US20110084423A1 - Imprint apparatus and manufacturing method of commodities - Google Patents
Imprint apparatus and manufacturing method of commodities Download PDFInfo
- Publication number
- US20110084423A1 US20110084423A1 US12/902,552 US90255210A US2011084423A1 US 20110084423 A1 US20110084423 A1 US 20110084423A1 US 90255210 A US90255210 A US 90255210A US 2011084423 A1 US2011084423 A1 US 2011084423A1
- Authority
- US
- United States
- Prior art keywords
- force
- mold
- demolding
- imprint apparatus
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/887—Nanoimprint lithography, i.e. nanostamp
Definitions
- the present invention relates to an imprint apparatus and a manufacturing method of commodities.
- an imprint technique that allows formation of a fine pattern is drawing attention as a technique for manufacturing a semiconductor device.
- a resin is applied to a substrate, such as a silicon wafer and a glass plate, and the resin is cured while an original plate (mold) with a fine pattern is pressed against the substrate through the resin to form the fine pattern on the substrate.
- the curing method of the resin include a light curing method where ultraviolet light is directed to an ultraviolet curing resin and a heat curing method where heat is applied to a heat curing resin.
- a wafer stage for driving a wafer is arranged on a base in the imprint apparatus, and a mold and a mold driving unit that drives the mold are arranged on a structure frame combined with the base.
- the base and the structure frame are united and supported by an anti-vibration mount.
- the next pattern needs to be accurately positioned (overlaid) and formed relative to the pattern formed on the substrate.
- the substrate needs to be positioned while the wafer stage is quickly driven, the mold needs to be imprinted, the resin needs to be cured, and the mold needs to be released (demolded) from the resin.
- the structure frame and the base can be mechanically independently supported by the anti-vibration mount to control the vibration of the structure frame caused by the drive of the stage (that is caused by the reactive force).
- the anti-vibration mount can be mechanically independently supported by the anti-vibration mount to control the vibration of the structure frame caused by the drive of the stage (that is caused by the reactive force).
- demolding force is provided to the mold during demolding, force generated in the structure is propagated to the anti-vibration mount with low supporting rigidity. Therefore, the entire structure frame including the mold is displaced, following the wafer. As a result, excellent demolding cannot be performed.
- the present invention provides a technique for preventing degradation of overlay accuracy of a pattern caused by the drive of a stage and capable of executing an excellent demolding process.
- an imprint apparatus comprising a mold and a stage that holds a substrate, the imprint apparatus executing a curing process of curing a resin while the mold and the resin applied to the substrate contact and a demolding process of releasing the mold from the resin cured in the curing process, the imprint apparatus including a structure that holds the mold, a pillar that supports the structure mechanically independently from the stage through an anti-vibration mount that reduces propagation of vibration, and a force providing unit that provides, to the structure, force in an opposite direction from a direction of force generated in the structure by providing demolding force to the mold during the demolding process.
- FIG. 1 is a diagram showing a configuration of an imprint apparatus as an aspect of the present invention.
- FIG. 2 is a diagram showing another configuration of the imprint apparatus as an aspect of the present invention.
- FIG. 1 is a diagram showing a configuration of an imprint apparatus 1 as an aspect of the present invention.
- the imprint apparatus 1 executes an imprint process, a curing process, and a demolding process (that is uses an imprint technique) to form a pattern on a substrate.
- the imprint process is a process of applying a resin on the substrate and pressing a mold (original plate) including a pattern against the substrate through the resin.
- the curing process is a process of curing the resin while the mold is being pressed against the substrate applied with the resin.
- the demolding process is a process of releasing the mold from the resin cured in the curing process.
- the imprint apparatus 1 includes a pillar 10 , an anti-vibration mount 12 , a structure 14 , a mold 16 , a mold driving unit 18 , an illumination system 20 , and a force providing unit 22 .
- the imprint apparatus 1 further includes a stage base 24 , an anti-vibration mount 26 , a wafer stage 28 , a profile generation unit 32 , and a control unit 34 .
- the pillar 10 supports the structure 14 mechanically independently from the stage base 24 (wafer stage 28 ), through the anti-vibration mount 12 that reduces (insulates) the propagation of vibration from an installation surface (floor).
- the structure 14 holds the mold 16 with a fine pattern through the mold driving unit 18 , the mold 16 being an original plate based on the imprint technique.
- the mold driving unit 18 has a function of driving the mold 16 .
- the mold driving unit 18 is constituted by a piezo actuator in the present embodiment, another well known actuator may constitute the mold driving unit 18 .
- the illumination system 20 is arranged on the structure 14 and directs light for curing the resin applied to the wafer 30 .
- the force providing unit 22 provides, to the structure 14 , force in the opposite direction (+Z direction) from a direction ( ⁇ Z direction) of force generated in the structure 14 by providing demolding force (force for releasing the mold 16 from the resin) to the mold 16 during the demolding process.
- the force providing unit 22 is constituted by a linear motor including a coil 222 arranged on the pillar 10 and a magnet 224 arranged on the structure 14 in the present embodiment and applies a current to the coil 222 to generate force in the +Z direction between the pillar 10 and the structure 14 .
- the stage base 24 is supported by the anti-vibration mount 26 that reduces the propagation of the vibration from the installation surface, mechanically independently from the structure 14 .
- the wafer stage 28 including an XY stage 282 and a Z tilt stage 284 is arranged on the stage base 24 .
- the Z tilt stage 284 holds the wafer 30 through a wafer chuck (not shown).
- the XY stage 282 includes several hundred mm drive strokes in an X axis direction and a Y axis direction to realize formation of patterns on all surfaces (all shots) of the wafer 30 and measurement of positions in all surfaces of the wafer 30 .
- the Z tilt stage 284 freely tilts around a Z axis.
- the anti-vibration mount 26 that supports the stage base 24 is not essential.
- the XY stage 282 may support the Z tilt stage 284 through the anti-vibration mount to reduce the propagation of the vibration from the installation surface.
- the profile generation unit 32 generates a profile indicating, in chronological order, demolding force provided to the mold 16 to release the mold 16 from the cured resin.
- the control unit 34 controls the (entire) operation of the imprint apparatus 1 .
- the control unit 34 controls the force providing unit 22 to provide, to the structure 14 , force equivalent to the force generated in the structure 14 (force in the opposite direction from the direction of the force generated in the structure 14 ) by providing demolding force to the mold 16 in the demolding process. Specific control of the control unit 34 in the demolding process will be described in detail later.
- a wafer transport system (not shown) transports the wafer 30 , and the Z tilt stage 284 holds the wafer 30 .
- An alignment detection system detects the position of the pattern formed on the wafer 30 , and the target position of the wafer 30 is determined shot by shot. While the wafer 30 is driven toward the target position, a dispenser (not shown) applies the resin to the shot (target shot for forming the pattern of the mold 16 ) of the wafer 30 .
- the mold driving unit 18 lowers the mold 16 and imprints the mold 16 to the resin applied to the wafer (imprint process).
- the illumination system 20 directs light to cure the resin (curing process).
- the mold driving unit 18 raises the mold 16 to release the mold 16 from the cured resin (demolding process).
- the structure 14 that holds the mold 16 is supported by the pillar 10 mechanically independently from the stage base 24 through the anti-vibration mount 12 . Therefore, as the demolding force is provided to the mold 16 during the demolding process, the force generated in the structure 14 acts on the anti-vibration mount 12 .
- the anti-vibration mount 12 has low rigidity to insulate the vibration from the installation surface and is displaced if the force generated in the structure 14 acts on the anti-vibration mount 12 .
- a current is applied to the coil 222 , and force is generated between the coil 222 and the magnet 224 . Based on the force, demolding force is provided to the mold 16 to cancel the force generated in the structure 14 .
- the profile generation unit 32 when a signal for instructing the start of the demolding process is inputted to the imprint apparatus 1 , the profile generation unit 32 generates a profile indicating, in chronological order, demolding force provided to the mold 16 to release the mold 16 from the cured resin.
- the profile generation unit 32 inputs the profile to the control unit 34 (first generation unit 342 and second generation unit 344 ).
- the control unit 34 independently controls the mold driving unit 18 and the force providing unit 22 based on the profile generated by the profile generation unit 32 . Therefore, there is no interaction between the mold driving unit 18 and the force providing unit 22 , and the control unit 34 can stably control the mold driving unit 18 and the force providing unit 22 even if the profile ( FIG. 1 ) indicates a monotone increase and a steep change toward 0.
- FIG. 2 is a diagram showing a configuration of an imprint apparatus 1 A as an aspect of the present invention.
- the imprint apparatus 1 A further includes a detection unit 42 that detects demolding force provided to the mold 16 .
- the control unit 34 in addition to the first generation unit 342 and the second generation unit 344 , the control unit 34 includes a profile conversion unit 346 .
- the profile conversion unit 346 converts the detection result of the detection unit 42 to a profile equivalent to the profile generated by the profile generation unit 32 (that is profile indicating the demolding force detected by the detection unit 42 in chronological order).
- the point that the structure 14 is supported by the pillar 10 mechanically independently from the stage base 24 through the anti-vibration mount 12 and the point that force providing unit 22 generates force in the +Z direction between the pillar 10 and the structure 14 are the same as in the imprint apparatus 1 .
- the profile generated by the profile generation unit 32 is inputted only to the first generation unit 342 .
- the first generation unit 342 generates a voltage value applied to the mold driving unit 18 constituted by a piezo actuator.
- the control unit 34 then applies a voltage with the voltage value generated by the first generation unit 342 to the mold driving unit 18 to drive the mold 16 .
- the detection unit 42 detects demolding force provided to the mold 16 .
- the profile conversion unit 346 converts the detection result of the detection unit 42 to a profile indicating, in chronological order, the demolding force detected by the detection unit 42 .
- the second generation unit 344 generates a current value applied to the coil 222 according to the profile converted by the profile conversion unit 346 .
- the control unit 34 then applies a current with the current value generated by the second generation unit 344 to the coil 222 .
- the control unit 34 controls the force providing unit 22 to provide, to the structure 14 , force equivalent to the force generated in the structure 14 according to the demolding force detected by the detection unit 42 (force in the opposite direction from the direction of the force generated in the structure 14 ).
- the force provided by the force providing unit 22 to the structure 14 follows the demolding force detected by the detection unit 42 . Therefore, even if demolding force different from the profile generated by the profile generation unit 32 is provided to the mold 16 , the force generated in the structure 14 can be canceled by providing the demolding force. For example, if the resin applied to the wafer 30 is changed, the profile generated by the profile generation unit 32 also needs to be changed in general. However, in the imprint apparatus 1 A, the force generated in the structure 14 can be canceled by providing the demolding force to the mold 16 without changing the profile generated by the profile generation unit 32 .
- the profile generated by the profile generation unit 32 may be inputted to the second generation unit 344 .
- the force provided by the force providing unit 22 to the structure 14 is detected, the detection result is inputted to the first generation unit 342 , and the voltage value applied to the mold driving unit 18 is generated.
- the force provided by the force providing unit 22 to the structure 14 is proportional to the current value of the current applied to the coil 222 . Therefore, the current value of the current applied to the coil 222 may be detected instead of directly detecting the force provided to the structure 14 .
- the force providing unit 22 is constituted by a linear motor including the coil 222 and the magnet 224 in the first and the second embodiments
- the force providing unit 22 can be constituted by another generally known actuator.
- the second generation unit 344 may be constituted by a pressure control unit to control the pressure provided to the anti-vibration mount 12 to provide force equivalent to the force generated in the structure 14 by providing the demolding force to the mold 16 (force in the opposite direction from the direction of the force generated in the structure 14 .)
- the imprint apparatuses 1 and 1 A each includes two mold driving units 18 and two force providing units 22 in the first and second embodiments, and only the force in the Z axis direction (perpendicular direction) has been described.
- the tilt component of the force generated in the structure 14 by providing the demolding force to the mold 16 also needs to be actually cancelled by the force provided by the force providing unit 22 . Therefore, the numbers and the positions of the mold driving units 18 and the force providing units 22 need to be appropriately set.
- Such a technique is a technique well known in the art, and details will not be described here.
- the XY stage 282 and the Z tilt stage 284 constitute the wafer stage 28 in the first and second embodiments, only the XY stage 282 may constitute the wafer stage 28 . In that case, the mold 16 (mold driving unit 18 ) can freely tilt around the Z axis.
- the mold driving unit 18 drives the mold 16 to generate the demolding force during the demolding process in the first and second embodiments.
- a Z axis drive mechanism on the wafer stage side may drive the wafer 30 to generate the demolding force.
- the first generation unit 342 generates a voltage value applied to the wafer stage in accordance with the profile generated by the profile generation unit 32 .
- the profile generated by the profile generation unit 32 may be obtained by another evaluation system or may be measured and obtained by the imprint apparatus 1 or 1 A.
- the demolding force detected by the detection unit 42 can be stored in chronological order, and the next profile can be predicted from the past demolding force to rewrite the profile generated by the profile generation unit 32 . If a peripheral part of the wafer 30 is included in an area for imprinting the mold 16 , the demolding force changes.
- a profile database with a parameter including the length and the representative position of the peripheral part of the wafer included in the area for imprinting the mold 16 can be stored, and the profile can be switched according to the length and the representative position of the peripheral part of the wafer.
- databases of profile can be stored according to the types of the resin applied to the wafer, and the profile can be switched according to the type of the resin.
- the imprint apparatus 1 or 1 A fast drive of the wafer stage 28 is possible (that is degradation of the overlay accuracy of the pattern caused by the drive of the wafer stage 28 can be prevented), and an excellent demolding process can be executed. Therefore, the imprint apparatus 1 or 1 A can provide economical and high-quality commodities in high throughput.
- a manufacturing method of devices such as a semiconductor integrated circuit element and a liquid crystal display element as commodities includes a step of transferring (forming) a pattern on a substrate (such as a wafer, a glass plate, and a film substrate) using the imprint apparatus 1 or 1 A.
- the manufacturing method further includes a step of etching the substrate with the transferred pattern.
- the manufacturing method includes another processing step of processing the substrate with the transferred pattern to manufacture other commodities, such as pattern dot media (recording media) and optical elements.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to an imprint apparatus and a manufacturing method of commodities.
- 2. Description of the Related Art
- In recent years, an imprint technique that allows formation of a fine pattern is drawing attention as a technique for manufacturing a semiconductor device. In the imprint technique, a resin is applied to a substrate, such as a silicon wafer and a glass plate, and the resin is cured while an original plate (mold) with a fine pattern is pressed against the substrate through the resin to form the fine pattern on the substrate. Examples of the curing method of the resin include a light curing method where ultraviolet light is directed to an ultraviolet curing resin and a heat curing method where heat is applied to a heat curing resin.
- An imprint apparatus using such an imprint technique is disclosed in Japanese Patent Laid-Open No. 2005-286062. A wafer stage for driving a wafer is arranged on a base in the imprint apparatus, and a mold and a mold driving unit that drives the mold are arranged on a structure frame combined with the base. The base and the structure frame are united and supported by an anti-vibration mount.
- In the manufacturing of the semiconductor device, the next pattern needs to be accurately positioned (overlaid) and formed relative to the pattern formed on the substrate. To improve the productivity, the substrate needs to be positioned while the wafer stage is quickly driven, the mold needs to be imprinted, the resin needs to be cured, and the mold needs to be released (demolded) from the resin.
- However, in the imprint apparatus disclosed in Japanese Patent Laid-Open No. 2005-286062, reactive force caused by the drive of the wafer stage is propagated to the structure frame through the base, and the structure frame is vibrated. The vibration of the structure frame causes relative vibration of the wafer and the mold, and overlay accuracy of the pattern formed on the substrate is degraded.
- The structure frame and the base (wafer stage) can be mechanically independently supported by the anti-vibration mount to control the vibration of the structure frame caused by the drive of the stage (that is caused by the reactive force). However, as demolding force is provided to the mold during demolding, force generated in the structure is propagated to the anti-vibration mount with low supporting rigidity. Therefore, the entire structure frame including the mold is displaced, following the wafer. As a result, excellent demolding cannot be performed.
- The present invention provides a technique for preventing degradation of overlay accuracy of a pattern caused by the drive of a stage and capable of executing an excellent demolding process.
- According to one aspect of the present invention, there is provided an imprint apparatus comprising a mold and a stage that holds a substrate, the imprint apparatus executing a curing process of curing a resin while the mold and the resin applied to the substrate contact and a demolding process of releasing the mold from the resin cured in the curing process, the imprint apparatus including a structure that holds the mold, a pillar that supports the structure mechanically independently from the stage through an anti-vibration mount that reduces propagation of vibration, and a force providing unit that provides, to the structure, force in an opposite direction from a direction of force generated in the structure by providing demolding force to the mold during the demolding process.
- Further aspects of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
-
FIG. 1 is a diagram showing a configuration of an imprint apparatus as an aspect of the present invention. -
FIG. 2 is a diagram showing another configuration of the imprint apparatus as an aspect of the present invention. - Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the same reference numerals denote the same members throughout the drawings, and a repetitive description thereof will not be given.
-
FIG. 1 is a diagram showing a configuration of animprint apparatus 1 as an aspect of the present invention. Theimprint apparatus 1 executes an imprint process, a curing process, and a demolding process (that is uses an imprint technique) to form a pattern on a substrate. The imprint process is a process of applying a resin on the substrate and pressing a mold (original plate) including a pattern against the substrate through the resin. The curing process is a process of curing the resin while the mold is being pressed against the substrate applied with the resin. The demolding process is a process of releasing the mold from the resin cured in the curing process. - As shown in
FIG. 1 , theimprint apparatus 1 includes apillar 10, ananti-vibration mount 12, astructure 14, amold 16, amold driving unit 18, anillumination system 20, and aforce providing unit 22. Theimprint apparatus 1 further includes astage base 24, ananti-vibration mount 26, awafer stage 28, aprofile generation unit 32, and acontrol unit 34. - The
pillar 10 supports thestructure 14 mechanically independently from the stage base 24 (wafer stage 28), through theanti-vibration mount 12 that reduces (insulates) the propagation of vibration from an installation surface (floor). Thestructure 14 holds themold 16 with a fine pattern through themold driving unit 18, themold 16 being an original plate based on the imprint technique. Themold driving unit 18 has a function of driving themold 16. Although themold driving unit 18 is constituted by a piezo actuator in the present embodiment, another well known actuator may constitute themold driving unit 18. Theillumination system 20 is arranged on thestructure 14 and directs light for curing the resin applied to thewafer 30. Theforce providing unit 22 provides, to thestructure 14, force in the opposite direction (+Z direction) from a direction (−Z direction) of force generated in thestructure 14 by providing demolding force (force for releasing themold 16 from the resin) to themold 16 during the demolding process. Theforce providing unit 22 is constituted by a linear motor including acoil 222 arranged on thepillar 10 and amagnet 224 arranged on thestructure 14 in the present embodiment and applies a current to thecoil 222 to generate force in the +Z direction between thepillar 10 and thestructure 14. - As described, the
stage base 24 is supported by theanti-vibration mount 26 that reduces the propagation of the vibration from the installation surface, mechanically independently from thestructure 14. Thewafer stage 28 including anXY stage 282 and aZ tilt stage 284 is arranged on thestage base 24. TheZ tilt stage 284 holds thewafer 30 through a wafer chuck (not shown). TheXY stage 282 includes several hundred mm drive strokes in an X axis direction and a Y axis direction to realize formation of patterns on all surfaces (all shots) of thewafer 30 and measurement of positions in all surfaces of thewafer 30. TheZ tilt stage 284 freely tilts around a Z axis. Theanti-vibration mount 26 that supports thestage base 24 is not essential. For example, theXY stage 282 may support theZ tilt stage 284 through the anti-vibration mount to reduce the propagation of the vibration from the installation surface. - The
profile generation unit 32 generates a profile indicating, in chronological order, demolding force provided to themold 16 to release themold 16 from the cured resin. Thecontrol unit 34 controls the (entire) operation of theimprint apparatus 1. For example, thecontrol unit 34 controls theforce providing unit 22 to provide, to thestructure 14, force equivalent to the force generated in the structure 14 (force in the opposite direction from the direction of the force generated in the structure 14) by providing demolding force to themold 16 in the demolding process. Specific control of thecontrol unit 34 in the demolding process will be described in detail later. - An operation of the
imprint apparatus 1 will be described. A wafer transport system (not shown) transports thewafer 30, and theZ tilt stage 284 holds thewafer 30. An alignment detection system then detects the position of the pattern formed on thewafer 30, and the target position of thewafer 30 is determined shot by shot. While thewafer 30 is driven toward the target position, a dispenser (not shown) applies the resin to the shot (target shot for forming the pattern of the mold 16) of thewafer 30. When thewafer 30 is positioned at the target position, themold driving unit 18 lowers themold 16 and imprints themold 16 to the resin applied to the wafer (imprint process). While themold 16 is imprinted, theillumination system 20 directs light to cure the resin (curing process). Themold driving unit 18 raises themold 16 to release themold 16 from the cured resin (demolding process). - In the
imprint apparatus 1, as described, thestructure 14 that holds themold 16 is supported by thepillar 10 mechanically independently from thestage base 24 through theanti-vibration mount 12. Therefore, as the demolding force is provided to themold 16 during the demolding process, the force generated in thestructure 14 acts on theanti-vibration mount 12. Theanti-vibration mount 12 has low rigidity to insulate the vibration from the installation surface and is displaced if the force generated in thestructure 14 acts on theanti-vibration mount 12. - Therefore, in the present embodiment, a current is applied to the
coil 222, and force is generated between thecoil 222 and themagnet 224. Based on the force, demolding force is provided to themold 16 to cancel the force generated in thestructure 14. - Specifically, when a signal for instructing the start of the demolding process is inputted to the
imprint apparatus 1, theprofile generation unit 32 generates a profile indicating, in chronological order, demolding force provided to themold 16 to release themold 16 from the cured resin. Theprofile generation unit 32 inputs the profile to the control unit 34 (first generation unit 342 and second generation unit 344). - In the
control unit 34, thefirst generation unit 342 generates a voltage value applied to themold driving unit 18 constituted by a piezo actuator in accordance with the profile generated by theprofile generation unit 32. Thesecond generation unit 344 generates a current value applied to thecoil 222 in accordance with the profile generated by theprofile generation unit 32. Thecontrol unit 34 applies a voltage with the voltage value generated by thefirst generation unit 342 to themold driving unit 18 and applies a current with the current value generated by thesecond generation unit 344 to thecoil 222. In this way, thecontrol unit 34 determines the force provided to thestructure 14 in accordance with the profile generated by theprofile generation unit 32 and controls theforce providing unit 22 to provide the force to thestructure 14. As a result, the force generated in thestructure 14 by providing the demolding force to themold 16 during the demolding process is canceled by the force provided by theforce providing unit 22 to thestructure 14, and an excellent demolding process can be executed without displacement of the structure 14 (anti-vibration mount 12). - The
control unit 34 independently controls themold driving unit 18 and theforce providing unit 22 based on the profile generated by theprofile generation unit 32. Therefore, there is no interaction between themold driving unit 18 and theforce providing unit 22, and thecontrol unit 34 can stably control themold driving unit 18 and theforce providing unit 22 even if the profile (FIG. 1 ) indicates a monotone increase and a steep change toward 0. - As described, in the
imprint apparatus 1, the force generated in thestructure 14 by providing the demolding force to themold 16 during the demolding process is canceled by the force provided by theforce providing unit 22 to thestructure 14. Therefore, force does not act in thestructure 14 as a whole. As a result, an excellent demolding process can be executed without displacement of thestructure 14 during the demolding process even if thestructure 14 is supported through theanti-vibration mount 12 with low rigidity. Since thestructure 14 is supported mechanically independently from thestage base 24, reactive force does not propagate to thestructure 14 when thewafer stage 28 is driven in high speed. Therefore, thestructure 14 and themold 16 do not vibrate, and the degradation in the overlay accuracy of the pattern formed on thewafer 30 can be prevented. -
FIG. 2 is a diagram showing a configuration of animprint apparatus 1A as an aspect of the present invention. In addition to the constituent elements of theimprint apparatus 1, theimprint apparatus 1A further includes adetection unit 42 that detects demolding force provided to themold 16. In theimprint apparatus 1A, in addition to thefirst generation unit 342 and thesecond generation unit 344, thecontrol unit 34 includes a profile conversion unit 346. The profile conversion unit 346 converts the detection result of thedetection unit 42 to a profile equivalent to the profile generated by the profile generation unit 32 (that is profile indicating the demolding force detected by thedetection unit 42 in chronological order). The point that thestructure 14 is supported by thepillar 10 mechanically independently from thestage base 24 through theanti-vibration mount 12 and the point that force providingunit 22 generates force in the +Z direction between thepillar 10 and thestructure 14 are the same as in theimprint apparatus 1. - In the
imprint apparatus 1A, the profile generated by theprofile generation unit 32 is inputted only to thefirst generation unit 342. In accordance with the profile generated by theprofile generation unit 32, thefirst generation unit 342 generates a voltage value applied to themold driving unit 18 constituted by a piezo actuator. Thecontrol unit 34 then applies a voltage with the voltage value generated by thefirst generation unit 342 to themold driving unit 18 to drive themold 16. As a result, thedetection unit 42 detects demolding force provided to themold 16. The profile conversion unit 346 converts the detection result of thedetection unit 42 to a profile indicating, in chronological order, the demolding force detected by thedetection unit 42. Thesecond generation unit 344 generates a current value applied to thecoil 222 according to the profile converted by the profile conversion unit 346. Thecontrol unit 34 then applies a current with the current value generated by thesecond generation unit 344 to thecoil 222. In this way, thecontrol unit 34 controls theforce providing unit 22 to provide, to thestructure 14, force equivalent to the force generated in thestructure 14 according to the demolding force detected by the detection unit 42 (force in the opposite direction from the direction of the force generated in the structure 14). As a result, the force generated in thestructure 14 by providing the demolding force to themold 16 during the demolding process is canceled by the force provided by theforce providing unit 22 to thestructure 14, and an excellent demolding process can be executed without displacement of the structure 14 (anti-vibration mount 12). - In the
imprint apparatus 1A, the force provided by theforce providing unit 22 to thestructure 14 follows the demolding force detected by thedetection unit 42. Therefore, even if demolding force different from the profile generated by theprofile generation unit 32 is provided to themold 16, the force generated in thestructure 14 can be canceled by providing the demolding force. For example, if the resin applied to thewafer 30 is changed, the profile generated by theprofile generation unit 32 also needs to be changed in general. However, in theimprint apparatus 1A, the force generated in thestructure 14 can be canceled by providing the demolding force to themold 16 without changing the profile generated by theprofile generation unit 32. - Although the profile generated by the
profile generation unit 32 is inputted to thefirst generation unit 342 in the present embodiment, the profile generated by theprofile generation unit 32 may be inputted to thesecond generation unit 344. In that case, the force provided by theforce providing unit 22 to thestructure 14 is detected, the detection result is inputted to thefirst generation unit 342, and the voltage value applied to themold driving unit 18 is generated. The force provided by theforce providing unit 22 to thestructure 14 is proportional to the current value of the current applied to thecoil 222. Therefore, the current value of the current applied to thecoil 222 may be detected instead of directly detecting the force provided to thestructure 14. - Although the
force providing unit 22 is constituted by a linear motor including thecoil 222 and themagnet 224 in the first and the second embodiments, theforce providing unit 22 can be constituted by another generally known actuator. Thesecond generation unit 344 may be constituted by a pressure control unit to control the pressure provided to theanti-vibration mount 12 to provide force equivalent to the force generated in thestructure 14 by providing the demolding force to the mold 16 (force in the opposite direction from the direction of the force generated in thestructure 14.) - The
imprint apparatuses mold driving units 18 and twoforce providing units 22 in the first and second embodiments, and only the force in the Z axis direction (perpendicular direction) has been described. However, the tilt component of the force generated in thestructure 14 by providing the demolding force to themold 16 also needs to be actually cancelled by the force provided by theforce providing unit 22. Therefore, the numbers and the positions of themold driving units 18 and theforce providing units 22 need to be appropriately set. Such a technique is a technique well known in the art, and details will not be described here. - Although the
XY stage 282 and theZ tilt stage 284 constitute thewafer stage 28 in the first and second embodiments, only theXY stage 282 may constitute thewafer stage 28. In that case, the mold 16 (mold driving unit 18) can freely tilt around the Z axis. - The
mold driving unit 18 drives themold 16 to generate the demolding force during the demolding process in the first and second embodiments. However, instead of themold driving unit 18, a Z axis drive mechanism on the wafer stage side (for example, Z tilt stage 284) may drive thewafer 30 to generate the demolding force. In that case, thefirst generation unit 342 generates a voltage value applied to the wafer stage in accordance with the profile generated by theprofile generation unit 32. - The profile generated by the
profile generation unit 32 may be obtained by another evaluation system or may be measured and obtained by theimprint apparatus detection unit 42 can be stored in chronological order, and the next profile can be predicted from the past demolding force to rewrite the profile generated by theprofile generation unit 32. If a peripheral part of thewafer 30 is included in an area for imprinting themold 16, the demolding force changes. In such a case, for example, a profile database with a parameter including the length and the representative position of the peripheral part of the wafer included in the area for imprinting themold 16 can be stored, and the profile can be switched according to the length and the representative position of the peripheral part of the wafer. Furthermore, databases of profile can be stored according to the types of the resin applied to the wafer, and the profile can be switched according to the type of the resin. - As described, according to the
imprint apparatus wafer stage 28 is possible (that is degradation of the overlay accuracy of the pattern caused by the drive of thewafer stage 28 can be prevented), and an excellent demolding process can be executed. Therefore, theimprint apparatus - A manufacturing method of devices (such as a semiconductor integrated circuit element and a liquid crystal display element) as commodities includes a step of transferring (forming) a pattern on a substrate (such as a wafer, a glass plate, and a film substrate) using the
imprint apparatus - While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
- This application claims the benefit of Japanese Patent application No. 2009-237581 filed on Oct. 14, 2009, which is hereby incorporated by reference herein in its entirety.
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-237581 | 2009-10-14 | ||
JP2009237581A JP5379636B2 (en) | 2009-10-14 | 2009-10-14 | Imprint apparatus and article manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
US20110084423A1 true US20110084423A1 (en) | 2011-04-14 |
US8834769B2 US8834769B2 (en) | 2014-09-16 |
Family
ID=43854198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/902,552 Expired - Fee Related US8834769B2 (en) | 2009-10-14 | 2010-10-12 | Imprint apparatus for forming a pattern of a resin on a substrate using a mold |
Country Status (2)
Country | Link |
---|---|
US (1) | US8834769B2 (en) |
JP (1) | JP5379636B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104898371A (en) * | 2015-06-25 | 2015-09-09 | 河海大学常州校区 | Nano-imprinting easy demoulding method |
US20170115185A1 (en) * | 2014-03-24 | 2017-04-27 | Compagnie Generale Des Etablissements Michelin | Surface demoldability prediction model |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6000712B2 (en) | 2012-07-24 | 2016-10-05 | キヤノン株式会社 | Resin manufacturing method and resin manufacturing apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050212156A1 (en) * | 2004-03-29 | 2005-09-29 | Toshinobu Tokita | Processing apparatus |
US7381272B2 (en) * | 2004-03-29 | 2008-06-03 | Canon Kabushiki Kaisha | Processing apparatus |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7248339B2 (en) * | 2003-07-04 | 2007-07-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR20060128886A (en) * | 2003-12-11 | 2006-12-14 | 노우코우다이 티엘오 가부시키가이샤 | Pattern-forming process utilizing nanoimprint and apparatus for performing such process |
US7649613B2 (en) * | 2006-03-03 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus, method of controlling a component of a lithographic apparatus and device manufacturing method |
JP4803589B2 (en) * | 2006-04-12 | 2011-10-26 | 独立行政法人産業技術総合研究所 | Imprint device |
EP2584408B1 (en) * | 2007-02-06 | 2020-10-07 | Canon Kabushiki Kaisha | Imprint method and imprint apparatus |
NL2003772A (en) * | 2008-12-11 | 2010-06-14 | Asml Netherlands Bv | Lithographic apparatus and a method to compensate for the effect of disturbances on the projection system of a lithographic apparatus. |
JP5379564B2 (en) * | 2009-06-01 | 2013-12-25 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
-
2009
- 2009-10-14 JP JP2009237581A patent/JP5379636B2/en not_active Expired - Fee Related
-
2010
- 2010-10-12 US US12/902,552 patent/US8834769B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050212156A1 (en) * | 2004-03-29 | 2005-09-29 | Toshinobu Tokita | Processing apparatus |
US7381272B2 (en) * | 2004-03-29 | 2008-06-03 | Canon Kabushiki Kaisha | Processing apparatus |
Non-Patent Citations (1)
Title |
---|
Trabadelo et al. Measurement of demolding forces in full wafer thermal nanoimprint, Microelectronic Engineering Volume 85, Issues 5-6, 7 February 2008, Pages 907-909 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170115185A1 (en) * | 2014-03-24 | 2017-04-27 | Compagnie Generale Des Etablissements Michelin | Surface demoldability prediction model |
US10551279B2 (en) * | 2014-03-24 | 2020-02-04 | Compagnie Generale Des Etablissements Michelin | Surface demoldability prediction model |
CN104898371A (en) * | 2015-06-25 | 2015-09-09 | 河海大学常州校区 | Nano-imprinting easy demoulding method |
Also Published As
Publication number | Publication date |
---|---|
JP2011086727A (en) | 2011-04-28 |
JP5379636B2 (en) | 2013-12-25 |
US8834769B2 (en) | 2014-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101702759B1 (en) | Imprint apparatus, device manufacturing method, and imprint method | |
JP6140966B2 (en) | Imprint apparatus and article manufacturing method using the same | |
JP6021606B2 (en) | Imprint apparatus, article manufacturing method using the same, and imprint method | |
JP5868215B2 (en) | Imprint apparatus, imprint method, and article manufacturing method using the same | |
KR101980415B1 (en) | Imprint apparatus and article manufacturing method | |
JP5930622B2 (en) | Imprint apparatus and article manufacturing method | |
JP5759303B2 (en) | Imprint apparatus and article manufacturing method using the same | |
JP5669466B2 (en) | Holding apparatus, imprint apparatus and article manufacturing method | |
US10216104B2 (en) | Imprint method, imprint apparatus, and method of manufacturing article | |
JP6306830B2 (en) | Imprint apparatus and article manufacturing method | |
US20140054823A1 (en) | Original and article manufacturing method using same | |
JP6120677B2 (en) | Imprint apparatus, imprint method, and article manufacturing method | |
JP6294686B2 (en) | Imprint apparatus, imprint method, and article manufacturing method | |
JP2013008911A (en) | Cleaning method, imprint device using the same and manufacturing method of article | |
JP5773761B2 (en) | Lithographic system and article manufacturing method using the same | |
JP6562795B2 (en) | Imprint apparatus and article manufacturing method | |
US8834769B2 (en) | Imprint apparatus for forming a pattern of a resin on a substrate using a mold | |
US20160257060A1 (en) | Imprint apparatus, imprint method, and article manufacturing method | |
JP5822597B2 (en) | Imprint apparatus and article manufacturing method using the same | |
JP2017157639A (en) | Imprint device and method for manufacturing article | |
JP2015111708A (en) | Imprint device, imprint method, and device manufacturing method | |
JP2012109432A (en) | Imprint apparatus and article manufacturing method | |
KR20160007377A (en) | Imprint apparatus and article manufacturing method | |
JP2012099658A (en) | Imprint device, and article manufacturing method using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CANON KABUSHIKI KAISHA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KORENAGA, NOBUSHIGE;REEL/FRAME:025664/0655 Effective date: 20100921 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20220916 |