US20090301555A1 - Solar cell, solar module and system and fabrication method thereof - Google Patents

Solar cell, solar module and system and fabrication method thereof Download PDF

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Publication number
US20090301555A1
US20090301555A1 US12/480,699 US48069909A US2009301555A1 US 20090301555 A1 US20090301555 A1 US 20090301555A1 US 48069909 A US48069909 A US 48069909A US 2009301555 A1 US2009301555 A1 US 2009301555A1
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Prior art keywords
metal layer
solar cell
bus bar
solar
bar opening
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US12/480,699
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English (en)
Inventor
Shih-Cheng Lin
Wei-Chih Chang
Yi-Chin Chou
Chorng-Jye Huang
Pin-Sheng Wang
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Delsolar Co Ltd
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Delsolar Co Ltd
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Priority to US12/480,699 priority Critical patent/US20090301555A1/en
Assigned to DELSOLAR CO., LTD. reassignment DELSOLAR CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, WEI-CHIH, CHOU, YI-CHIN, HUANG, CHORNG-JYE, LIN, SHIH-CHENG, WANG, PIN-SHENG
Publication of US20090301555A1 publication Critical patent/US20090301555A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a solar cell and a method of making the same. More particularly, this invention relates to a solar cell with an improved rear surface structure, a solar module and a solar system composed of such solar cell.
  • the solar cells can be manufactured using a variety of semiconductor material or organic compound material, however, from the industrial viewpoint; silicon which is semiconductor is mainly used for the solar cells.
  • the solar cells using silicon can be roughly classified into a bulk type solar cell using a wafer of mono-crystalline silicon, multi-crystalline silicon or the like and a thin film solar cell having a semiconductor film formed on a substrate.
  • the bulk type solar cell which is the most commonly known solar cell having the largest scale of commercial market than other types of solar cells. It has been well known that in the solar cells, a good ohmic contact between the electrode and the n/p doped region will make it easier to collect the electron and hole and further it will also produce a reduction of ohmic loss and increasing of the photovoltaic conversion efficiency.
  • the front surface field is made by doping an n type impurity in the whole front side. So the front side electrode can be in contact with front n doped region with good ohmic contact.
  • aluminum (Al) which is a cost effective material with good conductivity is most commonly used for making the p-type doped region. It has been well known that the p-type doped region can form the Back Surface Field (BSF) in the rear surface of solar cell.
  • BSF Back Surface Field
  • an aluminum oxide layer will be formed upon the process of forming such p-type doped region. Such aluminum oxide layer will not only increase contact resistance but also bring the difficulty for solar cell soldering.
  • the semiconductor substrate will be exposed in such discontinued region and a silver paste, or other suitable metal pastes, can be applied to such discontinued region to form a solderable interconnection pad.
  • one embodiment of this invention provides an improved rear surface structure of a solar cell therefore to be described as: (1) a loose metal layer; (2) a p-type doped region between the loose metal layer and the rear surface; (3) a dense metal layer between the loose metal layer and p-type doped region; (4) at least one bus bar opening made by removing the loose metal layer; and (5) a solderable material deposited on or within the bus bar opening.
  • the loose metal layer, dense metal layer and the p-type doped region thereof are formed by firing the metal paste.
  • the loose metal layer is a loose structure composed by metal particles wherein the structure contains many voids.
  • the dense metal layer is a dense structure composed of metal-silicon alloy that is formed after firing the metal paste, wherein the composition of the metal-silicon alloy is metal substantially.
  • the bus bar opening is made by removing the loose metal layer of the pre-selected area on rear surface by the methods including but not limited to: (1) laser ablation; (2) wet etching achieved by photo-resist coating and then the loose metal layer is etched by immersing in chemical solution such as NaCl and H2SO4 contained liquid under a suitable temperature; (3) dry etching carried out by mixed gas comprising Boron Trichloride (BCl3), Chloride (Cl2), Chloroform (CHCl3), Nitrogen (N2), and ammonia (NH3); (4) physical removing by high pressure gas, liquid or solid particles, and can be realized by spray gun; (5) ultrasonic cleaning in the water and (6) rubbing.
  • the bus bar opening is made by those alternative methods, however, care must be taken to assure that the dense metal layer should be exposed therefore providing a good electrical contact with the solderable material.
  • solderable material is chosen to have a good solderability with the dense metal layer and ribbon.
  • silver, copper, tin, zinc, palladium, nickel and alloy thereof could act as a good solderable material in this invention.
  • solderable material is applied on or within the bus bar opening by methods including but not limited to: (1) sputtering; (2) vapor deposition; (3) strip or patch coating (4) ink-jet printing, screen printing, gravure printing, letter printing, thermal printing, dispensing or transfer printing; (5) stamping; (6) electroplating; (7) electroless plating, or (8) combinations thereof. It is understood that the method of applying solderable material on or within the bus bar opening will be highly relied on the composition of the solderable material.
  • the metal paste is chosen to act as a p-type doping source, therefore such metal paste shall be composed of at least one of the elements of the III A group. Hence, either the loose metal layer or dense metal layer is made using the metal paste composed of at least one of the elements of the III A group.
  • a method of fabricating foregoing solar cell includes the following steps: (1) providing a metal paste coated on the entire or substantial area of the rear surface of solar cell; (2) forming a loose metal layer, a dense metal layer and a p-type doped region by firing the metal paste; (3) forming at least one bus bar opening by selectively removing said loose metal layer; (4) applying a solderable material on or within the bus bar opening.
  • the p-type doped region is under said dense metal layer and loose metal layer and extending on rear surface inwardly and the dense metal is between p-type doped region and the loose metal layer.
  • the basic structure of a solar module of the present invention is composed of a solar cell assembled with a front film and a back film which is sandwiched in between the back face member and a transparent front face member.
  • Such solar cell assembly is composed of more than one solar cells fabricated by the method disclosed in the present invention and each solar cell of such solar cell assembly is interconnected to next one electrically and mechanically by a conductor.
  • the front film and back film are composed of organic resin compositions such as EVA, EMA, acrylic resins, silicone elastomers, PVB, epoxy resins or aliphatic polyesterurethanes and the like.
  • the back face member has an insulating material like a polyethylene terephthalate (PET), nylon and TEDLAR® is used between the back face member and the solar cell assembly.
  • PET polyethylene terephthalate
  • TEDLAR® TEDLAR®
  • solar system provided having above-mentioned structure of one or more solar modules with one or more solar cells encapsulated by front film and back film and then covered by front face member and back face member, wherein the solar cells are fabricated by the method disclosed in the present invention.
  • the structure of such solar system is further composed an inverter.
  • the applications for the solar system disclosed in the present invention generally separated by two types: (1) connected with the utility power grid and (2) disconnected with the utility power grid.
  • FIG. 1 is a cross-sectional side view of the solar cell fabricated in the present invention.
  • FIG. 2 is a SEM picture in the cross-sectional side view of the rear surface of the solar cell fabricated in the present invention.
  • FIG. 3 shows the process of the method of making the solar cell in the present invention.
  • FIG. 4 shows one example of a structural view of the solar module with the solar cells made by the method of the present invention.
  • FIG. 5 is an example of a solar system with a plurality of solar modules and an inventor described in the present invention.
  • an improved rear surface structure of a solar cell includes: (1) a loose metal layer; (2) a p-type doped region between the loose metal layer and the rear surface; (3) a dense metal layer between the loose metal layer and p-type doped region; (4) at least one bus bar opening made by removing the loose metal layer; and (5) a solderable material deposited on or within the bus bar opening.
  • the loose metal layer, dense metal layer and the p-type doped region thereof are formed by firing the metal paste.
  • the loose metal layer is a loose structure composed by metal particles wherein the structure contains a plurality of voids.
  • the dense metal layer is a dense structure composed of metal-silicon alloy that is formed after firing the metal paste, wherein the composition of the metal-silicon alloy is metal substantially.
  • the bus bar opening may be made by removing the loose metal layer of the pre-selected area on rear surface by the methods including but not limited to: (1) laser ablation; (2) wet etching achieved by photo-resist coating and then the loose metal layer is etched by immersing in chemical solution such as NaCl and H2SO4 contained liquid under a suitable temperature; (3) dry etching carried out by mixed gas comprising Boron Trichloride (BCl3), Chloride (Cl2), Chloroform (CHCl3), Nitrogen (N2), and ammonia (NH3); (4) physical removing by high pressure gas, liquid or solid particles, and can be realized by spray gun; (5) ultrasonic cleaning in the water and (6) rubbing.
  • the bus bar opening is made by those alternative methods, however, care must be taken to assure that the dense metal layer should be exposed therefore providing a good electrical contact with the solderable material.
  • solderable material is chosen to have a good solderability with the dense metal layer and ribbon.
  • silver, copper, tin, zinc, palladium, nickel and alloy thereof could act as a good solderable material in this invention.
  • solderable material is applied on or within the bus bar opening by methods including but not limited to: (1) sputtering; (2) vapor deposition; (3) strip or patch coating (4) ink-jet printing, screen printing, gravure printing, letter printing, thermal printing, dispensing or transfer printing; (5) stamping; (6) electroplating; (7) electroless plating, or (8) combinations thereof. It is understood that the method of applying solderable material on or within the bus bar opening will be highly relied on the composition of the solderable material.
  • the metal paste is chosen to act as a p-type doping source, therefore such metal paste shall be composed of at least one of the elements of the III A group. Hence, either the loose metal layer or dense metal layer is made using the metal paste composed of at least one of the elements of the III A group.
  • a method of fabricating foregoing solar cell includes the following steps: (1) providing a metal paste coated on the entire or substantial area of the rear surface of solar cell; (2) forming a loose metal layer, a dense metal layer and a p-type doped region by firing the metal paste; (3) forming at least one bus bar opening by selectively removing said loose metal layer; (4) applying a solderable material on or within the bus bar opening.
  • the p-type doped region is under said dense metal layer and loose metal layer and extending on rear surface inwardly and the dense metal is between p-type doped region and the loose metal layer.
  • the basic structure of a solar module of the present invention is composed of a solar cell assembled with a front film and a back film which is sandwiched in between the back face member and a transparent front face member.
  • Such solar cell assembly is composed of one or more solar cells fabricated by the method disclosed in the present invention and each solar cell of such solar cell assembly is interconnected to other solar cells electrically and mechanically by a conductor.
  • the front film and back film are composed of organic resin compositions such as EVA, EMA, acrylic resins, silicone elastomers, PVB, epoxy resins or aliphatic polyesterurethanes and the like.
  • the back face member has an insulating material like polyethylene terephthalate (PET), nylon and TEDLAR® is used between the back face member and the solar cell assembly.
  • PET polyethylene terephthalate
  • solar system provided having above-mentioned structure of one or more solar modules with one or more solar cells encapsulated by front film and back film and then covered by front face member and back face member, wherein the solar cells are fabricated by the method disclosed in the present invention.
  • the structure of such solar system is further composed an inverter.
  • the applications for the solar system disclosed in the present invention generally separated by two types: (1) connected with the utility power grid and (2) disconnected with the utility power grid.
  • FIG. 1 and FIG. 2 An improved structure of solar cell according to one embodiment of the invention is shown in FIG. 1 and FIG. 2 .
  • the solar cell includes a semiconductor substrate 101 , 201 having a p-n junction 106 located adjacent to its front surface 107 .
  • An anti-reflective (AR) coating 110 is coated on the front surface 107 of the semiconductor substrate 101 , 201 .
  • a p-type doped region 102 , 202 located adjacent to the rear surface 108 of semiconductor substrate 101 , 201 .
  • the metal paste is composed of aluminum and all area of the rear surface 108 is covered with aluminum paste and fired at high temperature under 1200° C. for forming aluminum and silicon alloy.
  • the p-type doped region 102 , 202 , dense aluminum layer 103 , 203 , and loose aluminum layer 104 , 204 are formed.
  • the dense aluminum layer 103 , 203 is in contact with p-type doped region 102 , 202 so as to form ohmic contacts in between the dense aluminum layer 103 , 203 , p-type doped region 102 , 202 and the semiconductor substrate 101 , 201 .
  • the loose aluminum layer 104 , 204 is composed of aluminum particles formed by high temperature reaction of aluminum paste, and its structure is loose.
  • the loose aluminum layer is a loose structure composed by metal particles wherein the structure contains many voids.
  • the dense aluminum layer is a dense structure composed of metal-silicon alloy forming after firing aluminum paste, wherein the composition of the aluminum-silicon alloy is aluminum substantially.
  • the bus bar opening(s) 109 are made by removing the loose aluminum layer with laser ablation to thereby expose the underlying dense aluminum layer 103 .
  • the wavelength of laser used in the preferred embodiment is 300 to 1100 nm. However, care must be taken to assure that the dense aluminum layer 103 , 203 should be exposed therefore providing a good contact electrically with the solderable material 105 .
  • a preferred method of manufacturing a completed improved rear surface structure of solar cell in accordance with one embodiment of this invention is to be described with reference to FIG. 3 .
  • This method includes the following steps: (1) providing an aluminum paste coated on the entire or substantial area of the rear surface 108 of solar cell by printing aluminum paste directly; (2) forming a loose aluminum layer 104 , 204 , a dense aluminum layer 103 , 203 and a p-type doped region 102 , 202 by firing the aluminum paste; (3) forming at least one bus bar opening 109 by selectively removing said loose aluminum layer 104 , 204 , wherein the loose aluminum layer 104 , 204 is removed by laser ablation with a wavelength of 300 to 1100 nm; and (4) applying a solderable material 105 on or within the bus bar opening 109 .
  • the solderable material 105 is chosen so as to connect the dense aluminum layer 103 , 203 and ribbon 403 for the connection of the solar cell mechanically and electrically to other solar cells.
  • the solderable material is composited of tin-zinc alloy containing 5 to 50% zinc.
  • the solderable material 105 facilitates the formation of solderable contact(s) with ribbon while at the same time taking the advantage of reducing the complexity in manufacturing in comparison to the present available solar cells.
  • the ribbon is coated with tin or tin-alloy.
  • the completed structure of the solar cell is illustratively shown in FIG. 1 . Thereafter the solar cell may be further processed, e.g., to prepare it for connection to another solar cell.
  • solar module shown in the FIG. 4 is composed of a plurality of solar cells 406 interconnected by ribbon 403 assembled with a front film 402 and a back film 404 which is sandwiched in between the back face member 405 and a transparent front face member 401 .
  • the solar cells 406 are fabricated by the method disclosed in the present invention.
  • glass is used for the front face member 401 and TEDLAR® is used for the back face member 405 .
  • the front film 402 and back film 404 are organic resin preferably composed of EVA.
  • a preferred solar system shown in the FIG. 5 is also provided in present invention, the solar system thereof having the above-described solar module 501 .
  • such solar system comprising a plurality of solar modules with solar cells, which are fabricated by the method disclosed in the present invention.
  • the structure of such solar system is further integrated with an inverter 502 .
  • substrate two kinds of flat plate of p-type multi-crystalline silicon substrate and p-type monocrystallne silicon substrate of 156 mm ⁇ 156 mm in size both are fabricated by the foregoing method.
  • Table 1 shows the result of cell efficiency fabricated by the conventional method and the foregoing method pursuant to the preferred embodiment. By increasing Isc and FF, the efficiency is improved 0.14% in multicrystalline and 0.15% in monocrystalline in this invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
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  • Photovoltaic Devices (AREA)
US12/480,699 2008-06-09 2009-06-09 Solar cell, solar module and system and fabrication method thereof Abandoned US20090301555A1 (en)

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US20090305457A1 (en) * 2008-06-09 2009-12-10 Shih-Cheng Lin Solar cell, solar module and system and fabrication method thereof
US20120024368A1 (en) * 2009-01-30 2012-02-02 Renewable Energy Corporation Asa Back contacting and interconnection of two solar cells
CN102832264A (zh) * 2011-06-15 2012-12-19 茂迪股份有限公司 具有背电场结构的太阳能电池及其制造方法
US20180233616A1 (en) * 2015-08-13 2018-08-16 3M Innovative Properties Company Photovoltaic cell with frontside busbar tape on narrow front busbars

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DE102009044038A1 (de) * 2009-09-17 2011-03-31 Schott Solar Ag Verfahren zur Herstellung eines Kontaktbereichs eines elektronischen Bauteils
DE102010032187A1 (de) * 2010-07-23 2012-01-26 Reinhausen Plasma Gmbh Verfahren zur Herstellung einer Solarzelle und Solarzelle
KR101110826B1 (ko) * 2010-08-17 2012-02-24 엘지전자 주식회사 태양전지 패널
KR101835293B1 (ko) * 2010-09-03 2018-03-06 테트라썬, 아이엔씨. 광학코팅의 부분적 리프트-오프에 의한 광기전력 장치의 미세라인 금속화
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TW200952193A (en) 2009-12-16
EP2136408A3 (fr) 2016-04-27
EP2136407A3 (fr) 2016-04-27
CN101604712A (zh) 2009-12-16
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US7884029B2 (en) 2011-02-08
TWI362759B (en) 2012-04-21

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