side of the sealing frame 11, the reinforced sealing material 13 may be formed in the pad area according to the second exemplary embodiment.
  • In the exemplary embodiment, the reinforced sealing material 12 has a right triangular shape and is installed only at the upper side, but embodiments are not limited thereto. In addition, the reinforced sealing material 12 may be integrally configured with the sealing frame 11 or may be separately configured from the sealing frame 11 to be fastened with the sealing frame 11.
  • In the exemplary embodiment, a width of the first sealing frame portion 11 a, to which the reinforced sealing material 13 is added, is larger than corresponding widths of the other second to fourth sealing frame portions 11 b, 11 c, and 11 d. As a result, it may be possible to prevent cell releasing or rupturing. As described above, the combined width of the first sealing frame portion 11 a with the reinforced sealing material 13 may be larger than the widths of the second to fourth sealing frame portions 11 b, 11 c, and 11 d by about 10% or more.
  • FIG. 7 is a plan view of a unit cell of an organic light emitting diode display according to a fourth exemplary embodiment.
  • Referring to FIG. 7, a unit cell of an organic light emitting diode display according to the fourth exemplary embodiment may include the display substrate, the encapsulation substrate, the sealing portion 15″, and a protruding portion 14. Further, the sealing portion 15″ may include the sealing frame 11 and reinforced sealing materials 12 and 13 reinforcing the sealing frame 11, and the sealing frame 11 may include first to fourth sealing frame portions 11 a, 11 b, 11 c, and 11 d.
  • In this case, since the display substrate, the encapsulation substrate, the sealing frame 11, and the reinforced sealing materials 12 and 13 are the same as the configurations of the first to third exemplary embodiments described above, a duplicate description is omitted.
  • The protruding portion 14, as illustrated in FIG. 7, may be installed on at least one sealing frame portion among sealing frame portions of the sealing frame 11 where the reinforced sealing material 13 is not formed, e.g., on the second to fourth sealing frame portions 11 b through 11 d. The protruding portion 14 may protrude from the sealing frame 11 in an outer direction and may have a larger width than a width of the sealing frame 11. As a result, since the reinforced sealing materials 12 and 13 and the protruding portion 14 selectively, e.g., locally, increase a width of the sealing frame 11, a place where stress is concentrated may be reinforced.
  • In FIG. 7, the protruding portion 14 is formed only at the second and fourth sealing frame portions 11 b and 11 d, but is not limited thereto. Further, in FIG. 7, the protruding portion 14 is illustrated as a semicircular shape, but so long as the width of the protruding portion 14 extends in the outer direction, e.g., convex, the shape of the protruding portion is not limited thereto. Further, exemplary embodiments may include the display substrate, the encapsulation substrate, and the protruding portion 14, without configuring the sealing portion 15″.
  • According to the exemplary embodiment, a width of a sealing portion may be non-uniform, i.e., may be designed to be larger in a partial area to which a lot of stress is applied. As a result, it may be possible to prevent releasing or rupturing of the sealing portion.
  • In contrast, a conventional organic light emitting diode display may include a sealing portion with a uniform width along an entire circumference of the display substrate, while four edges of the sealing portion may be curved to have a radius of R and a width of L, i.e., four sides and the widths L are the same as each other. However, as stress may be concentrated in a pad area, i.e., where a step is non-uniform, or at an edge, i.e., including a curved portion R of the edge, the conventional sealing portion may rupture. Further, when implementing a large size, the problem is further increased.
  • Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.

Claims (10)

What is claimed is:
1. An organic light emitting diode display, comprising:
a display substrate including an organic light emitting element and a driving circuit part;
an encapsulation substrate sealing the display substrate; and
a sealing portion between the display substrate and the encapsulation substrate, the sealing portion including a plurality of sealing frame portions around the display substrate, and a first sealing frame portion of the plurality of sealing frame portions being adjacent to a pad portion,
wherein at least one of a width of an edge of the sealing portion and a width of the first sealing frame portion is wider than a width of a sealing frame portion other than the first sealing frame portion.
2. The organic light emitting diode display as claimed in claim 1, further comprising a sealing material at least at one inner edge of the sealing portion, the sealing material having a triangular shape.
3. The organic light emitting diode display as claimed in claim 2, wherein the sealing material is reinforced at two or more edges among inner edges of the sealing portion.
4. The organic light emitting diode display as claimed in claim 2, wherein the sealing material has a right-triangular shape, the sealing material fitting into an inner right-triangular shape of the inner edge of the sealing portion.
5. The organic light emitting diode display as claimed in claim 2, wherein the sealing material is only at edges of the sealing portion among all portions of the sealing portion, the sealing material being in direct contact with the inner edges of the sealing portion.
6. The organic light emitting diode display as claimed in claim 1, wherein the width of the first sealing frame portion is wider than the width of sealing frame portions other than the first sealing frame portion by about 10% or more.
7. The organic light emitting diode display as claimed in claim 1, further comprising a protruding portion on and protruding away from at least one of the sealing frame portions, a width of the protruding portion being wider than the sealing frame portions.
8. The organic light emitting diode display as claimed in claim 7, wherein the protruding portion has a semicircular shape.
9. The organic light emitting diode display as claimed in claim 8, wherein the protruding portion is at an opposite side.
10. The organic light emitting diode display as claimed in claim 1, wherein the width of the edge of the sealing portion is measured along a direction that is oblique with respect to a direction of the width of any adjacent sealing frame portion.
US14/074,919 2013-04-19 2013-11-08 Organic light emitting diode display Abandoned US20140312322A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/098,442 US9728743B2 (en) 2013-04-19 2016-04-14 Organic light emitting diode display with reinforced sealing portion

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0043752 2013-04-19
KR1020130043752A KR102036908B1 (en) 2013-04-19 2013-04-19 Organic light emitting diode display

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/098,442 Division US9728743B2 (en) 2013-04-19 2016-04-14 Organic light emitting diode display with reinforced sealing portion

Publications (1)

Publication Number Publication Date
US20140312322A1 true US20140312322A1 (en) 2014-10-23

Family

ID=51709170

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/074,919 Abandoned US20140312322A1 (en) 2013-04-19 2013-11-08 Organic light emitting diode display
US15/098,442 Active US9728743B2 (en) 2013-04-19 2016-04-14 Organic light emitting diode display with reinforced sealing portion

Family Applications After (1)

Application Number Title Priority Date Filing Date
US15/098,442 Active US9728743B2 (en) 2013-04-19 2016-04-14 Organic light emitting diode display with reinforced sealing portion

Country Status (4)

Country Link
US (2) US20140312322A1 (en)
KR (1) KR102036908B1 (en)
CN (1) CN104112401B (en)
TW (1) TWI602291B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170155080A1 (en) * 2015-11-26 2017-06-01 Samsung Display Co., Ltd. Display apparatus
CN109427996A (en) * 2017-08-31 2019-03-05 昆山国显光电有限公司 A kind of flexible display apparatus and preparation method
CN110956899A (en) * 2018-09-27 2020-04-03 三星显示有限公司 Flexible display device and method of manufacturing the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104485426A (en) * 2014-12-26 2015-04-01 昆山国显光电有限公司 OLED (organic light-emitting diode) package structure and package method
JP6815159B2 (en) * 2016-10-14 2021-01-20 株式会社ジャパンディスプレイ Display device
KR102449700B1 (en) * 2017-12-04 2022-09-29 엘지디스플레이 주식회사 Electroluminescent display device
CN111341732B (en) * 2018-12-18 2023-06-23 天津大学 Semiconductor device with sealing gasket reinforcing structure and electronic equipment with same
CN109860422B (en) * 2019-01-31 2021-06-04 武汉天马微电子有限公司 Display panel and display device
CN110048020B (en) * 2019-04-12 2020-04-03 昆山国显光电有限公司 Display panel, preparation method thereof and display device
CN110289290B (en) * 2019-06-24 2022-07-01 京东方科技集团股份有限公司 Display mother board, preparation method thereof and electroluminescent display panel

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6791660B1 (en) * 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
US20070228000A1 (en) * 2006-04-03 2007-10-04 Lg Electronics Inc. Encapsulation cap and display device including the same
US20080074036A1 (en) * 2006-09-21 2008-03-27 Samsung Sdi Co., Ltd. Organic light emitting display
US20090218253A1 (en) * 2008-02-28 2009-09-03 Kelvin Nguyen Hermetically-sealed packages for electronic components having reduced unused areas
US20090255213A1 (en) * 2008-04-11 2009-10-15 Innovida Holdings, Inc. Sandwich panel with closed edge and methods of fabricating
US20100102719A1 (en) * 2008-10-29 2010-04-29 Ung-Soo Lee Organic light emitting diode display and method for manufacturing the same
US20110163662A1 (en) * 2010-01-05 2011-07-07 Won-Kyu Lim Organic light-emitting display device and method of manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4069639B2 (en) * 2002-02-12 2008-04-02 セイコーエプソン株式会社 Manufacturing method of electro-optical device
KR100867167B1 (en) * 2002-06-17 2008-11-06 엘지디스플레이 주식회사 Liquid Crystal Display Device and Method for Fabricating the same
JP4240276B2 (en) * 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 Light emitting device
KR20050040175A (en) 2003-10-27 2005-05-03 엘지.필립스 엘시디 주식회사 Structure of a liquid crystal display panel having a plurality of sealing lines
JP4682575B2 (en) * 2004-09-30 2011-05-11 ソニー株式会社 Liquid crystal display
KR20060112948A (en) 2005-04-28 2006-11-02 엘지.필립스 엘시디 주식회사 Liquid crystal display panel having dual seal pattern
WO2008129884A1 (en) * 2007-04-13 2008-10-30 Sharp Kabushiki Kaisha Liquid crystal display panel, and its manufacturing method
KR100883072B1 (en) * 2007-07-12 2009-02-10 엘지전자 주식회사 Display device
KR100965255B1 (en) 2008-11-11 2010-06-22 삼성모바일디스플레이주식회사 Organic light emitting diode display
KR101223726B1 (en) * 2011-03-03 2013-01-17 주식회사 엔씰텍 Flat panel display apparatus, mother substrate for flat panel display apparatus, method of manufacturing flat panel display apparatus and method of manufacturing mother substrate for flat panel display apparatus
CN105702741B (en) * 2011-09-29 2019-01-01 株式会社半导体能源研究所 Semiconductor devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6791660B1 (en) * 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
US20070228000A1 (en) * 2006-04-03 2007-10-04 Lg Electronics Inc. Encapsulation cap and display device including the same
US20080074036A1 (en) * 2006-09-21 2008-03-27 Samsung Sdi Co., Ltd. Organic light emitting display
US20090218253A1 (en) * 2008-02-28 2009-09-03 Kelvin Nguyen Hermetically-sealed packages for electronic components having reduced unused areas
US20090255213A1 (en) * 2008-04-11 2009-10-15 Innovida Holdings, Inc. Sandwich panel with closed edge and methods of fabricating
US20100102719A1 (en) * 2008-10-29 2010-04-29 Ung-Soo Lee Organic light emitting diode display and method for manufacturing the same
US20110163662A1 (en) * 2010-01-05 2011-07-07 Won-Kyu Lim Organic light-emitting display device and method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170155080A1 (en) * 2015-11-26 2017-06-01 Samsung Display Co., Ltd. Display apparatus
US10276824B2 (en) * 2015-11-26 2019-04-30 Samsung Display Co., Ltd. Display apparatus having improved bonding performance
US10622583B2 (en) 2015-11-26 2020-04-14 Samsung Display Co., Ltd. Display apparatus with improved bonding performance
CN109427996A (en) * 2017-08-31 2019-03-05 昆山国显光电有限公司 A kind of flexible display apparatus and preparation method
US20190341580A1 (en) * 2017-08-31 2019-11-07 Kunshan Go-Visionox Opto-Electronics Co., Ltd. Flexible display device and method for manufacturing the flexible display device
US11264593B2 (en) * 2017-08-31 2022-03-01 Kunshan Go-Visionox Opto-Electronics Co., Ltd. Flexible display device
CN110956899A (en) * 2018-09-27 2020-04-03 三星显示有限公司 Flexible display device and method of manufacturing the same

Also Published As

Publication number Publication date
CN104112401A (en) 2014-10-22
US20160233452A1 (en) 2016-08-11
KR20140125656A (en) 2014-10-29
TWI602291B (en) 2017-10-11
TW201442224A (en) 2014-11-01
CN104112401B (en) 2018-03-06
US9728743B2 (en) 2017-08-08
KR102036908B1 (en) 2019-10-28

Similar Documents

Publication Publication Date Title
US9728743B2 (en) Organic light emitting diode display with reinforced sealing portion
US9362523B2 (en) Encapsulation structure of OLED device
US10514814B2 (en) Display panel and display device
JP2006146221A (en) Sealant for flat panel display device and flat panel display device including same
KR20100047585A (en) Organic light emitting diode display and method for manufacturing the same
US9577220B2 (en) Organic light emitting diode display
US12058879B2 (en) Organic light emitting diode display
EP3240033B1 (en) Oled array substrate, manufacturing method thereof, packaging structure and display device
KR20170079725A (en) Organic Light Emitting Display Device
JP6423808B2 (en) Display device
JP2004303733A (en) Display device with component or organic light emitting diode
US9626897B2 (en) Organic light emitting diode display device and method of manufacturing the same
KR20220027261A (en) Display panel, manufacturing method thereof and display device
US10872949B2 (en) Display panel and display device
US20140247420A1 (en) Liquid Crystal Display Device and Manufacturing Method Thereof
US9600033B2 (en) Impact-resistant display device
US20140175403A1 (en) Organic Light Emitting Diode Device and Method of Manufacturing the Same
US20180212013A1 (en) Double-sided oled display device
US20060076886A1 (en) Encapsulation cap and display device using the same
CN107358871B (en) Display device with a light-shielding layer
KR100622251B1 (en) Organic light-emitting display device
KR100629074B1 (en) Organic electroluminescent device for preventing overflow of a sealing agent
JP2007095622A (en) Organic el display panel
US20240057443A1 (en) Display panel
KR20060118758A (en) Organic electroluminescent device

Legal Events

Date Code Title Description
AS Assignment

Owner name: SAMSUNG DISPLAY CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JEONG, CHANG-YONG;HAN, MYUNG-SUK;REEL/FRAME:031566/0395

Effective date: 20131022

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION