US20100139895A1 - Thermal module - Google Patents

Thermal module Download PDF

Info

Publication number
US20100139895A1
US20100139895A1 US12/482,404 US48240409A US2010139895A1 US 20100139895 A1 US20100139895 A1 US 20100139895A1 US 48240409 A US48240409 A US 48240409A US 2010139895 A1 US2010139895 A1 US 2010139895A1
Authority
US
United States
Prior art keywords
plate
base
thermal module
cover
blower
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/482,404
Other languages
English (en)
Inventor
Ching-Bai Hwang
Jin-Gong Meng
Zhi-Hui Zhao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furui Precise Component Kunshan Co Ltd, Foxconn Technology Co Ltd filed Critical Furui Precise Component Kunshan Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HWANG, CHING-BAI, MENG, JIN-GONG, ZHAO, Zhi-hui
Publication of US20100139895A1 publication Critical patent/US20100139895A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • FIG. 1 is an isometric, assembled view of a thermal module according to an exemplary embodiment.
  • a thermal module for dissipating heat of electronic components of an electronic device includes a blower 10 , a fin unit 20 and a heat pipe 30 .
  • the fin unit 20 is arranged at the air outlet 130 of the blower 10 .
  • the fin unit 20 includes a plurality of fins 24 stacked together.
  • a channel 22 is defined between neighboring fins 24 communicating the air outlet 130 .
  • the flanges 324 , 344 of the top plate 32 and the bottom plate 34 are connected with each other through soldering, thus to form a chamber 39 between the top plate 32 and the bottom plate 34 of the heat pipe 30 , which receives a working fluid therein.
  • a wick structure (not shown) can be arranged in the chamber 39 for enhancing a heat transfer capability of the heat pipe 30 .
  • concaves 341 formed in the bottom plate 34 , in which one concave 341 is defined in the end portion 312 of the evaporation section 31 , one concave 341 is defined in the elongated portion 310 adjacent to the evaporation section 31 , and other two concaves 341 are defined in a middle of the evaporation section 31 .
  • the four concaves 341 are spaced from each other.
  • the protrusion 343 is formed adjacent to the middle of the evaporation section 31 .
  • the protrusion 343 and the concaves 341 are formed corresponding to the electronic components. It is to be understood that, a number, a shape and a position of the concave 341 and the protrusion 343 should be decided according to the arrangement of electronic components.
  • the electronic components of the electronic device usually are arranged close to each other, and have different heights, thus, the electronic components with lower heights can be attached to the portions of the absorbing surface 314 tightly, which are located corresponding to the concaves 341 of the bottom plate 34 .
  • the electronic component with a higher height can be attached to the portion of the absorbing surface 314 tightly, which is located corresponding to the protrusion 343 of the bottom plate 34 . Therefore, the evaporation section 31 of the heat pipe 30 with the non-planar absorbing surface 314 can tightly contact with plural electronic components with different heights at the same time.
  • a plurality of posts 38 each having a through hole 348 therein extend upwardly from the main body 342 of the bottom plate 34 .
  • the posts 38 are spaced from each other.
  • the top plate 32 defines a plurality of apertures 328 corresponding to the posts 38 of the bottom plate 34 .
  • a diameter of each aperture 328 is substantially the same as an outer diameter of the corresponding post 38 .
  • the thermal module Since the heat pipe 30 is integrally formed with the cover 11 of the blower 10 , the fin unit 20 is arranged at the air outlet 130 of the blower 10 and attached to the condensation section 33 of the heat pipe 30 , the thermal module is connected together without extra fixing structures.
  • several screws are just needed to extend through the apertures 328 and the through holes 348 of the heat pipe 30 into a circuit board on which the electronic components are mounted.
  • assembly of the thermal module is simple and easy. After assembled, a weight and a size of the thermal module are not increased, and thus the electronic device incorporates the thermal module can have a relatively lower weight and compactness size.
  • the plural electronic components of the electronic device respectively contact the portions of the absorbing surface 314 tightly, which are located corresponding to the concaves 341 and the protrusion 343 of the heat pipe 30 , respectively.
  • a heat resistance between the electronic components and the heat pipe 30 is reduced.
  • the heat generated by the electronic components thus can be quickly absorbed by the heat pipe 30 , and then transferred to the fin unit 20 timely.
  • the blower 10 generates forced airflow to the fin unit 20 to take away the heat to an outside. Therefore, the thermal module can cool plural electronic components simultaneously. A heat dissipation efficiency of the thermal module is enhanced.
  • a second air inlet 420 is defined in the base 42 around the supporting board 45 , and is divided into three parts by three ribs 46 which connect the supporting board 45 to the base 42 .
  • the heat pipe 50 is integrally formed with the base 42 of the blower 40 ; thus, assembly of the thermal module is also simplified.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/482,404 2008-12-10 2009-06-10 Thermal module Abandoned US20100139895A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810306086.5A CN101754655B (zh) 2008-12-10 2008-12-10 散热模组
CN200810306086.5 2008-12-10

Publications (1)

Publication Number Publication Date
US20100139895A1 true US20100139895A1 (en) 2010-06-10

Family

ID=42229776

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/482,404 Abandoned US20100139895A1 (en) 2008-12-10 2009-06-10 Thermal module

Country Status (2)

Country Link
US (1) US20100139895A1 (zh)
CN (1) CN101754655B (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150323262A1 (en) * 2014-05-07 2015-11-12 Samsung Electronics Co., Ltd. Heat dissipating apparatus and electronic device having the same
US20150362258A1 (en) * 2014-06-13 2015-12-17 Nidec Corporation Heat module
CN107295778A (zh) * 2016-04-11 2017-10-24 奇鋐科技股份有限公司 均温板结构
US20180100708A1 (en) * 2016-06-16 2018-04-12 Asia Vital Components Co., Ltd. Vapor chamber structure
US20190324507A1 (en) * 2019-06-27 2019-10-24 Intel Corporation Chassis embedded heat pipe
US20220015260A1 (en) * 2020-07-13 2022-01-13 Lenovo (Singapore) Pte. Ltd. Cooling module and electronic apparatus
US20220256738A1 (en) * 2021-02-10 2022-08-11 Dell Products L.P. Cooling system for an information handling system
JP7254891B1 (ja) 2021-12-22 2023-04-10 レノボ・シンガポール・プライベート・リミテッド 冷却モジュール及び電子機器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478025B (zh) * 2010-11-29 2016-04-27 富瑞精密组件（昆山）有限公司 散热装置及其离心风扇
CN103002715A (zh) * 2012-10-29 2013-03-27 任立元 水仙叶状散热片

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6263959B1 (en) * 1998-04-13 2001-07-24 Furukawa Electric Co. Ltd. Plate type heat pipe and cooling structure using it
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6408934B1 (en) * 1998-05-28 2002-06-25 Diamond Electric Mfg. Co., Ltd. Cooling module
US20030000684A1 (en) * 2001-06-13 2003-01-02 Wen-Shi Huang Heat dissipation device with high efficiency
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US7100680B2 (en) * 1999-05-12 2006-09-05 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
US20090219695A1 (en) * 2008-02-28 2009-09-03 Kabushiki Kaisha Toshiba Electronic Device, Loop Heat Pipe and Cooling Device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101090620B (zh) * 2006-06-16 2010-10-06 富准精密工业(深圳)有限公司 散热模组
CN101196770A (zh) * 2006-12-08 2008-06-11 英业达股份有限公司 散热模块

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6263959B1 (en) * 1998-04-13 2001-07-24 Furukawa Electric Co. Ltd. Plate type heat pipe and cooling structure using it
US6408934B1 (en) * 1998-05-28 2002-06-25 Diamond Electric Mfg. Co., Ltd. Cooling module
US7100680B2 (en) * 1999-05-12 2006-09-05 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US20030000684A1 (en) * 2001-06-13 2003-01-02 Wen-Shi Huang Heat dissipation device with high efficiency
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
US20090219695A1 (en) * 2008-02-28 2009-09-03 Kabushiki Kaisha Toshiba Electronic Device, Loop Heat Pipe and Cooling Device
US7738248B2 (en) * 2008-02-28 2010-06-15 Kabushiki Kaisha Toshiba Electronic device, loop heat pipe and cooling device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9639127B2 (en) * 2014-05-07 2017-05-02 Samsung Electronics Co., Ltd. Heat dissipating apparatus and electronic device having the same
US20150323262A1 (en) * 2014-05-07 2015-11-12 Samsung Electronics Co., Ltd. Heat dissipating apparatus and electronic device having the same
US20150362258A1 (en) * 2014-06-13 2015-12-17 Nidec Corporation Heat module
US9909813B2 (en) * 2014-06-13 2018-03-06 Nidec Corporation Heat module
CN107295778A (zh) * 2016-04-11 2017-10-24 奇鋐科技股份有限公司 均温板结构
US10948240B2 (en) * 2016-06-16 2021-03-16 Asia Vital Components Co., Ltd. Vapor chamber structure
US20180100708A1 (en) * 2016-06-16 2018-04-12 Asia Vital Components Co., Ltd. Vapor chamber structure
US20190324507A1 (en) * 2019-06-27 2019-10-24 Intel Corporation Chassis embedded heat pipe
US10921869B2 (en) * 2019-06-27 2021-02-16 Intel Corporation Chassis embedded heat pipe
US20220015260A1 (en) * 2020-07-13 2022-01-13 Lenovo (Singapore) Pte. Ltd. Cooling module and electronic apparatus
US11547017B2 (en) * 2020-07-13 2023-01-03 Lenovo (Singapore) Pte. Ltd. Cooling module and electronic apparatus
US20220256738A1 (en) * 2021-02-10 2022-08-11 Dell Products L.P. Cooling system for an information handling system
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
JP7254891B1 (ja) 2021-12-22 2023-04-10 レノボ・シンガポール・プライベート・リミテッド 冷却モジュール及び電子機器
JP2023092712A (ja) * 2021-12-22 2023-07-04 レノボ・シンガポール・プライベート・リミテッド 冷却モジュール及び電子機器

Also Published As

Publication number Publication date
CN101754655B (zh) 2013-03-06
CN101754655A (zh) 2010-06-23

Similar Documents

Publication Publication Date Title
US20100139895A1 (en) Thermal module
US7443680B1 (en) Heat dissipation apparatus for heat producing device
US7967473B2 (en) LED lamp with heat sink
US7755902B2 (en) Heat dissipation device for computer add-on cards
KR100766109B1 (ko) 방열장치
US20100155030A1 (en) Thermal module
US7891411B2 (en) Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
US7674011B2 (en) LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp
US7298620B2 (en) Heat dissipation device
US7403389B2 (en) Heat dissipation device
US6668910B2 (en) Heat sink with multiple surface enhancements
US7796387B2 (en) Heat dissipation apparatus having a fan received therein
US20090059525A1 (en) Heat dissipation device for computer add-on cards
US7810950B2 (en) LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp
US20090059524A1 (en) Heat dissipation device
US20100271774A1 (en) Heat dissipation device
US8562291B2 (en) Heat dissipation device and centrifugal fan thereof
US7647960B2 (en) Heat dissipation device
US20100155023A1 (en) Heat dissipation apparatus having heat pipes inserted therein
US20110265976A1 (en) Heat dissipation device with heat pipe
US20120043058A1 (en) Heat dissipation device
US8579016B2 (en) Heat dissipation device with heat pipe
US8579017B2 (en) Heat dissipation device with multiple heat sinks
US20060032617A1 (en) Heat sink electronic components
US20080314554A1 (en) Heat dissipation device with a heat pipe

Legal Events

Date Code Title Description
AS Assignment

Owner name: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.,CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HWANG, CHING-BAI;MENG, JIN-GONG;ZHAO, ZHI-HUI;REEL/FRAME:022809/0562

Effective date: 20090608

Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HWANG, CHING-BAI;MENG, JIN-GONG;ZHAO, ZHI-HUI;REEL/FRAME:022809/0562

Effective date: 20090608

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION