US20130049186A1 - Semiconductor device and method of manufacture thereof - Google Patents

Semiconductor device and method of manufacture thereof Download PDF

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Publication number
US20130049186A1
US20130049186A1 US13/455,577 US201213455577A US2013049186A1 US 20130049186 A1 US20130049186 A1 US 20130049186A1 US 201213455577 A US201213455577 A US 201213455577A US 2013049186 A1 US2013049186 A1 US 2013049186A1
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Prior art keywords
heat conductive
semiconductor device
cooling body
bonding material
molded resin
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Abandoned
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US13/455,577
Inventor
Noboru Miyamoto
Masao Kikuchi
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIKUCHI, MASAO, MIYAMOTO, NOBORU
Publication of US20130049186A1 publication Critical patent/US20130049186A1/en
Priority to US14/806,303 priority Critical patent/US11088045B2/en
Abandoned legal-status Critical Current

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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions

  • Japanese Laid-Open Patent Publication No. 2006-100327 discloses a semiconductor device in which a semiconductor module formed by encapsulating a semiconductor element with resin is secured to a cooling fin (or cooling body) by means of screws.
  • Japanese Laid-Open Patent Publication No. 2001-250890 also discloses related art.
  • the semiconductor module In order to reduce the number of parts in such a semiconductor device, it is desirable to secure the semiconductor module to the cooling body without using screws or the like. To accomplish this, the semiconductor module must be secured to the cooling body by way of some adhesive or bonding material which is disposed therebetween. It should be noted that such material must have substantial heat conductivity, as well as providing substantial bonding strength. It has been found, however, that the use of a material suitable for securing the semiconductor module to the cooling body may result in insufficient cooling of the semiconductor module. On the other hand, the use of a material suitable for cooling the semiconductor module may result in inadequate securing of the semiconductor module to the cooling body.
  • the present invention has been made to solve the above problems. It is, therefore, an object of the present invention to provide a semiconductor device which has a reduced number of parts, yet in which the semiconductor module is attached to a cooling body with substantial bonding strength and cooled adequately. Another object of the present invention is to provide a method of manufacturing such a semiconductor device.
  • a semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body.
  • a method of manufacturing a semiconductor device includes the steps of forming heat conductive material on a surface of a cooling body, forming bonding material on the surface of the cooling body, the bonding material having a projection, forming a resin groove in a molded resin of a semiconductor module having a heat conductive portion which is formed of metal and which is exposed at a surface of the molded resin, and integrally securing the cooling body and the semiconductor module together in such a manner that the projection is in contact with an inner wall of the resin groove, and that the heat conductive portion overlaps and is in contact with the heat conductive material.
  • FIG. 1 is a cross-sectional view of a semiconductor device in accordance with a first embodiment of the present invention
  • FIG. 2 is a perspective view showing the way in which the semiconductor module of the semiconductor device of the first embodiment is secured to the cooling body;
  • FIG. 3 is a cross-sectional view showing a variation of the semiconductor device of the first embodiment
  • FIG. 4 is a cross-sectional view showing another variation of the semiconductor device of the first embodiment
  • FIG. 5 is a cross-sectional view of the semiconductor device of the second embodiment
  • FIG. 6 is a perspective view showing the cooling body of the semiconductor device of the second embodiment
  • FIG. 7 is a perspective view showing the cooling body, the heat conductive material, and the bonding material in the semiconductor device of the second embodiment
  • FIG. 8 is a cross-sectional view of the semiconductor device of the third embodiment.
  • FIG. 9 is a cross-sectional view showing a variation of the semiconductor device of the third embodiment.
  • FIG. 10 is a cross-sectional view of the semiconductor device of the fourth embodiment.
  • FIG. 11 is a cross-sectional view of the semiconductor device of the fifth embodiment.
  • FIG. 12 is a cross-sectional view showing the way in which the cooling body and the semiconductor module of the semiconductor device of the fifth embodiment are integrally secured together.
  • FIG. 1 is a cross-sectional view of a semiconductor device 10 in accordance with a first embodiment of the present invention.
  • the semiconductor device 10 is provided with a cooling body 12 .
  • the cooling body 12 is formed of metal, e.g., copper.
  • a semiconductor module 14 is disposed above the cooling body 12 .
  • the semiconductor module 14 has a heat conductive portion 16 formed of metal and a molded resin 18 having a surface at which the heat conductive portion 16 is exposed.
  • the semiconductor module 14 is formed, e.g., by encapsulating a semiconductor element, such as an IGBT, with resin by means of transfer molding.
  • a bonding material 20 and a heat conductive material 22 are formed between the semiconductor module 14 and the cooling body 12 .
  • the bonding material 20 secures the molded resin 18 of the semiconductor module 14 to the cooling body 12 .
  • the bonding material 20 is formed of insulating material.
  • the heat conductive material 22 is formed between and thermally couples the heat conductive portion 16 and the cooling body 12 .
  • the heat conductive material 22 is formed of electrically conductive material having excellent heat conductivity.
  • FIG. 2 is a perspective view showing the way in which the semiconductor module of the semiconductor device of the first embodiment is secured to the cooling body.
  • the bonding material 20 is formed to surround the heat conductive material 22 .
  • the semiconductor module 14 is moved in the direction of the arrow of FIG. 2 and brought into bonding engagement with the bonding material 20 so that the semiconductor module 14 is secured to the cooling body 12 .
  • the heat conductive portion 16 and the heat conductive material 22 are separated from the outside by the bonding material 20 .
  • the semiconductor module 14 is secured to the cooling body 12 by means of the bonding material 20 , which is suitable for that purpose, making it possible to attach the semiconductor module 14 to the cooling body 12 with substantial bonding strength.
  • the heat conductive portion 16 is thermally coupled to the cooling body 12 by way of the heat conductive material 22 , which is suitable for cooling the semiconductor module 14 , making it possible to adequately cool the semiconductor module 14 .
  • the semiconductor device 10 has a reduced number of parts, since the semiconductor module 14 is secured to the cooling body 12 without using screws or the like. Thus, although the semiconductor device of the first embodiment has a reduced number of parts, the semiconductor module 14 is attached to the cooling body 12 with substantial bonding strength and cooled adequately.
  • the heat conductive material 22 is formed of electrically conductive material having excellent heat conductivity, and hence is expected to provide good heat conduction. Furthermore, the heat conductive portion 16 and the heat conductive material 22 are separated from the outside by the bonding material 20 , which is formed of insulating material, thereby insulating the heat conductive material 22 from the outside atmosphere. Insulating a semiconductor module from the outside atmosphere is an effective way to maintain the characteristics of the semiconductor module, especially if the module includes a power semiconductor device driven by a high voltage.
  • FIG. 3 is a cross-sectional view showing a variation of the semiconductor device of the first embodiment.
  • an anchor portion 24 is formed in the surface of the molded resin 18 in contact with the bonding material 20 , thereby increasing the surface roughness of that surface.
  • the surface of the molded resin 18 in contact with the bonding material 20 has a greater surface roughness than the surfaces of the molded resin 18 which are not in contact with the bonding material 20 . In this way it is possible to increase the bonding strength of the bonding material 20 between the semiconductor module 14 and the cooling body 12 .
  • FIG. 4 is a cross-sectional view showing another variation of the semiconductor device of the first embodiment.
  • the portion of the molded resin 18 in contact with the bonding material 20 has been subjected to hydrophilic treatment, forming a hydrophilic portion 26 . Therefore, the portion of the molded resin 18 in contact with the bonding material 20 is more hydrophilic than the portions of the molded resin 18 which are not in contact with the bonding material 20 . In this way it is possible to increase the bonding strength of the bonding material 20 between the semiconductor module 14 and the cooling body 12 . It should be noted that the bonding strength of the bonding material 20 between the semiconductor module 14 and the cooling body 12 may be increased by subjecting the molded resin 18 to a surface treatment other than those described above.
  • the bonding material 20 may be formed of material other than insulating material.
  • the heat conductive material 22 is formed of electrically conductive material, it is to be understood that in other embodiments it may be formed of, e.g., silicone grease.
  • the heat conductive material 22 is formed of an insulating material such as silicone grease, it is easier to insulate the semiconductor module 14 .
  • the semiconductor element and the heat conductive portion 16 within the molded resin 18 may be insulated from each other by insulating material in order to ensure the insulation of the semiconductor module.
  • FIG. 5 is a cross-sectional view of the semiconductor device of the second embodiment.
  • the cooling body 12 has a cooling body groove 12 a formed therein.
  • the heat conductive material 22 is separated from a cooling material 30 by the cooling body groove 12 a.
  • FIG. 6 is a perspective view showing the cooling body of the semiconductor device of the second embodiment.
  • the cooling body groove 12 a formed in the cooling body 12 , has a rectangular annular shape.
  • FIG. 7 is a perspective view showing the cooling body, the heat conductive material, and the bonding material in the semiconductor device of the second embodiment.
  • the bonding material 30 is formed to surround the heat conductive material 22 .
  • the heat conductive material 22 serves to cool the semiconductor module 14
  • the bonding material 30 serves to bond the semiconductor module 14 to the cooling body 12 .
  • the heat conductive material 22 and the bonding material 30 have different functions. Therefore, mixing or bringing into contact these materials may prevent them from functioning properly.
  • the heat conductive material 22 and the bonding material 30 are prevented from being mixed or brought into contact with each other, since they are separated from each other by the cooling body groove 12 a.
  • FIG. 8 is a cross-sectional view of the semiconductor device of the third embodiment.
  • a bonding material 40 is formed to extend to cover the side surfaces 18 a of the molded resin 18 . Further, the surface of the heat conductive portion 16 in contact with the heat conductive material 22 and the bottom surface 18 b of the molded resin 18 form a single plane.
  • the bonding material 40 extends to cover the side surfaces 18 a of the molded resin 18 , the bonding strength of the bonding material 40 between the semiconductor module 14 and the cooling body 12 is increased. Further, since the surface of the heat conductive portion 16 in contact with the heat conductive material 22 and the bottom surface 18 b of the molded resin 18 form a single plane, the gap between the bottom surface 18 b and the cooling body 12 is narrowed, making it easier to form the bonding material 40 , which extends to cover the side surfaces 18 a of the molded resin 18 .
  • FIG. 9 is a cross-sectional view showing a variation of the semiconductor device of the third embodiment.
  • the outer circumferential bottom edge of the molded resin 18 has been notched to form side surfaces 18 c .
  • a bonding material 50 is formed to extend to cover these side surfaces 18 c .
  • FIG. 12 is a cross-sectional view showing the way in which the cooling body and the semiconductor module of the semiconductor device of the fifth embodiment are integrally secured together.
  • the heat conductive material 22 is formed on the surface of the cooling body 12 .
  • the bonding material 70 having the projection 70 a is formed on the surface of the cooling body 12 .
  • the bonding material 70 is formed at a distance from the heat conductive material 22 .
  • the semiconductor module 14 is then formed, which has the heat conductive portion 16 formed of metal and the molded resin 18 having a surface at which the heat conductive portion 16 is exposed.
  • the resin groove 18 d is then formed in the molded resin 18 . It should be noted that the order of the above process steps may be varied where appropriate.
  • the semiconductor device manufacturing method of the fifth embodiment is characterized in that the cooling body 12 and the semiconductor module 14 are aligned with each other using the projection 70 a when integrally securing them together, and that the projection 70 a is brought into bonding engagement with the resin groove 18 d in order to increase the bonding strength between the semiconductor module 14 and the cooling body 12 .
  • the bonding material 70 need not necessarily be formed at a distance from the heat conductive material 22 .
  • semiconductor devices described in connection with the second and subsequent embodiments are susceptible of alterations at least similar to those that can be made to the semiconductor device of the first embodiment. Further, features of different embodiments may be combined where appropriate.

Abstract

A semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a semiconductor device used, e.g., for high power control, and a method of manufacture thereof.
  • 2. Background Art
  • Japanese Laid-Open Patent Publication No. 2006-100327 discloses a semiconductor device in which a semiconductor module formed by encapsulating a semiconductor element with resin is secured to a cooling fin (or cooling body) by means of screws. Japanese Laid-Open Patent Publication No. 2001-250890 also discloses related art.
  • In order to reduce the number of parts in such a semiconductor device, it is desirable to secure the semiconductor module to the cooling body without using screws or the like. To accomplish this, the semiconductor module must be secured to the cooling body by way of some adhesive or bonding material which is disposed therebetween. It should be noted that such material must have substantial heat conductivity, as well as providing substantial bonding strength. It has been found, however, that the use of a material suitable for securing the semiconductor module to the cooling body may result in insufficient cooling of the semiconductor module. On the other hand, the use of a material suitable for cooling the semiconductor module may result in inadequate securing of the semiconductor module to the cooling body.
    • SUMMARY OF THE INVENTION
  • The present invention has been made to solve the above problems. It is, therefore, an object of the present invention to provide a semiconductor device which has a reduced number of parts, yet in which the semiconductor module is attached to a cooling body with substantial bonding strength and cooled adequately. Another object of the present invention is to provide a method of manufacturing such a semiconductor device. The features and advantages of the present invention may be summarized as follows.
  • According to one aspect of the present invention, a semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body.
  • According to another aspect of the present invention, a method of manufacturing a semiconductor device, includes the steps of forming heat conductive material on a surface of a cooling body, forming bonding material on the surface of the cooling body, the bonding material having a projection, forming a resin groove in a molded resin of a semiconductor module having a heat conductive portion which is formed of metal and which is exposed at a surface of the molded resin, and integrally securing the cooling body and the semiconductor module together in such a manner that the projection is in contact with an inner wall of the resin groove, and that the heat conductive portion overlaps and is in contact with the heat conductive material.
  • Other and further objects, features and advantages of the invention will appear more fully from the following description.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a cross-sectional view of a semiconductor device in accordance with a first embodiment of the present invention;
  • FIG. 2 is a perspective view showing the way in which the semiconductor module of the semiconductor device of the first embodiment is secured to the cooling body;
  • FIG. 3 is a cross-sectional view showing a variation of the semiconductor device of the first embodiment;
  • FIG. 4 is a cross-sectional view showing another variation of the semiconductor device of the first embodiment;
  • FIG. 5 is a cross-sectional view of the semiconductor device of the second embodiment;
  • FIG. 6 is a perspective view showing the cooling body of the semiconductor device of the second embodiment;
  • FIG. 7 is a perspective view showing the cooling body, the heat conductive material, and the bonding material in the semiconductor device of the second embodiment;
  • FIG. 8 is a cross-sectional view of the semiconductor device of the third embodiment;
  • FIG. 9 is a cross-sectional view showing a variation of the semiconductor device of the third embodiment;
  • FIG. 10 is a cross-sectional view of the semiconductor device of the fourth embodiment;
  • FIG. 11 is a cross-sectional view of the semiconductor device of the fifth embodiment; and
  • FIG. 12 is a cross-sectional view showing the way in which the cooling body and the semiconductor module of the semiconductor device of the fifth embodiment are integrally secured together.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment
  • FIG. 1 is a cross-sectional view of a semiconductor device 10 in accordance with a first embodiment of the present invention. The semiconductor device 10 is provided with a cooling body 12. The cooling body 12 is formed of metal, e.g., copper. A semiconductor module 14 is disposed above the cooling body 12. The semiconductor module 14 has a heat conductive portion 16 formed of metal and a molded resin 18 having a surface at which the heat conductive portion 16 is exposed. The semiconductor module 14 is formed, e.g., by encapsulating a semiconductor element, such as an IGBT, with resin by means of transfer molding.
  • The following description will be directed to components between the semiconductor module 14 and the cooling body 12. A bonding material 20 and a heat conductive material 22 are formed between the semiconductor module 14 and the cooling body 12. The bonding material 20 secures the molded resin 18 of the semiconductor module 14 to the cooling body 12. The bonding material 20 is formed of insulating material. The heat conductive material 22 is formed between and thermally couples the heat conductive portion 16 and the cooling body 12. The heat conductive material 22 is formed of electrically conductive material having excellent heat conductivity.
  • FIG. 2 is a perspective view showing the way in which the semiconductor module of the semiconductor device of the first embodiment is secured to the cooling body. The bonding material 20 is formed to surround the heat conductive material 22. The semiconductor module 14 is moved in the direction of the arrow of FIG. 2 and brought into bonding engagement with the bonding material 20 so that the semiconductor module 14 is secured to the cooling body 12. As a result, the heat conductive portion 16 and the heat conductive material 22 are separated from the outside by the bonding material 20.
  • In the semiconductor device of the first embodiment, the semiconductor module 14 is secured to the cooling body 12 by means of the bonding material 20, which is suitable for that purpose, making it possible to attach the semiconductor module 14 to the cooling body 12 with substantial bonding strength. Further, the heat conductive portion 16 is thermally coupled to the cooling body 12 by way of the heat conductive material 22, which is suitable for cooling the semiconductor module 14, making it possible to adequately cool the semiconductor module 14. Further, the semiconductor device 10 has a reduced number of parts, since the semiconductor module 14 is secured to the cooling body 12 without using screws or the like. Thus, although the semiconductor device of the first embodiment has a reduced number of parts, the semiconductor module 14 is attached to the cooling body 12 with substantial bonding strength and cooled adequately.
  • As is known in the art, materials having higher electrical conductivity have higher heat conductivity. In the semiconductor device of the first embodiment, the heat conductive material 22 is formed of electrically conductive material having excellent heat conductivity, and hence is expected to provide good heat conduction. Furthermore, the heat conductive portion 16 and the heat conductive material 22 are separated from the outside by the bonding material 20, which is formed of insulating material, thereby insulating the heat conductive material 22 from the outside atmosphere. Insulating a semiconductor module from the outside atmosphere is an effective way to maintain the characteristics of the semiconductor module, especially if the module includes a power semiconductor device driven by a high voltage.
  • FIG. 3 is a cross-sectional view showing a variation of the semiconductor device of the first embodiment. In this variation, an anchor portion 24 is formed in the surface of the molded resin 18 in contact with the bonding material 20, thereby increasing the surface roughness of that surface. As a result, the surface of the molded resin 18 in contact with the bonding material 20 has a greater surface roughness than the surfaces of the molded resin 18 which are not in contact with the bonding material 20. In this way it is possible to increase the bonding strength of the bonding material 20 between the semiconductor module 14 and the cooling body 12.
  • FIG. 4 is a cross-sectional view showing another variation of the semiconductor device of the first embodiment. In this variation, the portion of the molded resin 18 in contact with the bonding material 20 has been subjected to hydrophilic treatment, forming a hydrophilic portion 26. Therefore, the portion of the molded resin 18 in contact with the bonding material 20 is more hydrophilic than the portions of the molded resin 18 which are not in contact with the bonding material 20. In this way it is possible to increase the bonding strength of the bonding material 20 between the semiconductor module 14 and the cooling body 12. It should be noted that the bonding strength of the bonding material 20 between the semiconductor module 14 and the cooling body 12 may be increased by subjecting the molded resin 18 to a surface treatment other than those described above.
  • Various other alterations may be made to the first embodiment without departing from the features of the present invention. For example, the bonding material 20 may be formed of material other than insulating material. Further, although in the first embodiment the heat conductive material 22 is formed of electrically conductive material, it is to be understood that in other embodiments it may be formed of, e.g., silicone grease. When the heat conductive material 22 is formed of an insulating material such as silicone grease, it is easier to insulate the semiconductor module 14. Further, the semiconductor element and the heat conductive portion 16 within the molded resin 18 may be insulated from each other by insulating material in order to ensure the insulation of the semiconductor module.
    • Second Embodiment
  • The following description of a semiconductor device in accordance with a second embodiment of the present invention will be primarily limited to the differences from the semiconductor device of the first embodiment in order to avoid undue repetition. FIG. 5 is a cross-sectional view of the semiconductor device of the second embodiment. In this semiconductor device, the cooling body 12 has a cooling body groove 12 a formed therein. The heat conductive material 22 is separated from a cooling material 30 by the cooling body groove 12 a.
  • FIG. 6 is a perspective view showing the cooling body of the semiconductor device of the second embodiment. The cooling body groove 12 a, formed in the cooling body 12, has a rectangular annular shape. FIG. 7 is a perspective view showing the cooling body, the heat conductive material, and the bonding material in the semiconductor device of the second embodiment. The bonding material 30 is formed to surround the heat conductive material 22.
  • As described above in connection with the first embodiment, the heat conductive material 22 serves to cool the semiconductor module 14, and the bonding material 30 serves to bond the semiconductor module 14 to the cooling body 12. Thus, the heat conductive material 22 and the bonding material 30 have different functions. Therefore, mixing or bringing into contact these materials may prevent them from functioning properly. In the semiconductor device of the second embodiment, the heat conductive material 22 and the bonding material 30 are prevented from being mixed or brought into contact with each other, since they are separated from each other by the cooling body groove 12 a.
    • Third Embodiment
  • The following description of a semiconductor device in accordance with a third embodiment of the present invention will be primarily limited to the differences from the semiconductor device of the first embodiment in order to avoid undue repetition. FIG. 8 is a cross-sectional view of the semiconductor device of the third embodiment. In this semiconductor device, a bonding material 40 is formed to extend to cover the side surfaces 18 a of the molded resin 18. Further, the surface of the heat conductive portion 16 in contact with the heat conductive material 22 and the bottom surface 18 b of the molded resin 18 form a single plane.
  • In the semiconductor device of the third embodiment, since the bonding material 40 extends to cover the side surfaces 18 a of the molded resin 18, the bonding strength of the bonding material 40 between the semiconductor module 14 and the cooling body 12 is increased. Further, since the surface of the heat conductive portion 16 in contact with the heat conductive material 22 and the bottom surface 18 b of the molded resin 18 form a single plane, the gap between the bottom surface 18 b and the cooling body 12 is narrowed, making it easier to form the bonding material 40, which extends to cover the side surfaces 18 a of the molded resin 18.
  • FIG. 9 is a cross-sectional view showing a variation of the semiconductor device of the third embodiment. In this variation, the outer circumferential bottom edge of the molded resin 18 has been notched to form side surfaces 18 c. A bonding material 50 is formed to extend to cover these side surfaces 18 c. As a result of this configuration, the bonding strength between the semiconductor module 14 and the cooling body 12 can be increased by using an amount of bonding material smaller than that used in the semiconductor device described above with reference to FIG. 8.
    • Fourth Embodiment
  • The following description of a semiconductor device in accordance with a fourth embodiment of the present invention will be primarily limited to the differences from the semiconductor device of the first embodiment in order to avoid undue repetition. FIG. 10 is a cross-sectional view of the semiconductor device of the fourth embodiment. In this semiconductor device, a resin groove 18 d is formed in the surface of the molded resin 18 facing the cooling body 12. A bonding material 60 is formed to fill the resin groove 18 d. In the semiconductor device of the fourth embodiment, since the bonding material 60 is formed to fill the resin groove 18 d of the molded resin 18, the bonding strength of the bonding material 60 between the semiconductor module 14 and the cooling body 12 is increased.
    • Fifth Embodiment
  • The following description of a semiconductor device and a method of manufacture thereof in accordance with a fifth embodiment of the present invention will be primarily limited to the differences from the semiconductor device of the first embodiment in order to avoid undue repetition. FIG. 11 is a cross-sectional view of the semiconductor device of the fifth embodiment. In this semiconductor device, a bonding material 70 has a projection 70 a which is in contact with a portion of the inner walls of the resin groove 18 d.
  • The method of manufacturing a semiconductor device in accordance with the fifth embodiment will now be described. FIG. 12 is a cross-sectional view showing the way in which the cooling body and the semiconductor module of the semiconductor device of the fifth embodiment are integrally secured together. In this process, first the heat conductive material 22 is formed on the surface of the cooling body 12. Next, the bonding material 70 having the projection 70 a is formed on the surface of the cooling body 12. The bonding material 70 is formed at a distance from the heat conductive material 22. The semiconductor module 14 is then formed, which has the heat conductive portion 16 formed of metal and the molded resin 18 having a surface at which the heat conductive portion 16 is exposed. The resin groove 18 d is then formed in the molded resin 18. It should be noted that the order of the above process steps may be varied where appropriate.
  • Next, the cooling body 12 and the semiconductor module 14 are integrally secured together. In this process step, the cooling body 12 and the semiconductor module 14 are integrally secured together in such a manner that the projection 70 a is in contact with inner walls of the resin groove 18 d, and that the heat conductive portion 16 overlaps and is in contact with the heat conductive material 22. At that time, the cooling body 12 and the semiconductor module 14 are aligned with each other by inserting the projection 70 a into the resin groove 18 d.
  • In the semiconductor device manufacturing method of the fifth embodiment, the cooling body 12 and the semiconductor module 14 are integrally secured together using the projection 70 a as an alignment guide, making it possible to increase the accuracy of alignment of the components in the semiconductor device. Further, since the projection 70 a is in contact with inner walls of the resin groove 18 d, the bonding strength between the semiconductor module 14 and the cooling body 12 is increased. Further, since the bonding material 70 is spaced apart from the heat conductive material 22, even if a portion of the bonding material 70 diffuses toward the heat conductive material 22, that portion is retained or trapped in the resin groove 18 d, thereby preventing the bonding material 70 from reaching and mixing with the heat conductive material 22.
  • The semiconductor device manufacturing method of the fifth embodiment is characterized in that the cooling body 12 and the semiconductor module 14 are aligned with each other using the projection 70 a when integrally securing them together, and that the projection 70 a is brought into bonding engagement with the resin groove 18 d in order to increase the bonding strength between the semiconductor module 14 and the cooling body 12. It should be noted that the bonding material 70 need not necessarily be formed at a distance from the heat conductive material 22.
  • The semiconductor devices described in connection with the second and subsequent embodiments are susceptible of alterations at least similar to those that can be made to the semiconductor device of the first embodiment. Further, features of different embodiments may be combined where appropriate.
  • In accordance with the present invention, both bonding material and heat conductive material are formed between the semiconductor module and the cooling body in a semiconductor device, making it possible to attach the semiconductor module to the cooling body with substantial bonding strength and adequately cool the semiconductor module while reducing the number of parts in the semiconductor device.
  • Obviously many modifications and variations of the present invention are possible in the light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described.
  • The entire disclosure of a Japanese Patent Application No. 2011-184800, filed on Aug. 26, 2011 including specification, claims, drawings and summary, on which the Convention priority of the present application is based, are incorporated herein by reference in its entirety.

Claims (10)

1. A semiconductor device comprising:
a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which said heat conductive portion is exposed;
a cooling body secured to said semiconductor module by means of bonding material; and
heat conductive material formed between and thermally coupling said heat conductive portion and said cooling body.
2. The semiconductor device according to claim 1, wherein:
said semiconductor module includes a semiconductor element encapsulated with said molded resin;
said bonding material is formed of insulating material;
said bonding material is formed to separate said heat conductive portion and said heat conductive material from the outside; and
said heat conductive portion is insulated from said semiconductor element.
3. The semiconductor device according to claim 1, wherein:
said cooling body has a cooling body groove formed therein; and
said heat conductive material is separated from said bonding material by said cooling body groove.
4. The semiconductor device according to claim 1, wherein said bonding material is formed to extend to cover a side surface of said molded resin.
5. The semiconductor device according to claim 1, wherein:
said molded resin has a resin groove formed in a surface thereof facing said cooling body; and
said bonding material is formed to fill said resin groove.
6. The semiconductor device according to claim 1, wherein:
said bonding material is in contact with said molded resin; and
the surface of said molded resin in contact with said bonding material has a greater surface roughness than the surfaces of said molded resin which are not in contact with said bonding material.
7. The semiconductor device according to claim 1, wherein:
said bonding material is in contact with said molded resin; and
the portion of said molded resin in contact with said bonding material is more hydrophilic than the portions of said molded resin which are not in contact with said bonding material.
8. The semiconductor device according to claim 1, wherein said heat conductive material is formed of electrically conductive material.
9. The semiconductor device according to claim 1, wherein said heat conductive material is formed of silicone grease.
10. A method of manufacturing a semiconductor device, comprising the steps of:
forming heat conductive material on a surface of a cooling body;
forming bonding material on said surface of said cooling body, said bonding material having a projection;
forming a resin groove in a molded resin of a semiconductor module having a heat conductive portion which is formed of metal and which is exposed at a surface of said molded resin; and
integrally securing said cooling body and said semiconductor module together in such a manner that said projection is in contact with an inner wall of said resin groove, and that said heat conductive portion overlaps and is in contact with said heat conductive material.
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US11088045B2 (en) 2021-08-10
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CN102956569B (en) 2016-01-13

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