US20120211211A1 - Heat sink equipped with a vapor chamber - Google Patents

Heat sink equipped with a vapor chamber Download PDF

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Publication number
US20120211211A1
US20120211211A1 US13/029,878 US201113029878A US2012211211A1 US 20120211211 A1 US20120211211 A1 US 20120211211A1 US 201113029878 A US201113029878 A US 201113029878A US 2012211211 A1 US2012211211 A1 US 2012211211A1
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US
United States
Prior art keywords
vapor chamber
heat
heat sink
heat conduction
conduction plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/029,878
Inventor
David Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIA CHERNE INDUSTRY Co Ltd
Original Assignee
CHIA CHERNE INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIA CHERNE INDUSTRY Co Ltd filed Critical CHIA CHERNE INDUSTRY Co Ltd
Priority to US13/029,878 priority Critical patent/US20120211211A1/en
Assigned to CHIA CHERNE INDUSTRY CO., LTD. reassignment CHIA CHERNE INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIH, DAVID
Publication of US20120211211A1 publication Critical patent/US20120211211A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink and particularly to a heat sink equipped with a vapor chamber.
  • a conventional heat sink includes a heat conduction plate 1 and a vapor chamber 2 .
  • the heat conduction plate 1 has one side formed a plurality of radiation fins 3 and another side bonded to the vapor chamber 2 , and two lateral sides fastened to a printed circuit board (PCB in short, not shown in the drawing) through at least one screw 4 .
  • the vapor chamber 2 is in contact with a heat generation element (not shown in the drawing) of the PCB, and is hollow and vacuumed to seal heat transfer fluid 5 (pure water) inside which can rapidly transfer heat through phase transition between liquid and gas states. Hence the heat generated by the heat generation element can be quickly spread by the vapor chamber 2 to the radiation fins 3 to dissipate the heat to lower the temperature.
  • the heat conduction plate 1 usually is fabricated at a small thickness. Hence when the heat conduction plate 1 is fastened to the PCB at the two lateral sides through the screws 4 , the fastening force tends to cause distortion and deformation of the heat conduction plate 1 that could also result in deformation of the vapor chamber 2 without closely contacting the heat generation element. As a result, heat transfer effect suffers.
  • a gap is easily generated between the vapor chamber 2 and heat conduction plate 1 due to the aforesaid deformation. That also diminishes the heat transfer effect and slows heat transfer from the vapor chamber 2 to the heat conduction plate 1 . All these hamper heat dissipation effect of the heat sink.
  • the primary object of the present invention is to provide a heat sink that can quickly and effectively transfer heat outside to achieve desired cooling effect.
  • the present invention provides a heat sink equipped with a vapor chamber.
  • the heat sink includes a heat conduction plate and a vapor chamber.
  • the heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber.
  • the fastening portion is fastened to a PCB through at least one screw to make the vapor chamber in contact with a heat generation element.
  • the fastening portion is formed integrally at a desired thickness, it has a sufficient strength to withstand the fastening force of the screw, thus tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate can be prevented, and the vapor chamber can smoothly contact the heat generation element to quickly and effectively transfer heat outside.
  • FIG. 1 is a sectional view of a conventional heat sink equipped with a vapor chamber.
  • FIG. 2 is an exploded view of the invention.
  • FIG. 3 is a perspective view of the invention.
  • FIG. 4 is an exploded view of another embodiment of the invention.
  • FIG. 5 is a sectional view of another embodiment of the invention.
  • FIG. 6 is a sectional view of yet another embodiment of the invention.
  • the present invention aims to provide a heat sink equipped with a vapor chamber.
  • the heat sink includes a heat conduction plate 10 and a vapor chamber 20 .
  • the heat conduction plate 10 has one side formed integrally a plurality of radiation fins 30 and another side with two lateral edges formed respectively and integrally a fastening portion 40 .
  • the two fastening portions 40 are interposed by a recess 50 to bond the vapor chamber 20 .
  • Each fastening portion 40 has at least one aperture 41 run through by at least one screw 60 coupled with a spring 61 to fasten to a printed circuit board (PCB in short, not shown in the drawings) to allow the vapor chamber 20 in contact with a heat generation element (not shown in the drawings).
  • PCB printed circuit board
  • the heat conduction plate 10 has a latch flange 52 respectively on a front side and a rear side of the recess 50 , and an airtight compartment 51 dug downwards.
  • the vapor chamber 20 is positioned and surrounded by the two latch flanges 52 and the two fastening portions 40 to cover and seal the airtight compartment 51 .
  • the heat conduction plate 10 has an air extraction vent 11 communicating with the airtight compartment 51 to extract air therefrom and inject into a heat transfer fluid 70 which can be pure water capable of quickly transferring heat through phase transition between liquid and gas states of the heat transfer fluid 70 .
  • the vapor chamber 20 also has a sealed compartment 22 holding heat conduction fluid 71 to quickly transfer heat through phase transition between liquid and gas states of the heat conduction fluid 71 to rapidly transfer heat from the vapor chamber 20 to the heat conduction plate 10 .
  • the vapor chamber 20 further includes a plurality of heat conduction fins 21 extended into the airtight compartment 51 to contact the heat transfer fluid 70 to increase the contact area with the vapor chamber 20 , thereby to further enhance heat transfer effect to better meet use requirements.
  • the fastening portion 40 is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw 60 to prevent tight sealing between the vapor chamber 20 and heat generation element affected by deformation of the heat conduction plate 10 , thus the vapor chamber 20 can smoothly contact the heat generation element. With rapid heat transfer of the heat conduction fluid 70 , heat transfer effect can be further enhanced to meet use requirements.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink equipped with a vapor chamber includes a heat conduction plate and a vapor chamber. The heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber. Each fastening portion is fastened to a printed circuit board through at least one screw to allow the vapor chamber to contact a heat generation element. The fastening portion is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw to prevent tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate. Thereby the vapor chamber can smoothly contact the heat generation element to rapidly transfer heat outside.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat sink and particularly to a heat sink equipped with a vapor chamber.
    • BACKGROUND OF THE INVENTION
  • Please refer to FIG. 1, a conventional heat sink includes a heat conduction plate 1 and a vapor chamber 2. The heat conduction plate 1 has one side formed a plurality of radiation fins 3 and another side bonded to the vapor chamber 2, and two lateral sides fastened to a printed circuit board (PCB in short, not shown in the drawing) through at least one screw 4. The vapor chamber 2 is in contact with a heat generation element (not shown in the drawing) of the PCB, and is hollow and vacuumed to seal heat transfer fluid 5 (pure water) inside which can rapidly transfer heat through phase transition between liquid and gas states. Hence the heat generated by the heat generation element can be quickly spread by the vapor chamber 2 to the radiation fins 3 to dissipate the heat to lower the temperature.
  • To save material, reduce weight and also accelerate heat transfer, the heat conduction plate 1 usually is fabricated at a small thickness. Hence when the heat conduction plate 1 is fastened to the PCB at the two lateral sides through the screws 4, the fastening force tends to cause distortion and deformation of the heat conduction plate 1 that could also result in deformation of the vapor chamber 2 without closely contacting the heat generation element. As a result, heat transfer effect suffers.
  • Moreover, a gap is easily generated between the vapor chamber 2 and heat conduction plate 1 due to the aforesaid deformation. That also diminishes the heat transfer effect and slows heat transfer from the vapor chamber 2 to the heat conduction plate 1. All these hamper heat dissipation effect of the heat sink.
    • SUMMARY OF THE INVENTION
  • Therefore, the primary object of the present invention is to provide a heat sink that can quickly and effectively transfer heat outside to achieve desired cooling effect.
  • To achieve the foregoing object, the present invention provides a heat sink equipped with a vapor chamber. The heat sink includes a heat conduction plate and a vapor chamber. The heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber.
  • The fastening portion is fastened to a PCB through at least one screw to make the vapor chamber in contact with a heat generation element. As the fastening portion is formed integrally at a desired thickness, it has a sufficient strength to withstand the fastening force of the screw, thus tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate can be prevented, and the vapor chamber can smoothly contact the heat generation element to quickly and effectively transfer heat outside.
  • The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a sectional view of a conventional heat sink equipped with a vapor chamber.
  • FIG. 2 is an exploded view of the invention.
  • FIG. 3 is a perspective view of the invention.
  • FIG. 4 is an exploded view of another embodiment of the invention.
  • FIG. 5 is a sectional view of another embodiment of the invention.
  • FIG. 6 is a sectional view of yet another embodiment of the invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 2 and 3, the present invention aims to provide a heat sink equipped with a vapor chamber. The heat sink includes a heat conduction plate 10 and a vapor chamber 20. The heat conduction plate 10 has one side formed integrally a plurality of radiation fins 30 and another side with two lateral edges formed respectively and integrally a fastening portion 40. The two fastening portions 40 are interposed by a recess 50 to bond the vapor chamber 20. Each fastening portion 40 has at least one aperture 41 run through by at least one screw 60 coupled with a spring 61 to fasten to a printed circuit board (PCB in short, not shown in the drawings) to allow the vapor chamber 20 in contact with a heat generation element (not shown in the drawings).
  • Refer to FIGS. 4 and 5 for another embodiment of the invention. The heat conduction plate 10 has a latch flange 52 respectively on a front side and a rear side of the recess 50, and an airtight compartment 51 dug downwards. The vapor chamber 20 is positioned and surrounded by the two latch flanges 52 and the two fastening portions 40 to cover and seal the airtight compartment 51. The heat conduction plate 10 has an air extraction vent 11 communicating with the airtight compartment 51 to extract air therefrom and inject into a heat transfer fluid 70 which can be pure water capable of quickly transferring heat through phase transition between liquid and gas states of the heat transfer fluid 70. The vapor chamber 20 also has a sealed compartment 22 holding heat conduction fluid 71 to quickly transfer heat through phase transition between liquid and gas states of the heat conduction fluid 71 to rapidly transfer heat from the vapor chamber 20 to the heat conduction plate 10.
  • Refer to FIG. 6 for yet another embodiment of the invention. The vapor chamber 20 further includes a plurality of heat conduction fins 21 extended into the airtight compartment 51 to contact the heat transfer fluid 70 to increase the contact area with the vapor chamber 20, thereby to further enhance heat transfer effect to better meet use requirements.
  • By means of the structures set forth above, the fastening portion 40 is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw 60 to prevent tight sealing between the vapor chamber 20 and heat generation element affected by deformation of the heat conduction plate 10, thus the vapor chamber 20 can smoothly contact the heat generation element. With rapid heat transfer of the heat conduction fluid 70, heat transfer effect can be further enhanced to meet use requirements.

Claims (6)

1. A heat sink equipped with a vapor chamber, comprising:
a heat conduction plate which includes one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion, the two fastening portions being interposed by a recess; and
a vapor chamber being bonded to the recess.
2. The heat sink of claim 1, wherein the heat conduction plate includes a latch flange respectively on a front side and a rear side of the recess and an airtight compartment dug downwards, such that the vapor chamber is positioned and surrounded by the two latch flanges and the two fastening portions to cover and seal the airtight compartment.
3. The heat sink of claim 2, wherein the vapor chamber includes a plurality of heat conduction fins extended into the airtight compartment.
4. The heat sink of claim 2, wherein the heat conduction plate includes an air extraction vent communicating with the airtight compartment.
5. The heat sink of claim 1, wherein each fastening portion includes at least one aperture run through by at least one screw.
6. The heat sink of claim 5, wherein the screw is coupled with a spring.
US13/029,878 2011-02-17 2011-02-17 Heat sink equipped with a vapor chamber Abandoned US20120211211A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/029,878 US20120211211A1 (en) 2011-02-17 2011-02-17 Heat sink equipped with a vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/029,878 US20120211211A1 (en) 2011-02-17 2011-02-17 Heat sink equipped with a vapor chamber

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US20120211211A1 true US20120211211A1 (en) 2012-08-23

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103974600A (en) * 2013-02-01 2014-08-06 艾默生网络能源-嵌入式计算有限公司 Method and device to provide uniform cooling in rugged environment
US9069535B2 (en) 2013-06-07 2015-06-30 Apple Inc. Computer thermal system
WO2015110865A1 (en) * 2014-01-22 2015-07-30 Provides Metalmeccanica S.R.L. Heat exchanger
US9880595B2 (en) 2016-06-08 2018-01-30 International Business Machines Corporation Cooling device with nested chambers for computer hardware
US20180164042A1 (en) * 2016-12-08 2018-06-14 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
US20180288901A1 (en) * 2017-03-28 2018-10-04 Dynatron Corporation Heat dissipation device having compact vapor chamber
US10359818B2 (en) 2015-08-17 2019-07-23 Microsoft Technology Licensing, Llc Device faraday cage
US20200124352A1 (en) * 2015-03-26 2020-04-23 Murata Manufacturing Co., Ltd. Sheet-shaped heat pipe
EP3779640A4 (en) * 2018-05-24 2021-05-26 Huawei Technologies Co., Ltd. Heat-dissipating apparatus and manufacturing method thereof and server
US20230262935A1 (en) * 2022-01-26 2023-08-17 Celsia Technologies Taiwan, Inc. Heat dissipation device and anti-vibration heat conduction structure thereof
US11899511B2 (en) 2013-06-07 2024-02-13 Apple Inc. Computer housing

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Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11006548B2 (en) * 2013-02-01 2021-05-11 Smart Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
US20140217870A1 (en) * 2013-02-01 2014-08-07 Emerson Network Power - Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
CN103974600A (en) * 2013-02-01 2014-08-06 艾默生网络能源-嵌入式计算有限公司 Method and device to provide uniform cooling in rugged environment
US9946315B2 (en) 2013-06-07 2018-04-17 Apple Inc. Desktop consumer electronic device
US9974206B2 (en) 2013-06-07 2018-05-15 Apple Inc. Computer internal architecture
US9207729B2 (en) 2013-06-07 2015-12-08 Apple Inc. Computer Architecture
US9207728B2 (en) 2013-06-07 2015-12-08 Apple Inc. Computer input/output interface
US9218028B2 (en) 2013-06-07 2015-12-22 Apple Inc. Computer housing
US9285846B2 (en) 2013-06-07 2016-03-15 Apple Inc. Computer thermal management
US9395772B2 (en) 2013-06-07 2016-07-19 Apple Inc. Computer internal architecture
US9423840B2 (en) 2013-06-07 2016-08-23 Apple Inc. Computer housing
US9665134B2 (en) 2013-06-07 2017-05-30 Apple Inc. Computer internal architecture
US12045099B2 (en) 2013-06-07 2024-07-23 Apple Inc. Computer housing
US9913400B2 (en) 2013-06-07 2018-03-06 Apple Inc. Computer thermal system
US12050494B2 (en) 2013-06-07 2024-07-30 Apple Inc. Desktop electronic device
US9964999B2 (en) 2013-06-07 2018-05-08 Apple Inc. Computer internal architecture
US9176548B2 (en) 2013-06-07 2015-11-03 Apple Inc. Computer system
US11899509B2 (en) 2013-06-07 2024-02-13 Apple Inc. Computer housing
US10073499B2 (en) 2013-06-07 2018-09-11 Apple Inc. Computer internal architecture
US11899511B2 (en) 2013-06-07 2024-02-13 Apple Inc. Computer housing
US9069535B2 (en) 2013-06-07 2015-06-30 Apple Inc. Computer thermal system
US10248171B2 (en) 2013-06-07 2019-04-02 Apple Inc. Desktop electronic device
US10254805B2 (en) 2013-06-07 2019-04-09 Apple Inc. Desktop electronic device
US11650634B2 (en) 2013-06-07 2023-05-16 Apple Inc. Desktop electronic device
US11256307B2 (en) 2013-06-07 2022-02-22 Apple Inc. Desktop electronic device
US10539984B2 (en) 2013-06-07 2020-01-21 Apple Inc. Computer housing
US11256306B2 (en) 2013-06-07 2022-02-22 Apple Inc. Computer housing
US10725507B2 (en) 2013-06-07 2020-07-28 Apple Inc. Desktop electronic device
US10845852B2 (en) 2013-06-07 2020-11-24 Apple Inc. Desktop electronic device
US10224263B2 (en) 2014-01-22 2019-03-05 Provides Metalmeccanica S.R.L. Heat exchanger
WO2015110865A1 (en) * 2014-01-22 2015-07-30 Provides Metalmeccanica S.R.L. Heat exchanger
US20200124352A1 (en) * 2015-03-26 2020-04-23 Murata Manufacturing Co., Ltd. Sheet-shaped heat pipe
US10359818B2 (en) 2015-08-17 2019-07-23 Microsoft Technology Licensing, Llc Device faraday cage
US9880595B2 (en) 2016-06-08 2018-01-30 International Business Machines Corporation Cooling device with nested chambers for computer hardware
US10451356B2 (en) * 2016-12-08 2019-10-22 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
US20180164042A1 (en) * 2016-12-08 2018-06-14 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
US20180288901A1 (en) * 2017-03-28 2018-10-04 Dynatron Corporation Heat dissipation device having compact vapor chamber
EP3779640A4 (en) * 2018-05-24 2021-05-26 Huawei Technologies Co., Ltd. Heat-dissipating apparatus and manufacturing method thereof and server
US11490545B2 (en) 2018-05-24 2022-11-01 Huawei Technologies Co., Ltd. Heat dissipation apparatus and server
US11737242B2 (en) 2018-05-24 2023-08-22 Huawei Technologies Co., Ltd. Heat dissipation apparatus and server
US20230262935A1 (en) * 2022-01-26 2023-08-17 Celsia Technologies Taiwan, Inc. Heat dissipation device and anti-vibration heat conduction structure thereof

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Legal Events

Date Code Title Description
AS Assignment

Owner name: CHIA CHERNE INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHIH, DAVID;REEL/FRAME:025828/0351

Effective date: 20110214

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION