US20100059211A1 - Cooling fan and heat dissipation device having the same - Google Patents

Cooling fan and heat dissipation device having the same Download PDF

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Publication number
US20100059211A1
US20100059211A1 US12/481,564 US48156409A US2010059211A1 US 20100059211 A1 US20100059211 A1 US 20100059211A1 US 48156409 A US48156409 A US 48156409A US 2010059211 A1 US2010059211 A1 US 2010059211A1
Authority
US
United States
Prior art keywords
top wall
center
outer periphery
auxiliary
cooling fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/481,564
Other languages
English (en)
Inventor
Shu-Min Li
Xin-Xiang Zha
Shu-Yuan Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, SHU-MIN, XU, Shu-yuan, ZHA, XIN-XIANG
Publication of US20100059211A1 publication Critical patent/US20100059211A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
US12/481,564 2008-09-11 2009-06-09 Cooling fan and heat dissipation device having the same Abandoned US20100059211A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810304470.1 2008-09-11
CN2008103044701A CN101672297B (zh) 2008-09-11 2008-09-11 散热风扇及具有该散热风扇的散热装置

Publications (1)

Publication Number Publication Date
US20100059211A1 true US20100059211A1 (en) 2010-03-11

Family

ID=41798206

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/481,564 Abandoned US20100059211A1 (en) 2008-09-11 2009-06-09 Cooling fan and heat dissipation device having the same

Country Status (2)

Country Link
US (1) US20100059211A1 (zh)
CN (1) CN101672297B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110030930A1 (en) * 2009-08-05 2011-02-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110132582A1 (en) * 2009-12-07 2011-06-09 Hon Hai Precision Industry Co., Ltd. Fan module and heat dissipation device incorporating the same
US20160134174A1 (en) * 2014-11-07 2016-05-12 Industrial Technology Research Institute Heat dissipation apparatus for motors

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104989658B (zh) * 2015-06-17 2018-09-21 成都瑞达科恒科技有限公司 一种可拆卸式自动冷却散热风扇
CN105240774A (zh) * 2015-11-18 2016-01-13 蒋敏 一种led汽车车灯
CN109764255B (zh) * 2019-03-22 2020-06-30 安徽艳阳电气集团有限公司 一种可调节的散热式led灯

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885888A (en) * 1973-03-26 1975-05-27 John G Warhol Cooling fan for radiators and the like
US20020122724A1 (en) * 2001-01-16 2002-09-05 Yung-Chang Tseng Combination fan blade unit for electric fan
US20040096326A1 (en) * 2002-11-18 2004-05-20 Shun-Chen Chang Heat dissipation device and its impeller thereof
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
US20060008346A1 (en) * 2004-07-06 2006-01-12 Hon Hai Precision Industry Co., Ltd. Fan blade set for cooling fan
JP2006161757A (ja) * 2004-12-09 2006-06-22 Daikin Ind Ltd 軸流ファン
US20080107524A1 (en) * 2006-11-03 2008-05-08 Bor-Haw Chang Fan device capable of increasing air pressure and air supply
US20080152490A1 (en) * 2006-12-20 2008-06-26 Tzyy-Pyng Lin Fan device
US20080247874A1 (en) * 2007-04-05 2008-10-09 Acre James A Dual flow fan heat sink application
US20090008067A1 (en) * 2007-07-04 2009-01-08 Foxconn Technology Co., Ltd. Heat dissipation device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468037B1 (en) * 1999-08-06 2002-10-22 American Cooling Systems, Llc Fan clutch with central vanes to move air to fan blades
US7112043B2 (en) * 2003-08-29 2006-09-26 General Motors Corporation Compressor impeller thickness profile with localized thick spot
CN2859018Y (zh) * 2005-12-30 2007-01-17 元山科技工业股份有限公司 外极式离心型散热风扇

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885888A (en) * 1973-03-26 1975-05-27 John G Warhol Cooling fan for radiators and the like
US20020122724A1 (en) * 2001-01-16 2002-09-05 Yung-Chang Tseng Combination fan blade unit for electric fan
US20040096326A1 (en) * 2002-11-18 2004-05-20 Shun-Chen Chang Heat dissipation device and its impeller thereof
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
US20060008346A1 (en) * 2004-07-06 2006-01-12 Hon Hai Precision Industry Co., Ltd. Fan blade set for cooling fan
JP2006161757A (ja) * 2004-12-09 2006-06-22 Daikin Ind Ltd 軸流ファン
US20080107524A1 (en) * 2006-11-03 2008-05-08 Bor-Haw Chang Fan device capable of increasing air pressure and air supply
US20080152490A1 (en) * 2006-12-20 2008-06-26 Tzyy-Pyng Lin Fan device
US20080247874A1 (en) * 2007-04-05 2008-10-09 Acre James A Dual flow fan heat sink application
US20090008067A1 (en) * 2007-07-04 2009-01-08 Foxconn Technology Co., Ltd. Heat dissipation device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP_2006161757A Foreign Reference copy (Takaoka et al.) *
JP_2006161757A Translated Abstract (Takaoka et al.) *
JP_2006161757A Translation (Takaoka et al.) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110030930A1 (en) * 2009-08-05 2011-02-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110132582A1 (en) * 2009-12-07 2011-06-09 Hon Hai Precision Industry Co., Ltd. Fan module and heat dissipation device incorporating the same
US20160134174A1 (en) * 2014-11-07 2016-05-12 Industrial Technology Research Institute Heat dissipation apparatus for motors
US10243431B2 (en) * 2014-11-07 2019-03-26 Industrial Technology Research Institute Heat dissipation apparatus for motors

Also Published As

Publication number Publication date
CN101672297B (zh) 2012-07-18
CN101672297A (zh) 2010-03-17

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, SHU-MIN;ZHA, XIN-XIANG;XU, SHU-YUAN;REEL/FRAME:022803/0295

Effective date: 20090531

Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, SHU-MIN;ZHA, XIN-XIANG;XU, SHU-YUAN;REEL/FRAME:022803/0295

Effective date: 20090531

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION