US20130215577A1 - Interface module and manufacturing method thereof - Google Patents

Interface module and manufacturing method thereof Download PDF

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Publication number
US20130215577A1
US20130215577A1 US13/685,056 US201213685056A US2013215577A1 US 20130215577 A1 US20130215577 A1 US 20130215577A1 US 201213685056 A US201213685056 A US 201213685056A US 2013215577 A1 US2013215577 A1 US 2013215577A1
Authority
US
United States
Prior art keywords
connection portion
substrate
interface module
electrodes
row electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/685,056
Other languages
English (en)
Inventor
Kung-Chieh Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innocom Technology Shenzhen Co Ltd
Innolux Corp
Original Assignee
Innocom Technology Shenzhen Co Ltd
Chimei Innolux Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innocom Technology Shenzhen Co Ltd, Chimei Innolux Corp filed Critical Innocom Technology Shenzhen Co Ltd
Assigned to INNOCOM TECHNOLOGY(SHENZHEN) CO., LTD., CHIMEI INNOLUX CORPORATION reassignment INNOCOM TECHNOLOGY(SHENZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Huang, Kung-Chieh
Publication of US20130215577A1 publication Critical patent/US20130215577A1/en
Assigned to Innolux Corporation reassignment Innolux Corporation CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: CHIMEI INNOLUX CORPORATION
Priority to US14/969,556 priority Critical patent/US10114488B2/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/052—Branched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Definitions

  • the present invention relates to an interface module, and in particular relates to an interface module which is connected to a flexible print circuit board.
  • Conventional interface modules such as touch panel modules or display modules, have column electrodes and row electrodes formed on the substrate.
  • the column electrodes and the row electrodes are electrically connected to an integrated circuit disposed on the substrate or disposed on a flexible print circuit board via a trace formed on an edge of the substrate.
  • the integrated circuit on the substrate or the flexible print circuit board is then electrically connected to a main board via the flexible print circuit board.
  • the trace disposed on the edge of the substrate occupies surface area of the substrate, and the dimension of the interface module therefore cannot be reduced. Additionally, the line width of the trace has rigid restrictions, and the surface area of the substrate occupied by the trace therefore cannot be decreased.
  • the interface module includes a substrate and a flexible print circuit board.
  • the substrate includes a first side, a second side, a plurality of column electrodes and a plurality of row electrodes, wherein the first side is perpendicular to the second side, the column electrodes are formed on the substrate and arranged along the first side, and the row electrodes are formed on the substrate and arranged along the second side.
  • the flexible print circuit board includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.
  • an interface module in another embodiment, includes a first substrate, a second substrate and a flexible print circuit board.
  • the first substrate includes a first side and a plurality of column electrodes, wherein the column electrodes are formed on the first substrate and arranged along the first side, and the column electrodes are extended to a first edge of the first side.
  • the second substrate includes a second side and a plurality of row electrodes, wherein the row electrodes are formed on the second substrate and arranged along the second side, the row electrodes are extended to a second edge of the second side, and the first side is perpendicular to the second side.
  • the flexible print circuit board includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.
  • the flexible print circuit board is electrically connected to the row electrodes on the second and third sides of the substrate, and the flexible print circuit board is bent and attached to the back side of the interface module. The dimension of the interface module is therefore decreased.
  • FIG. 1 shows the interface module of a first embodiment of the invention
  • FIG. 2A is a top view showing the bent flexible print circuit board of the first embodiment of the invention.
  • FIG. 2B is a perspective view showing the bent flexible print circuit board of the first embodiment of the invention.
  • FIG. 2C shows signal transmission path of the first embodiment of the invention
  • FIG. 3A is an exploded view of the interface of a second embodiment of the invention.
  • FIG. 3B is an assembled view of the interface of a second embodiment of the invention.
  • FIG. 4 shows a method for manufacturing an interface module of an embodiment of the invention.
  • FIG. 5 shows the first substrate and the second substrate formed by a roll to roll process.
  • FIG. 1 shows an interface module 100 of a first embodiment of the invention, comprising a substrate 110 and a flexible print circuit board 130 .
  • the substrate 110 comprises a first side 111 , a second side 112 , a plurality of column electrodes 151 and a plurality of row electrodes 152 .
  • the column electrodes 151 are formed on the substrate 110 and arranged along the first side 111
  • the row electrodes 152 are formed on the substrate 110 and arranged along the second side 112 .
  • the flexible print circuit board 130 comprises a first connection portion 131 and a second connection portion 132 , wherein the first connection portion 131 is electrically connected to the column electrodes 151 at the first side 111 , and the second connection portion 132 is electrically connected to at least a portion of the row electrodes 152 at the second side 112 .
  • the first side 111 is perpendicular to the second side 112 .
  • the substrate 110 further comprises a third side 113 , the third side 113 is parallel to the second side 112 , the flexible print circuit board 130 further comprises a third connection portion 133 , and the third connection portion 133 is electrically connected to at least a portion of the row electrodes 152 at the third side 113 .
  • the single row electrode 152 can be electrically connected to the second connection portion 132 and the third connection portion 133 simultaneously, or electrically connects to one of the second connection portion 132 and the third connection portion 133 .
  • the column electrodes 151 and the row electrodes 152 are respectively data lines and scan lines.
  • the interface module 100 is a touch panel module, the column electrodes 151 and the row electrodes 152 are both sensing electrodes, or, the column electrodes 151 or the row electrodes 152 are sensing electrodes.
  • the flexible print circuit board 130 is integrally formed.
  • the interface module 100 comprises an interface side 101 and a back side 102 , the interface side 101 is opposite to the back side 102 , and at least a portion of the second connection portion 132 and the third connection portion 133 are bent to contact the back side 102 .
  • the flexible print circuit board 130 is electrically connected to the row electrodes on the second and third sides of the substrate, and the flexible print circuit board 130 is bent and attached to the back side 102 of the interface module. The dimension of the interface module is therefore decreased.
  • the interface module 100 further comprises an integrated circuit 140 , wherein the integrated circuit 140 is disposed on the first side 111 of the substrate 110 , and the column electrodes 151 are electrically connected to the integrated circuit 140 via trace 141 .
  • the first connection portion 131 is electrically connected to the integrated circuit 140 .
  • a main board (not shown) provides a signal, and the signal is transmitted to the integrated circuit 140 via the flexible print circuit board 130 .
  • the integrated circuit 140 outputs a row signal and a column signal according to the signal from the main board, the column signal is transmitted through the trace 141 to one of the column electrodes 151 , and the row signal is transmitted through the trace 141 to one of the row electrodes 152 via the second connection portion 132 (or, via the second connection portion 132 and the third connection portion 133 ) of the flexible print circuit board 130 .
  • the integrated circuit 140 is disposed on the flexible print circuit board 130 , and when the integrated circuit 140 outputs the column signal and the row signal, the column signal passes through the first connection portion 131 of the flexible print circuit board 130 and the trace 141 to one of the column electrodes, and the row signal passes through the second connection portion 132 (or, the second connection portion 132 and the third connection portion 133 ) to one of the row electrodes.
  • FIGS. 3A and 3B show interface module 200 of a second embodiment of the invention, comprising a first substrate 210 , a second substrate 220 and a flexible print circuit board 230 .
  • the first substrate 210 comprises a first side 211 and a plurality of column electrodes 251 , wherein the column electrodes 251 are formed on the first substrate 210 and arranged along the first side 211 , and the column electrodes 251 extend to a first edge of the first side 211 .
  • the second substrate 220 comprises a second side 222 and a plurality of row electrodes 252 , wherein the row electrodes 252 are formed on the second substrate 220 and arranged along the second side 222 , the row electrodes 252 extend to a second edge of the second side 222 , and the first side 211 is perpendicular to the second side 222 .
  • the dimension of the first substrate 210 is greater than the second substrate 220 .
  • the positions of the first substrate 210 and the second substrate 220 can be exchanged, wherein the dimension of the first substrate 210 is smaller than the second substrate 220 , and when the first substrate 210 overlaps the second substrate 220 , the row electrodes 252 adjacent to the second edge of the second side 222 are exposed.
  • the flexible print circuit board 230 comprises a first connection portion 231 and a second connection portion 232 , wherein the first connection portion 231 is electrically connected to the column electrodes 251 at the first side 211 , and the second connection portion 232 is electrically connected to at least a portion of the row electrodes 252 at the second side 222 .
  • the interface module 200 comprises a first substrate 210 , a second substrate 220 and a flexible print circuit board 230 .
  • the first substrate 210 comprises a first side 211 and a plurality of column electrodes 251 , wherein the column electrodes 251 are formed on a lower surface of the first substrate 210 and arranged along the first side 211 , and the column electrodes 251 extend to a first edge of the first side 211 .
  • the second substrate 220 comprises a second side 222 and a plurality of row electrodes 252 , wherein the row electrodes 252 are formed on an upper surface of the second substrate 220 and arranged along the second side 222 , the row electrodes 252 extend to a second edge of the second side 222 , and the first side 211 is perpendicular to the second side 222 .
  • the positions of the first substrate 210 and the second substrate 220 can be exchanged, wherein the column electrodes 251 are formed on an upper surface of the substrate 210 , and the row electrodes 252 are formed on a lower surface of the second substrate 220 .
  • the flexible print circuit board 230 comprises a first connection portion 231 and a second connection portion 232 , wherein the first connection portion 231 is electrically connected to the column electrodes 251 at the first side 211 , and the second connection portion 232 is electrically connected to at least a portion of the row electrodes 252 at the second side 222 .
  • the second substrate 220 comprises a third side 223
  • the third side 223 is parallel to the second side 222
  • the row electrodes 252 extend to a third edge of the third side 223
  • the flexible print circuit board 230 further comprises a third connection portion 233
  • the third connection portion 233 is electrically connected to at least a portion of the row electrodes 252 at the third side 223 .
  • the single row electrode 252 can be electrically connected to the second connection portion 232 and the third connection portion 233 simultaneously, or electrically connects to one of the second connection portion 232 and the third connection portion 233 .
  • the column electrodes 251 and the row electrodes 252 are both sensing electrodes, or, the column electrodes 251 or the row electrodes 252 are sensing electrodes.
  • the interface module 200 can further comprise an optical film 260 , wherein the optical film 260 is disposed between the first substrate 210 and the second substrate 220 .
  • the flexible print circuit board 230 is integrally formed. Similar to the first embodiment of the invention, the interface module 200 comprises an interface side 201 and a back side 202 , the interface side 201 is opposite to the back side 202 , and at least a portion of the second connection portion 232 and the third connection portion 233 are bent to contact the back side 202 .
  • FIG. 4 shows a method for manufacturing an interface module of an embodiment of the invention.
  • a first substrate and a second substrate are provided, wherein the first substrate comprises a first side and a plurality of column electrodes, the column electrodes are formed on the first substrate and arranged along the first side, and the column electrodes are extended to a first edge of the first side, the second substrate comprises a second side and a plurality of row electrodes, the row electrodes are formed on the second substrate and arranged along the second side, and the row electrodes are extended to a second edge of the second side (S 1 ).
  • the first substrate is overlapped with the second substrate, wherein the first side is perpendicular to the second side (S 2 ).
  • a flexible print circuit board comprising a first connection portion and a second connection portion (S 3 ).
  • the first connection portion is electrically connected to the column electrodes at the first side
  • the second connection portion is electrically connected to at least a portion of the row electrodes at the second side (S 4 ).
  • the interface module when the interface module is a display module, the column electrodes and the row electrodes are respectively data lines and scan lines.
  • the interface module is a touch panel module, the column electrodes and the row electrodes are both sensing electrodes, or, the column electrodes or the row electrodes are sensing electrodes.
  • the first substrate and the second substrate are formed by a roll to roll process.
  • parallel electrodes are formed on a continuous substrate material.
  • the substrate material is cut, and the first and second substrates are therefore obtained.
  • the second substrate is rotated by 90°, and is overlapped with the first substrate.
  • the interface module of the embodiment is obtained.
  • the first substrate and the second substrate can be respectively cut from tow different substrate material rolls with the same or different material components. Utilizing the method for manufacturing the interface module of the embodiment of the invention, the substrate can be mass produced, and manufacturing cost is therefore decreased.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
US13/685,056 2012-02-16 2012-11-26 Interface module and manufacturing method thereof Abandoned US20130215577A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/969,556 US10114488B2 (en) 2012-02-16 2015-12-15 Interface module and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101105043 2012-02-16
TW101105043A TWI437934B (zh) 2012-02-16 2012-02-16 介面模組及其製造方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110636688A (zh) * 2019-08-21 2019-12-31 武汉华星光电半导体显示技术有限公司 柔性电路板组件及柔性显示装置
US11234332B2 (en) * 2019-03-01 2022-01-25 Ordos Yuansheng Optoelectronics Co., Ltd. Circuit board structure and fabricating method thereof, display panel and fabricating method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106652929B (zh) * 2016-10-18 2019-11-05 武汉华星光电技术有限公司 显示模组及液晶显示屏

Citations (6)

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Publication number Priority date Publication date Assignee Title
US6002594A (en) * 1996-12-20 1999-12-14 Logitech, Inc. Flexible touchpad circuit with mounted circuit board
US6519021B1 (en) * 1999-01-18 2003-02-11 Seiko Epson Corporation Wiring board for connection of electro-optical panel, electro-optical device and electronic apparatus
US20080053713A1 (en) * 2006-08-30 2008-03-06 High Tech Computer Corp. (A Legal Entity Of Taiwan) Touch-sensitive input device and electronic device incorporating the touch-sensitive input device
US20080158181A1 (en) * 2007-01-03 2008-07-03 Apple Computer, Inc. Double-sided touch sensitive panel and flex circuit bonding
US20080316416A1 (en) * 2007-06-20 2008-12-25 Mao-Yi Chang Liquid crystal display and method for making the same
US20120057312A1 (en) * 2010-09-07 2012-03-08 Young-Seok Yoo Flexible printed circuit board and touch screen panel apparatus having the same

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JP3643640B2 (ja) * 1995-06-05 2005-04-27 株式会社東芝 表示装置及びこれに使用されるｉｃチップ
JP2003108021A (ja) * 2001-09-28 2003-04-11 Hitachi Ltd 表示装置
JP5116277B2 (ja) * 2006-09-29 2013-01-09 株式会社半導体エネルギー研究所 半導体装置、表示装置、液晶表示装置、表示モジュール及び電子機器
US8576209B2 (en) * 2009-07-07 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002594A (en) * 1996-12-20 1999-12-14 Logitech, Inc. Flexible touchpad circuit with mounted circuit board
US6519021B1 (en) * 1999-01-18 2003-02-11 Seiko Epson Corporation Wiring board for connection of electro-optical panel, electro-optical device and electronic apparatus
US20080053713A1 (en) * 2006-08-30 2008-03-06 High Tech Computer Corp. (A Legal Entity Of Taiwan) Touch-sensitive input device and electronic device incorporating the touch-sensitive input device
US20080158181A1 (en) * 2007-01-03 2008-07-03 Apple Computer, Inc. Double-sided touch sensitive panel and flex circuit bonding
US20080316416A1 (en) * 2007-06-20 2008-12-25 Mao-Yi Chang Liquid crystal display and method for making the same
US20120057312A1 (en) * 2010-09-07 2012-03-08 Young-Seok Yoo Flexible printed circuit board and touch screen panel apparatus having the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11234332B2 (en) * 2019-03-01 2022-01-25 Ordos Yuansheng Optoelectronics Co., Ltd. Circuit board structure and fabricating method thereof, display panel and fabricating method thereof
CN110636688A (zh) * 2019-08-21 2019-12-31 武汉华星光电半导体显示技术有限公司 柔性电路板组件及柔性显示装置
US11468799B2 (en) * 2019-08-21 2022-10-11 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible circuit board assembly and flexible display device

Also Published As

Publication number Publication date
US10114488B2 (en) 2018-10-30
TWI437934B (zh) 2014-05-11
US20160103540A1 (en) 2016-04-14
TW201336359A (zh) 2013-09-01

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AS Assignment

Owner name: CHIMEI INNOLUX CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUANG, KUNG-CHIEH;REEL/FRAME:029348/0777

Effective date: 20121112

Owner name: INNOCOM TECHNOLOGY(SHENZHEN) CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUANG, KUNG-CHIEH;REEL/FRAME:029348/0777

Effective date: 20121112

AS Assignment

Owner name: INNOLUX CORPORATION, TAIWAN

Free format text: CHANGE OF NAME;ASSIGNOR:CHIMEI INNOLUX CORPORATION;REEL/FRAME:032672/0813

Effective date: 20121219

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION