US20130181310A1 - Semiconductor apparatus and image sensor package using the same - Google Patents

Semiconductor apparatus and image sensor package using the same Download PDF

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Publication number
US20130181310A1
US20130181310A1 US13/598,790 US201213598790A US2013181310A1 US 20130181310 A1 US20130181310 A1 US 20130181310A1 US 201213598790 A US201213598790 A US 201213598790A US 2013181310 A1 US2013181310 A1 US 2013181310A1
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United States
Prior art keywords
trench
image sensor
transparent member
semiconductor apparatus
aperture
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Abandoned
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US13/598,790
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English (en)
Inventor
Hyun-Su JUN
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUN, HYUN-SU
Publication of US20130181310A1 publication Critical patent/US20130181310A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements

Definitions

  • the present inventive concept relates to a semiconductor apparatus and an image sensor package using the same.
  • a glass holder is disposed on an image sensor chip, and an optical low pass filter (OLPF) is disposed on the glass holder.
  • the glass holder and the OLPF are adhered to each other. Since the OLPF surrounds an image sensor package holder, the thickness of the image sensor package increases. In addition, since the image sensor package uses multiple holders that are redundant, the manufacturing process is not simplified, and the cost of parts increases.
  • Exemplary embodiments of the inventive concept provide a semiconductor apparatus in which both of a transparent member and an optical filter can be adhered to one holder for an image sensor package through trenches formed in the holder.
  • Exemplary embodiments of the inventive concept also provide a thin image sensor package which can be assembled in a simple process using the above semiconductor apparatus.
  • Exemplary embodiments of the present inventive concept provide a semiconductor apparatus comprising, a body having a first surface and a second surface which face each other, a first trench formed in the first surface of the body, a second trench formed in the second surface of the body, a third trench formed in a bottom surface of the second trench, and an aperture connecting the first trench to the third trench.
  • Exemplary embodiments of the present inventive concept also provide an image sensor package comprising, a semiconductor apparatus comprising a body having a first surface and a second surface which face each other, a first trench formed in the first surface of the body, a second trench formed in the second surface of the body, a third trench formed in a bottom surface of the second trench, and an aperture connecting the first trench to the third trench, a transparent member placed in the third trench and covering the aperture, a mounting board placed under the second surface of the body, and an image sensor chip placed between the mounting board and the transparent member and surrounded by the second trench.
  • a semiconductor apparatus comprising a body having a first surface and a second surface which face each other, a first trench formed in the first surface of the body, a second trench formed in the second surface of the body, a third trench formed in a bottom surface of the second trench, and an aperture connecting the first trench to the third trench, a transparent member placed in the third trench and covering the aperture, a mounting board placed under the second surface of the body, and an image sensor
  • Exemplary embodiments of the present inventive concept also provide a semiconductor apparatus, comprising: a first side including a first trench formed therein; a second side including a second trench formed therein and a third trench formed within the second trench such that the second side includes a stepped portion from the second trench to the third trench; and an aperture connecting the first trench and the third trench.
  • the semiconductor apparatus further includes an optical filter having a first surface adhered within the first trench and a transparent member having a first surface adhered within the third trench such that the aperture is enclosed between the first surfaces of the optical filter and the transparent member.
  • the semiconductor apparatus further includes an image sensor chip connected to a second surface of the transparent member and a mounting board electrically and physically connected to the image sensor chip.
  • a corner at which a bottom surface of the first trench meets the aperture or a corner at which a bottom surface of the third trench meets the aperture is beveled.
  • a corner at which sidewalls of the second trench meet the second side is beveled.
  • FIG. 1 is a cross-sectional view of a semiconductor apparatus according to an embodiment of the present inventive concept
  • FIG. 2 is a plan view of the semiconductor apparatus shown in FIG. 1 ;
  • FIG. 3 is a bottom view of the semiconductor apparatus shown in FIG. 1 ;
  • FIG. 4 shows a modified example of the semiconductor apparatus of FIG. 1 ;
  • FIG. 5 shows the disposition of a transparent member and an optical filter in the semiconductor apparatus of FIG. 1 ;
  • FIG. 6 is a cross-sectional view of a semiconductor apparatus according to another embodiment of the present inventive concept.
  • FIG. 7 is a view of an image sensor package according to an embodiment of the present inventive concept.
  • FIGS. 8A and 8B are detailed views of a portion P shown in FIG. 7 ;
  • FIG. 9 is a cross-sectional view of an image sensor package according to another embodiment of the present inventive concept.
  • FIG. 10 is a detailed view of a portion Q shown in FIG. 9 ;
  • FIG. 11 is a cross-sectional view of an image sensor package according to another embodiment of the present inventive concept.
  • FIGS. 12 through 14 are views illustrating processes included in a method of manufacturing an image sensor package according to an embodiment of the present inventive concept.
  • FIGS. 15 and 16 are views illustrating processes included in a method of manufacturing an image sensor package according to another embodiment of the present inventive concept.
  • first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Thus, for example, a first element, a first component or a first section discussed below could be termed a second element, a second component or a second section without departing from the teachings of the present invention.
  • FIGS. 1 through 5 a semiconductor apparatus according to an embodiment of the present inventive concept will be described with reference to FIGS. 1 through 5 .
  • FIG. 1 is a cross-sectional view of a semiconductor apparatus 10 according to an embodiment of the present inventive concept.
  • FIG. 2 is a plan view of the semiconductor apparatus 10 shown in FIG. 1 .
  • FIG. 3 is a bottom view of the semiconductor apparatus 10 shown in FIG. 1 .
  • FIG. 4 shows a modified example of the semiconductor apparatus 10 of FIG. 1 .
  • FIG. 5 shows the disposition of a transparent member 200 and an optical filter 300 in the semiconductor apparatus 10 of FIG. 1 .
  • the semiconductor apparatus 10 includes a body 100 , a first trench 110 , a second trench 120 , a third trench 130 , and an aperture 140 .
  • the body 100 includes a first surface 102 and a second surface 104 which oppose each other.
  • the first trench 110 is formed in the first surface 102 of the body 100
  • the second trench 120 is formed in the second surface 104 of the body 100 .
  • the third trench 130 is formed in a bottom surface 120 b of the second trench 120 .
  • the aperture 140 connects the first trench 110 and the third trench 130 formed in the body 100 .
  • the first trench 110 , the second trench 120 , the third trench 130 , and the aperture 140 are formed in the body 100 .
  • the first and second surfaces 102 and 104 of the body 100 and bottom surfaces 110 b through 130 b of the first through third trenches 110 through 130 included in the semiconductor apparatus 10 according to the current embodiment have substantially the same roughness.
  • no artificial protrusions and recesses may be formed on the first and second surfaces 102 and 104 of the body 100 and the bottom surfaces 110 b through 130 b of the first through third trenches 110 through 130 .
  • protrusions and recesses may be formed in an adhesion portion of the semiconductor apparatus 10 which is adhered to, e.g., a mounting board in order to increase adhesion between the semiconductor apparatus 10 and the mounting board. This will be described later with reference to FIGS. 2 and 3 .
  • the body 100 may be made of, for example, polymer or ceramic. Semiconductor apparatuses 10 according to embodiments of the present inventive concept will be described based on the assumption that the body 100 is made of polymer.
  • the body 100 may be formed by, for example, injection molding.
  • the body 100 can be made of any material that can be injection-molded, such as acrylic polymer or amine-based polymer.
  • the first through third trenches 110 through 130 and the aperture 140 can be formed simultaneously in the body 100 using injection molding.
  • the first trench 110 formed in the first surface 102 of the body 100 is recessed into the body 100 with respect to the first surface 102 of the body 100 .
  • the first trench 110 may be formed in the center of the first surface 102 of the body 100 .
  • a plane of the first trench 110 may have, but is not limited to, a shape of a square or rectangle.
  • the bottom surface 110 b of the first trench 110 may be substantially parallel to the first surface 102 of the body 100 .
  • the bottom surface 110 b of the first trench 110 is connected to the first surface 102 of the body 100 by sidewalls 110 s of the first trench 110 . In the drawing, the sidewalls 110 s of the first trench 110 are orthogonal to the first surface 102 of the body 100 .
  • an angle formed by each sidewall 110 s of the first trench 110 and the first surface 102 can also be provided as an obtuse angle.
  • the shape of the first trench 110 may vary according to the shape of the optical filter 300 (see FIG. 5 ) inserted into the first trench 110 . That is, the first trench 110 may be processed according to the shape of corners of the optical filter 300 in order to enhance adhesion of the semiconductor apparatus 10 to the optical filter 300 .
  • the second trench 120 formed in the second surface 104 of the body 100 is recessed into the body 100 from the second surface 104 of the body 100 .
  • the second trench 120 may be formed in the center of the second surface 104 of the body 100 .
  • a plane of the second trench 120 may have, but is not limited to, a shape of a square or rectangle.
  • sidewalls 120 s of the second trench 120 are orthogonal to the second surface 104 of the body 100 .
  • an angle formed by each sidewall of the second trench 120 and the second surface 104 of the body 100 can also be provided as an obtuse angle.
  • the slope of the sidewalls of the second trench 120 may vary according to the shape of an image sensor chip 400 (see FIG. 7 ) and the shape of wirings 410 (see FIG. 7 ) that connect the image sensor chip 400 to a mounting board 500 (see FIG. 7 ).
  • the third trench 130 formed in the bottom surface 120 b of the second trench 120 is recessed toward the first trench 110 from the bottom surface 120 b of the second trench 120 .
  • the third trench 130 may be formed in the center of the bottom surface 120 b of the second trench 120 .
  • a plane of the third trench 130 may have, but is not limited to, a shape of a square or rectangle.
  • the bottom surface 130 b of the third trench 130 may be substantially parallel to the bottom surface 110 b of the first trench 110 .
  • sidewalls of the third trench 130 are orthogonal to the bottom surface 110 b of the first trench 110 .
  • an angle formed by each sidewall of the third trench 130 and the first surface 102 of the body 100 can also be provided as an obtuse angle.
  • the shape of the third trench 130 may vary according to the shape of the transparent member 200 (see FIG. 5 ) inserted into the third trench 130 . That is, the third trench 130 may be processed according to the shape of corners of the transparent member 200 in order to enhance adhesion of the semiconductor apparatus 10 to the transparent member 200 .
  • the aperture 140 connects the first trench 110 to the third trench 130 . That is, the bottom surface 110 b of the first trench 110 is connected to the bottom surface 120 b of the second trench 120 by sidewalls 140 s of the aperture 140 .
  • the aperture 140 may have, but is not limited to, a shape of a square or rectangle.
  • the square shape aperture 140 illustrated is surrounded by the bottom surface 110 b of the first trench 110 .
  • the bottom surface 110 b of the first trench 110 is surrounded by the first surface 102 of the body 100 which has a step difference from the bottom surface 110 b of the first trench 110 .
  • An air vent hole 150 may be formed in the first surface 102 of the body 100 . Since gas inside an image sensor package is released to the outside through the air vent hole 150 , the image sensor package can be prevented from being destroyed due to pressure.
  • the air vent hole 150 is optional, depending on the structure of the image sensor package. This will be described later with reference to FIGS. 7 and 9 .
  • the bottom surface 130 b of the third trench 130 surrounds the aperture 140 .
  • the bottom surface 120 b of the second trench 120 and the second surface 104 of the body 100 which have a step difference from the bottom surface 130 b of the third trench 130 , sequentially surround the bottom surface 130 b of the third trench 130 .
  • An air vent hole 150 may be formed in the bottom surface 120 b of the second trench 120 .
  • the air vent hole 150 formed in the image sensor package may connect the first surface 102 of the body 100 to the second surface 104 of the body 100 .
  • the bottom surface 110 b of the first trench 110 and the bottom surface 130 b of the third trench 130 are hatched.
  • the bottom surface 110 b of the first trench 110 and the bottom surface 130 b of the third trench 130 may include protrusions and recesses.
  • a first roughness of the first surface 102 of the body 100 may be different from a second roughness of the bottom surface 110 b of the first trench 110 .
  • a third roughness of the bottom surface 120 b of the second trench 120 may be different from a fourth roughness of the bottom surface 130 b of the third trench 130 .
  • the difference in roughness between the above surfaces can be reduced by forming artificial protrusions and recesses on the bottom surface 110 b of the first trench 110 and the bottom surface 130 b of the third trench 130 .
  • one or more of the bottom surface 110 b of the first trench 110 and the bottom surface 130 b of the third trench 130 may include protrusions and recesses.
  • the protrusions and recesses included in the bottom surface 110 b of the first trench 110 and the bottom surface 130 b of the third trench 130 may be a regular repetition of, for example, a mesh shape, a saw-toothed shape, or a wave shape.
  • the protrusions and recesses may be formed using a physical method or a chemical method.
  • an adhesion surface of a semiconductor apparatus may be etched or corroded using chemicals.
  • Examples of the physical method may include sand blasting and injection molding in which protruding and recessed shapes are formed in a mold to form protrusions and recesses.
  • the method of forming protrusions and recesses is not limited to the above methods.
  • FIG. 4 A modified example of the semiconductor apparatus 10 shown in FIG. 1 will now be described with reference to FIG. 4 .
  • a semiconductor apparatus 10 may further include one or more protrusions 104 p which protrude from the second surface 104 of the body 100 .
  • the protrusions 104 p may be formed respectively on four sides of the second surface 104 of the body 100 around the second trench 120 .
  • the present inventive concept is not limited thereto, and the protrusions 104 p can also be formed at arbitrary locations on the second surface 104 of the body 100 .
  • the protrusions 104 p may be formed to align the semiconductor apparatus 10 with the mounting board 500 (see FIG. 7 ).
  • the protrusions 104 p may be formed to increase adhesion between the semiconductor apparatus 10 and the mounting board 500 .
  • the mounting board 500 may include recesses at locations corresponding respectively to the protrusions 104 p.
  • the semiconductor apparatus 10 may further include the transparent member 200 or the optical filter 300 .
  • the transparent member 200 may be placed within the third trench 130 and cover the aperture 140 .
  • the transparent member 200 may be, e.g., a glass plate.
  • the transparent member 200 may be adhered to the semiconductor apparatus 10 by a first adhesive film 210 .
  • the transparent member 200 is adhered to the bottom surface 130 b of the third trench 130 and the sidewalls of the third trench 130 by the first adhesive film 210 .
  • Part of sidewalls of the transparent member 200 may not overlap the sidewalls of the third trench 130 . That is, the transparent member 200 may be raised higher than the bottom surface 120 b of the second trench 120 .
  • this is merely an example used to describe the semiconductor apparatus 10 according to exemplary embodiments of the present inventive concept, and the present inventive concept is not limited to this example.
  • the optical filter 300 is placed within the first trench 110 and covers the aperture 140 with respect to the first surface 102 side of the body 100 .
  • the optical filter 300 and the transparent member 200 face each other with the aperture 140 interposed therebetween.
  • the optical filter 300 may be, for example, an optical low frequency filter (OLPF).
  • OLPF optical low frequency filter
  • the optical filter 300 can remove moire fringes to realize a high-quality image sensor system.
  • the optical filter 300 is adhered to the bottom surface 110 b of the first trench 110 and the sidewalls of the first trench 110 by a second adhesive film 220 .
  • the optical filter 300 may be raised higher than the first surface 102 of the body 100 .
  • the present inventive concept is not limited thereto.
  • a semiconductor apparatus according to another embodiment of the present inventive concept will now be described with reference to FIG. 6 .
  • the semiconductor apparatus according to the current embodiment is substantially the same as the semiconductor apparatus 10 described above with reference to FIGS. 1 through 5 , except that an adhesion portion of the semiconductor apparatus is beveled, and thus a redundant description thereof will be omitted or made briefly.
  • FIG. 6 is a cross-sectional view of a semiconductor apparatus 10 according to another embodiment of the present inventive concept.
  • a corner at which a bottom surface 110 b of a first trench 110 meets each sidewall 140 s of an aperture 140 is beveled to form a first beveled surface 110 c.
  • a corner at which a second surface 104 of a body 100 meets each sidewall 120 s of a second trench 120 is beveled to form a second beveled surface 120 c.
  • a corner at which a bottom surface 130 b of a third trench 130 meets each sidewall 140 s of the aperture 140 is beveled to form a third beveled surface 130 c.
  • the first through third beveled surfaces 110 c, 120 c and 130 c are illustrated in the drawing.
  • the semiconductor apparatus 10 may include one or more of the first through third beveled surfaces 110 c, 120 c and 130 c.
  • the first through third beveled surfaces 110 c, 120 c and 130 c shown in the drawing are flat surfaces. However, they can also be curved surfaces having a curvature. The formation of such beveled surfaces can increase the adhesion of the semiconductor apparatus 10 to a mounting board 500 (see FIG. 7 ), a transparent member 200 (see FIG. 7 ) and an optical filter 300 (see FIG. 7 ), thereby improving the reliability of an image sensor package.
  • FIGS. 7 through 8B An image sensor package according to an embodiment of the present inventive concept will now be described with reference to FIGS. 7 through 8B .
  • a semiconductor apparatus used in the image sensor package is substantially the same as any one of the semiconductor apparatuses 10 described above, and thus a redundant description thereof will be omitted or provided briefly.
  • FIG. 7 is a view of an image sensor package 1 according to an embodiment of the present inventive concept.
  • FIGS. 8A and 8B are detailed views of a portion P shown in FIG. 7 .
  • the image sensor package 1 includes a semiconductor apparatus 10 , a transparent member 200 , an image sensor chip 400 , and a mounting board 500 .
  • the image sensor package 1 may further include an optical filter 300 .
  • the image sensor chip 400 may further include wirings 410 which electrically connect the image sensor chip 400 to the mounting board 500 .
  • the image sensor package 1 may further include first through third adhesive films 210 , 220 and 230 .
  • the transparent member 200 is placed in a third trench 130 formed in a body 100 and covers an aperture 140 .
  • the optical filter 300 is placed in a first trench 110 formed in the body 100 and covers another side of the aperture 140 with respect to the second surface 104 side of the body 100 .
  • the transparent member 200 and the optical filter 300 face each other with the aperture 140 positioned therebetween.
  • the mounting board 500 is placed under the semiconductor apparatus 10 , specifically, under a second surface 104 of the body 100 .
  • the image sensor chip 400 is disposed between the mounting board 500 and the transparent member 200 and surrounded by the semiconductor apparatus 10 . That is, the image sensor chip 400 is surrounded by a second trench 120 and placed within the second trench 120 .
  • the semiconductor apparatus 10 includes the body 100 , the first through third trenches 110 , 120 and 130 , and the aperture 140 .
  • the body 100 includes a first surface 102 and the second surface 104 which oppose each other.
  • the first trench 110 is formed in the first surface 102 of the body 100
  • the second trench 120 is formed in the second surface 104 of the body 100
  • the third trench 130 is formed in a bottom surface 120 b of the second trench 120 .
  • the aperture 140 connects the first trench 110 and the third trench 130 formed in the body 100 . Protrusions and recesses described above with reference to FIGS.
  • the shape and/or roughness of the protrusions and recesses formed in the bottom surface 110 b of the first trench 110 may be the same as the shape and/or roughness of the bottom surface 130 b of the third trench 130 .
  • the term ‘same’ encompasses not only a case where two surfaces are completely the same in their shape and/or roughness but also a case where fine differences exist between the two surfaces due to processing margins.
  • the transparent member 200 placed in the third trench 130 is connected to the third trench 130 by the first adhesive film 210 .
  • the transparent member 200 is adhered to the bottom surface 130 b of the third trench 130 and sidewalls 130 s of the third trench 130 by the first adhesive film 210 .
  • a distance from the bottom surface 130 b of the third trench 130 to a surface of the transparent member 200 which faces the image sensor chip 400 may be greater than a height of the sidewalls 130 s of the third trench 130 . Therefore, a part of a side surface of the transparent member 200 may face the sidewalls 130 s of the third trench 130 , and the other part of the side surface of the transparent member 200 may face sidewalls 120 s of the second trench 120 .
  • a thickness of the transparent member 200 may be determined in view of a height of the wirings 410 .
  • the transparent member 200 should be thick enough to fully protect the wirings 410 .
  • part of the first adhesive film 210 may be placed on the bottom surface 120 b of the second trench 120 .
  • the first adhesive film 210 may be placed in a band shape on the bottom surface 120 b of the second trench 120 which adjoins the third trench 130 .
  • the transparent member 200 is connected to the image sensor chip 400 in addition to the semiconductor apparatus 10 .
  • the transparent member 200 is connected to the image sensor chip 400 by the third adhesive film 230 .
  • the transparent member 200 is adhered to a top surface of the image sensor chip 400 by the third adhesive film 230 .
  • the third adhesive film 230 is placed around a light-receiving portion (not shown) of the image sensor chip 400 .
  • the third adhesive film 230 adheres edges of the transparent member 200 to a region around the light-receiving portion of the image sensor chip 400 .
  • a first space S 1 surrounded by the transparent member 200 , the image sensor chip 400 and the third adhesive film 230 is sealed.
  • the sealed first space S 1 prevents particles from entering the light-receiving portion of the image sensor chip 400 , thereby reducing the feeling of a presence of foreign matter in a sensed image.
  • the image sensor chip 400 is placed between the mounting board 500 and the transparent member 200 .
  • a bottom surface of the image sensor chip 400 is adhered, and thus connected, to the mounting board 500 by an adhesive film (not shown), and a top surface of the image sensor chip 400 is connected to the transparent member 200 by the third adhesive film 230 .
  • the terms bottom surface and top surface are relative terms only, and the surfaces of the image sensor chip 400 may be referred to in the opposite manner. Thus, a description of top and bottom surfaces is for ease of description and understanding of the drawings only.
  • the image sensor chip 400 may be electrically connected to the mounting board 500 by the wirings 410 .
  • the wirings 410 are formed on a surface of the image sensor chip 400 which faces the transparent member 200 .
  • the wirings 410 may be formed using a conventional wiring method or a reverse wiring method.
  • the wirings 410 may not overlap the transparent member 200 and the third adhesive film 230 . That is, the wirings 410 may be placed around the third adhesive film 230 and connected to the image sensor chip 400 .
  • the wirings 410 may be positioned in a second space S 2 that can be formed by the second trench 120 , the transparent member 200 , the third adhesive film 230 , and the image sensor chip 400 . In other words, the second space S 2 may surround the wirings 410 .
  • the mounting board 500 may be, but is not limited to, a printed circuit board (PCB).
  • the body 100 , the transparent member 200 , the image sensor chip 400 and the mounting board 500 are sequentially connected to each other by adhesive films to form one fixed body.
  • the mounting board 500 is placed under the second surface 104 of the body 100 , it does not necessarily contact the second surface 104 of the body 100 .
  • an adhesive film which adheres the mounting board 500 to the second surface 104 of the body 100 may not be used.
  • the mounting board 500 and the second surface 104 of the body 100 may contact each other.
  • an air gap t 1 may be formed between the mounting board 500 and the second surface 104 of the body 100 .
  • the air gap t 1 is formed between the second surface 104 of the body 100 and the mounting board 500 .
  • the second space S 2 is a space surrounded by the second trench 120 , the transparent member 200 , the third adhesive film 230 , the image sensor chip 400 and the air gap t 1 .
  • the second space S 2 may not be sealed off from the outside of the image sensor package 1 . That is, part of each of the wirings 410 in the second space S 2 may be surrounded by the air gap t 1 . Since air inside the second space S 2 can flow out of the image sensor package 1 through the air gap t 1 , an air vent hole 150 may not be formed on the first surface 102 of the body 100 , unlike in FIG. 2 .
  • the air vent hole 150 prevents the pressure inside the second space S 2 from increasing during a manufacturing process, and thus destroying the image sensor package 1 .
  • the pressure of the second space S 2 can be controlled without using the air vent hole 150 .
  • the optical filter 300 placed within the first trench 110 is connected to the first trench 110 by the second adhesive film 220 .
  • the optical filter 300 is adhered to the bottom surface 110 b of the first trench 110 and sidewalls 110 s of the first trench 110 by the second adhesive film 220 .
  • a top surface of the optical filter 300 may be, but is not limited to, higher than the first surface 102 of the body 100 .
  • part of the second adhesive film 220 may be placed on the first surface 102 of the body 100 .
  • the second adhesive film 220 may be placed in a band shape on the first surface 102 of the body 100 which adjoins the first trench 110 .
  • the first through third adhesive films 210 , 220 and 230 may be, for example, epoxy.
  • each of the wirings 410 is connected to a connection pad 400 p formed on the image sensor chip 400 .
  • the connection pad 400 p is formed on each portion of the image sensor chip 400 which is not overlapped by the third adhesive film 230 . Therefore, each wiring 410 connected to the connection pad 400 p does not contact the third adhesive film 230 and the transparent member 200 formed on the third adhesive film 230 .
  • the wirings 410 are not overlapped by the transparent member 200 and the third adhesive film 230 when seen in a plane view.
  • the third adhesive film 230 has a curved side surface in the drawing, the present embodiment is not limited thereto.
  • part of the third adhesive film 230 may protrude further than the side surface of the transparent member 200 .
  • the third adhesive film 230 may also be recessed from the side surface of the transparent member 200 in a direction away from the connection pad 400 p. There is no correlation between a height of a topmost part of each wiring 410 and a thickness of the third adhesive film 230 .
  • a spacer 230 s may further be provided between the transparent member 200 and the image sensor chip 400 .
  • the spacer 230 s may be adhered and connected to the transparent member 200 and the image sensor chip 400 by the third adhesive film 230 formed on both sides of the spacer 230 s.
  • the spacer 230 s may secure the first space S 1 (see FIG. 7 ) between the transparent member 200 and the image sensor chip 400 , or may be used to improve the durability of the image sensor package 1 .
  • a shape of the spacer 230 s may be the same as a planar shape of the transparent member 200 . However, the present embodiment is not limited thereto.
  • the spacer 230 s includes a through hole (not shown) in the center thereof to allow incident light to reach the light receiving portion of the image sensor chip 400 without being blocked. That is, the spacer 230 s may be an object that includes inner and outer sidewalls and an aperture formed in the center thereof.
  • the image sensor package according to the current embodiment is substantially the same as the image sensor package 1 described above with reference to FIG. 7 , except that a transparent member 200 is not adhered to an image sensor chip 400 and that a second surface 104 of a body 100 is adhered to a mounting board 500 , and thus a redundant description thereof will be omitted or made briefly.
  • FIG. 9 is a cross-sectional view of an image sensor package 1 according to another embodiment of the present inventive concept.
  • FIG. 10 is a detailed view of a portion Q shown in FIG. 9 .
  • a first adhesive film 210 adheres and connects a transparent member 200 to a third trench 130 .
  • a fourth adhesive film 240 adheres and connects a second surface 104 of a body 100 to a mounting board 500 .
  • the transparent member 200 and an image sensor chip 400 are not connected to each other, but face each other.
  • a first space S 1 between the transparent member 200 and the image sensor chip 400 is not a sealed space.
  • a second space S 2 surrounded by a second trench 120 , the fourth adhesive film 240 , the image sensor chip 400 and the transparent member 200 is connected to the first space S 1 .
  • the inside of the image sensor package 1 which is formed by the first space S 1 and the second space S 2 is sealed off from the outside of the image sensor package 1 .
  • the fourth adhesive film 240 may be, for example, epoxy.
  • the transparent member 200 , the body 100 , the mounting board 500 , and the image sensor chip 400 may be connected sequentially to each other by adhesive films to form one fixed body. Since the inside of the image sensor package 1 is sealed off from the outside, an air vent hole 150 (see FIG. 2 ) may be formed to release the air inside the image sensor package 1 to the outside.
  • a wiring 410 which electrically connects the image sensor chip 400 to the mounting board 500 is connected to a connection pad 400 p.
  • part of the connection pad 400 p is disposed under the transparent member 200 to be overlapped by the transparent member 200 .
  • the present inventive concept is not limited thereto. That is, the wiring 410 may not overlap the first space S 1 (see FIG. 9 ).
  • the connection pad 400 p is placed on a portion of the image sensor chip 400 which is overlapped by the first space S 1 (see FIG. 9 ), the wiring 410 may be overlapped by the transparent member 200 .
  • part of the wiring 410 may be positioned within the first space S 1 (see FIG. 9 ).
  • a height t 2 of the first space S 1 may be determined in view of a height of a topmost part of the wiring 410 .
  • the height t 2 of the first space S 1 should be great enough to prevent the transparent member 200 and the wiring 410 from contacting each other.
  • the image sensor package according to the current embodiment is substantially the same as the image sensor package 1 described above with reference to FIG. 9 , except that an adhesion portion of a semiconductor apparatus 10 is beveled, and thus a redundant description thereof will be omitted or made briefly.
  • FIG. 11 is a cross-sectional view of an image sensor package 1 according to another embodiment of the present inventive concept.
  • a corner at which a bottom surface 110 b of a first trench 110 meets an aperture 140 is beveled.
  • a corner at which each sidewall 120 s of a second trench 120 meets a second surface 104 of a body 100 is beveled.
  • a corner at which a bottom surface 130 b of a third trench 130 meets the aperture 140 is beveled.
  • a first beveled surface 110 c is positioned between the bottom surface 110 b of the first trench 110 and each sidewall 140 s of the aperture 140 .
  • a second beveled surface 120 c is positioned between each sidewall 120 s of the second trench 120 and the second surface 104 of the body 100 .
  • a third beveled surface 130 c is positioned between the bottom surface 130 b of the third trench 130 and each sidewall 140 s of the aperture 140 .
  • a first adhesive film 210 contacts the sidewalls 130 s of the third trench 130 , the bottom surface 130 b of the third trench 130 , the third beveled surface 130 c, and the transparent member 200 .
  • a second adhesive film 220 contacts the bottom surface 110 b of the first trench 110 , the sidewalls 110 s of the first trench 110 , the first beveled surface 110 c, and an optical filter 300 .
  • a fourth adhesive film 240 contacts the second surface 104 of the body 100 , a mounting board 500 , and the second beveled surface 120 c.
  • first through third beveled surfaces 110 c through 130 c can be formed.
  • the first through third beveled surfaces 110 c through 130 c respectively increase the adhesion areas of the second adhesive film 220 , the fourth adhesive film 240 and the first adhesive film 210 , thereby increasing the adhesion of an adhesion portion of the image sensor package 1 .
  • FIGS. 7 and 12 through 14 A method of manufacturing an image sensor package according to an embodiment of the present inventive concept will now be described with reference to FIGS. 7 and 12 through 14 .
  • FIGS. 12 through 14 are views illustrating a process of manufacturing the image sensor package 1 of FIG. 7 .
  • a wafer having an image sensor device is made thin by a polishing process. Then, the thin wafer is expanded by cutting the wafer into sizes of an image sensor chip.
  • An image sensor chip 400 is examined to determine whether it is non-defective. When the image sensor chip 400 is determined to be a non-defective chip, a transparent member 200 is adhered onto the image sensor chip 400 using a third adhesive film 230 . Then, the image sensor chip 400 where the transparent member 200 is adhered is separated from the wafer.
  • FIG. 12 illustrates the separated image sensor chip 400
  • FIG. 13 is a cross section taken along the line A-A of FIG. 12 .
  • the transparent member 200 is positioned in the center of the image sensor chip 400 , and the third adhesive film 230 is positioned under the transparent member 200 .
  • the third adhesive film 230 is formed in a band shape along edges of the transparent member 200 .
  • the inside of the third adhesive film 230 may be a light receiving portion of the image sensor chip 400 .
  • a first space S 1 formed by the transparent member 200 , the image sensor chip 400 and the third adhesive film 230 may be sealed.
  • the image sensor chip 400 coupled to the transparent member 200 is placed on a mounting board 500 .
  • the image sensor chip 400 may be adhered to the mounting board 500 using an adhesive film (not shown).
  • a curing process may be performed so that the image sensor chip 400 can stably adhere to the mounting board 500 .
  • the mounting board 500 and the image sensor chip 400 are electrically connected to each other using wirings 410 .
  • the third trench 130 and the transparent member 200 included in the semiconductor apparatus 10 of FIG. 1 are adhered to each other using a first adhesive film 210 .
  • a curing process may be performed so that the semiconductor apparatus 10 can stably adhere to the transparent member 200 .
  • An optical filter 300 is connected to the semiconductor apparatus 10 using a second adhesive film 220 , thereby completing an image sensor package.
  • the semiconductor apparatus 10 and the optical filter 300 can also be adhered to each other using the second adhesive film 220 before the semiconductor apparatus 10 and the transparent member 200 are adhered to each other.
  • FIGS. 9 , 15 and 16 A method of manufacturing an image sensor package according to another embodiment of the present inventive concept will now be described with reference to FIGS. 9 , 15 and 16 .
  • FIGS. 15 and 16 are views illustrating a process of manufacturing the image sensor package 1 of FIG. 9 .
  • the third trench 130 and the transparent member 200 included in the semiconductor apparatus 10 of FIG. 1 are connected to each other using a first adhesive film 210 .
  • An optical filter may further be connected to the semiconductor apparatus 10 which includes the transparent member 200 .
  • the present inventive concept is not limited thereto. In the method of manufacturing an image sensor package according to the present inventive concept, the semiconductor apparatus 10 is adhered to a mounting board 500 before the optical filter is connected to the semiconductor apparatus 10 .
  • an image sensor chip 400 is placed on the mounting board 500 .
  • the image sensor chip 400 may be adhered to the mounting board 500 using an adhesive film (not shown).
  • a curing process may be performed so that the image sensor chip 400 can stably adhere to the mounting board 500 .
  • the mounting board 500 and the image sensor chip 400 may be electrically connected to each other using wirings 410 .
  • a fourth adhesive film 240 is formed at a location on the mounting board 500 which corresponds to a second surface 104 (see FIG. 15 ) of a body 100 .
  • the fourth adhesive film 240 can also be formed on the second surface 104 of the body 100 , instead of on the mounting board 500 .
  • the semiconductor apparatus 10 manufactured in FIG. 15 is adhered to the mounting board 500 .
  • an optical filter 300 is connected to the semiconductor apparatus 10 using a second adhesive film 220 , thereby completing an image sensor package.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
US13/598,790 2012-01-12 2012-08-30 Semiconductor apparatus and image sensor package using the same Abandoned US20130181310A1 (en)

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KR10-2012-0003916 2012-01-12
KR1020120003916A KR20130083249A (ko) 2012-01-12 2012-01-12 반도체 장치 및 이를 이용한 이미지 센서 패키지

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140160327A1 (en) * 2012-12-07 2014-06-12 Sony Corporation Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus
US20150011038A1 (en) * 2013-07-08 2015-01-08 Kingpak Technology Inc. Two-stage packaging method of image sensors
CN105321909A (zh) * 2014-07-31 2016-02-10 立景光电股份有限公司 电子装置及封装电子装置的方法
US9634046B2 (en) 2014-05-12 2017-04-25 Samsung Electronics Co., Ltd. Semiconductor packages including electrical insulation features
US9691801B2 (en) 2014-12-22 2017-06-27 Stmicroelectronics Pte Ltd Image sensing device with cap and related methods
CN106986298A (zh) * 2015-10-27 2017-07-28 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
KR20190098537A (ko) * 2018-02-14 2019-08-22 삼성전자주식회사 생체 센서를 포함하는 전자 장치
US11515220B2 (en) 2019-12-04 2022-11-29 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and methods of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020131782A1 (en) * 2001-01-12 2002-09-19 Susumu Yamaguchi Image pickup device and image pickup lens
US6762796B1 (en) * 1998-08-10 2004-07-13 Olympus Optical Co., Ltd. Image pickup module having integrated lens and semiconductor chip
US20040211882A1 (en) * 2003-04-23 2004-10-28 Jackson Hsieh Image sensor having a rough contact surface
US20080023808A1 (en) * 2006-07-28 2008-01-31 Altus Technology Inc. Chip package and digital camera module using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762796B1 (en) * 1998-08-10 2004-07-13 Olympus Optical Co., Ltd. Image pickup module having integrated lens and semiconductor chip
US20020131782A1 (en) * 2001-01-12 2002-09-19 Susumu Yamaguchi Image pickup device and image pickup lens
US20040211882A1 (en) * 2003-04-23 2004-10-28 Jackson Hsieh Image sensor having a rough contact surface
US20080023808A1 (en) * 2006-07-28 2008-01-31 Altus Technology Inc. Chip package and digital camera module using same

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10020347B2 (en) * 2012-12-07 2018-07-10 Sony Corporation Solid-state image pickup device and electronic apparatus
US20140160327A1 (en) * 2012-12-07 2014-06-12 Sony Corporation Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus
US20150011038A1 (en) * 2013-07-08 2015-01-08 Kingpak Technology Inc. Two-stage packaging method of image sensors
US8969120B2 (en) * 2013-07-08 2015-03-03 Kingpak Technology Inc. Two-stage packaging method of image sensors
US9634046B2 (en) 2014-05-12 2017-04-25 Samsung Electronics Co., Ltd. Semiconductor packages including electrical insulation features
CN105321909A (zh) * 2014-07-31 2016-02-10 立景光电股份有限公司 电子装置及封装电子装置的方法
US10854651B2 (en) 2014-12-22 2020-12-01 Stmicroelectronics Pte Ltd Image sensing device with cap and related methods
US9691801B2 (en) 2014-12-22 2017-06-27 Stmicroelectronics Pte Ltd Image sensing device with cap and related methods
US10403661B2 (en) 2014-12-22 2019-09-03 Stmicroelectronics Pte Ltd Image sensing device with cap and related methods
US10526200B2 (en) * 2015-10-27 2020-01-07 Advanced Semiconductor Engineering, Inc. Semiconductor device package including cover including tilted inner sidewall
US20180072563A1 (en) * 2015-10-27 2018-03-15 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
CN106986298A (zh) * 2015-10-27 2017-07-28 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
US9850124B2 (en) * 2015-10-27 2017-12-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package for reducing parasitic light and method of manufacturing the same
CN110228786A (zh) * 2015-10-27 2019-09-13 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
KR20190098537A (ko) * 2018-02-14 2019-08-22 삼성전자주식회사 생체 센서를 포함하는 전자 장치
WO2019160357A1 (en) * 2018-02-14 2019-08-22 Samsung Electronics Co., Ltd. Electronic device including biometric sensor
US10990792B2 (en) 2018-02-14 2021-04-27 Samsung Electronics Co., Ltd. Electronic device including biometric sensor
KR102526993B1 (ko) * 2018-02-14 2023-04-28 삼성전자주식회사 생체 센서를 포함하는 전자 장치
US11657639B2 (en) 2018-02-14 2023-05-23 Samsung Electronics Co., Ltd. Electronic device including biometric sensor
EP4283572A3 (en) * 2018-02-14 2024-04-17 Samsung Electronics Co., Ltd. Electronic device including biometric sensor
US11515220B2 (en) 2019-12-04 2022-11-29 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and methods of manufacturing the same

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