US20140054302A1 - Device cover - Google Patents
Device cover Download PDFInfo
- Publication number
- US20140054302A1 US20140054302A1 US14/065,624 US201314065624A US2014054302A1 US 20140054302 A1 US20140054302 A1 US 20140054302A1 US 201314065624 A US201314065624 A US 201314065624A US 2014054302 A1 US2014054302 A1 US 2014054302A1
- Authority
- US
- United States
- Prior art keywords
- device cover
- sidewall
- bottom base
- die
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims abstract 2
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000001000 micrograph Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000003292 diminished effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/20—Deep-drawing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
- B21J5/08—Upsetting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12382—Defined configuration of both thickness and nonthickness surface or angle therebetween [e.g., rounded corners, etc.]
Definitions
- the present disclosure relates to device housings, and more particularly to a device cover for electronic devices.
- metallic device covers present an appealing appearance and contact surface, and thus are popularly used for electronic devices such as mobile phones.
- a metallic sheet is drawn into a preformed cover having a bottom base and a plurality of sidewalls extending substantially perpendicularly from a periphery of the bottom base.
- the preformed cover is upset by a forming die to thicken the sidewalls.
- the forming die includes a punch having a working surface extending perpendicular to an axis of the sidewalls.
- the sidewalls are machined by computerized numerical control (CNC) milling machines to complete the fabrication of the preformed device cover.
- CNC computerized numerical control
- FIG. 9 shows a metallographic micrograph of an upset part of an aluminum alloy cover prepared by the above described method. It shows relatively disordered flow tracks of grains. Two large folds are formed by the flow tracks in sections A and B, and two distinguishable micro-cracks are formed in the middle of the two folds. As a result, the sidewalls exhibit diminished mechanical properties, such as low strength and stiffness, during machining by CNC milling machines.
- FIG. 1 is an isometric view of one embodiment of a device cover.
- FIG. 2 is a cross-section of the device cover in FIG. 1 taken along line II-II.
- FIG. 3 is a metallographic micrograph of an upset part of the device cover in FIG. 1 .
- FIG. 4 is a flowchart of one embodiment of a method for fabricating the device cover of FIG. 1 .
- FIG. 5 is a cross-section of a forming die with a preformed device cover used in fabricating the device cover of FIG. 1 .
- FIG. 6 is an enlarged view of a circular part VI in FIG. 5 .
- FIG. 7 is similar to FIG. 5 , but shows another state of the forming die and the preformed device cover.
- FIG. 8 is an enlarged view of a circular part VIII in FIG. 7 .
- FIG. 9 is a metallographic micrograph of an upset part of a conventional device cover.
- a device cover 10 according to an embodiment is shown.
- the device cover 10 is used for a notebook computer.
- the device cover 10 includes a rectangular bottom base 11 and four sidewalls 12 extending substantially perpendicularly from a periphery of the rectangular bottom base 11 along an axis 122 .
- the sidewalls 12 are formed by an upsetting process, and the sidewalls 12 and the bottom base 11 cooperatively define a cavity 13 .
- T represents a thickness of the sidewall 12
- K represents a thickness of the bottom base 21 .
- the ratio between T and K (T/K) is preferably about 1 to about 1.76.
- the sidewall 12 includes an angled contact surface 121 , angling from an outer surface to an inner surface of the sidewall 12 , toward the bottom base 11 .
- An angle C defined by the contact surface 121 relative to the axis 122 is preferably about 55° to about 65°. In the illustrated embodiment, the angle C is about 60°.
- the shape of the bottom base 11 is not limited to being rectangular, and, for example, may be triangular, pentagonal, or any other shape, with a corresponding number of sidewalls, respectively three, five, and so on.
- a metallographic micrograph of a cross-section of the sidewall 12 under temperatures between about 16° C. to about 26° C. and relative humidity (RH) ranging between about 40% to about 80% is shown for one embodiment of the device cover 10 made of aluminum alloy.
- the metallographic micrograph magnified at 50 ⁇ shows only a single fold formed by flow tracks of the metallic grain of the sidewall 12 after upsetting.
- the metallographic micrograph also shows smooth and well-ordered flow tracks of the metallic grain.
- the micro-cracks in section A are short, and the micro-cracks in section B are undetectable.
- one embodiment of a method for fabricating the device cover 10 is disclosed as follows. Depending on the embodiment, certain of the steps described below may be removed, others may be added, and the sequence of steps may be altered.
- step S 1 a metallic flat sheet (not shown) is provided.
- the metallic flat sheet is aluminum alloy.
- step S 2 the metallic flat sheet is deeply drawn into a preformed cover 10 a .
- the preformed cover 10 a includes a bottom base 11 a and four sidewalls 12 a extending substantially perpendicularly from a periphery of the bottom base 11 a.
- the sidewall 12 a has an axis 122 a and a contact surface 121 a substantially perpendicular to the axis 122 a .
- the bottom base 11 a and the sidewall 12 a have about the same thickness K.
- step S 3 the preformed cover 10 a is upset by a forming die 20 to thicken and strengthen the sidewalls 12 a, to reserve space for a subsequent process.
- the forming die 20 includes a lower die assembly 21 and an upper die assembly 22 .
- the lower die assembly 21 includes a supporting plate 211 , a die set 212 , a lower padding plate 213 , a die holder 214 , a die core 215 , a plurality of punches 216 , a nitrogen spring 217 , and a plurality of guiding bushings 218 .
- the supporting plate 211 , the die set 212 , the lower padding plate 213 , and the die holder 214 are combined together in order.
- the die holder 214 can be substantially rectangular, and defines a holding hole (not labeled) to receive the die core 215 .
- the die core 215 is able to move in the holding hole.
- the die core 215 can be substantially rectangular, and includes a top surface (not labeled) similar to the bottom base 11 a of the preformed cover 10 a.
- the punch 216 is fixed to the lower padding plate 213 and is disposed between the die holder 214 and the die core 215 .
- the punch 216 is positioned below the die holder 214 and the die core 215 .
- the punch 216 includes an angled working surface 2161 .
- An angle D defined by the working surface 2161 and the axis 122 a of the sidewall 12 a is preferably about 55° to about 65°. In the illustrated embodiment, the angle D is about 60°.
- the die holder 214 includes a left side surface 2141 .
- the die core 215 includes a right side surface 2151 substantially parallel to the left side surface 2141 .
- the left side surface 2141 , the right side surface 2151 , and the working surface 2161 together define a mold cavity 219 receiving the sidewall 12 a.
- L represents a width of the mold cavity 219 .
- a ratio between L and K (L/K) is preferably about 1 to about 1 . 76 .
- One end of the nitrogen spring 217 is fixed to the supporting plate 211 , the other end passes through the die set 212 and the lower padding plate 213 , and then attaches to the die core 215 .
- the plurality of guiding bushings 218 are fixed to the die set 212 .
- the upper die assembly 22 includes a punch set 221 , a punch core 222 , and a plurality of guiding posts 223 .
- the punch set 221 can be substantially rectangular.
- the punch core 222 is fixed to the punch set 221 , and corresponds to the die core 215 .
- the plurality of guiding posts 223 is fixed to the punch set 221 to engage with the guiding bushings 218 .
- the preformed cover 10 a is placed on the die core 215 .
- the upper die assembly 22 moves downwards towards the lower die assembly 21 , and the guiding posts 223 protrude into the corresponding guiding bushings 218 .
- the punch core 222 contacts the bottom base 11 a of the preformed cover 10 a
- the die core 215 begins to move downwards and compresses the nitrogen spring 217 .
- the sidewalls 12 a of the preformed cover 10 a are received in the mold cavity 219 and contact the punch 216 .
- the upper die assembly 22 moves further downwards, and the working surface 2161 of the punch 216 moves along the axis 122 a of the sidewall 12 a relative to the preformed cover 10 a.
- the contact surfaces 121 a of the sidewalls 12 a contact the working surface 2161 with a force F
- the material of the sidewalls 12 a displaces and fills the mold cavity 219 , resulting in the sidewalls 12 a of the preformed cover 10 a exceeding the bottom base 11 a in thickness/width.
- An angle ⁇ is defined by a direction of force F and the axis 122 a because the working surface 2161 of the punch 216 is not parallel to the axis 122 a of the sidewall 12 a.
- the angle ⁇ is preferably about 25° to about 35° depending on the angle D. In the illustrated embodiment, the angle ⁇ is about 30°.
- the force F can be divided into a vertical component force F 1 along the axis 122 a and a horizontal component force F 2 perpendicular thereto.
- the metallic grains are guided into a smooth and well-ordered flow toward the bottom base 11 a by the horizontal component force F 2 , thus only one fold is formed in section A adjacent to an inner portion of the bottom base 11 a.
- each of the sidewalls 12 a of the preformed cover 10 a is machined to a predetermined shape by a machining tool such as by CNC, forming the device cover 10 .
- the machining process improves certain mechanical properties, such as strength and stiffness, of the sidewalls 12 a compared with sidewalls otherwise fabricated.
- the contact surface 121 may angle away from the bottom base 11 , as long as the working surface 2161 of the punch 216 angles toward the die core 215 .
- the punch 216 may also be fixed to one component of the upper die assembly 22 , such as the punch set 221 , in which case, the die core 215 is fixed to the punch set 221 , and the punch core 222 is fixed to the die set 212 .
- the punch set 221 , the lower padding plate 213 , the nitrogen spring 217 , and the die holder 214 may, alternatively, be omitted.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
Description
- The present application is a divisional application of U.S. patent application Ser. No. 12,545,207, filed on Aug. 21, 2009.
- 1. Technical Field
- The present disclosure relates to device housings, and more particularly to a device cover for electronic devices.
- 2. Description of Related Art
- Generally, metallic device covers present an appealing appearance and contact surface, and thus are popularly used for electronic devices such as mobile phones.
- In a typical method for fabricating such a device cover, a metallic sheet is drawn into a preformed cover having a bottom base and a plurality of sidewalls extending substantially perpendicularly from a periphery of the bottom base. The preformed cover is upset by a forming die to thicken the sidewalls. The forming die includes a punch having a working surface extending perpendicular to an axis of the sidewalls. The sidewalls are machined by computerized numerical control (CNC) milling machines to complete the fabrication of the preformed device cover.
-
FIG. 9 shows a metallographic micrograph of an upset part of an aluminum alloy cover prepared by the above described method. It shows relatively disordered flow tracks of grains. Two large folds are formed by the flow tracks in sections A and B, and two distinguishable micro-cracks are formed in the middle of the two folds. As a result, the sidewalls exhibit diminished mechanical properties, such as low strength and stiffness, during machining by CNC milling machines. - What is needed, therefore, is a device cover that overcomes the limitations described. A highly efficient method of fabricating the device cover is also needed.
- The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views, and all the views are schematic.
-
FIG. 1 is an isometric view of one embodiment of a device cover. -
FIG. 2 is a cross-section of the device cover inFIG. 1 taken along line II-II. -
FIG. 3 is a metallographic micrograph of an upset part of the device cover inFIG. 1 . -
FIG. 4 is a flowchart of one embodiment of a method for fabricating the device cover ofFIG. 1 . -
FIG. 5 is a cross-section of a forming die with a preformed device cover used in fabricating the device cover ofFIG. 1 . -
FIG. 6 is an enlarged view of a circular part VI inFIG. 5 . -
FIG. 7 is similar toFIG. 5 , but shows another state of the forming die and the preformed device cover. -
FIG. 8 is an enlarged view of a circular part VIII inFIG. 7 . -
FIG. 9 is a metallographic micrograph of an upset part of a conventional device cover. - Referring to
FIGS. 1 and 2 , adevice cover 10 according to an embodiment is shown. In the illustrated embodiment, thedevice cover 10 is used for a notebook computer. Thedevice cover 10 includes arectangular bottom base 11 and foursidewalls 12 extending substantially perpendicularly from a periphery of therectangular bottom base 11 along anaxis 122. Thesidewalls 12 are formed by an upsetting process, and thesidewalls 12 and thebottom base 11 cooperatively define a cavity 13. T represents a thickness of thesidewall 12, and K represents a thickness of thebottom base 21. The ratio between T and K (T/K) is preferably about 1 to about 1.76. Thesidewall 12 includes anangled contact surface 121, angling from an outer surface to an inner surface of thesidewall 12, toward thebottom base 11. An angle C defined by thecontact surface 121 relative to theaxis 122 is preferably about 55° to about 65°. In the illustrated embodiment, the angle C is about 60°. It is to be understood that the shape of thebottom base 11 is not limited to being rectangular, and, for example, may be triangular, pentagonal, or any other shape, with a corresponding number of sidewalls, respectively three, five, and so on. - Referring to
FIG. 3 , a metallographic micrograph of a cross-section of thesidewall 12 under temperatures between about 16° C. to about 26° C. and relative humidity (RH) ranging between about 40% to about 80% is shown for one embodiment of thedevice cover 10 made of aluminum alloy. The metallographic micrograph magnified at 50× shows only a single fold formed by flow tracks of the metallic grain of thesidewall 12 after upsetting. The metallographic micrograph also shows smooth and well-ordered flow tracks of the metallic grain. The micro-cracks in section A are short, and the micro-cracks in section B are undetectable. - Referring to
FIGS. 4 through 6 , one embodiment of a method for fabricating thedevice cover 10 is disclosed as follows. Depending on the embodiment, certain of the steps described below may be removed, others may be added, and the sequence of steps may be altered. - In step S1, a metallic flat sheet (not shown) is provided. In one embodiment, the metallic flat sheet is aluminum alloy.
- In step S2, the metallic flat sheet is deeply drawn into a
preformed cover 10 a. Thepreformed cover 10 a includes abottom base 11 a and foursidewalls 12 a extending substantially perpendicularly from a periphery of thebottom base 11 a. Thesidewall 12 a has anaxis 122 a and acontact surface 121 a substantially perpendicular to theaxis 122 a. Thebottom base 11 a and thesidewall 12 a have about the same thickness K. - In step S3, the
preformed cover 10 a is upset by a forming die 20 to thicken and strengthen thesidewalls 12 a, to reserve space for a subsequent process. - The forming die 20 includes a
lower die assembly 21 and anupper die assembly 22. The lower dieassembly 21 includes a supportingplate 211, a dieset 212, alower padding plate 213, a dieholder 214, a diecore 215, a plurality ofpunches 216, anitrogen spring 217, and a plurality of guidingbushings 218. The supportingplate 211, thedie set 212, thelower padding plate 213, and the dieholder 214 are combined together in order. The dieholder 214 can be substantially rectangular, and defines a holding hole (not labeled) to receive the diecore 215. The diecore 215 is able to move in the holding hole. - The die
core 215 can be substantially rectangular, and includes a top surface (not labeled) similar to thebottom base 11 a of thepreformed cover 10 a. Thepunch 216 is fixed to thelower padding plate 213 and is disposed between the dieholder 214 and the diecore 215. Thepunch 216 is positioned below the dieholder 214 and the diecore 215. Thepunch 216 includes an angled workingsurface 2161. An angle D defined by the workingsurface 2161 and theaxis 122 a of thesidewall 12 a is preferably about 55° to about 65°. In the illustrated embodiment, the angle D is about 60°. - The
die holder 214 includes aleft side surface 2141. Thedie core 215 includes aright side surface 2151 substantially parallel to theleft side surface 2141. Theleft side surface 2141, theright side surface 2151, and the workingsurface 2161 together define amold cavity 219 receiving thesidewall 12 a. L represents a width of themold cavity 219. - A ratio between L and K (L/K) is preferably about 1 to about 1.76. One end of the
nitrogen spring 217 is fixed to the supportingplate 211, the other end passes through the die set 212 and thelower padding plate 213, and then attaches to thedie core 215. The plurality of guidingbushings 218 are fixed to the die set 212. - The
upper die assembly 22 includes apunch set 221, apunch core 222, and a plurality of guidingposts 223. The punch set 221 can be substantially rectangular. Thepunch core 222 is fixed to the punch set 221, and corresponds to thedie core 215. The plurality of guidingposts 223 is fixed to the punch set 221 to engage with the guidingbushings 218. - Referring to the
FIGS. 7 and 8 , before upsetting, the preformedcover 10 a is placed on thedie core 215. During upsetting, theupper die assembly 22 moves downwards towards thelower die assembly 21, and the guidingposts 223 protrude into the corresponding guidingbushings 218. When thepunch core 222 contacts thebottom base 11 a of the preformedcover 10 a, thedie core 215 begins to move downwards and compresses thenitrogen spring 217. The sidewalls 12 a of the preformedcover 10 a are received in themold cavity 219 and contact thepunch 216. Theupper die assembly 22 moves further downwards, and the workingsurface 2161 of thepunch 216 moves along theaxis 122 a of thesidewall 12 a relative to the preformedcover 10 a. When the contact surfaces 121 a of the sidewalls 12 a contact the workingsurface 2161 with a force F, the material of the sidewalls 12 a displaces and fills themold cavity 219, resulting in the sidewalls 12 a of the preformedcover 10 a exceeding thebottom base 11 a in thickness/width. - An angle θ is defined by a direction of force F and the
axis 122 a because the workingsurface 2161 of thepunch 216 is not parallel to theaxis 122 a of thesidewall 12 a. The angle θ is preferably about 25° to about 35° depending on the angle D. In the illustrated embodiment, the angle θ is about 30°. The force F can be divided into a vertical component force F1 along theaxis 122 a and a horizontal component force F2 perpendicular thereto. The metallic grains are guided into a smooth and well-ordered flow toward thebottom base 11 a by the horizontal component force F2, thus only one fold is formed in section A adjacent to an inner portion of thebottom base 11 a. - In step S4, each of the sidewalls 12 a of the preformed
cover 10 a is machined to a predetermined shape by a machining tool such as by CNC, forming thedevice cover 10. The machining process improves certain mechanical properties, such as strength and stiffness, of the sidewalls 12 a compared with sidewalls otherwise fabricated. - The
contact surface 121 may angle away from thebottom base 11, as long as the workingsurface 2161 of thepunch 216 angles toward thedie core 215. - The
punch 216 may also be fixed to one component of theupper die assembly 22, such as the punch set 221, in which case, thedie core 215 is fixed to the punch set 221, and thepunch core 222 is fixed to the die set 212. - The punch set 221, the
lower padding plate 213, thenitrogen spring 217, and thedie holder 214 may, alternatively, be omitted. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/065,624 US20140054302A1 (en) | 2008-12-19 | 2013-10-29 | Device cover |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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CN200810306407.1 | 2008-12-19 | ||
CN200810306407.1A CN101754624B (en) | 2008-12-19 | 2008-12-19 | Metal shell body and forming method thereof |
US12/545,207 US8601849B2 (en) | 2008-12-19 | 2009-08-21 | Device cover and method for fabricating the same |
US14/065,624 US20140054302A1 (en) | 2008-12-19 | 2013-10-29 | Device cover |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/545,207 Division US8601849B2 (en) | 2008-12-19 | 2009-08-21 | Device cover and method for fabricating the same |
Publications (1)
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US20140054302A1 true US20140054302A1 (en) | 2014-02-27 |
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US12/545,207 Expired - Fee Related US8601849B2 (en) | 2008-12-19 | 2009-08-21 | Device cover and method for fabricating the same |
US14/065,624 Abandoned US20140054302A1 (en) | 2008-12-19 | 2013-10-29 | Device cover |
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US12/545,207 Expired - Fee Related US8601849B2 (en) | 2008-12-19 | 2009-08-21 | Device cover and method for fabricating the same |
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CN (1) | CN101754624B (en) |
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JPS5854898B2 (en) * | 1981-06-18 | 1983-12-07 | アイシン精機株式会社 | Manufacturing method of V-ribbed pulley |
CA2054018A1 (en) * | 1991-02-25 | 1992-08-26 | Thomas Wesley Gustafson | Metal matrix composite composition and method |
US5706696A (en) * | 1996-09-09 | 1998-01-13 | Wagner; Wendell J. | Modular pressure set and system for stamping press |
IT1297735B1 (en) * | 1997-11-28 | 1999-12-20 | Attrezzeria Mv & C Snc | DRAWING AND COINING MOLD FOR THE MANUFACTURE OF METALLIC CONTAINERS AND SIMILAR |
DE102004022666B4 (en) * | 2003-05-28 | 2023-03-16 | Schaeffler Technologies AG & Co. KG | stamping process |
US7980112B2 (en) * | 2007-02-23 | 2011-07-19 | Advanced Tooling Systems, Inc. | Modular tooling system and method |
CN101274345B (en) * | 2007-03-28 | 2011-12-21 | 鸿富锦精密工业(深圳)有限公司 | Metal casing forming method and rotary cutting apparatus using the same |
JP4553955B2 (en) * | 2008-05-13 | 2010-09-29 | 日本発條株式会社 | Clamp for disk rotation drive device and method for manufacturing clamp |
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2008
- 2008-12-19 CN CN200810306407.1A patent/CN101754624B/en not_active Expired - Fee Related
-
2009
- 2009-08-21 US US12/545,207 patent/US8601849B2/en not_active Expired - Fee Related
-
2013
- 2013-10-29 US US14/065,624 patent/US20140054302A1/en not_active Abandoned
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US20080309834A1 (en) * | 2007-06-14 | 2008-12-18 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd . | Metallic cover and method for making the same |
US20090126450A1 (en) * | 2007-11-16 | 2009-05-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Metallic cover and method for making the same |
Cited By (1)
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CN103533787A (en) * | 2012-07-04 | 2014-01-22 | Nec个人电脑株式会社 | Cabinet for electronic apparatus and an electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
US8601849B2 (en) | 2013-12-10 |
CN101754624B (en) | 2012-07-25 |
US20100159267A1 (en) | 2010-06-24 |
CN101754624A (en) | 2010-06-23 |
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Legal Events
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Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LUO, WEI;LUO, LIE-CHAO;LI, YU-LUN;REEL/FRAME:033427/0656 Effective date: 20131028 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LUO, WEI;LUO, LIE-CHAO;LI, YU-LUN;REEL/FRAME:033427/0656 Effective date: 20131028 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |