US20110259549A1 - Heat dissipating device with an oscillation unit - Google Patents

Heat dissipating device with an oscillation unit Download PDF

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Publication number
US20110259549A1
US20110259549A1 US12/858,621 US85862110A US2011259549A1 US 20110259549 A1 US20110259549 A1 US 20110259549A1 US 85862110 A US85862110 A US 85862110A US 2011259549 A1 US2011259549 A1 US 2011259549A1
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United States
Prior art keywords
heat
heat dissipating
oscillation
dissipating device
heat sink
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Abandoned
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US12/858,621
Inventor
Chin-Kuang Luo
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Individual
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Individual
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Publication of US20110259549A1 publication Critical patent/US20110259549A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a heat dissipating device, more particularly to a heat dissipating device having an oscillation unit.
  • heat dissipating efficiency is determined by the size of the area of the metal piece.
  • a heat dissipating member with an enormous size has to be used.
  • Heat dissipating efficiency may be further enhanced by incorporation of a heat dissipating fan.
  • the overall size of the heat dissipating device may therefore become relatively huge, which may have an adverse effect on the miniaturization of the electronic component.
  • operation of the heat dissipating fan generates noise, which is annoying and causes discomfort.
  • an object of the present invention is to provide a heat dissipating device with a high heat dissipating efficiency.
  • a heat dissipating device of the present invention comprises a heat sink, and an oscillation unit.
  • the heat sink is adapted to contact a heat source.
  • the oscillation unit is disposed in the heat sink, and includes an oscillation element, and a liquid that surrounds the oscillation element and that transmits an oscillation movement of the oscillation element to the heat sink to produce a resonant oscillation and to thereby enhance heat dissipation.
  • FIG. 1 is an exploded perspective view of a first preferred embodiment of a heat dissipating device according to the present invention and a semiconductor chip;
  • FIG. 2 is a partly sectional view of the first preferred embodiment and the semiconductor chip
  • FIG. 3 is an exploded perspective view of a second preferred embodiment of the heat dissipating device according to the present invention and a semiconductor chip;
  • FIG. 4 is a partly sectional view of the second preferred embodiment and the semiconductor chip
  • FIG. 5 is an exploded perspective view of a third preferred embodiment of the heat dissipating device according to the present invention and a semiconductor chip;
  • FIG. 6 is a partly sectional view of the third preferred embodiment and the semiconductor chip.
  • FIG. 7 is a sectional view of a fourth preferred embodiment of the heat dissipating device according to the present invention and a semiconductor chip.
  • a heat dissipating device 2 according to the first preferred embodiment of the present invention is shown as being connected to a semiconductor chip 1 that is a heat source.
  • the heat dissipating device 2 includes a heat sink 3 and an oscillation unit 4 .
  • the heat sink 3 is placed in contact with the semiconductor chip 1 , and is able to emit an infrared radiation for heat dissipation.
  • the heat sink 3 includes a heat conductive layer 31 to contact the semiconductor chip 1 , and an infrared heat dissipating layer 32 disposed on one side of the heat conductive layer 31 opposite to the semiconductor chip 1 .
  • the infrared ray heat dissipating layer 32 may be formed on the heat conductive layer 31 by spraying, sputtering, vapor deposition and adhesive bonding.
  • the heat conductive layer 31 is made of a metallic material, and has top and bottom planar surfaces.
  • the bottom surface is a metallic heat absorbing surface 312 connected to the semiconductor chip 1 .
  • the top surface is formed with a mounting hole 313 .
  • the infrared ray heat dissipating layer 32 is made of a material capable of dissipating an infrared radiation, and has an infrared heat dissipating surface 321 that is disposed opposite to the metallic heat absorbing surface 312 and faces upward.
  • the infrared material is selected from the group consisting of a ceramic powder, graphite, a carbon powder, silicon crystal, tungsten, titanium, and any combination thereof.
  • the oscillation unit 4 is disposed in the heat sink 3 , and includes an oscillation element 41 disposed in the mounting hole 313 , a liquid 42 filling the mounting hole 313 around the oscillation element 41 , and a closure member 43 closing the mounting hole 313 to prevent the liquid 42 from escaping therefrom.
  • the liquid 42 is made from a heat conductive electric-insulation material and serves to transmit an oscillation movement of the oscillation element 41 to the heat sink 3 so that a resonant oscillation is generated in the heat sink 3 to enhance heat dissipation.
  • the oscillating element 41 has an oscillation frequency of no less than 1000 per second, which is substantially equal to the frequency of an infrared radiation. Thus, a resonant oscillation can be generated that excites the infrared heat dissipating layer 32 and causes it to dissipate heat.
  • the liquid 42 may be an insulation oil that is usually used in a transformer or a capacitor.
  • the heat generated by the semiconductor chip 1 transfers from the metallic heat absorbing surface 312 to the infrared heat dissipating layer 32 where the heat is dissipated in the form of an infrared radiation from the metallic heat absorbing surface 312 .
  • the high-frequency oscillation generated by the oscillation element 41 activates the infrared heat dissipating layer 32 through the liquid 42 for generating a resonant frequency. Heat is thus converted rapidly into infrared radiation, thereby increasing the rate of heat dissipation.
  • the present invention may dispense with the use of large size heat-dissipating fins and fans for the dissipation of heat.
  • the oscillating frequency of the oscillation element 41 is a high frequency inaudible by human beings, undesirable noises are not produced in the present invention.
  • the second preferred embodiment of this invention is generally similar to the first preferred embodiment, and differs in that a plurality of fins 314 projects from the infrared ray heat dissipating surface 321 in a direction away from the semiconductor chip 1 .
  • the third preferred embodiment of this invention generally has the same construction as the second preferred embodiment.
  • the third preferred embodiment differs in that the oscillating unit 4 further includes a case 44 that contains the oscillating element 41 and the liquid 42 filling the case 44 and surrounding the oscillation element 41 .
  • the case 44 is fixed to the mounting hole 313 .
  • the fourth preferred embodiment of this invention generally has the same construction as the first preferred embodiment, but differs in that the heat conductive layer 31 is configured to be a hollow structure 315 having a layer of hollow space 316 to contain the oscillation unit 4 and that the oscillation unit 4 further includes an isolation member 45 covering and isolating the oscillating element 41 from the liquid 42 to prevent the liquid 42 from wetting and soaking the oscillation element 41 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating device includes a heat sink and an oscillation unit. The oscillation unit is disposed in the heat sink, and includes an oscillation element, and a liquid that surrounds the oscillation element and that transmits an oscillation movement of the oscillation element to the heat sink to generate a resonant oscillation and to thereby enhance heat dissipation. By virtue of the high-frequency resonant oscillation generated in the heat sink, infrared radiation can be dissipated quickly increasing the efficiency of heat dissipation.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims priority of Taiwanese Application No. 99112669 filed on Apr. 22, 2010.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention relates to a heat dissipating device, more particularly to a heat dissipating device having an oscillation unit.
  • 2. Description of the Related Art
  • As technology progresses, many electronic components increase in function while decreasing in size. However, as the size of an electronic component becomes smaller, the issue of heat dissipation becomes more critical, and many solutions have therefore been proposed. One conventional solution is to connect a metal piece to an electronic component that generates heat to achieve heat conductance and heat dissipation. Another is to provide a heat dissipating fan to cause a cooling and heat dissipating effect.
  • However, heat dissipating efficiency is determined by the size of the area of the metal piece. To increase the heat dissipating effect, a heat dissipating member with an enormous size has to be used. Heat dissipating efficiency may be further enhanced by incorporation of a heat dissipating fan. The overall size of the heat dissipating device may therefore become relatively huge, which may have an adverse effect on the miniaturization of the electronic component. Moreover, operation of the heat dissipating fan generates noise, which is annoying and causes discomfort.
    • SUMMARY OF THE INVENTION
  • Therefore, an object of the present invention is to provide a heat dissipating device with a high heat dissipating efficiency.
  • Accordingly, a heat dissipating device of the present invention comprises a heat sink, and an oscillation unit.
  • The heat sink is adapted to contact a heat source. The oscillation unit is disposed in the heat sink, and includes an oscillation element, and a liquid that surrounds the oscillation element and that transmits an oscillation movement of the oscillation element to the heat sink to produce a resonant oscillation and to thereby enhance heat dissipation.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
  • FIG. 1 is an exploded perspective view of a first preferred embodiment of a heat dissipating device according to the present invention and a semiconductor chip;
  • FIG. 2 is a partly sectional view of the first preferred embodiment and the semiconductor chip;
  • FIG. 3 is an exploded perspective view of a second preferred embodiment of the heat dissipating device according to the present invention and a semiconductor chip;
  • FIG. 4 is a partly sectional view of the second preferred embodiment and the semiconductor chip;
  • FIG. 5 is an exploded perspective view of a third preferred embodiment of the heat dissipating device according to the present invention and a semiconductor chip;
  • FIG. 6 is a partly sectional view of the third preferred embodiment and the semiconductor chip; and
  • FIG. 7 is a sectional view of a fourth preferred embodiment of the heat dissipating device according to the present invention and a semiconductor chip.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Before the present invention is described in greater detail with reference to the accompanying preferred embodiments, it should be noted herein that like elements are denoted by the same reference numerals throughout the disclosure.
  • Referring to FIGS. 1 and 2, a heat dissipating device 2 according to the first preferred embodiment of the present invention is shown as being connected to a semiconductor chip 1 that is a heat source. The heat dissipating device 2 includes a heat sink 3 and an oscillation unit 4.
  • The heat sink 3 is placed in contact with the semiconductor chip 1, and is able to emit an infrared radiation for heat dissipation. The heat sink 3 includes a heat conductive layer 31 to contact the semiconductor chip 1, and an infrared heat dissipating layer 32 disposed on one side of the heat conductive layer 31 opposite to the semiconductor chip 1. The infrared ray heat dissipating layer 32 may be formed on the heat conductive layer 31 by spraying, sputtering, vapor deposition and adhesive bonding.
  • The heat conductive layer 31 is made of a metallic material, and has top and bottom planar surfaces. The bottom surface is a metallic heat absorbing surface 312 connected to the semiconductor chip 1. The top surface is formed with a mounting hole 313.
  • The infrared ray heat dissipating layer 32 is made of a material capable of dissipating an infrared radiation, and has an infrared heat dissipating surface 321 that is disposed opposite to the metallic heat absorbing surface 312 and faces upward. In this embodiment, the infrared material is selected from the group consisting of a ceramic powder, graphite, a carbon powder, silicon crystal, tungsten, titanium, and any combination thereof.
  • The oscillation unit 4 is disposed in the heat sink 3, and includes an oscillation element 41 disposed in the mounting hole 313, a liquid 42 filling the mounting hole 313 around the oscillation element 41, and a closure member 43 closing the mounting hole 313 to prevent the liquid 42 from escaping therefrom. The liquid 42 is made from a heat conductive electric-insulation material and serves to transmit an oscillation movement of the oscillation element 41 to the heat sink 3 so that a resonant oscillation is generated in the heat sink 3 to enhance heat dissipation. In this embodiment, the oscillating element 41 has an oscillation frequency of no less than 1000 per second, which is substantially equal to the frequency of an infrared radiation. Thus, a resonant oscillation can be generated that excites the infrared heat dissipating layer 32 and causes it to dissipate heat. The liquid 42 may be an insulation oil that is usually used in a transformer or a capacitor.
  • In application, the heat generated by the semiconductor chip 1 transfers from the metallic heat absorbing surface 312 to the infrared heat dissipating layer 32 where the heat is dissipated in the form of an infrared radiation from the metallic heat absorbing surface 312. The high-frequency oscillation generated by the oscillation element 41 activates the infrared heat dissipating layer 32 through the liquid 42 for generating a resonant frequency. Heat is thus converted rapidly into infrared radiation, thereby increasing the rate of heat dissipation.
  • In comparison with the dissipation of heat by the conventional heat dissipation devices that employ heat-dissipating fins and heat dissipating fans, the present invention may dispense with the use of large size heat-dissipating fins and fans for the dissipation of heat. Moreover, because the oscillating frequency of the oscillation element 41 is a high frequency inaudible by human beings, undesirable noises are not produced in the present invention.
  • Referring to FIGS. 3 and 4, the second preferred embodiment of this invention is generally similar to the first preferred embodiment, and differs in that a plurality of fins 314 projects from the infrared ray heat dissipating surface 321 in a direction away from the semiconductor chip 1.
  • Referring to FIGS. 5 and 6, the third preferred embodiment of this invention generally has the same construction as the second preferred embodiment. However, the third preferred embodiment differs in that the oscillating unit 4 further includes a case 44 that contains the oscillating element 41 and the liquid 42 filling the case 44 and surrounding the oscillation element 41. The case 44 is fixed to the mounting hole 313.
  • Referring to FIG. 7, the fourth preferred embodiment of this invention generally has the same construction as the first preferred embodiment, but differs in that the heat conductive layer 31 is configured to be a hollow structure 315 having a layer of hollow space 316 to contain the oscillation unit 4 and that the oscillation unit 4 further includes an isolation member 45 covering and isolating the oscillating element 41 from the liquid 42 to prevent the liquid 42 from wetting and soaking the oscillation element 41.
  • While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.

Claims (11)

1. A heat dissipating device comprising:
a heat sink adapted to contact a heat source; and
an oscillation unit disposed in said heat sink, and including an oscillation element, and a liquid that surrounds said oscillation element and that transmits an oscillation movement of said oscillation element to said heat sink to generate a resonant oscillation and to thereby enhance heat dissipation.
2. The heat dissipating device of claim 1, wherein said heat sink includes a heat conductive layer adapted to contact the heat source, and an infrared heat dissipating layer disposed on one side of said heat conductive layer opposite to the heat source.
3. The heat dissipating device of claim 2, wherein said infrared heat dissipating layer is made of an infrared material.
4. The heat dissipating device of claim 3, wherein said infrared material is selected from the group consisting of a ceramic powder, graphite, a carbon powder, silicon crystal, tungsten, titanium, and a combination thereof.
5. The heat dissipating device of claim 2, wherein said heat conductive layer is made of metal.
6. The heat dissipating device of claim 1, wherein said oscillating element has an oscillation frequency of no less than 1000 per second.
7. The heat dissipating device of claim 1, wherein said heat conductive layer has top and bottom planar surfaces .
8. The heat dissipating device of claim 1, wherein said heat sink further has a plurality of fins projecting from said infrared heat dissipating layer in a direction away from the heat source.
9. The heat dissipating device of claim 1, wherein said heat sink has a mounting hole to receive said oscillation unit, and a closure member to close said mounting hole.
10. The heat dissipating device of claim 1, wherein said heat sink has a mounting hole, and said oscillating unit further includes a case that contains said oscillating element and said liquid and that is fixed to said mounting hole.
11. The heat dissipating device of claim 1, wherein said heat conductive layer is configured to be a hollow structure having a layer of hollow space to contain said oscillation unit, and said oscillation unit further includes an isolation member covering and isolating said oscillating element from said liquid.
US12/858,621 2010-04-22 2010-08-18 Heat dissipating device with an oscillation unit Abandoned US20110259549A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW099112669A TW201138604A (en) 2010-04-22 2010-04-22 Active type cooling device
TW099112669 2010-04-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10866038B2 (en) * 2018-10-25 2020-12-15 United Arab Emirates University Heat sinks with vibration enhanced heat transfer for non-liquid heat sources

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10866038B2 (en) * 2018-10-25 2020-12-15 United Arab Emirates University Heat sinks with vibration enhanced heat transfer for non-liquid heat sources
US10890387B2 (en) * 2018-10-25 2021-01-12 United Arab Emirates University Heat sinks with vibration enhanced heat transfer

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