US20140198435A1 - Package structure of electronic device - Google Patents

Package structure of electronic device Download PDF

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Publication number
US20140198435A1
US20140198435A1 US13/934,222 US201313934222A US2014198435A1 US 20140198435 A1 US20140198435 A1 US 20140198435A1 US 201313934222 A US201313934222 A US 201313934222A US 2014198435 A1 US2014198435 A1 US 2014198435A1
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US
United States
Prior art keywords
substrate
electronic device
disposed
barrier structure
package structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/934,222
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English (en)
Inventor
Shu-Tang Yeh
Chia-Hao Tsai
Mei-Ru Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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Filing date
Publication date
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Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE reassignment INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, MEI-RU, TSAI, CHIA-HAO, YEH, SHU-TANG
Publication of US20140198435A1 publication Critical patent/US20140198435A1/en
Priority to US15/051,645 priority Critical patent/US9795028B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing

Definitions

  • the disclosure is related to a package structure of an electronic device.
  • flexible substrates Compared with normal rigid substrates, flexible substrates have a wider range of applications due to bendability, ease for carriage, safety, and broad applications in consumer products.
  • flexible substrates have a large coefficient of thermal expansion and poor resistance against heat, moisture, oxygen, and chemicals. Since typical flexible substrates cannot block the transmission of moisture and oxygen completely, electronic devices on the typical flexible substrates experience accelerated aging. Consequently, these short-lived electronic devices fail to fulfill commercial needs.
  • the electronic device is disposed between two substrates, and the upper and lower substrates are closely attached to each other with a sealant so as to reduce contact of moisture and oxygen with the electronic device.
  • moisture and oxygen may still permeate through the sealant and contact with the electronic device and thereby lower down the service life of the electronic device.
  • An embodiment of the disclosure introduces a package structure of an electronic device, including a first substrate, a second substrate, an electronic device and a first barrier structure.
  • the first substrate includes a first light-transmitting portion and a periphery portion surrounding the first light-transmitting portion.
  • the second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion.
  • the first and second light-transmitting portions are disposed correspondingly, and a device disposition region is arranged therebetween.
  • the covering portions cover the periphery portion of the first substrate and cover two opposite side surfaces of the first substrate.
  • the electronic device is disposed on the first or second substrate and is located in the device disposition region.
  • the first barrier structure is disposed on the first or second substrate.
  • the first barrier structure is disposed corresponding to the periphery portion, and is located on at least one side of the device disposition region.
  • An embodiment of the disclosure further introduces a package structure of electronic device, including a first substrate, an electronic device, a barrier layer, a second substrate and a first barrier structure.
  • the first substrate includes a first light-transmitting portion and a periphery portion surrounding the first light-transmitting portion, and the first substrate includes an inner surface and an outer surface.
  • the electronic device is disposed on the inner surface of the first substrate.
  • the barrier layer includes a main portion and two covering portions located on two opposite sides of the main portion, wherein the main portion and the first light-transmitting portion are disposed correspondingly, and the main portion covers the outer surface of the first substrate.
  • the covering portions cover a first periphery portion of the first substrate located on two opposite sides of the first light-transmitting portion, the electronic device located on the first periphery portion of the first substrate, two opposite side surfaces of the first substrate, and two opposite side surfaces of the electronic device.
  • the second substrate and the first substrate are disposed opposite to each other, and the electronic device is disposed therebetween.
  • the second substrate includes a second light-transmitting portion and a second periphery portion surrounding the second light-transmitting portion.
  • the second light-transmitting portion is disposed corresponding to the first light-transmitting portion
  • the second periphery portion is disposed corresponding to the first periphery portion.
  • the first barrier structure is disposed on the second periphery portion of the second substrate.
  • FIG. 1A is a schematic cross-sectional view of a package structure of electronic device according to the first embodiment of the disclosure.
  • FIG. 1B is an exploded view of the package structure of electronic device in FIG. 1A before packaging.
  • FIG. 1C is a perspective side view of the package structure of electronic device in FIG. 1B after packaging.
  • FIGS. 2A to 2H are schematic top views of the first barrier structure in other embodiments of the disclosure.
  • FIG. 3 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 4 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 5 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 6 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 7 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 8 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 9 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 10 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 11 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 12 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 13 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 14 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 15 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 16 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 17 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 18 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • FIG. 1A is a schematic cross-sectional view of a package structure of electronic device according to the first embodiment of the disclosure.
  • FIG. 1B is an exploded view of the package structure of electronic device in FIG. 1A prior to packaging.
  • FIG. 1C is a perspective side view of the package structure of electronic device in FIG. 1B after packaging.
  • a package structure of an electronic device 100 a includes a first substrate 110 , a second substrate 120 , an electronic device 130 , a sealant 140 and a barrier structure 150 .
  • FIG. 1A for example, is the schematic cross-sectional view along a section line A-N in FIG. 1C . In order to clearly illustrate the disposition relationship between each element, part of the elements is omitted in FIGS. 1B and 1C .
  • the first substrate 110 includes a first light-transmitting portion 112 and a periphery portion 114 , wherein the periphery portion 114 surrounds the first light-transmitting portion 112 .
  • the first substrate 110 includes an inner surface 110 a and an outer surface 110 b .
  • the first substrate 110 includes two opposite side surfaces 110 s .
  • the first light-transmitting portion 112 of the first substrate 110 allows the transmission of light.
  • the second substrate 120 includes a second light-transmitting portion 122 and two covering portions 124 .
  • the second substrate 120 may be, for example, a transparent substrate, wherein the second light-transmitting portion 122 of the second substrate 120 allows the transmission of light.
  • the covering portions 124 are located on two opposite sides of the second light-transmitting portion 122 .
  • the first substrate 110 and the second substrate 120 are disposed opposite to each other, and the first substrate 110 is covered by the second substrate 120 , wherein the inner surface 110 a of the first substrate 110 faces the second light-transmitting portion 122 of the second substrate 120 .
  • the outer surface 110 b of the first substrate 110 is away from the second light-transmitting portion 122 of the second substrate 120 , and part of the outer surface 110 b is exposed from the covering portions 124 .
  • the first light-transmitting portion 112 of the first substrate 110 and the second light-transmitting portion 122 of the second substrate 120 are disposed correspondingly, and a device disposition region 115 exists between the first light-transmitting portion 112 and the second light-transmitting portion 122 .
  • the covering portions 124 of the second substrate 120 are, for example, covering structures formed by curling or folding part of the second substrate 120 to cover the periphery portion 114 of the first substrate 110 , and therefore the covering portions 124 have curved or bent shapes where corresponds to the side surfaces 110 s of the first substrate 110 . Accordingly, the covering portions 124 cover the periphery portion 114 located on two opposite sides of the first light-transmitting portion 112 , and the covering portions 124 cover the side surfaces 110 s located on two opposite sides of the first substrate 110 .
  • the first substrate 110 may be a flexible substrate or a rigid substrate.
  • the second substrate 120 may be, for example, a flexible substrate.
  • the material of the flexible substrate may be polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (PC), PI or a metal foil.
  • the material of the rigid substrate is, for example, glass or other suitable materials for rigid substrates.
  • a touch device such as a surface-capacitive touch device, a digital matrix touch device (for example, a projective capacitive touch device) or an analog matrix touch device, may further be disposed on the first substrate 110 or the second substrate 120 .
  • the first substrate 110 and the second substrate 120 both take flexible substrates for example.
  • the electronic device 130 is disposed on the second substrate 120 and is located in the device disposition region 115 .
  • the disclosure is not limited thereto. As long as the electronic device 130 is located in the device disposition region 115 , such an arrangement is the scope that the disclosure intends to claim.
  • the electronic device 130 may also be disposed on the first substrate 110 .
  • the electronic device 130 is disposed between the first light-transmitting portion 112 and the second light-transmitting portion 122 , and therefore the package structure 100 a of the electronic device may be a double-side light-emitting electronic device.
  • a reflective layer may be disposed on the first light-transmitting portion 112 of the first substrate 110 or the second light-transmitting portion 122 of the second substrate 120 , so that light generated in the electronic device 130 is emitted from either the first substrate 110 or the second substrate 120 .
  • the electronic device 130 is, for example, an active environment-sensitive display device or a passive environment-sensitive display device.
  • the active environment-sensitive display device is, for example, an active matrix organic light emitting diode (AMOLED) display device, an active matrix Eelectro phoretic display device (AMEPD), an active matrix liquid crystal display device (AMLCD) or an active matrix blue phase liquid crystal display device.
  • the passive environment-sensitive display device is, for example, a passive matrix OLED (PM-OLED) or a super twisted nematic liquid crystal display device (STN-LCD).
  • the sealant 140 is a selective material.
  • the sealant 140 is disposed between the first substrate 110 and the second substrate 120 .
  • the sealant 140 for example, is coated on the second substrate 120 where each element has been disposed, and the sealant 140 is closely covered between each element (such as the electronic device and a barrier structure described below). Then, the second substrate 120 coated with the sealant 140 is bent to cover the periphery portions 114 of the first substrate 110 located on two opposite sides of the first light-transmitting portion 112 .
  • the disclosure is not limited thereto.
  • the sealant 140 may be coated on a predetermined region that the first substrate 110 is covering, and then the second substrate 120 is folded to cover the predetermined region of the first substrate 110 .
  • the material of the sealant 140 may be, for example, an acrylic, an expoxy or a silicone, and the form of the sealant 140 may be, for example, a pressure-sensitive sealant, a stuffed sealant, a thermal curable sealant or an ultraviolet curable sealant.
  • the first barrier structure 150 is disposed on the second substrate 120 .
  • the first barrier structure 150 is disposed in the sealant 140 .
  • the first barrier structure 150 is disposed corresponding to the periphery portion 114 of the first substrate 110 and surrounding the device disposition region 115 .
  • the material of the first barrier structure 150 may be, for example, a single-layer structure of organic materials, inorganic materials or mixtures of organic and inorganic materials.
  • the first barrier structure 150 may also be a multi-layer structure stacked by organic materials, inorganic materials or mixtures of organic and inorganic materials. In the present embodiment, the first barrier structure 150 protrudes from the second substrate 120 toward the inner surface 110 a of the first substrate 110 .
  • the first barrier structure 150 Since the path of moisture and oxygen to the electronic device 130 is extended through the first barrier structure 150 , moisture and oxygen do not direct permeate to the electronic device 130 .
  • the first barrier structure 150 is, for example, disposed surrounding the whole device disposition region 115 , the capability of the package structure 110 a of the electronic device in blocking moisture and oxygen on all sides is effectively increased. Accordingly, the package structure 110 a of the electronic device may have good capability in blocking moisture and oxygen; however, in other embodiments, the first barrier structure may also be disposed merely surrounding at least one side (among three sides, for example) of the device disposition region 115 .
  • a gap d1 exists between the first barrier structure 150 and the inner surface 110 a of the first substrate 110 .
  • the size of the gap d1 is between 0 ⁇ m and 100 ⁇ m. The smaller the gap d1 is, the less easy it is for moisture and oxygen to pass the first barrier structure 150 through the gap d1.
  • the first barrier structure 150 in the present embodiment takes a barrier structure having a continuous barrier pattern for example.
  • the first barrier structure 150 may be composed of a plurality of barrier structures arranged continuously, and the barrier structures are disposed surrounding the device disposition region 115 , as shown in FIGS. 2A and 2B .
  • the present embodiment takes the disposition of two first barrier structures 150 for example.
  • the package structure of electronic device may also include one first barrier structure 150 , as shown in FIGS. 2A to 2C , or two or more first barrier structures 150 , as shown in FIGS. 2D to 2F .
  • the disclosure does not limit the number of the first barrier structure 150 .
  • the pattern of the first barrier structure 150 in the present embodiment substantially forms a frame pattern; however, the disclosure is not limited thereto.
  • the pattern of the first barrier structure 150 may be a curve pattern as shown in FIG. 2G or a waffle pattern as shown in FIG. 2H .
  • the package structure 100 a of the electronic device in the disclosure may form a plurality of lead wires 132 electrically connected to the electronic device 130 on the side not covered by the covering portions 124 .
  • the electronic device 130 may be selectively connected electrically to a flexible printed circuit (FPC) 200 through the lead wires 132 extending outside the second light-transmitting portion 122 .
  • FPC 200 may be further connected to a printed circuit board 300 .
  • the second substrate 120 in addition to covering the inner surface 110 a of the first substrate 110 , the second substrate 120 further covers the periphery portion 114 of the first substrate 110 with the covering portions 124 formed by curling or folding the second substrate 120 from the edge portion and stuffs between the first substrate 110 and the second substrate 120 with the sealant 140 . Accordingly, the path for moisture or oxygen in the environment to enter the sealant 140 and permeate toward the electronic device 130 from the brink side of the covering portions 124 is further extended.
  • the package structure 110 a of the electronic device has a better capability in blocking moisture and oxygen, and thereby further extends the service life of the electronic device 130 effectively.
  • the disclosure does not limit the position and form of the first barrier structure 150 .
  • the first barrier structure 150 mentioned herein is disposed on the second substrate 120 , and the shape of the least cross section of the first barrier structure 150 is a trapezoid, other known structural designs capable of achieving the blockage of moisture and oxygen may still be technical solutions that the disclosure may adopt without departing from the protection scope of the disclosure.
  • Multiple different embodiments are used hereafter to describe the design of the package structures 100 b to 100 p of the electronic device respectively.
  • the package structures 100 b to 100 p of the electronic device may also selectively use a lead wire for connecting with a FPC and a printed circuit board (not shown).
  • the disclosure is not limited thereto.
  • FIG. 3 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 b of the electronic device in FIG. 3 is similar to the package structure 100 a of the electronic device in FIG. 1A , and the difference lies in that the electronic device 130 in the package structure 100 b of the electronic device in FIG. 3 is disposed on the first substrate 110 .
  • FIG. 4 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 c of the electronic device in FIG. 4 is similar to the package structure 100 a of the electronic device in FIG. 1A , and the difference lies in that the package structure 100 c of the electronic device in FIG. 4 further includes a second barrier structure 160 .
  • the second barrier structure 160 is disposed on the second substrate 120 and is disposed corresponding to the periphery portion 114 of the first substrate 110 .
  • the second barrier structure 160 protrudes from the second substrate 120 toward the outer surface 110 b of the first substrate 110 , and a gap d2 exists between the second barrier structure 160 and the first substrate 110 , wherein the size of the gap d2 is, for example, from 0 ⁇ m to 100 ⁇ m.
  • the function of the second barrier structure 160 is similar to that of the first barrier structure 150 . Accordingly, the package structure 100 c of the electronic device has a better capability in blocking moisture and oxygen, and thereby the service life of the electronic device 130 is further extended effectively.
  • FIG. 5 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 d of the electronic device in FIG. 5 is similar to the package structure 100 c of the electronic device in FIG. 4 , and the difference lies in that the electronic device 130 in the package structure 100 d of the electronic device in FIG. 5 is disposed on the first substrate 110 .
  • FIG. 6 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 e of the electronic device in FIG. 6 is similar to the package structure 100 a of the electronic device in FIG. 1A , and the difference lies in that the first barrier structure 150 of the package structure 100 e of the electronic device in FIG. 6 is disposed on the second substrate 120 , and the first barrier structure 150 protrudes from the second substrate 120 toward the outer surface 110 b of the first substrate 110 .
  • FIG. 7 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 f of the electronic device in FIG. 7 is similar to the package structure 100 e of the electronic device in FIG. 6 , and the difference lies in that the electronic device 130 in the package structure 100 f of the electronic device in FIG. 7 is disposed on the first substrate 110 .
  • FIG. 8 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 g of the electronic device in FIG. 8 is similar to the package structure 100 e of the electronic device in FIG. 6 , and the difference lies in that the package structure 100 g of the electronic device in FIG. 8 further includes a second barrier structure 160 .
  • the second barrier structure 160 is disposed on the inner surface 110 a of the first substrate 110 , and is disposed corresponding to the periphery portion 114 of the first substrate 110 .
  • the second barrier structure 160 protrudes from the inner surface 110 a of the first substrate 110 toward the second substrate 120 .
  • the function of the second barrier structure 160 is similar to that of the first barrier structure 150 . Accordingly, the package structure 100 g of the electronic device has a better capability in blocking moisture and oxygen, and thereby the service life of the electronic device 130 is further extended effectively.
  • FIG. 9 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 h of the electronic device in FIG. 9 is similar to the package structure 100 g of the electronic device in FIG. 8 , and the difference lies in that the electronic device 130 in the package structure 100 h of the electronic device in FIG. 9 is disposed on the first substrate 110 .
  • FIG. 10 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 i of the electronic device in FIG. 10 is similar to the package structure 100 g of the electronic device in FIG. 8 , and the difference lies in that the package structure 100 i of the electronic device in FIG. 10 further includes an extending portion 170 .
  • the package structures 100 a , 100 c and 100 e of the electronic device in the embodiments of FIGS. 1A , 4 and 6 may also further include the extending portion 170 .
  • the extending portion 170 is connected with two adjacent covering portions 124 , and the extending portion 170 covers the outer surface 110 b of the first substrate 110 .
  • the second substrate 120 of the package structure 100 i of the electronic device further includes the extending portion 170 extending from the covering portions 124 .
  • the extending portion 170 and the sealant 140 further covers the outer surface 110 b of the first substrate 110 originally exposed by the covering portions 124 .
  • the sealant 140 located between the extending portion 170 and the first substrate 110 is substantially covered by the extending portion 170 , and therefore it is more uneasy for moisture and oxygen to enter the package structure 100 i of the electronic device.
  • the package structure 110 i of the electronic device has a better capability in blocking moisture and oxygen, and thereby further extends the service life of the electronic device 130 effectively.
  • the covering portions 124 of the second substrate 120 are attached more closely to the outer surface 110 b of the first substrate 110 through the extending portion 170 and the sealant 140 disposed extendedly.
  • FIG. 11 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 j of the electronic device in FIG. 11 is similar to the package structure 100 i of the electronic device in FIG. 10 , and the difference lies in that the electronic device 130 in the package structure 100 j of the electronic device in FIG. 11 is disposed on the first substrate 110 . That is, the package structures 100 b , 100 d , 100 f and 100 h of the electronic device in the embodiments of FIGS. 3 , 5 , 7 and 9 may also further include the extending portion 170 .
  • FIG. 12 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 k of the electronic device in FIG. 12 is similar to the package structure 100 i of the electronic device in FIG. 10 , and the difference lies in that the second barrier structure 160 of the package structure 100 k of the electronic device in FIG. 12 is disposed on the second substrate 120 , and is disposed corresponding to the first light-transmitting portion 112 of the first substrate 110 .
  • the second barrier structure 160 protrudes from the second substrate 120 toward the outer surface 110 b of the first substrate 110 .
  • the package structures 100 a to 100 j of the electronic device are all double-side light-emitting electronic devices; however, the disclosure is not limited thereto.
  • the package structure 100 k of the electronic device may dispose a reflective layer (not shown) on a non-light-emitting side thereof, such as the first light-transmitting portion 112 to form a single-side light-emitting electronic device, and light of the electronic device 130 is emitted from the second light-transmitting portion 122 of the second substrate.
  • FIG. 13 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 1001 of the electronic device in FIG. 13 is similar to the package structure 100 k of the electronic device in FIG. 12 , and the difference lies in that the electronic device 130 in the package structure 1001 of the electronic device in FIG. 13 is disposed on the first substrate 110 .
  • FIG. 14 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 m of the electronic device in FIG. 14 is similar to the package structure 100 a of the electronic device in FIG. 1 , and the difference lies in that the package structure 100 m of the electronic device in FIG. 14 further includes a first extending portion 180 and a second extending portion 190 .
  • the package structures 100 c , 100 e and 100 g of the electronic device in the embodiments of FIGS. 4 , 6 and 8 may also further include the first extending portion 180 and the second extending portion 190 .
  • the first extending portion 180 extends from one covering portion 124 a , and the first extending portion 180 covers an outer surface 110 b of the first substrate 110 .
  • the second extending portion 190 extends from the other covering portion 124 b , and the second extending portion 190 covers the first extending portion 180 .
  • the unfolded covering portion 124 a is folded first so that the first extending portion 180 covers the outer surface 110 b of the first substrate 110 . Then, the unfolded covering portion 124 b is folded so that the second extending portion 190 covers the first extending portion 180 to form the structure as shown in FIG. 14 .
  • the shapes of the covering portion 124 b connected with the second extending portion 190 and the covering portion 124 a connected with the first extending portion 180 are different.
  • the covering portion 124 a covers the periphery portion 114 of the first substrate 110 and one of the side surfaces 110 s of the first substrate 110 .
  • the covering portions 124 b cover the periphery portion 114 of the first substrate 110 and the other side surface 110 s of the first substrate 110 .
  • the covering portion 124 b further covers side surfaces 180 s of the first extending portion 180 .
  • the first barrier structure 150 is disposed corresponding to the periphery portion 114 and is disposed on the inner surface 110 a of the first substrate 110 .
  • the package structure 100 m of the electronic device further includes the second barrier structure 160 .
  • the second barrier structure 160 is disposed corresponding to the periphery portion 114 of the first substrate 110 , and is disposed on the second substrate 120 .
  • the second barrier structure 160 is disposed on the first extending portion 180 of the second substrate 120 and is continuously disposed on the second extending portion 190 , wherein the second barrier structure 160 located on the first extending portion 180 protrudes toward the outer surface 110 b of the first substrate 110 , and the second barrier structure 160 located on the second extending portion 190 protrudes toward the first extending portion 180 .
  • FIG. 15 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 n of the electronic device in FIG. 15 is similar to the package structure 100 m of the electronic device in FIG. 14 , and the difference lies in that the electronic device 130 in the package structure 100 n of the electronic device in FIG. 15 is disposed on the first substrate 110 .
  • the package structures 100 b , 100 d , 100 f and 100 h of the electronic device in the embodiments of FIGS. 3 , 5 , 7 and 9 may also further include the first extending portion 180 and the second extending portion 190 .
  • FIG. 16 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 o of the electronic device in FIG. 16 is similar to the package structure 100 m of the electronic device in FIG. 14 , and the difference lies in that the second barrier structure 160 of the package structure 100 o of the electronic device in FIG. 16 is disposed corresponding to the first light-transmitting portion 112 of the first substrate 110 and is disposed on the second substrate 120 .
  • the package structure 100 o of the electronic device is, for example, a single-side light-emitting electronic device, and light of the electronic device 130 is emitted from the second light-transmitting portion 122 of the second substrate 120 .
  • FIG. 17 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 p of the electronic device in FIG. 17 is similar to the package structure 100 o of the electronic device in FIG. 16 , and the difference lies in that the electronic device 130 in the package structure 100 p of the electronic device in FIG. 17 is disposed on the first substrate 110 .
  • FIG. 18 is a schematic cross-sectional view of a package structure of electronic device according to another embodiment of the disclosure.
  • a package structure 100 q of the electronic device of the present embodiment includes the first substrate 110 , the electronic device 130 , a barrier layer 200 , a second substrate 210 and the first barrier structure 150 .
  • elements identical to the above embodiments are marked with identical numerals, and technical contents thereof may be referred to in the above embodiments.
  • the first substrate 110 includes a first light-transmitting portion 112 and a first periphery portion 114 surrounding the first light-transmitting portion 112 .
  • the first substrate 110 includes an inner surface 110 a and an outer surface 110 b .
  • the electronic device 130 is disposed on the inner surface 110 a of the first substrate 110 .
  • the barrier layer 200 includes a main portion 202 and two covering portions 204 located on two opposite sides of the main portion 202 , wherein the main portion 202 and the first light-transmitting portion 112 are disposed correspondingly, and the main portion 202 covers the outer surface 110 b of the first substrate 110 .
  • the covering portions 204 cover the first periphery portion 114 of the first substrate 110 located on two opposite sides of the first light-transmitting portion 112 , covers the electronic device 130 located on the first periphery portion 114 of the first substrate 110 , covers the two opposite side surfaces 110 s of the first substrate 110 , and covers two opposite side surfaces 130 s of the electronic device 130 .
  • the material of the barrier layer 200 may be organic materials, metallic materials or inorganic materials, wherein the organic materials are, for example, small-molecular materials, organic oligomers, mixtures of oligomers and inorganic materials or mixtures of organic small-molecule and inorganic materials.
  • the molecular weight of organic small-molecule compounds is between approximately 10 g/mol to 5,000 g/mol, such as Alq3(Tris-(8-hydroxyquinoline)aluminum), alpha-NPB(N,N′-Dis(naphthalene-1-yl)-N,N′-diphenyl-benzidine) or CuPc(Phthalocyanine copper complex).
  • the molecular weight of the organic Oligomers is between proximately 500 g/mol to 9,000 g/mol, such as phenylene vinylene oligomers or fluorene oligomers.
  • the molecular weight of the organic-inorganic co-steaming materials is between proximately 3 g/mol to 500 g/mol.
  • the metallic materials are, for example, Al, Ag, Au, Be, Cr, Cu, Co, Fe, Ge, Ir, In, Mo, Mn, Mg, Ni, Nb, Pb, Pd, Pt, Ru, Rh, Sn, Si, Sb, Se, Ti, Ta, Te, V, W, Zr, Zn, Mg/Ag, Al/Ag, Al/Si, Al/Si/Cu, Au/Ge, Au/Be, Au/Ge/Ni, Ni/Cr, Pb/Sn or In/Sn.
  • the inorganic materials are, for example, ITO, IZO, AZO, WO3, MoO3, SiOx, SiNx, SiOxNy, Al2O3, AlN, BaTiO3, CeO2, Cr2O3, CuO, Dy2O3, Er2O3, Eu2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, PbTiO3, MgO, MnO2, Nd2O3, NiO, Nb2O5, Pr2O3, Sm2O3, SiO2, SiO, Ta2O5, ThO2, SnO2, TiO3, Y2O3, ZnO, ZrO2, CdTe, ZnTe, CdSe, CdS, ZnS or MoS2.
  • the covering portions 204 of the barrier layer 200 are, for example, covering structures formed by curling part of the barrier layer 200 to cover the first periphery portion 114 of the first substrate 110 and part of the electronic device 130 . Therefore, the covering portions 204 have bent shapes where correspond to the side surfaces 110 s of the first substrate 110 and the side surfaces 130 s of the electronic device 130 .
  • the bather layer 200 effectively reduces the possibility of direct contact of moisture and oxygen with the electronic device 130 .
  • the second substrate 210 is disposed opposite to the first substrate 110 , and the electronic device 130 is disposed between the first substrate 110 and the second substrate 210 .
  • the second substrate 210 includes a second light-transmitting portion 212 and a second periphery portion 214 surrounding the second light-transmitting portion 212 .
  • the second light-transmitting portion 212 is disposed corresponding to the first light-transmitting portion 112
  • the second periphery portions 214 are disposed corresponding to the first periphery portion 114 .
  • a sealant 140 is a selective material.
  • the sealant 140 is disposed between the first substrate 110 and the second substrate 210 for binding, and the electronic device 130 is packaged between the first substrate 110 and the second substrate 210 .
  • the second substrate 210 covers the sealant 140 , the entry of moisture and oxygen from the sealant 140 into the electronic device 130 is reduced.
  • the second substrate 210 of the present embodiment is, for example, a touch panel having a touch control function, and is disposed on one side of the display face of the electronic device 130 , for example.
  • the second substrate 210 has both functions of touch control function and blockage of moisture and oxygen.
  • the first barrier structure 150 is disposed on the second periphery portions 214 of the second substrate 210 and in the sealant 140 .
  • the first bather structure 150 is disposed corresponding to the first periphery portion 114 of the first substrate 110 and surrounding the electronic device 130 . Therefore, the capability of the package structure 100 q of the electronic device in blocking moisture and oxygen on all sides is effectively increased. Thereby, the package structure 100 q of the electronic device has good capability in blocking moisture and oxygen.
  • a gap d1 exists between the first barrier structure 150 and the barrier layer 200 .
  • the size of the gap d1 is between 0 ⁇ m and 100 ⁇ m. The smaller the gap d1 is, the less easy it is for moisture and oxygen to pass the first barrier structure 150 through the gap d1.
  • Package structures of the electronic device in experimental examples 1 to 3 and a comparative example are shown in FIG. 3 , wherein the material of the first substrate is a PI, and the material of the second substrate is a metal foil.
  • the electronic device is an Active Matrix Organic Light Emitting Diode, and the material of the first barrier structure is a metal foil.
  • the first and second substrates are closely attached to each other with a sealant having an approximate thickness of 20 ⁇ m, wherein the size of a gap between the barrier structure and the first substrate of the package structure of electronic device in the experimental example 1 is approximately 11 ⁇ m, and the size of a gap between the barrier structure and the first substrate of the package structure of electronic device in the experimental example 2 is approximately 3
  • the package structures of the electronic device in the experimental examples 1 and 2 and the comparative example are tested with high temperature and high humidity. That is, the package structures of the electronic device for test are arranged in an environment having a temperature of 60° C. and a relative humidity of 90% RH for a period of time (i.e. testing time), and then the package structures of the electronic device for test are removed and the electronic devices are turned on. Ratios of normal pixels are measured, and testing times are 0 hour (hr) to 1,000 hrs. Criteria of the number and height of the barrier structures used in the package structures of the electronic device in the experimental examples 1 and 2 and the comparative example are shown in Table 1. Testing results of the ratio of illuminating pixels of the electronic device are shown in Table 2.
  • the package structure of electronic device of the disclosure includes a barrier structure disposed continuously surrounding the device disposition region, and the electronic device is disposed in the device disposition region. Since the barrier structure blocks the transmission of moisture and oxygen effectively, the service life of the electronic device is effectively extended.
  • the package structure of electronic device in the disclosure further covers the periphery portion of the first substrate with the sealant and the covering portions of the second substrate, and therefore further extends the transmission path of moisture and oxygen into the electronic device in the device disposition region. Thereby, the service life of the electronic device is effectively extended.

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US20160174366A1 (en) 2016-06-16

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