US20140098505A1 - Heterogeneous encapsulation - Google Patents
Heterogeneous encapsulation Download PDFInfo
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- US20140098505A1 US20140098505A1 US13/646,610 US201213646610A US2014098505A1 US 20140098505 A1 US20140098505 A1 US 20140098505A1 US 201213646610 A US201213646610 A US 201213646610A US 2014098505 A1 US2014098505 A1 US 2014098505A1
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- Prior art keywords
- encapsulant
- printed circuit
- circuit board
- electronic device
- region
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Definitions
- the present invention relates generally to techniques of encapsulating integrated circuits and other electronic components on a substrate, such as a printed circuit board, to to mechanically, electrically and/or chemically protect the encapsulated components.
- PCB printed circuit board
- the PCB or other type of substrate provides a base that supports the electronic components, including integrated circuits, electronic subassemblies, capacitors, resistors and the like, and provides connection paths that electrically connect the various components together to form various electrical circuits that are required for a properly functioning electronic device.
- the electronic components are encapsulated with a protective cover that mechanically, electrically and/or chemically protects the encapsulated components.
- a protective cover that mechanically, electrically and/or chemically protects the encapsulated components.
- various electronic components may be encapsulated with an epoxy encapsulant to protect the encapsulated components from environmental hazards including moisture and various chemicals that they may otherwise be exposed to. While a number of different encapsulation techniques have been developed, improvements are desirable.
- Embodiments of the invention employ two or more different types of encapsulant to mechanically, electrically and/or chemically protect various electronic components attached to a substrate, such as a printed circuit board, in an electronic device.
- the different encapsulants may have different mechanical, electrical and physical properties that better protect different components depending on the location of the components on substrate or better protect different portions of the substrate itself.
- a surface mount connector may have multiple leads that physically and electrically couple the connector to a printed circuit board. The body of the connector may be positioned off the printed circuit board while the leads are soldered to bonding pads on the circuit board.
- Encapsulant may be used to seal the interface between the connector and the printed circuit board to prevent the ingress of moisture or various chemicals, but the connector may need to be mechanically compliant with the circuit board for one or more reasons.
- Embodiments of the invention may use a compliant or relatively soft encapsulant, such as a silicone-based encapsulant, to provide the desired seal and environmental protection in this area. In a different area of the printed circuit board, however, a precise pattern of encapsulant may be needed to cover various closely spaced electronic components while leaving other areas of the printed circuit board uncovered with encapsulant.
- Embodiments of the invention may use an epoxy encapsulant that can be applied with a jet dispenser to provide the intricate encapsulation pattern required.
- One embodiment of the invention pertains to an electronic device that includes a substrate and at least first and second electronic components attached to the substrate.
- the first electronic component is sealed with a first encapsulant and the second electronic component is sealed with a second encapsulant that has mechanical, electrical and/or chemical properties different from mechanical, electrical and/or chemical properties of the first encapsulant.
- the first encapsulant is a relatively hard and rigid epoxy encapsulant and the second encapsulant is a relatively compliant silicone encapsulant.
- the substrate can be a printed circuit board
- the second component can be an electrical connector and the second encapsulant can extend between a portion of the body of the electrical connector and the printed circuit board.
- Another embodiment of the invention pertains to an electronic device that includes at least a first electronic component attached to a first region of the substrate and sealed with a first encapsulant.
- a second encapsulant that has mechanical, electrical and/or chemical properties different from mechanical, electrical and/or chemical properties of the first encapsulant is formed over a second region of the substrate.
- the second encapsulant protects the substrate itself or the overall assembly.
- the second encapsulant protects one or more electronic components attached to the substrate in the second region.
- Another embodiment of the invention pertains to an electronic device that includes a printed circuit board, a first set of bonding pads formed on the printed circuit board and a plurality of electronic components attached to a first region of the printed circuit.
- a first encapsulant covers the first region of the printed circuit board including the first plurality of electronic components.
- the electronic device further includes an electronic connector that has a housing and a plurality of leads that extend from the housing and are attached to the first set of bonding pads. The connector is positioned off of and attached to the printed circuit board such that an exterior surface of the housing of the electronic connector is spaced apart from a second region of the printed circuit board different than the first region.
- a second encapsulant that is more compliant than the first encapsulant extends between the exterior surface of the housing to the second region of the printed circuit board and covers the plurality of leads attached to the first plurality of bonding pads.
- the first encapsulant is an epoxy material and the second encapsulant is a silicone material.
- Additional embodiments of the invention pertain to methods of assembling a substrate or printed circuit board assembly.
- electronic components are attached to a printed circuit board or other type of substrate.
- a first region of the printed circuit board is sealed with a first encapsulant and a second region of the printed circuit board is sealed with a second encapsulant that has mechanical and chemical properties different from mechanical and chemical properties of the first encapsulant.
- the first encapsulant is a relatively hard and rigid epoxy encapsulant that is applied over one or more of the electronic components attached to the printed circuit board and the second encapsulant is a relatively compliant silicone encapsulant that is applied between an electrical connector and the printed circuit board and covers a plurality of leads that extend out of the connector and are electrically attached to bonding pads on the printed circuit board.
- the first encapsulant is an epoxy material and the second encapsulant is a silicone material.
- FIG. 1 is a diagram that illustrates a top plan view of a PCB assembly 100 in accordance with an embodiment of the invention
- FIG. 2 is a diagram that illustrates a cross-sectional view of PCB assembly 100 shown in FIG. 1 ;
- FIG. 3 is a diagram that illustrates a top plan view of a PCB assembly 150 in accordance with another embodiment of the invention in a first partial state of assembly;
- FIG. 4 is a diagram that illustrates a top plan view of PCB assembly 150 shown in FIG. 3 in a second partial state of assembly;
- FIG. 5 is a diagram that illustrates a top plan view of PCB assembly 150 shown in FIG. 3 in a third partial state of assembly;
- FIG. 6 is a simplified cross-sectional view of PCB assembly 150 in accordance with one embodiment of the invention.
- FIG. 7 is a simplified cross-sectional view of PCB assembly 150 shown in FIG. 6 when connector 140 is subject to a lateral force;
- FIG. 8 is a simplified cross-sectional view of a portion of PCB assembly 150 showing an underfill encapsulant applied beneath an electronic component 119 according to an embodiment of the invention
- FIG. 9 is a diagram that illustrates a cross-sectional view of a PCB assembly 180 in accordance with another embodiment of the invention.
- FIG. 10 is a diagram that illustrates a cross-sectional view of a PCB assembly 190 in accordance with yet another embodiment of the invention.
- FIG. 11 is a process by which a PCB assembly using two or more encapsulants can be made in accordance with an embodiment of the invention.
- Certain embodiments of the present invention relate to substrate assemblies having electronic components attached thereto and encapsulated with a protective encapsulant.
- the substrate assemblies may be employed in portable electronic devices, such as portable media players, cellular telephones, tablet computers, laptop computers and the like including accessories for such devices, or may be employed in electronic devices that are not traditionally thought of as portable devices such as desktop computers and video displays, among other devices.
- the substrate employed in the assembly may include any type of substrate used for attaching integrated circuits including a ceramic substrate, a glass substrate, a silicon substrate, a polyimide substrate or a printed circuit board (PCB) among others.
- PCB printed circuit board
- FIG. 1 is simplified a top schematic view of an exemplary PCB assembly 100 in accordance with one embodiment of the invention.
- PCB assembly 100 includes a printed circuit board 105 comprised of, for example, epoxy/glass-fiber/metal, ceramic/metal, polyamide film/metal.
- PCB 105 may have a portion of outer surfaces that are metallic and designed for the electrical attachment of exemplary electronic components 110 and 119 , which may be attached to the PCB in regions 111 and 112 , respectively.
- Attachment of electronic components 110 , 119 to PCB 105 may be performed with any electrically conductive material including, for example, solder alloys and conductive adhesive. Myriad processes may be employed to perform the attachment, for example, convective solder reflow, wave soldering and epoxy dispensing/placement/curing.
- Electronic components 110 , 119 may include integrated circuits, electronic subassemblies, electrical connectors, capacitors, resistors and the like.
- one or more encapsulants may be dispensed on top of the electronic components, forming a protective barrier around the components.
- electronic components 110 mounted in region 111 of PCB 105 may require different protection than electronic components 119 mounted in region 112 .
- two different encapsulants may be employed where region 111 uses a first encapsulant 130 and region 112 uses a second encapsulant 135 .
- the different encapsulants may have different mechanical, electrical and/or chemical properties designed to protect the electronic components 110 , 119 and the areas 111 , 112 differently.
- the different mechanical, electrical, chemical and physical properties of encapsulants 130 , 135 and exemplary benefits thereof, will be discussed in more detail below.
- PCB assembly 100 may have one or more regions, such as regions 116 and 117 shown in FIG. 1 , designated as keep out regions where the encapsulant must be kept out of altogether or must not enter until a later stage of assembly.
- keep out region 116 may be a feature attached to PCB 105 , such as a vertical stand-off that helps keep separation between PCB 105 and an exterior shield or housing of an electronic device that the PCB assembly 100 is positioned within, while region 117 may contain a plurality of bonding pads 125 that need to remain exposed for a subsequent step in which a cable, a flex circuit or other component is bonded to the bonding pads.
- encapsulants 130 , 135 may be required to be dispensed carefully and may have the necessary properties to not run or bleed into keep out regions 116 and 117 .
- FIG. 1 is a top view only of PCB assembly 100 and thus shows only one of the two major sides of PCB 105
- the PCB assembly may include electronic components attached to the opposing side of PCB 105 as well.
- FIG. 2 which is a simplified cross-sectional view of PCB 100 shown in FIG. 1 , depicts electronic components formed on each such side and depicts that encapsulants 130 , 135 may or may not entirely cover all of electronic components 110 , 119 .
- encapsulants 130 , 135 may cover the entirety of all the electronic components 110 , 119 , whereas in other embodiments the encapsulants may only cover the periphery of the electronic components.
- encapsulants 130 , 135 may be disposed on either or both sides of PCB 105 as shown in FIG. 2 .
- FIG. 3 is a simplified top schematic view of a PCB assembly 150 according to another embodiment of the invention at a partial stage of manufacture.
- PCB assembly 150 can be used in an electronic accessory that is an adapter that allows two electronic devices that include otherwise incompatible connectors to be electrically connected with each other to exchange information.
- the adapter may provide an electrical communication path between first and second electronic devices that could otherwise only communicate via a wireless means.
- An example of such an adapter is described in U.S. patent application Ser. No. 13/607,519, filed on Sep. 7, 2012, which is hereby incorporated by reference in its entirety.
- PCB assembly 150 includes two different encapsulants 152 and 154 along with a surface mount receptacle connector 140 with leads 145 that may be attached to a first set of bonding pads 148 on PCB 105 . More specifically, surface mount connector 140 may have multiple leads 145 that physically and electrically couple the connector to PCB 105 . As shown in FIG. 3 , connector 140 is a 30-pin connector that includes thirty leads 145 ( 1 ) . . . 145 ( 30 ) and PCB 105 includes a corresponding number of first bonding pads 148 ( 1 ) . . . 148 ( 30 ). In other embodiments of the invention, PCB assembly 150 may include a connector 140 with a different number of leads, fewer or more than thirty, and include a set of bonding pads 148 with a number of bonding pads equal to or different than the number of leads.
- Connector 140 further includes a body 142 that has a surface spaced apart from PCB 105 in a vertical, horizontal or both vertical and horizontal direction.
- Body 142 defines a cavity in which a plurality of contact structures are positioned.
- Each contact structure has a contact tip exposed within the cavity to make electrical connection to a corresponding contact in a mating plug connector and a lead that extends out of the housing and is bonded to one of the plurality of bonding pads as described above.
- each contact structure includes a beam portion and an anchor portion (neither of which are shown) between the contact tips and leads.
- the body of connector 140 is positioned off of and spaced apart from PCB 105 in the horizontal direction while leads 145 ( 1 ) . . . 145 ( 30 ) may be soldered to bonding pads 148 ( 1 ) . . . 148 ( 30 ) on the PCB.
- Encapsulant 152 may be used to seal the interface between connector 140 and PCB 105 to prevent the ingress of moisture or various chemicals, to strengthen the mechanical connection between the connector PCB 105 and/or to distribute stress or strain. Towards this end encapsulant 152 may extend from a portion of PCB 105 to a surface of connector 140 and may do so from both sides of the PCB as shown in FIG. 6 .
- encapsulant 152 may be used in any location where, through use of the electronic device that PCB assembly 150 is incorporated into, mechanical forces can be imparted to the assembly to possibly separate one or more components from PCB 105 . In the case of PCB assembly 150 and connector 140 , such separation may result in dendryte growth on the contacts due to sugars and salts that may travel through cracks in the encapsulant, which in turn may result in thermal failures.
- PCB 105 includes a second set of bonding pads 125 in a region 117 that must be initially kept free of encapsulant.
- encapsulant 152 may first be applied to extend from first and second edge portions 122 a and 122 b on opposing sides of region 117 to the body of connector 140 , covering a portion of an edge 105 a of PCB 105 as well as some of leads 145 and bonding pads 148 . While bonding pads 125 and 148 are shown as being on the same side of PCB 105 in FIG. 3 , in other embodiments of the invention bonding pads 125 and 148 can be on opposite sides of the PCB.
- PCB assembly 150 also includes a second type of encapsulant 154 to environmentally seal electronic components 110 and 119 .
- Encapsulant 154 may be an epoxy encapsulant that is harder than and relatively rigid compared to encapsulant 152 . The use of a relatively rigid non-compliant encapsulant may be beneficial in particular regions of PCB assembly 150 .
- encapsulant 154 is a jet dispensable material so that it can be applied with a jet dispenser in a precise pattern to cover certain electronic components while leaving other portions of PCB 105 free from encapsulant.
- encapsulant 154 is curable with ultra-violet radiation and heat, is UV fluorescent and does not allow outgassing of halogen elements.
- encapsulant 154 has a hardness value of medium hard or higher on the Shore D scale while encapsulant 152 has a hardness value of medium soft or less on the Shore A scale.
- PCB assembly 150 includes at least one zone 117 which is kept free of encapsulant.
- bonding pads 125 ( 1 ) . . . 125 ( 11 ) are positioned in zone 117 .
- the bonding pads 125 are kept free of encapsulant at this stage of assembly so that a flex cable (cable 156 shown in FIG. 4 ) can be bonded to the bonding pads using a hot bar or other suitable bonding operation.
- PCB assembly 150 may include a second, plug connector 142 that physically incompatible with receptacle connector 140 and is attached to PCB 105 using a flexible mount (not shown) that enables connector 142 to flex or bend in multiple dimensions. Further details of a suitable flexible mount can be found in U.S. patent application Ser. No. 13/607,598, filed on Sep. 7, 2012, which is hereby incorporated by reference in its entirety.
- Flex cable 156 extends from connector 142 to bonding pads 125 ( 1 ) . . . 125 ( 11 ).
- the end of flex cable 156 opposite connector 142 includes a plurality of connector pads (not shown) that correspond in number and are bonded to bonding pads 125 ( 1 ) . . . 125 ( 11 ). In one embodiment, the connector pads and bonding pads are bonded in a hot bar process.
- Flex cable 156 also includes a conductive spacer 158 that includes a conductive elastomer material and extends upwards from cable 156 in the vertical direction. Conductive spacer 158 can be electrically connected to an outer shield (shield 170 shown in FIG. 8 ) and provides a dam for additional encapsulant 160 that can be applied in a subsequent assembly step as described below.
- FIG. 5 which is a simplified top plan view of PCB assembly 150 at a third stage of assembly after the second stage, shows additional encapsulant 160 applied over bonding pads 125 ( 1 ) . . . 125 ( 11 ) and an end portion of flex cable 156 as well as over any remaining leads 145 and bonding pads 146 not previously covered by encapsulant 152 .
- encapsulant 160 is a compliant silicone encapsulant and is identical to encapsulant 152 .
- compliant encapsulants 152 and 160 may improve the reliability of the electronic device, as illustrated in FIG. 7 . More specifically, connector 140 may be subjected to an exemplary force depicted by “F” and the associated arrow. Thus, connector 140 may be required to flex relative to PCB 105 . If a rigid, hard encapsulant were used as encapsulants 152 and/or 160 in this area, PCB 105 or connector 140 may break or crack creating a potential path for the ingress of moisture or various chemicals or the solder connections to leads 145 may crack or break, any of which may in turn cause a subsequent failure of the electronic device.
- FIG. 8 is a cross-sectional view of an exemplary electronic component 119 .
- electronic component 119 may be a flip-chip integrated circuit with electronic leads 161 that may be attached to PCB 105 .
- Encapsulant 154 is depicted as covering the entirety of electronic device 119 .
- An optional underfill encapsulant 165 is also shown between electronic component 119 and PCB 105 .
- encapsulants 154 , 165 both have a relatively high modulus of elasticity and a coefficient of thermal expansion that may be roughly close to the coefficient of thermal expansion of electronic component 119 .
- the encapsulants may have different mechanical properties, for example, their mechanical properties may more closely match those of the PCB 105 .
- Encapsulants 135 , 165 may strengthen, stiffen and restrict flexure of PCB 105 in the local region of electronic component 119 .
- Encapsulants 135 , 165 may also add environmental or electrical protection to electronic component 119 .
- some embodiments of the invention include underfill encapsulant 165 without covering component 119 with another encapsulant.
- FIG. 9 may involve placing a metallic shield 170 over at least a portion of a PCB assembly 180 .
- Metallic shield 170 may have interference regions 182 where the shield may interfere or come in contact with encapsulant 152 , 160 .
- encapsulant 152 , 160 may be compliant, easily deforming when shield 170 is engaged.
- encapsulant 152 , 160 may be designed with a relatively slow curing rate that may allow it to be in a partially cured state having a low modulus of elasticity and a higher modulus of elasticity after fully curing.
- Such an encapsulant provides a window in which shield 170 can be assembled and attached to PCB assembly 180 prior to encapsulant 152 , 160 being fully cured. This, in turn, allows the encapsulant to be pressed towards PCB 105 by the shield in interference regions 182 further improving the seal between the shield and the encapsulant.
- encapsulant 152 , 160 may have a slower curing rate than encapsulant 154 used on PCB 105 .
- shield 170 may have a ground connection (not shown) that may interface with keep out region 116 (see FIG. 3 ). More specifically, region 116 may be required to be completely free of any encapsulant, for the ground connection to make contact with this region.
- Certain PCB regions such as 112 (see FIG. 3 ) that are encapsulated may be close to keep out regions. These areas may require encapsulant 154 to be dispensed with precision, which may require encapsulant 154 to have different properties than other encapsulants used on PCB assembly 100 . More specifically, some encapsulant dispense processes, for example, jet dispensing, may provide improved control of the encapsulant.
- jet dispensing may require the encapsulant to have a particular formulation of viscosity, thixotropic index and other properties.
- certain encapsulants even if dispensed with a syringe and needle, may need to be formulated to minimize bleeding and running to ensure they remain contained in encapsulant regions 111 , 112 (see FIG. 3 ) and do not enter keep out regions 116 , 117 .
- certain encapsulants may require different formulations as compared to other encapsulants used on PCB assembly 100 .
- an injection molding process may be used where an injection moldable plastic such as, for example, nylon, ABS or PBT may be used.
- an injection molding process may be used where an injection moldable mold compound is used such as a phenol-aralkyl type epoxy resin filled with 70% fused silica.
- an encapsulant may be used as described above.
- An encapsulant differs from the injection molding embodiments wherein an encapsulant does not employ injection molding die and the encapsulant is typically dispensed with, for example, a syringe, a jet dispenser, an ultrasonic dispenser, or other similar dispensers.
- step 205 one or more electronic components are attached to a PCB or other type of substrate.
- the electronic components may include integrated circuits, electronic subassemblies, electrical connectors, capacitors, resistors, and the like may be attached, for example, with a solder or a conductive adhesive.
- the PCB assembly may be cleaned, or may not be cleaned depending on the requirements of the encapsulant and the PCB assembly.
- a first encapsulant with particular chemical, physical, mechanical and electrical properties is dispensed in one or more regions of the PCB and on one or both sides of the PCB to environmentally seal a portion or portions of the PCB.
- the first encapsulant may cover various electronic components attached to the PCB or it may extend between a component and the PCB to cover an area of potential separation between the two.
- the encapsulant may then be cured, according to its particular requirements.
- a second encapsulant with different particular chemical, physical, mechanical and electrical properties as compared to the first encapsulant is dispensed in one or more other regions of the PCB on one or both sides of the PCB to environmentally seal another portion or portions of the PCB.
- the second encapsulant may cover various electronic components attached to the PCB or it may extend between a component and the PCB to cover an area of potential separation between the two.
- the second encapsulant may then be cured, according to its particular requirements. Additional encapsulants, different from either the first or second encapsulant, may also be applied as appropriate in steps after step 220 or after any of the subsequently described steps prior to the completion of the PCB assembly.
- a component such as flex cable 160 is bonded to bonding pads on the PCB that were purposefully left uncovered by encapsulant in steps 215 and 220 .
- the component can then be encapsulated with the same encapsulant used to encapsulate other portions of the receptacle connector.
- shield 170 can be attached to the PCB assembly as shown in FIG. 9 and in step 240 the assembly of PCB assembly can be completed and it may be installed in an appropriate electronic device.
- Some embodiments may use encapsulants that comprise an epoxy that may be heat, light or catalyst cured. Some embodiments may use encapsulants that may comprise a filler such as silica, or a ceramic to increase mechanical modulus, reduce the coefficient of thermal expansion and or to increase thermal conductivity. Other embodiments may use encapsulants with high surface free energy designed to wick into small crevices such as between a flip-chip and a PCB. Other embodiments may comprise a combination of encapsulants such as dam and fill where a viscous encapsulant is used to build a dam and a lower viscosity encapsulant is used to fill. Some encapsulants may comprise special formulations to chemically bond to particular components within PCB assembly 105 .
- the sole and exclusive indicator of the scope of the invention, and what is intended by the applicants to be the scope of the invention, is the literal and equivalent scope of the set of claims that issue from this application, in the specific form in which such claims issue, including any subsequent correction.
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Abstract
Description
- The present invention relates generally to techniques of encapsulating integrated circuits and other electronic components on a substrate, such as a printed circuit board, to to mechanically, electrically and/or chemically protect the encapsulated components.
- Many electronic devices include multiple electronic components attached to a substrate, such as a printed circuit board (PCB). The PCB or other type of substrate provides a base that supports the electronic components, including integrated circuits, electronic subassemblies, capacitors, resistors and the like, and provides connection paths that electrically connect the various components together to form various electrical circuits that are required for a properly functioning electronic device.
- In some electronic devices the electronic components are encapsulated with a protective cover that mechanically, electrically and/or chemically protects the encapsulated components. For example, in some electronic devices various electronic components may be encapsulated with an epoxy encapsulant to protect the encapsulated components from environmental hazards including moisture and various chemicals that they may otherwise be exposed to. While a number of different encapsulation techniques have been developed, improvements are desirable.
- Embodiments of the invention employ two or more different types of encapsulant to mechanically, electrically and/or chemically protect various electronic components attached to a substrate, such as a printed circuit board, in an electronic device. The different encapsulants may have different mechanical, electrical and physical properties that better protect different components depending on the location of the components on substrate or better protect different portions of the substrate itself. For example, a surface mount connector may have multiple leads that physically and electrically couple the connector to a printed circuit board. The body of the connector may be positioned off the printed circuit board while the leads are soldered to bonding pads on the circuit board. Encapsulant may be used to seal the interface between the connector and the printed circuit board to prevent the ingress of moisture or various chemicals, but the connector may need to be mechanically compliant with the circuit board for one or more reasons. Embodiments of the invention may use a compliant or relatively soft encapsulant, such as a silicone-based encapsulant, to provide the desired seal and environmental protection in this area. In a different area of the printed circuit board, however, a precise pattern of encapsulant may be needed to cover various closely spaced electronic components while leaving other areas of the printed circuit board uncovered with encapsulant. Embodiments of the invention may use an epoxy encapsulant that can be applied with a jet dispenser to provide the intricate encapsulation pattern required.
- One embodiment of the invention pertains to an electronic device that includes a substrate and at least first and second electronic components attached to the substrate. The first electronic component is sealed with a first encapsulant and the second electronic component is sealed with a second encapsulant that has mechanical, electrical and/or chemical properties different from mechanical, electrical and/or chemical properties of the first encapsulant. In some embodiments the first encapsulant is a relatively hard and rigid epoxy encapsulant and the second encapsulant is a relatively compliant silicone encapsulant. In some embodiments the substrate can be a printed circuit board, the second component can be an electrical connector and the second encapsulant can extend between a portion of the body of the electrical connector and the printed circuit board.
- Another embodiment of the invention pertains to an electronic device that includes at least a first electronic component attached to a first region of the substrate and sealed with a first encapsulant. A second encapsulant that has mechanical, electrical and/or chemical properties different from mechanical, electrical and/or chemical properties of the first encapsulant is formed over a second region of the substrate. In some embodiments the second encapsulant protects the substrate itself or the overall assembly. In other embodiments the second encapsulant protects one or more electronic components attached to the substrate in the second region.
- Another embodiment of the invention pertains to an electronic device that includes a printed circuit board, a first set of bonding pads formed on the printed circuit board and a plurality of electronic components attached to a first region of the printed circuit. A first encapsulant covers the first region of the printed circuit board including the first plurality of electronic components. The electronic device further includes an electronic connector that has a housing and a plurality of leads that extend from the housing and are attached to the first set of bonding pads. The connector is positioned off of and attached to the printed circuit board such that an exterior surface of the housing of the electronic connector is spaced apart from a second region of the printed circuit board different than the first region. A second encapsulant that is more compliant than the first encapsulant extends between the exterior surface of the housing to the second region of the printed circuit board and covers the plurality of leads attached to the first plurality of bonding pads. In some embodiments the first encapsulant is an epoxy material and the second encapsulant is a silicone material.
- Additional embodiments of the invention pertain to methods of assembling a substrate or printed circuit board assembly. According to one such embodiment, electronic components are attached to a printed circuit board or other type of substrate. A first region of the printed circuit board is sealed with a first encapsulant and a second region of the printed circuit board is sealed with a second encapsulant that has mechanical and chemical properties different from mechanical and chemical properties of the first encapsulant. In some embodiments the first encapsulant is a relatively hard and rigid epoxy encapsulant that is applied over one or more of the electronic components attached to the printed circuit board and the second encapsulant is a relatively compliant silicone encapsulant that is applied between an electrical connector and the printed circuit board and covers a plurality of leads that extend out of the connector and are electrically attached to bonding pads on the printed circuit board. In some embodiments the first encapsulant is an epoxy material and the second encapsulant is a silicone material.
- To better understand the nature and advantages of the present invention, reference should be made to the following description and the accompanying figures. It is to be understood, however, that each of the figures is provided for the purpose of illustration only and is not intended as a definition of the limits of the scope of the present invention. Also, as a general rule, and unless it is evident to the contrary from the description, where elements in different figures use identical reference numbers, the elements are generally either identical or at least similar in function or purpose.
-
FIG. 1 is a diagram that illustrates a top plan view of aPCB assembly 100 in accordance with an embodiment of the invention; -
FIG. 2 is a diagram that illustrates a cross-sectional view ofPCB assembly 100 shown inFIG. 1 ; -
FIG. 3 is a diagram that illustrates a top plan view of aPCB assembly 150 in accordance with another embodiment of the invention in a first partial state of assembly; -
FIG. 4 is a diagram that illustrates a top plan view ofPCB assembly 150 shown inFIG. 3 in a second partial state of assembly; -
FIG. 5 is a diagram that illustrates a top plan view ofPCB assembly 150 shown inFIG. 3 in a third partial state of assembly; -
FIG. 6 is a simplified cross-sectional view ofPCB assembly 150 in accordance with one embodiment of the invention; -
FIG. 7 is a simplified cross-sectional view ofPCB assembly 150 shown inFIG. 6 whenconnector 140 is subject to a lateral force; -
FIG. 8 is a simplified cross-sectional view of a portion ofPCB assembly 150 showing an underfill encapsulant applied beneath anelectronic component 119 according to an embodiment of the invention; -
FIG. 9 is a diagram that illustrates a cross-sectional view of aPCB assembly 180 in accordance with another embodiment of the invention; -
FIG. 10 is a diagram that illustrates a cross-sectional view of aPCB assembly 190 in accordance with yet another embodiment of the invention; and -
FIG. 11 is a process by which a PCB assembly using two or more encapsulants can be made in accordance with an embodiment of the invention. - Certain embodiments of the present invention relate to substrate assemblies having electronic components attached thereto and encapsulated with a protective encapsulant. The substrate assemblies may be employed in portable electronic devices, such as portable media players, cellular telephones, tablet computers, laptop computers and the like including accessories for such devices, or may be employed in electronic devices that are not traditionally thought of as portable devices such as desktop computers and video displays, among other devices. The substrate employed in the assembly may include any type of substrate used for attaching integrated circuits including a ceramic substrate, a glass substrate, a silicon substrate, a polyimide substrate or a printed circuit board (PCB) among others. Some embodiments of the invention to substrate assemblies, such as PCB assemblies, for electronic devices that include different types of encapsulates, each having different mechanical, electrical and/or chemical properties, on the same PCB assembly as described in more detail below.
- Certain embodiments of the present invention relate to PCB assemblies employed in electronic devices. Many electronic devices such as smart-phones, media players, tablet computers, and connector adapters may have PCB assemblies containing encapsulated electronic components.
FIG. 1 is simplified a top schematic view of anexemplary PCB assembly 100 in accordance with one embodiment of the invention.PCB assembly 100 includes a printedcircuit board 105 comprised of, for example, epoxy/glass-fiber/metal, ceramic/metal, polyamide film/metal. PCB 105 may have a portion of outer surfaces that are metallic and designed for the electrical attachment of exemplaryelectronic components regions electronic components PCB 105 may be performed with any electrically conductive material including, for example, solder alloys and conductive adhesive. Myriad processes may be employed to perform the attachment, for example, convective solder reflow, wave soldering and epoxy dispensing/placement/curing.Electronic components - After
electronic components PCB 105, one or more encapsulants may be dispensed on top of the electronic components, forming a protective barrier around the components. In some embodiments, it may be desirable to encapsulateelectronic components 110 inregion 111 with an encapsulant that has different mechanical, chemical and/or electrical properties than the encapsulant used to encapsulateelectronic components 119 inregion 112. For example,electronic components 110 mounted inregion 111 ofPCB 105 may require different protection thanelectronic components 119 mounted inregion 112. To provide the required protection, two different encapsulants may be employed whereregion 111 uses afirst encapsulant 130 andregion 112 uses asecond encapsulant 135. The different encapsulants may have different mechanical, electrical and/or chemical properties designed to protect theelectronic components areas encapsulants -
PCB assembly 100 may have one or more regions, such asregions FIG. 1 , designated as keep out regions where the encapsulant must be kept out of altogether or must not enter until a later stage of assembly. In one embodiment, keep outregion 116 may be a feature attached toPCB 105, such as a vertical stand-off that helps keep separation betweenPCB 105 and an exterior shield or housing of an electronic device that thePCB assembly 100 is positioned within, whileregion 117 may contain a plurality ofbonding pads 125 that need to remain exposed for a subsequent step in which a cable, a flex circuit or other component is bonded to the bonding pads. Thus, in some embodiments,encapsulants regions - While
FIG. 1 is a top view only ofPCB assembly 100 and thus shows only one of the two major sides ofPCB 105, the PCB assembly may include electronic components attached to the opposing side ofPCB 105 as well.FIG. 2 , which is a simplified cross-sectional view ofPCB 100 shown inFIG. 1 , depicts electronic components formed on each such side and depicts thatencapsulants electronic components encapsulants electronic components encapsulants PCB 105 as shown inFIG. 2 . -
FIG. 3 is a simplified top schematic view of aPCB assembly 150 according to another embodiment of the invention at a partial stage of manufacture.PCB assembly 150 can be used in an electronic accessory that is an adapter that allows two electronic devices that include otherwise incompatible connectors to be electrically connected with each other to exchange information. Specifically, the adapter may provide an electrical communication path between first and second electronic devices that could otherwise only communicate via a wireless means. An example of such an adapter is described in U.S. patent application Ser. No. 13/607,519, filed on Sep. 7, 2012, which is hereby incorporated by reference in its entirety. - As shown in
FIG. 3 ,PCB assembly 150 includes twodifferent encapsulants mount receptacle connector 140 withleads 145 that may be attached to a first set ofbonding pads 148 onPCB 105. More specifically,surface mount connector 140 may havemultiple leads 145 that physically and electrically couple the connector toPCB 105. As shown inFIG. 3 ,connector 140 is a 30-pin connector that includes thirty leads 145(1) . . . 145(30) andPCB 105 includes a corresponding number of first bonding pads 148(1) . . . 148(30). In other embodiments of the invention,PCB assembly 150 may include aconnector 140 with a different number of leads, fewer or more than thirty, and include a set ofbonding pads 148 with a number of bonding pads equal to or different than the number of leads. -
Connector 140 further includes abody 142 that has a surface spaced apart fromPCB 105 in a vertical, horizontal or both vertical and horizontal direction.Body 142 defines a cavity in which a plurality of contact structures are positioned. Each contact structure has a contact tip exposed within the cavity to make electrical connection to a corresponding contact in a mating plug connector and a lead that extends out of the housing and is bonded to one of the plurality of bonding pads as described above. In some embodiments, each contact structure includes a beam portion and an anchor portion (neither of which are shown) between the contact tips and leads. - In the embodiment depicted in
FIG. 4 , the body ofconnector 140 is positioned off of and spaced apart fromPCB 105 in the horizontal direction while leads 145(1) . . . 145(30) may be soldered to bonding pads 148(1) . . . 148(30) on the PCB.Encapsulant 152 may be used to seal the interface betweenconnector 140 andPCB 105 to prevent the ingress of moisture or various chemicals, to strengthen the mechanical connection between theconnector PCB 105 and/or to distribute stress or strain. Towards thisend encapsulant 152 may extend from a portion ofPCB 105 to a surface ofconnector 140 and may do so from both sides of the PCB as shown inFIG. 6 . Some embodiments of the invention allow the connector to remain mechanically compliant relative to the PCB and may use a compliant or relativelysoft encapsulant 152 inregion 117, such as, for example, a silicone encapsulant which is not easily separable fromPCB 105 orconnector 140, to provide the desired seal and environmental protection in this area. In other embodiments,encapsulant 152 may be used in any location where, through use of the electronic device thatPCB assembly 150 is incorporated into, mechanical forces can be imparted to the assembly to possibly separate one or more components fromPCB 105. In the case ofPCB assembly 150 andconnector 140, such separation may result in dendryte growth on the contacts due to sugars and salts that may travel through cracks in the encapsulant, which in turn may result in thermal failures. - As shown in
FIG. 3 , in oneembodiment PCB 105 includes a second set ofbonding pads 125 in aregion 117 that must be initially kept free of encapsulant. In this embodiment,encapsulant 152 may first be applied to extend from first andsecond edge portions region 117 to the body ofconnector 140, covering a portion of anedge 105 a ofPCB 105 as well as some ofleads 145 andbonding pads 148. Whilebonding pads PCB 105 inFIG. 3 , in other embodiments of theinvention bonding pads -
PCB assembly 150 also includes a second type ofencapsulant 154 to environmentally sealelectronic components Encapsulant 154 may be an epoxy encapsulant that is harder than and relatively rigid compared toencapsulant 152. The use of a relatively rigid non-compliant encapsulant may be beneficial in particular regions ofPCB assembly 150. In some embodiments,encapsulant 154 is a jet dispensable material so that it can be applied with a jet dispenser in a precise pattern to cover certain electronic components while leaving other portions ofPCB 105 free from encapsulant. Also, in some embodiments,encapsulant 154 is curable with ultra-violet radiation and heat, is UV fluorescent and does not allow outgassing of halogen elements. In some embodiments,encapsulant 154 has a hardness value of medium hard or higher on the Shore D scale whileencapsulant 152 has a hardness value of medium soft or less on the Shore A scale. - As shown in
FIG. 3A ,PCB assembly 150 includes at least onezone 117 which is kept free of encapsulant. As discussed above, bonding pads 125(1) . . . 125(11) are positioned inzone 117. Thebonding pads 125 are kept free of encapsulant at this stage of assembly so that a flex cable (cable 156 shown inFIG. 4 ) can be bonded to the bonding pads using a hot bar or other suitable bonding operation. Referring now toFIG. 4 , which is a simplified top plan view ofPCB assembly 150 at a second stage of assembly after the first stage,PCB assembly 150 may include a second,plug connector 142 that physically incompatible withreceptacle connector 140 and is attached toPCB 105 using a flexible mount (not shown) that enablesconnector 142 to flex or bend in multiple dimensions. Further details of a suitable flexible mount can be found in U.S. patent application Ser. No. 13/607,598, filed on Sep. 7, 2012, which is hereby incorporated by reference in its entirety. -
Flex cable 156 extends fromconnector 142 to bonding pads 125(1) . . . 125(11). The end offlex cable 156opposite connector 142 includes a plurality of connector pads (not shown) that correspond in number and are bonded to bonding pads 125(1) . . . 125(11). In one embodiment, the connector pads and bonding pads are bonded in a hot bar process.Flex cable 156 also includes aconductive spacer 158 that includes a conductive elastomer material and extends upwards fromcable 156 in the vertical direction.Conductive spacer 158 can be electrically connected to an outer shield (shield 170 shown inFIG. 8 ) and provides a dam foradditional encapsulant 160 that can be applied in a subsequent assembly step as described below. -
FIG. 5 , which is a simplified top plan view ofPCB assembly 150 at a third stage of assembly after the second stage, showsadditional encapsulant 160 applied over bonding pads 125(1) . . . 125(11) and an end portion offlex cable 156 as well as over any remainingleads 145 and bonding pads 146 not previously covered byencapsulant 152. In one embodiment,encapsulant 160 is a compliant silicone encapsulant and is identical toencapsulant 152. - In some embodiments,
compliant encapsulants FIG. 7 . More specifically,connector 140 may be subjected to an exemplary force depicted by “F” and the associated arrow. Thus,connector 140 may be required to flex relative toPCB 105. If a rigid, hard encapsulant were used asencapsulants 152 and/or 160 in this area,PCB 105 orconnector 140 may break or crack creating a potential path for the ingress of moisture or various chemicals or the solder connections to leads 145 may crack or break, any of which may in turn cause a subsequent failure of the electronic device. - Some embodiments of the invention include an underfill encapsulant for some or all of
electronic components encapsulants FIG. 8 , which is a cross-sectional view of an exemplaryelectronic component 119. InFIG. 8 electronic component 119 may be a flip-chip integrated circuit withelectronic leads 161 that may be attached toPCB 105.Encapsulant 154 is depicted as covering the entirety ofelectronic device 119. Anoptional underfill encapsulant 165 is also shown betweenelectronic component 119 andPCB 105. Otherelectronic components encapsulants electronic component 119. However, in other embodiments, the encapsulants may have different mechanical properties, for example, their mechanical properties may more closely match those of thePCB 105.Encapsulants PCB 105 in the local region ofelectronic component 119.Encapsulants electronic component 119. In some regions ofPCB 105 some embodiments of the invention includeunderfill encapsulant 165 without coveringcomponent 119 with another encapsulant. - Further embodiments, depicted in
FIG. 9 , may involve placing ametallic shield 170 over at least a portion of aPCB assembly 180.Metallic shield 170 may haveinterference regions 182 where the shield may interfere or come in contact withencapsulant shield 170 is engaged. In other embodiments,encapsulant shield 170 can be assembled and attached toPCB assembly 180 prior toencapsulant PCB 105 by the shield ininterference regions 182 further improving the seal between the shield and the encapsulant. Thus, in some embodiments,encapsulant encapsulant 154 used onPCB 105. - In some embodiments, shield 170 may have a ground connection (not shown) that may interface with keep out region 116 (see
FIG. 3 ). More specifically,region 116 may be required to be completely free of any encapsulant, for the ground connection to make contact with this region. Certain PCB regions such as 112 (seeFIG. 3 ) that are encapsulated may be close to keep out regions. These areas may requireencapsulant 154 to be dispensed with precision, which may requireencapsulant 154 to have different properties than other encapsulants used onPCB assembly 100. More specifically, some encapsulant dispense processes, for example, jet dispensing, may provide improved control of the encapsulant. However, jet dispensing may require the encapsulant to have a particular formulation of viscosity, thixotropic index and other properties. Further, certain encapsulants, even if dispensed with a syringe and needle, may need to be formulated to minimize bleeding and running to ensure they remain contained inencapsulant regions 111, 112 (seeFIG. 3 ) and do not enter keep outregions PCB assembly 100. - Further embodiments, depicted in
FIG. 10 , may involve a final step of filling some or all of the space betweenshield 170 and the PCB assembly with amaterial 185. In some embodiments, an injection molding process may be used where an injection moldable plastic such as, for example, nylon, ABS or PBT may be used. In other embodiments, an injection molding process may be used where an injection moldable mold compound is used such as a phenol-aralkyl type epoxy resin filled with 70% fused silica. In other embodiments, an encapsulant may be used as described above. An encapsulant differs from the injection molding embodiments wherein an encapsulant does not employ injection molding die and the encapsulant is typically dispensed with, for example, a syringe, a jet dispenser, an ultrasonic dispenser, or other similar dispensers. - An exemplary simplified process for manufacturing a PCB assembly comprising electronic components encapsulated with two different materials, in accordance with embodiments described herein, is depicted in
FIG. 10 . Instep 205 one or more electronic components are attached to a PCB or other type of substrate. The electronic components may include integrated circuits, electronic subassemblies, electrical connectors, capacitors, resistors, and the like may be attached, for example, with a solder or a conductive adhesive. The PCB assembly may be cleaned, or may not be cleaned depending on the requirements of the encapsulant and the PCB assembly. Instep 215, a first encapsulant with particular chemical, physical, mechanical and electrical properties is dispensed in one or more regions of the PCB and on one or both sides of the PCB to environmentally seal a portion or portions of the PCB. Depending on where the first encapsulant is applied it may cover various electronic components attached to the PCB or it may extend between a component and the PCB to cover an area of potential separation between the two. The encapsulant may then be cured, according to its particular requirements. Instep 220, a second encapsulant with different particular chemical, physical, mechanical and electrical properties as compared to the first encapsulant is dispensed in one or more other regions of the PCB on one or both sides of the PCB to environmentally seal another portion or portions of the PCB. Depending on where the second encapsulant is applied it may cover various electronic components attached to the PCB or it may extend between a component and the PCB to cover an area of potential separation between the two. The second encapsulant may then be cured, according to its particular requirements. Additional encapsulants, different from either the first or second encapsulant, may also be applied as appropriate in steps afterstep 220 or after any of the subsequently described steps prior to the completion of the PCB assembly. - Next, in step 225 a component such as
flex cable 160 is bonded to bonding pads on the PCB that were purposefully left uncovered by encapsulant insteps step 235, shield 170 can be attached to the PCB assembly as shown inFIG. 9 and instep 240 the assembly of PCB assembly can be completed and it may be installed in an appropriate electronic device. - In the foregoing specification, embodiments of the invention have been described with reference to numerous specific details that may vary from implementation to implementation. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense. While a number of specific embodiments and examples were disclosed with specific features, a person of ordinary skill in the art will recognize instances where the features of one embodiment can be combined with the features of other embodiments. Also, myriad encapsulants comprising different mechanical, physical, chemical and electrical properties may be used in
PCB assembly 100 without departing from the invention. For example, some embodiments may use encapsulants that comprise silicone and may be moisture cured while others may be cured using ultra-violet light. Some embodiments may use encapsulants that comprise an epoxy that may be heat, light or catalyst cured. Some embodiments may use encapsulants that may comprise a filler such as silica, or a ceramic to increase mechanical modulus, reduce the coefficient of thermal expansion and or to increase thermal conductivity. Other embodiments may use encapsulants with high surface free energy designed to wick into small crevices such as between a flip-chip and a PCB. Other embodiments may comprise a combination of encapsulants such as dam and fill where a viscous encapsulant is used to build a dam and a lower viscosity encapsulant is used to fill. Some encapsulants may comprise special formulations to chemically bond to particular components withinPCB assembly 105. The sole and exclusive indicator of the scope of the invention, and what is intended by the applicants to be the scope of the invention, is the literal and equivalent scope of the set of claims that issue from this application, in the specific form in which such claims issue, including any subsequent correction.
Claims (25)
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US20140126161A1 (en) * | 2012-11-02 | 2014-05-08 | Universal Global Scientific Industrial Co., Ltd. | Electronic pacakge module and method of manufacturing the same |
US20140190930A1 (en) * | 2013-01-04 | 2014-07-10 | Apple Inc. | Methods for transparent encapsulation and selective encapsulation |
US20160113115A1 (en) * | 2014-10-21 | 2016-04-21 | Heung Kyu Kwon | SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING THE SoP |
JP2016152282A (en) * | 2015-02-17 | 2016-08-22 | 日立オートモティブシステムズ株式会社 | Resin-sealed vehicle-mounted electronic control device |
WO2016156670A1 (en) * | 2015-04-02 | 2016-10-06 | Tacto Tek Oy | Multi-material structure with embedded electronics |
WO2018111306A1 (en) * | 2016-12-16 | 2018-06-21 | Syed Taymur Ahmad | Process for protecting an electronic device by selective deposition of polymer coatings |
CN108336069A (en) * | 2017-01-17 | 2018-07-27 | 日月光半导体制造股份有限公司 | Electronic module and semiconductor encapsulation device |
TWI650056B (en) * | 2017-08-02 | 2019-02-01 | 日商歐姆龍股份有限公司 | Electronic device and manufacturing method thereof |
JP2021128947A (en) * | 2020-02-10 | 2021-09-02 | ダイキン工業株式会社 | Electrical component and method for manufacturing electrical component |
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