US20100006472A1 - Drain device and method - Google Patents

Drain device and method Download PDF

Info

Publication number
US20100006472A1
US20100006472A1 US12/459,749 US45974909A US2010006472A1 US 20100006472 A1 US20100006472 A1 US 20100006472A1 US 45974909 A US45974909 A US 45974909A US 2010006472 A1 US2010006472 A1 US 2010006472A1
Authority
US
United States
Prior art keywords
drain device
transporting box
wafers
openings
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/459,749
Other languages
English (en)
Inventor
Arnaud Favre
Cindy Rude
Bertrand Bellet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel Lucent SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Assigned to ALCATEL LUCENT reassignment ALCATEL LUCENT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BELLET, BERTRAND, Rude, Cindy, FAVRE, ARNAUD
Publication of US20100006472A1 publication Critical patent/US20100006472A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
US12/459,749 2008-07-11 2009-07-07 Drain device and method Abandoned US20100006472A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR08/54769 2008-07-11
FR0854769A FR2933813B1 (fr) 2008-07-11 2008-07-11 Dispositif de purge et procede.

Publications (1)

Publication Number Publication Date
US20100006472A1 true US20100006472A1 (en) 2010-01-14

Family

ID=39826373

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/459,749 Abandoned US20100006472A1 (en) 2008-07-11 2009-07-07 Drain device and method

Country Status (8)

Country Link
US (1) US20100006472A1 (fr)
EP (1) EP2144276A3 (fr)
JP (1) JP2011527514A (fr)
KR (1) KR20110028547A (fr)
CN (1) CN101625962B (fr)
FR (1) FR2933813B1 (fr)
TW (1) TW201017801A (fr)
WO (1) WO2010003910A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9662688B2 (en) 2012-07-09 2017-05-30 Kla-Tencor Corporation Apparatus and method for cross-flow purge for optical components in a chamber

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6364762B1 (en) * 1999-09-30 2002-04-02 Lam Research Corporation Wafer atmospheric transport module having a controlled mini-environment
JP3759492B2 (ja) * 2002-12-03 2006-03-22 近藤工業株式会社 ミニエンバライメント方式の半導体製造装置
JP2004235516A (ja) * 2003-01-31 2004-08-19 Trecenti Technologies Inc ウエハ収納治具のパージ方法、ロードポートおよび半導体装置の製造方法
TWI228750B (en) * 2003-02-25 2005-03-01 Samsung Electronics Co Ltd Apparatus and method for processing wafers
JP4027837B2 (ja) * 2003-04-28 2007-12-26 Ｔｄｋ株式会社 パージ装置およびパージ方法
KR100583726B1 (ko) * 2003-11-12 2006-05-25 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
JP4541232B2 (ja) * 2005-06-16 2010-09-08 東京エレクトロン株式会社 処理システム及び処理方法
US20070062561A1 (en) * 2005-09-19 2007-03-22 International Business Machines Corporation Method And Apparatus For Testing Particulate Contamination In Wafer Carriers
JP4278676B2 (ja) * 2005-11-30 2009-06-17 Ｔｄｋ株式会社 密閉容器の蓋開閉システム
JP2007317909A (ja) * 2006-05-26 2007-12-06 Kondo Kogyo Kk シャッター付きブレスフィルター装置
KR100902330B1 (ko) * 2006-06-29 2009-06-12 주식회사 아이피에스 반도체공정장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9662688B2 (en) 2012-07-09 2017-05-30 Kla-Tencor Corporation Apparatus and method for cross-flow purge for optical components in a chamber

Also Published As

Publication number Publication date
TW201017801A (en) 2010-05-01
JP2011527514A (ja) 2011-10-27
FR2933813B1 (fr) 2010-12-24
EP2144276A2 (fr) 2010-01-13
CN101625962A (zh) 2010-01-13
FR2933813A1 (fr) 2010-01-15
EP2144276A3 (fr) 2012-07-18
WO2010003910A1 (fr) 2010-01-14
KR20110028547A (ko) 2011-03-18
CN101625962B (zh) 2011-10-26

Similar Documents

Publication Publication Date Title
US10010913B2 (en) Purging apparatus and purging method for substrate storage container
US9349627B2 (en) Lid opening/closing system for closed container and substrate processing method using same
US20050111935A1 (en) Apparatus and method for improved wafer transport ambient
JP2001516500A (ja) フラットな対象物を搬送するためのデバイスならびにフラットな対象物を搬送デバイスと処理装置との間にわたって搬送するための方法
US20110114129A1 (en) Methods and apparatuses for controlling contamination of substrates
US20180114710A1 (en) Equipment front end module and semiconductor manufacturing apparatus including the same
CN115440638A (zh) Efem和装载端口
US20060104750A1 (en) Apparatus and method for processing wafers
KR20160108141A (ko) 도어 개폐 장치, 반송 장치, 소터 장치, 수납 용기의 개방 방법
US10741432B2 (en) Systems, apparatus, and methods for a load port door opener
US8413815B2 (en) Wafer container with at least one purgeable supporting module having a long slot
JP4306798B2 (ja) 基板キャリアおよびロードロック用ドア駆動装置
JP4386700B2 (ja) ウエハー供給回収装置
KR20210093911A (ko) 웨이퍼 스토커
US20100006472A1 (en) Drain device and method
US20040165973A1 (en) Apparatus and method for processing wafers
KR100679591B1 (ko) 퍼지 장치 및 퍼지 방법
US11581204B2 (en) Semiconductor device manufacturing system and method for manufacturing semiconductor device
JP4229497B2 (ja) 基板処理装置および基板の処理方法
JP2000297953A (ja) クリーンルームのポッド用インターフェースチャンバ
JP4415006B2 (ja) カセットの運用管理方法及び基板の処理方法
JP4359109B2 (ja) 基板処理装置および基板処理方法
KR102281662B1 (ko) 웨이퍼 반송 시스템
KR20080058690A (ko) 기판 처리 장치
KR20240037128A (ko) 기판 처리 장치 및 그 제어 방법

Legal Events

Date Code Title Description
AS Assignment

Owner name: ALCATEL LUCENT, FRANCE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FAVRE, ARNAUD;RUDE, CINDY;BELLET, BERTRAND;REEL/FRAME:023299/0734;SIGNING DATES FROM 20090916 TO 20090917

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION