US20100112235A1 - Method for treating plasma under continuous atmospheric pressure of work pieces, in particular, material plates or strips - Google Patents

Method for treating plasma under continuous atmospheric pressure of work pieces, in particular, material plates or strips Download PDF

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Publication number
US20100112235A1
US20100112235A1 US11/993,362 US99336206A US2010112235A1 US 20100112235 A1 US20100112235 A1 US 20100112235A1 US 99336206 A US99336206 A US 99336206A US 2010112235 A1 US2010112235 A1 US 2010112235A1
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Prior art keywords
workpiece
electrode
plasma
treated
barrier electrodes
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Abandoned
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US11/993,362
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English (en)
Inventor
Eckhard Prinz
Peter Palm
Frank Forster
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Softal Corona and Plasma GmbH
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Softal Electronic Erik Blumenfeld GmbH and Co KG
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Assigned to SOFTAL ELECTRONIC ERIK BLUMENFELD GMBH & CO. KG reassignment SOFTAL ELECTRONIC ERIK BLUMENFELD GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FORSTER, FRANK, PALM, PETER, PRINZ, ECKHARD
Publication of US20100112235A1 publication Critical patent/US20100112235A1/en
Assigned to SOFTAL CORONA & PLASMA GMBH reassignment SOFTAL CORONA & PLASMA GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SOFTAL ELECTRONIC ERIK BLUMENFELD GMBH & CO. KG
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2418—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2437—Multilayer systems

Definitions

  • the invention relates to a method for continuous atmospheric-pressure plasma treatment of workpieces, in particular boards or sheets of material according to the preamble of claim 1 and/or the preamble of claim 6 .
  • the film is activated at the surface by a plasma treatment at atmospheric pressure, also known as a corona treatment.
  • An industrial corona system usually comprises a high-voltage electrode and a counter-electrode designed as a roll which is guided over the plastic film in close proximity thereto.
  • the electrode is arranged parallel to the roll, the electrode being connected to a high voltage of approx. 10 kilovolts at approx. 20-40 kilohertz and the roll being connected to ground potential.
  • a corona discharge develops with a conventional practical power output of 1 to 5 kilowatts per meter.
  • the plastic film is activated by the corona discharge, i.e., oxidized at the surface.
  • DE 102 28 506 A1 discloses a method for continuous atmospheric pressure plasma treatment of electrically insulated workpieces that operates by a different principle, but this method includes all of the features of the preamble of claim 1 .
  • a plasma discharge is ignited in the gap formed between the barrier electrodes and is then expelled by a gas stream in the direction of the surface to be treated.
  • the plasma acts only along a narrow strip, the width of which corresponds essentially to the width of the gap left between the barrier electrodes on the surface of the workpiece to be treated.
  • the present invention describes a method with which a workpiece can be subjected to an atmospheric pressure plasma treatment continuously along a larger working width.
  • a first possibility for such a method is defined in claim 1 , this method being based on the method disclosed in DE 102 28 506 A1.
  • the electrode consists of at least two barrier electrodes but more than two barrier electrodes may also be aligned in rows one after the other, leaving a gap after each.
  • the electrode is composed of two single channel barrier electrodes.
  • capacitive coupling occurs due to the dielectric mass of the workpiece as the workpiece is brought to an adjusted distance in proximity to the electrode with a suitable choice of the other parameters (high voltage, atmosphere). Due to the presence of the plasma species formed in the gap between the barrier electrodes and driven out of the gap in the direction of the workpiece surface, a uniform discharge therefore develops between the barrier electrodes and the workpiece resembling a glow discharge in a vacuum plasma.
  • the electrode is operated mainly with air as the process gas, but it may also be operated in foreign gas atmosphere, e.g., in nitrogen or mixtures of nitrogen with other gases such as oxygen, carbon dioxide, hydrogen or noble gases. Due to the discharge, the workpiece surface is oxidized, depending on the type of gas, and/or other chemical groups, e.g., amines, amides or imides are incorporated. Therefore, the surface energy of the workpiece is increased and thus the adhesion of paints, enamels, adhesives or other coatings is improved or made possible.
  • foreign gas atmosphere e.g., in nitrogen or mixtures of nitrogen with other gases such as oxygen, carbon dioxide, hydrogen or noble gases. Due to the discharge, the workpiece surface is oxidized, depending on the type of gas, and/or other chemical groups, e.g., amines, amides or imides are incorporated. Therefore, the surface energy of the workpiece is increased and thus the adhesion of paints, enamels, adhesives or other coatings is improved or made possible.
  • An advantage of this inventive method is in particular the fact that due to the capacitive coupling, the discharge is adapted to the dimensions of the workpiece, i.e., the discharge is ignited primarily on the workpiece surface but not beside it. This results in a location-specific discharge and also leads to savings of the energy required for igniting and maintaining the discharge.
  • the gap between the barrier electrodes is preferably between 0.5 millimeter and 5 millimeters wide. Gaps of these widths are especially suitable for ignition of the desired plasma with the voltage ranges preferred for performing this method.
  • the barrier electrodes are preferably made of aluminum oxide ceramic. This material is especially resistant.
  • the barrier electrodes are made of rectangular tubes each having one or more channels.
  • the barrier electrodes are preferably arranged on a holding body.
  • the barrier electrodes may also be attached to a holding plate by means of electrode carriers via insulators.
  • a chamber is formed into which air or another gas can be fed, to then flow through the gap as a result of the excess pressure which then builds up and to drive the discharge out of the gap in the direction of the workpiece.
  • a counter-electrode is arranged as described in claim 3 .
  • the counter-electrode may be formed preferably as a supporting surface designed as an electrode.
  • the counter-electrode may be omitted.
  • Materials having a low dielectric mass such as plastic films, foams, air cushion film, paper, plastic fibers or natural fibers, granules or powders should be treated with a counter-electrode.
  • the counter-electrode may serve as a dielectric mass (roller, conveyor belt) and/or as a ground metal roll or plate with a dielectric (silicone or ceramic) or may be designed without a dielectric.
  • a dielectric roll treatment of the back side is prevented or greatly suppressed in treatment of plastic films when there are indentations in the roll in the case of a dielectric roll with a capacitive coupling discharge.
  • a counter-electrode can also be an electrode designed in mirror image to the electrode producing the discharge. Then the workpiece is passed between two electrodes. This also allows two-sided treatment of the substrate.
  • a symmetrical transformer with a primary coil connected to a generator and with two secondary coils each connected to one of the barrier electrodes is used (claim 4 ).
  • a symmetrical transformer with a primary coil connected to a generator and with two secondary coils each connected to one of the barrier electrodes is used (claim 4 ).
  • operation with two separate transformers is also possible. They may be operated in synchronized operation or in push-pull operation.
  • the high voltage is reduced to one-half by a symmetrical transformer. This prevents damage to the thin metal layer by the plasma discharge.
  • the electrode is preferably arranged in a tunnel-like housing that is open on the side facing the top side of the workpiece and the housing is connected to a suction exhaust (see claim 5 ).
  • the essential invention of the method here consists of controlling the ignition of plasma in a certain range through the type of atmosphere in this area and adjusting a suitable high-voltage accordingly.
  • a plasma should be ignited only on the side of the sheet or board of material that is opposite the electrode.
  • a first atmosphere is established in which a plasma does not yet ignite at a selected high voltage.
  • a second atmosphere differing from the first atmosphere is established in which a plasma ignition can already take place, induced by the high voltage applied by the electrode.
  • a plasma is ignited only on the “back side” of the sheet or board of material so that a large area plasma treatment is performed there.
  • this is a “capacitively coupling discharge” in the sense of the present invention, with the discharge also over the entire width and length of the electrodes in this example, but limited to the dimensions of the respective material to be treated.
  • FIG. 1 shows a schematic side view of a device for performing the inventive method in a first variant, this view showing the direction of conveyance of a workpiece that is to be coated continuously;
  • FIG. 2 shows a basic diagram of the electric wiring of the electrode of the device shown in FIG. 1 ;
  • FIG. 3 shows a schematic view in the direction of movement of the workpiece to be coated showing a detail of the device with the plasma ignited;
  • FIGS. 4 a and 4 b show two possible wiring variants of an alternative embodiment of an electrode with two double-channel barrier electrodes
  • FIG. 5 shows another possible wiring of two double-channel barrier electrodes, a precursor additionally being fed into the ignited plasma discharge in this case and
  • FIG. 6 shows a schematic diagram of an inventive method according to the second variant.
  • FIG. 1 shows schematically a first cross section through a device for performing the inventive method according to the first alternative, this cross section being shown along a plane in which the direction of movement occurs.
  • the inventive device consists of two barrier electrodes 1 a, 1 b arranged one after the other in the direction of movement (arrow P) of a workpiece 13 .
  • a gap 12 is left between the barrier electrodes 1 a, 1 b.
  • the barrier electrodes 1 a, 1 b are arranged on a holding body 2 which at the same time forms a chamber for introducing a gas 11 , preferably air or nitrogen and/or a gas mixture containing nitrogen to drive this gas and/or gas mixture through the gap 12 in the direction of the surface of the workpiece 13 to be treated.
  • a gas 11 preferably air or nitrogen and/or a gas mixture containing nitrogen
  • a plasma ignited in the gap 12 between the barrier electrodes 1 a, 1 b is conveyed through the gas and/or gas mixture constantly being resupplied into the gap and the plasma is conveyed into the area between electrodes 1 a, 1 b and the workpiece 13 , ultimately flowing out of this area in both directions, namely with and against the direction of movement (arrow P).
  • a tunnel-shaped housing 9 which is open in the direction of the workpiece 13 is arranged above the arrangement of the holding body 2 and the electrode (barrier electrodes 1 a, 1 b ) and this housing is connected via an upper opening to a suction device 10 , shown here schematically.
  • the workpiece 13 is conveyed in the direction of movement (arrow P) by mechanisms that are not shown here.
  • the workpiece may rest on a supporting surface (e.g., a conveyor belt), for example, but it may also be conveyed away beneath the electrode without a supporting surface due to its own inherent rigidity.
  • An electric conductor 3 shown here schematically, runs in the barrier electrodes 1 a, 1 b, which in the present case are rectangular tubes made of aluminum oxide ceramic, to make it possible to apply an appropriate voltage to the respective barrier electrode 1 a, 1 b.
  • the barrier electrodes 1 a, 1 b in this exemplary embodiment have a length of up to several meters.
  • the electric conductor 3 may be comprised of, for example, a metal powder filling or a metal coating of the electrode from the inside.
  • FIG. 2 shows schematically an electric wiring of the barrier electrodes 1 a, 1 b.
  • the device To supply high voltage to the barrier electrodes 1 a, 1 b, the device has a transformer, which is indicated here by the border labeled as 5 and which in this case is a symmetrical transformer having a primary coil 8 and two secondary coils 6 .
  • the secondary coils 6 are each connected to one of the barrier electrodes 1 a, 1 b and to ground 15 .
  • the connection to the electric mass 15 may also be omitted.
  • An alternating voltage generator 7 is connected to the primary coil 8 of the transformer 5 .
  • the voltage may be wired in synchronized operation or in push-pull operation.
  • a sinusoidal voltage between 10 and 60 kilovolts with a frequency of 1 to 100 kilohertz, preferably 5 to 30 kilohertz is used.
  • the voltage may also be pulsed. Due to the symmetrical transformer, the voltage is applied uniformly to the two barrier electrodes 1 a, 1 b so that a plasma can be ignited in the gap 12 .
  • the gap 12 has a gap width of 0.5 to 5 millimeters, preferably 1 millimeter. Due to the flow of the gas 11 into the gap 12 and/or through the gap in the direction of the surface of the workpiece 13 , the ignited plasma 4 is conveyed in the direction of the surface of the workpiece 13 that is to be treated. In the plasma gas, the ignition voltage is reduced.
  • FIG. 3 is a schematic view of one of the barrier electrodes 1 a and the workpiece 13 which is guided beneath a view as seen in the direction of movement (arrow P).
  • the workpiece 13 has been moved beneath the electrodes formed by the two barrier electrodes 1 a, 1 b so that a continuous plasma treatment of the surface of the workpiece 13 facing the electrode can be achieved along its entire width.
  • the gas 11 e.g., air
  • the holding body 2 not only is the discharge deflected out of the gap 12 in the direction of the surface of the workpiece 13 that is to be treated, but at the same barrier electrodes 1 a, 1 b are also cooled.
  • the thermal stress on the workpiece to be treated is low. After a treatment with the device depicted in FIG. 1 , an increase in temperature of only approx. 5° C. is found.
  • the barrier electrodes 1 are implemented by two double-channel tubes, each being equipped with conductors 3 .
  • the barrier electrodes are either connected to the symmetrical transformer in parallel, as illustrated in FIG. 4 a , or in an antiparallel ( FIG. 4 b ).
  • an antiparallel connection there is a higher energy input due to the higher field line density of the electric field in the gap between the barrier electrodes 1 a, 1 b. Due to preionization of the discharge carriers in the gap 12 , the remote effect of the charge carriers leaving the electrode in the direction of the workpiece 13 may be expanded in comparison with the arrangement having two single channel barrier electrodes ( FIG. 1 ).
  • FIG. 5 shows another variant where so-called precursors 14 are fed into the plasma discharge for deposition of layers on the workpiece 13 .
  • precursors 14 may be, for example, tetramethylorthosilicate, hexamethylene disiloxane in the form of vapor or aerosols.
  • a silicon dioxide layer for example, in the range of a few nanometers to micrometers may be deposited on the surface of the workpiece.
  • a precursor current like that described here may be fed preferably into the capacitively coupled discharge zone between the surface of the workpiece 13 that is to be treated and the surfaces of the barrier electrodes 1 a, 1 b facing the surfaces of the workpiece 13 that is to be treated.
  • FIG. 6 shows schematically how an inventive method is performed according to the claimed alternative.
  • an electrode which in this case is made up of a double-channel barrier electrode 1 a, 1 b, is arranged on one side of a workpiece 13 (a sheet or panel of material) and a housing 9 is arranged on the opposite of the workpiece 13 with respect to the electrodes 1 a, 1 b.
  • An atmosphere fed into the housing 9 is such that, when an ac high voltage is applied to the electrodes 1 a, 1 b, this atmosphere allows ignition of a plasma discharge 4 on this side of the workpiece 13 , with a different accordingly prevailing in the area between the electrodes 1 a, 1 b and the workpiece 13 to suppress a plasma discharge.
  • the workpiece 13 is coated over a large area of the “back side” which is opposite the electrodes 1 a, 1 b.
  • the atmosphere in the housing 9 is also removed by suction in this method to prevent unwanted plasma products, especially ozone, from entering the environment.
  • This figure additionally shows how precursors 14 are introduced into the area of the plasma discharge 4 . This is possible but not necessary for the inventive method. This method functions equally well without the introduction of precursors.
  • the electrodes 1 a, 1 b may also be, for example, an electrode formed by two individual barrier electrodes separated from one another by a gap (an electrode pair). As long as the gap is not too great, a continuous plasma discharge will still develop on the side of the workpiece 13 facing the housing 9 , producing a desired surface change on this side of the workpiece.
  • a capacitive coupling may be performed in a large volume reaction chamber.
  • the plasma discharge is ignited throughout the entire chamber in the case of a large volume chamber through which a noble gas flows, by attaching the barrier electrodes through the capacitive coupling described above.
  • several electrodes may be necessary.
  • a pure noble gas mixtures with air and nitrogen, oxygen and the like may again be used here.
  • precursors may be added to the carrier gas in the case when coating is desired.
  • melts on an extruder can also be treated with a capacitively coupling discharge shortly after discharge from an extruder nozzle to thereby ensure adhesion to a web to be coated.
  • inventive device and/or with the inventive method to activate liquids in the mode of the capacitively coupling plasma discharge. Then chemical reactions may be induced at the plasma-liquid interface, their products then being able to diffuse into the liquid. It is also possible to crosslink thin liquid films by using a plasma discharge according to this invention.
  • An LDPE film with a surface energy (before the plasma treatment) of 30 mN/m on both sides was plasma treated on the side facing the barrier electrodes.
  • the LDPE film was freely clamped, i.e., no counter-electrode was used.
  • the plasma treatment was performed with a pair of electrodes according to FIG. 4 a , formed by a double-channel tube and arranged in parallel with one another from a distance of 0.5 mm leaving a gap.
  • the film was moved at the rate of 60 m/min beneath the electrode using a linear table, where the distance from the barrier electrodes to the LDPE film was 1.5 mm.
  • the surface energy was measured with test inks according to the DIN ISO 8296.
  • a 7.5 mm thick polypropylene web plate with a surface energy (before the plasma treatment) of 30 mN/m on both sides was plasma treated on the side facing the barrier electrodes. This was done by freely clamping the polypropylene web plate, i.e., no counter-electrode was used.
  • the plasma treatment was performed with a pair of double-channel tubes according to FIG. 4 a arranged at a distance of 0.5 mm in parallel with one another while leaving a gap.
  • the web plate was moved beneath the electrode system using a linear table at the rate of 10 m/min.
  • the electric energy applied to the double barrier electrode was 500 watts at a frequency of the ac high voltage of 8 kilohertz.
  • the distance between the barrier electrodes and the web plate was 1.0 mm. Blowing air was fed into the gap between the two double-channel tubes of the double barrier electrodes.
  • the plasma ignited between the barrier electrodes and was expelled onto the web plate by the blowing air.
  • the ignition voltage was reduced in this area due to the plasma species blown out into the interspace between the double barrier electrodes and the web plate until a “secondary ignition” of a large area plasma was ignited in the entire area between the surfaces of the barrier electrodes facing the plate and the surface of the web plate (remote discharge). Two treatments were performed.
  • the surface energy is measured with test inks according to DIN ISO 8296.
  • This plasma treatment resulted in an increase in the surface energy to 50 mN/m owing to the capacitively coupling discharge on the barrier electrode side of the polypropylene web plate; this is a typical value for adhesive bondability.
  • the back side of the web plate did not receive any treatment and the value of the surface energy remained at the original level of 30 mN/m.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Treatment Of Fiber Materials (AREA)
US11/993,362 2005-06-24 2006-06-19 Method for treating plasma under continuous atmospheric pressure of work pieces, in particular, material plates or strips Abandoned US20100112235A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005029360.3 2005-06-24
DE102005029360A DE102005029360B4 (de) 2005-06-24 2005-06-24 Zwei Verfahren zur kontinuierlichen Atmosphärendruck Plasmabehandlung von Werkstücken, insbesondere Materialplatten oder -bahnen
PCT/EP2006/005839 WO2007016999A2 (de) 2005-06-24 2006-06-19 Verfahren zur kontinuierlichen atmosphärendruck plasmabehandlung von werkstücken, insbesondere materialplatten oder -bahnen

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US11/993,095 Expired - Fee Related US7989034B2 (en) 2005-06-24 2006-06-19 Method for continuous atmospheric pressure plasma treatment of workpieces

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US (2) US20100112235A1 (de)
EP (2) EP1902156B1 (de)
JP (1) JP2008547166A (de)
CN (1) CN101198718B (de)
AT (2) ATE533339T1 (de)
DE (2) DE102005029360B4 (de)
DK (1) DK1902156T3 (de)
PL (1) PL1894449T3 (de)
WO (2) WO2007000255A2 (de)

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US20110006040A1 (en) * 2009-07-08 2011-01-13 Stephen Edward Savas Methods for Plasma Processing
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US20120247390A1 (en) * 2009-09-17 2012-10-04 Tokyo Electron Limited Film formation apparatus
US20130337657A1 (en) * 2012-06-19 2013-12-19 Plasmasi, Inc. Apparatus and method for forming thin protective and optical layers on substrates
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US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US20190210823A1 (en) * 2016-05-17 2019-07-11 Leonhard Kurz Stiftung & Co. Kg Device for the Surface Treatment of a Substrate, Comprising a Metallic Conveyor Belt
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
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DE102005029360B4 (de) * 2005-06-24 2011-11-10 Softal Corona & Plasma Gmbh Zwei Verfahren zur kontinuierlichen Atmosphärendruck Plasmabehandlung von Werkstücken, insbesondere Materialplatten oder -bahnen
DE102007018716A1 (de) 2007-04-20 2008-10-23 Schaeffler Kg Verfahren zum Aufbringen einer verschleißfesten Beschichtung
DE102007025151A1 (de) * 2007-05-29 2008-09-04 Innovent E.V. Verfahren zum Beschichten eines Substrats
DE102007025152B4 (de) * 2007-05-29 2012-02-09 Innovent E.V. Verfahren zum Beschichten eines Substrats
DE102010024086A1 (de) * 2010-06-17 2011-12-22 WPNLB UG (haftungsbeschränkt) & Co. KG Vorrichtung zur kontinuierlichen Plasmabehandlung und/oder Plasmabeschichtung eines Materialstücks
JP5670229B2 (ja) * 2011-03-10 2015-02-18 積水化学工業株式会社 表面処理方法及び装置
JP5626899B2 (ja) * 2011-05-17 2014-11-19 株式会社日立製作所 大気圧プラズマ処理装置
WO2014119349A1 (ja) * 2013-02-04 2014-08-07 株式会社クリエイティブ テクノロジー プラズマ発生装置
DE102013106315B4 (de) 2013-06-18 2016-09-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Erzeugen eines physikalischen Plasmas
JP2015005780A (ja) * 2014-09-25 2015-01-08 株式会社日立製作所 プラズマ処理装置
DE102016105976A1 (de) * 2016-04-01 2017-10-05 Dieffenbacher GmbH Maschinen- und Anlagenbau Vorrichtung zum Transport von Material
DE102016118569A1 (de) * 2016-09-30 2018-04-05 Cinogy Gmbh Elektrodenanordnung zur Ausbildung einer dielektrisch behinderten Plasmaentladung
EP3585136A1 (de) * 2018-06-20 2019-12-25 Masarykova Univerzita Verfahren und vorrichtung zur erzeugung von elektrischem wasserbasiertem plasma bei niedrigen temperaturen und dessen verwendung
DE102019101997A1 (de) 2019-01-28 2020-07-30 Koenig & Bauer Ag Verfahren und Druckmaschine jeweils zum Bedrucken eines metallischen Bedruckstoffes

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4723508A (en) * 1985-04-08 1988-02-09 Semiconductor Energy Laboratory Co., Ltd. Plasma CVD apparatus
US6312767B2 (en) * 1997-11-05 2001-11-06 L'air Liquide, Societe Anonyme Pour L'exploitation Des Procedes Georges Claude Process and device for the surface treatment of a substrate by an electrical discharge between two electrodes in a gas mixture
US6361748B1 (en) * 1999-04-21 2002-03-26 Softal Electronic Erik Blumenfeld Gmbh & Co. Barrier electrode for treating surfaces of electrically conductive or non-conductive materials and arrangement of such barrier electrodes
US20030075432A1 (en) * 2000-02-11 2003-04-24 Panayotis Cocolios Method for surface treatment of polymeric substrates
US20030104141A1 (en) * 2001-08-27 2003-06-05 Amato-Wierda Carmela C. Dielectric barrier discharge process for depositing silicon nitride film on substrates
US20030113479A1 (en) * 2001-08-23 2003-06-19 Konica Corporation Atmospheric pressure plasma treatmet apparatus and atmospheric pressure plasma treatment method
US20040247886A1 (en) * 2003-06-06 2004-12-09 Konica Minolta Holdings, Inc. Thin film forming method and thin film forming substance
US20050181606A1 (en) * 2000-12-12 2005-08-18 Konica Corporation Layer forming method, product comprising the layer, optical film, dielectric-coated electrode and plasma discharge apparatus
US20060011465A1 (en) * 2004-06-14 2006-01-19 Douglas Burke Plasma driven, N-Type semiconductor, thermoelectric power superoxide ion generator with critical bias conditions
US20070154650A1 (en) * 2005-12-30 2007-07-05 Atomic Energy Council - Institute Of Nuclear Energy Research Method and apparatus for glow discharge plasma treatment of flexible material at atmospheric pressure
US7288204B2 (en) * 2002-07-19 2007-10-30 Fuji Photo Film B.V. Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG)
US20080138534A1 (en) * 2005-06-14 2008-06-12 Peter Doncheff Dineff Method For Plasma Chemical Surface Modification
US7989034B2 (en) * 2005-06-24 2011-08-02 Softal Corona & Plasma Gmbh Method for continuous atmospheric pressure plasma treatment of workpieces

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61155430A (ja) * 1984-12-28 1986-07-15 Isuzu Motors Ltd プラズマ処理方法
DE3521318A1 (de) * 1985-06-14 1986-12-18 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum behandeln, insbesondere zum beschichten, von substraten mittels einer plasmaentladung
CN1036286A (zh) * 1988-02-24 1989-10-11 珀金·埃莱姆公司 超导陶瓷的次大气压等离子体喷涂
JP2803017B2 (ja) * 1993-06-07 1998-09-24 工業技術院長 抗血栓性医用材料及び医療用具並びにこれらの製造方法、製造装置及びプラズマ処理装置
JP3844151B2 (ja) * 1997-05-14 2006-11-08 凸版印刷株式会社 表面処理装置
JP2000208296A (ja) * 1999-01-13 2000-07-28 Sekisui Chem Co Ltd 表面処理品の製造方法
JP4688116B2 (ja) * 1999-04-15 2011-05-25 コニカミノルタホールディングス株式会社 偏光板用保護フィルム
US6150430A (en) * 1999-07-06 2000-11-21 Transitions Optical, Inc. Process for adhering a photochromic coating to a polymeric substrate
EP1073091A3 (de) * 1999-07-27 2004-10-06 Matsushita Electric Works, Ltd. Elektrode für Plasmaerzeugung, Anwendung dieser Elektrode in einem Plasmabehandlungsgerät, und Plasmabehandlung mittels dieses Gerätes
DE60102903T2 (de) * 2000-02-11 2005-05-12 Dow Corning Ireland Ltd., Midleton Eine plasmaanlage mit atmosphärischem druck
JP2002018276A (ja) * 2000-07-10 2002-01-22 Pearl Kogyo Kk 大気圧プラズマ処理装置
JP4140289B2 (ja) * 2002-06-10 2008-08-27 コニカミノルタホールディングス株式会社 大気圧プラズマ放電処理装置、大気圧プラズマ放電処理方法及び光学素子
JP4433680B2 (ja) * 2002-06-10 2010-03-17 コニカミノルタホールディングス株式会社 薄膜形成方法
DE10228506B4 (de) * 2002-06-24 2015-10-08 Fachhochschule Hildesheim/Holzminden/Göttingen - Körperschaft des öffentlichen Rechts - Verfahren und Vorrichtung zum Modifizieren von Oberflächen durch dielektrisch behinderte Entladung unter Atmosphärendruck
US7322313B2 (en) * 2002-08-30 2008-01-29 Sekisui Chemical Co., Ltd. Plasma processing system
DE10300439B4 (de) 2003-01-09 2017-06-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Behandeln von Oberflächen
JP3955835B2 (ja) * 2003-07-01 2007-08-08 株式会社イー・スクエア プラズマ表面処理装置とその処理方法
JP2006005315A (ja) * 2004-06-21 2006-01-05 Seiko Epson Corp プラズマ処理装置およびプラズマ処理方法

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4723508A (en) * 1985-04-08 1988-02-09 Semiconductor Energy Laboratory Co., Ltd. Plasma CVD apparatus
US6312767B2 (en) * 1997-11-05 2001-11-06 L'air Liquide, Societe Anonyme Pour L'exploitation Des Procedes Georges Claude Process and device for the surface treatment of a substrate by an electrical discharge between two electrodes in a gas mixture
US6361748B1 (en) * 1999-04-21 2002-03-26 Softal Electronic Erik Blumenfeld Gmbh & Co. Barrier electrode for treating surfaces of electrically conductive or non-conductive materials and arrangement of such barrier electrodes
US7147758B2 (en) * 2000-02-11 2006-12-12 L'Air Liquide, Societe Anonyme A' Directolre et Conseil de Surveillance pour l'Etude Et. l'Exploitation des Procedes Georges Claude Method for surface treatment of polymeric substrates
US20030075432A1 (en) * 2000-02-11 2003-04-24 Panayotis Cocolios Method for surface treatment of polymeric substrates
US7462379B2 (en) * 2000-12-12 2008-12-09 Konica Corporation Layer forming method, product comprising the layer, optical film, dielectric-coated electrode and plasma discharge apparatus
US20050181606A1 (en) * 2000-12-12 2005-08-18 Konica Corporation Layer forming method, product comprising the layer, optical film, dielectric-coated electrode and plasma discharge apparatus
US20030113479A1 (en) * 2001-08-23 2003-06-19 Konica Corporation Atmospheric pressure plasma treatmet apparatus and atmospheric pressure plasma treatment method
US6849306B2 (en) * 2001-08-23 2005-02-01 Konica Corporation Plasma treatment method at atmospheric pressure
US20030104141A1 (en) * 2001-08-27 2003-06-05 Amato-Wierda Carmela C. Dielectric barrier discharge process for depositing silicon nitride film on substrates
US7288204B2 (en) * 2002-07-19 2007-10-30 Fuji Photo Film B.V. Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG)
US20040247886A1 (en) * 2003-06-06 2004-12-09 Konica Minolta Holdings, Inc. Thin film forming method and thin film forming substance
US20060011465A1 (en) * 2004-06-14 2006-01-19 Douglas Burke Plasma driven, N-Type semiconductor, thermoelectric power superoxide ion generator with critical bias conditions
US20080138534A1 (en) * 2005-06-14 2008-06-12 Peter Doncheff Dineff Method For Plasma Chemical Surface Modification
US7989034B2 (en) * 2005-06-24 2011-08-02 Softal Corona & Plasma Gmbh Method for continuous atmospheric pressure plasma treatment of workpieces
US20070154650A1 (en) * 2005-12-30 2007-07-05 Atomic Energy Council - Institute Of Nuclear Energy Research Method and apparatus for glow discharge plasma treatment of flexible material at atmospheric pressure

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9096933B2 (en) 2009-07-08 2015-08-04 Aixtron, Inc. Methods for plasma processing
US10049859B2 (en) 2009-07-08 2018-08-14 Aixtron Se Plasma generating units for processing a substrate
US20110006040A1 (en) * 2009-07-08 2011-01-13 Stephen Edward Savas Methods for Plasma Processing
US8697197B2 (en) * 2009-07-08 2014-04-15 Plasmasi, Inc. Methods for plasma processing
US9096932B2 (en) 2009-07-08 2015-08-04 Aixtron, Inc. Methods for plasma processing
US9443702B2 (en) 2009-07-08 2016-09-13 Aixtron Se Methods for plasma processing
US20120247390A1 (en) * 2009-09-17 2012-10-04 Tokyo Electron Limited Film formation apparatus
US20120225218A1 (en) * 2011-01-10 2012-09-06 Plasmasi, Inc. Apparatus and method for dielectric deposition
US8765232B2 (en) * 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
US9359674B2 (en) 2011-01-10 2016-06-07 Aixtron, Inc. Apparatus and method for dielectric deposition
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US20130337657A1 (en) * 2012-06-19 2013-12-19 Plasmasi, Inc. Apparatus and method for forming thin protective and optical layers on substrates
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
WO2014097620A1 (en) * 2012-12-21 2014-06-26 Asahi Glass Company Limited Ignition process and device for pairs of dbd electrodes
EA027687B1 (ru) * 2012-12-21 2017-08-31 Асахи Гласс Компани Лимитед Способ и устройство зажигания для пар электродов диэлектрического барьерного разряда (дбр)
US20190210823A1 (en) * 2016-05-17 2019-07-11 Leonhard Kurz Stiftung & Co. Kg Device for the Surface Treatment of a Substrate, Comprising a Metallic Conveyor Belt
US11155427B2 (en) * 2016-05-17 2021-10-26 Leonhard Kurz Stiftung & Co. Kg Device for the surface treatment of a substrate, comprising a metallic conveyor belt
US10827598B2 (en) * 2017-08-16 2020-11-03 DBD Plasma GmbH Plasma generator module
US12024621B2 (en) 2018-06-29 2024-07-02 Dow Global Technologies Llc Foam bead and sintered foam structure

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