US20140158334A1 - Thermal management system with variable-volume material - Google Patents

Thermal management system with variable-volume material Download PDF

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Publication number
US20140158334A1
US20140158334A1 US14/128,266 US201214128266A US2014158334A1 US 20140158334 A1 US20140158334 A1 US 20140158334A1 US 201214128266 A US201214128266 A US 201214128266A US 2014158334 A1 US2014158334 A1 US 2014158334A1
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US
United States
Prior art keywords
heat
thermal management
management system
thermal
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/128,266
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English (en)
Inventor
Olivier Dellea
Philippe Coronel
Jérôme Gavillet
Emmanuel Ollier
Helga Szambolics
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES reassignment COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CORONEL, PHILIPPE, DELLEA, OLIVIER, GAVILLET, JEROME, OLLIER, Emmanuel, SZAMBOLICS, Helga
Publication of US20140158334A1 publication Critical patent/US20140158334A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/02—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature
    • G05D23/028—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature with fusing sensing element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/008—Variable conductance materials; Thermal switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Switch 6 comprises a chamber 10 containing a material 12 , the volume of which increases when it is heated. Above a given temperature, called critical temperature T C , the material provides a thermal connection between the first and second conductors. The heat-transfer material partially fills chamber 10 , at least when it does not thermally connect the two heat conductors.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Control Of Temperature (AREA)
  • Control Of Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US14/128,266 2011-06-22 2012-06-21 Thermal management system with variable-volume material Abandoned US20140158334A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1155511 2011-06-22
FR1155511A FR2977121B1 (fr) 2011-06-22 2011-06-22 Systeme de gestion thermique a materiau a volume variable
PCT/EP2012/062001 WO2012175627A2 (fr) 2011-06-22 2012-06-21 Systeme de gestion thermique a materiau a volume variable

Publications (1)

Publication Number Publication Date
US20140158334A1 true US20140158334A1 (en) 2014-06-12

Family

ID=46321044

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/128,266 Abandoned US20140158334A1 (en) 2011-06-22 2012-06-21 Thermal management system with variable-volume material

Country Status (4)

Country Link
US (1) US20140158334A1 (fr)
EP (1) EP2724108A2 (fr)
FR (1) FR2977121B1 (fr)
WO (1) WO2012175627A2 (fr)

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110198059A1 (en) * 2008-08-01 2011-08-18 Commissariat A L'energie Atomique Et Aux Ene Alt Heat exchange structure and cooling device comprising such a structure
US9234879B2 (en) 2013-07-22 2016-01-12 Commissariat à l'énergie atomique et aux énergies alternatives Device comprising a fluid channel provided with at least one micro or nanoelectronic system and method for carrying out such a device
US20160021786A1 (en) * 2014-07-18 2016-01-21 Kabushiki Kaisha Toshiba Electronic apparatus
US9318681B2 (en) 2010-06-23 2016-04-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Thermogenerator comprising phase-change materials
US9340410B2 (en) 2013-07-22 2016-05-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device
US9358575B2 (en) 2012-02-10 2016-06-07 Commissariat à l'énergie atomique et aux énergies alternatives Method for depositing particles onto a substrate, including a step of structuring a particle film on a liquid conveyor
US9444371B2 (en) 2012-02-14 2016-09-13 Commisariat A L'energie Atomique Et Aux Energies Alternatives Device for recovering and converting heat energy into electrical energy
US9533838B2 (en) 2012-01-02 2017-01-03 Commissariat à l'énergie atomique et aux énergies alternatives Method for transferring objects onto a substrate by means of a compact film of particles
GB2542696A (en) * 2015-09-09 2017-03-29 Gen Electric Thermal management system
US9636704B2 (en) 2012-02-10 2017-05-02 Commissariat à l'énergie atomique et aux énergies alternatives Method for depositing a particle film onto a substrate via a liquid conveyor, including a step of structuring the film on the substrate
US9667121B2 (en) 2013-05-24 2017-05-30 Commissariat à l'énergie atomique et aux énergies alternatives Device for converting heat energy into electrical energy with heat-sensitive molecules
US9744557B2 (en) 2012-09-10 2017-08-29 Commissariat à l'énergie atomique et aux énergies alternative Method for forming a film of particles on a carrier liquid, with movement of an inclined ramp for compressing the particles
US9793162B2 (en) 2014-10-21 2017-10-17 Commissariat à l'énergie atomique et aux énergies alternatives Method for producing interconnections for 3D integrated circuit
US9873227B2 (en) 2012-02-10 2018-01-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for transferring objects onto a substrate using a compact particle film, including a step of producing connectors on the objects
JP2018025319A (ja) * 2016-08-08 2018-02-15 株式会社デンソー 熱スイッチ装置
US9962729B2 (en) 2013-10-11 2018-05-08 Commissariat à l'énergie atomique et aux énergies alternatives Installation and method with improved performance for forming a compact film of particles on the surface of a carrier fluid
US20180142923A1 (en) * 2016-11-21 2018-05-24 Stmicroelectronics (Crolles 2) Sas Heat-transferring and electrically connecting device and electronic device
US10010906B2 (en) 2013-05-13 2018-07-03 Commissariat à l'énergie atomique et aux énergies alternatives Process for depositing a compact film of particles on the internal surface of a part having a hollow delimited by this internal surface
US20180209750A1 (en) * 2017-01-26 2018-07-26 Samsung Electronics Co., Ltd. Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacity
JP2019087728A (ja) * 2017-11-08 2019-06-06 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． ゼロ電力自動熱調節のためのシステムおよび方法
WO2019129896A1 (fr) * 2017-12-29 2019-07-04 Airbus Defence And Space Sa Connecteur thermique à conductance élevée
EP3509099A1 (fr) * 2018-01-04 2019-07-10 Juniper Networks, Inc. Dissipateur thermique
US10365047B2 (en) 2016-06-21 2019-07-30 Ge Aviation Systems Llc Electronics cooling with multi-phase heat exchange and heat spreader
US10646074B2 (en) 2014-09-30 2020-05-12 Seb S.A. Removable handle comprising a thermoelectric generator
US10694889B2 (en) 2014-09-30 2020-06-30 Seb S.A. Handle comprising a thermoelectric generator
US10772236B2 (en) * 2018-06-26 2020-09-08 Lenovo (Beijing) Co., Ltd. Heat dissipation device and method, and electronic device
US10866036B1 (en) 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch
DE102019216924A1 (de) * 2019-11-04 2021-05-06 Robert Bosch Gmbh Laseremitteranordnung sowie LiDAR-System
CN113097599A (zh) * 2021-04-07 2021-07-09 华北电力大学 基于过冷相变材料被动式电池热调节器、方法和管理系统
US11260953B2 (en) 2019-11-15 2022-03-01 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260976B2 (en) 2019-11-15 2022-03-01 General Electric Company System for reducing thermal stresses in a leading edge of a high speed vehicle
US11267551B2 (en) 2019-11-15 2022-03-08 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11352120B2 (en) 2019-11-15 2022-06-07 General Electric Company System and method for cooling a leading edge of a high speed vehicle
JP2022535612A (ja) * 2019-07-15 2022-08-09 キウトラ ゲーエムベーハー 熱スイッチ
US11407488B2 (en) 2020-12-14 2022-08-09 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11427330B2 (en) 2019-11-15 2022-08-30 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11577817B2 (en) 2021-02-11 2023-02-14 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US20230172431A1 (en) * 2019-09-05 2023-06-08 Karl Storz Se & Co. Kg Apparatus for heat dissipation and use of such apparatus
US11745847B2 (en) 2020-12-08 2023-09-05 General Electric Company System and method for cooling a leading edge of a high speed vehicle

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CN107168415B (zh) * 2017-06-01 2020-03-31 西南电子技术研究所（中国电子科技集团公司第十研究所） 快响应相变温控装置
CN109060495B (zh) * 2018-09-11 2024-03-15 四川省机械研究设计院(集团)有限公司 可调节热阻的装置

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US3302703A (en) * 1964-07-03 1967-02-07 Trw Inc Thermal valve
US3763454A (en) * 1972-02-22 1973-10-02 Tektronix Inc Thermal switch
US3957107A (en) * 1975-02-27 1976-05-18 The United States Of America As Represented By The Secretary Of The Air Force Thermal switch
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US6317321B1 (en) * 1994-11-04 2001-11-13 Compaq Computer Corporation Lap-top enclosure having surface coated with heat-absorbing phase-change material
US7682690B2 (en) * 2002-02-06 2010-03-23 Parker-Hannifin Corporation Thermal management materials having a phase change dispersion
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US7191823B2 (en) * 2003-03-20 2007-03-20 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optoelectronic module and a thermal switch therefor
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Cited By (54)

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US9362201B2 (en) 2008-08-01 2016-06-07 Commissariat A L'energie Atomique Et Aux Energies Alternatives Heat exchange structure and cooling device comprising such a structure
US20110198059A1 (en) * 2008-08-01 2011-08-18 Commissariat A L'energie Atomique Et Aux Ene Alt Heat exchange structure and cooling device comprising such a structure
US9318681B2 (en) 2010-06-23 2016-04-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Thermogenerator comprising phase-change materials
US9533838B2 (en) 2012-01-02 2017-01-03 Commissariat à l'énergie atomique et aux énergies alternatives Method for transferring objects onto a substrate by means of a compact film of particles
US9636704B2 (en) 2012-02-10 2017-05-02 Commissariat à l'énergie atomique et aux énergies alternatives Method for depositing a particle film onto a substrate via a liquid conveyor, including a step of structuring the film on the substrate
US9358575B2 (en) 2012-02-10 2016-06-07 Commissariat à l'énergie atomique et aux énergies alternatives Method for depositing particles onto a substrate, including a step of structuring a particle film on a liquid conveyor
US9873227B2 (en) 2012-02-10 2018-01-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for transferring objects onto a substrate using a compact particle film, including a step of producing connectors on the objects
US9444371B2 (en) 2012-02-14 2016-09-13 Commisariat A L'energie Atomique Et Aux Energies Alternatives Device for recovering and converting heat energy into electrical energy
US9744557B2 (en) 2012-09-10 2017-08-29 Commissariat à l'énergie atomique et aux énergies alternative Method for forming a film of particles on a carrier liquid, with movement of an inclined ramp for compressing the particles
US10010906B2 (en) 2013-05-13 2018-07-03 Commissariat à l'énergie atomique et aux énergies alternatives Process for depositing a compact film of particles on the internal surface of a part having a hollow delimited by this internal surface
US9667121B2 (en) 2013-05-24 2017-05-30 Commissariat à l'énergie atomique et aux énergies alternatives Device for converting heat energy into electrical energy with heat-sensitive molecules
US9234879B2 (en) 2013-07-22 2016-01-12 Commissariat à l'énergie atomique et aux énergies alternatives Device comprising a fluid channel provided with at least one micro or nanoelectronic system and method for carrying out such a device
US9340410B2 (en) 2013-07-22 2016-05-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device
US9962729B2 (en) 2013-10-11 2018-05-08 Commissariat à l'énergie atomique et aux énergies alternatives Installation and method with improved performance for forming a compact film of particles on the surface of a carrier fluid
US20160021786A1 (en) * 2014-07-18 2016-01-21 Kabushiki Kaisha Toshiba Electronic apparatus
US10646074B2 (en) 2014-09-30 2020-05-12 Seb S.A. Removable handle comprising a thermoelectric generator
US10694889B2 (en) 2014-09-30 2020-06-30 Seb S.A. Handle comprising a thermoelectric generator
US9793162B2 (en) 2014-10-21 2017-10-17 Commissariat à l'énergie atomique et aux énergies alternatives Method for producing interconnections for 3D integrated circuit
GB2542696A (en) * 2015-09-09 2017-03-29 Gen Electric Thermal management system
US10386127B2 (en) 2015-09-09 2019-08-20 General Electric Company Thermal management system
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US10365047B2 (en) 2016-06-21 2019-07-30 Ge Aviation Systems Llc Electronics cooling with multi-phase heat exchange and heat spreader
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FR2977121B1 (fr) 2014-04-25
WO2012175627A2 (fr) 2012-12-27

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