US20090036033A1 - Methods and apparatus for processing a substrate - Google Patents
Methods and apparatus for processing a substrate Download PDFInfo
- Publication number
- US20090036033A1 US20090036033A1 US12/245,765 US24576508A US2009036033A1 US 20090036033 A1 US20090036033 A1 US 20090036033A1 US 24576508 A US24576508 A US 24576508A US 2009036033 A1 US2009036033 A1 US 2009036033A1
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- United States
- Prior art keywords
- substrate
- edge
- polishing film
- polishing
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
Definitions
- the present invention relates generally to substrate processing, and more particularly to methods and apparatus for cleaning an edge of a substrate.
- an apparatus adapted to polish an edge of a substrate includes a polishing film, a frame adapted to tension the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply tension to the substrate, contour to an edge of the substrate which includes at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated.
- an apparatus adapted to polish an edge of a substrate includes a plurality of polishing films, a frame adapted to tension each of the polishing films so that at least a portion of each of the films are supported in a respective plane, and a substrate rotation driver adapted to rotate a substrate against at least one of the respective planes of the polishing films such that any polishing films contacting the substrate apply pressure to the substrate, contour to an edge of the substrate, and polish the edge as the substrate is rotated.
- an apparatus adapted to polish an edge of a substrate includes a polishing film having a polishing side and a second side, an inflatable pad disposed adjacent the second side of the polishing film, a frame adapted to support the polishing film and the inflatable pad, and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film.
- the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate and the polishing film contacts the edge of the substrate.
- a method of cleaning an edge of a substrate includes (a) supporting a polishing film, (b) conforming the polishing film to an edge of a substrate, the edge including an outer edge and at least one bevel, and (c) rotating the substrate.
- FIG. 1 is a schematic illustration of a cross-section of a portion of a substrate.
- FIG. 2 is a schematic illustration depicting an example embodiment of an edge cleaning apparatus according to the present invention.
- FIGS. 3A and 3B are close-up front and side cross-sectional schematic views, respectively, of a portion of the edge cleaning apparatus of FIG. 2 .
- FIG. 4 is a perspective view depicting an example embodiment of an edge cleaning apparatus according to the present invention.
- FIG. 5 is a perspective view depicting another example embodiment of an edge cleaning apparatus according to the present invention.
- FIG. 6 is a perspective view of a portion of the example embodiment depicted in FIG. 5 .
- FIGS. 7A and 7B are close-up perspective views of different embodiments of replaceable cassettes for use with embodiments of the present invention.
- FIGS. 8A through 8C are close-up perspective views of different embodiments of pads for use with embodiments of the present invention.
- FIGS. 9A through 9C are plan views of examples of different possible head positions of the example edge polishing apparatus of FIG. 4 .
- FIGS. 10A through 10C are plan views of examples of different possible head positions of the example edge polishing apparatus of FIG. 5 .
- FIG. 11 is a perspective view of an embodiment of a multiple head edge polishing apparatus according to the present invention.
- FIG. 12 is a perspective view of another embodiment of a multiple head edge polishing apparatus according to the present invention.
- FIG. 13 is a perspective view of yet another embodiment of a multiple head edge polishing apparatus according to the present invention.
- a substrate 100 may include two major surfaces 102 , 102 ′ and an edge 104 .
- Each major surface 102 , 102 ′ of the substrate 100 may include a device region 106 , 106 ′ and an exclusion region 108 , 108 ′.
- the exclusion regions 108 , 108 ′ may serve as buffers between the device regions 106 , 106 ′ and the edge 104 .
- the edge 104 of a substrate 100 may include an outer edge 110 and bevels 112 , 114 .
- the bevels 112 , 114 may be located between the outer edge 110 and the exclusion regions 108 , 108 ′ of the two major surfaces 102 , 102 ′.
- the present invention is adapted to clean and/or polish the outer edge 110 and at least one bevel 112 , 114 of a substrate 100 without affecting the device regions 106 , 106 ′. In some embodiments, all or part of the exclusion regions 108 , 108 ′ may be cleaned or polished as well.
- the present invention provides a frame for supporting a film (e.g., an abrasive polishing film) or abrasive buffer against the edge 104 of a substrate 100 as the substrate 100 is rotated (e.g., by a vacuum chuck, drive rollers, etc.).
- the film may be pressed against the rotating substrate edge 104 using a pad pushed by an actuator and/or an inflatable pad.
- the pad and/or inflatable pad may be soft and/or include or develop contours to conform with the shape of the substrate edge 104 .
- a controlled amount of pressure may be applied to polish the edge 104 .
- the film may be under tension within the frame such that the film itself is adapted to apply a variable amount of tension to the substrate edge 104 and to contour to both the outer edge 110 and at least one of the bevels 112 , 114 (e.g., with or without additional support from a pad).
- the present invention provides precise control of an edge polish process which may be used to compensate for different edge geometries and changes in the substrate 100 as material is removed from the edge 104 .
- the frame may support multiple heads, each head being adapted to support polishing film.
- the heads may support different types of films (e.g., films of different abrasive grits) which may be used concurrently, in a predefined sequence, or at different times.
- the heads may be disposed in different positions to allow the supported films to polish different portions of the edge 104 of the rotating substrate 100 .
- the heads may be adapted to be moved (e.g., angularly translated about a tangential axis of the substrate 100 and/or circumferentially relative to the substrate 100 ) around the edge 104 by the frame so as to polish different portions of the edge 104 .
- the heads may continuously oscillate around the rotating edge 104 of the substrate 100 .
- Each head may include an indexed spool of film and/or be contained in a replaceable cassette.
- the present invention may include facilities to deliver fluids to the substrate edge 104 being polished.
- one or more channels may be provided to direct chemicals or water to the substrate edge 104 to assist in the polishing and/or to wash away particles resulting from the polishing.
- the chemicals may be sprayed directly onto the substrate 100 , at the substrate/polishing film interface, and/or may be applied to and/or through the film and/or pad.
- the fluids may be sprayed from either or both sides of the substrate 100 and the present invention may employ gravity or suction to cause the runoff not to contaminate or contact other parts of the substrate 100 or apparatus of the invention.
- energy e.g., megasonic energy
- the substrate 100 may be rotated in a horizontal plane. In additional or alternative embodiments, the substrate 100 may be rotated in a vertical plane, other non-horizontal plane, and/or be moved between different planes of rotation.
- FIG. 2 a schematic view of an edge polishing apparatus 200 is depicted.
- a frame 202 supports and tensions a polishing film 204 in a plane perpendicular to the major surfaces 102 , 102 ′ of a substrate 100 such that the edge 104 of the substrate 100 may be pressed against (e.g., as indicated by the straight downward arrows 205 a , 205 b ) the polishing film 204 and the polishing film 204 may contour to the substrate edge 104 .
- the substrate 100 may be rotated against the polishing film 204 .
- the substrate 100 may be rotated at a rate ranging from about 50 to 300 RPM, for example, although other rates may be used.
- the substrate 100 may contact the polishing film 204 for about 15 to 150 seconds depending on the type of film used, the grit of the film, the rate of rotation, the amount of polishing required, etc. More or less time may be used.
- the polishing film 204 may be supported by a pad 206 disposed adjacent a backside (e.g., a non-abrasive side) of the polishing film 204 and mounted on the frame 202 .
- the frame 202 including the tensioned polishing film 204 and/or the pad 206 may be pushed against the edge 104 of the substrate 100 .
- the substrate may be pushed against the polishing film with an amount of force ranging from about 0.5 lbs. to about 2.0 lbs. Other amounts of force may be used.
- an additional length of the polishing film 204 may be supported and tensioned by spools 208 , 210 mounted to the frame 202 .
- a supply spool 208 may include unused polishing film 204 available to be unwound and pulled into position adjacent the substrate 100 while a take-up spool 210 may be adapted to receive used and/or worn polishing film 204 .
- One or both of the spools 208 , 210 may be indexed to precisely control the amount of polishing film 204 that is advanced.
- the polishing film 204 may be made from many different materials including aluminum oxide, silicon oxide, silicon carbide, etc. Other materials may also be used.
- the abrasives used may range from about 0.5 microns up to about 3 microns in size although other sizes may be used. Different widths ranging from about 1 inch to about 1.5 inches may be used (although other widths may be used).
- the polishing film may be about 0.002 to about 0.02 of an inch thick and be able to withstand about 1 to 5 lbs. of tension in embodiments that use a pad 206 and from about 3 to about 8 lbs. of tension in embodiments without a pad. Other films having different thicknesses and strengths may be used.
- the spools 208 , 210 may be approximately 1 inch in diameter, hold about 500 inches of polishing film 204 , and may be constructed from any practicable materials such as polyurethane, polyvinyl difloride (PVDF), etc. Other materials may be used.
- the frame 202 may be constructed from any practicable materials such as aluminum, stainless steel, etc.
- one or more fluid channels 212 may be provided to deliver chemicals and/or water to aid in the polishing/cleaning of the substrate edge 104 , lubricate the substrate, and/or to wash away removed material.
- the fluid channel 212 may be adapted to deliver fluid to the substrate 100 , to the polishing film 204 , and/or to the pad 206 .
- the fluids may include deionized water which may serve as a lubricant and to flush particles away. A surfactant and/or other known cleaning chemistries may also be included.
- sonic (e.g., megasonic) nozzles may be used to deliver sonicated fluids to the substrate edge 104 to supplement the cleaning. Fluid also may be delivered through the polishing film 204 and/or pad 206 to the edge 104 .
- FIGS. 3A and 3B close-up front and side cross-sectional schematic views, respectively, of the polishing film 204 and pad 206 of FIG. 2 are depicted. Note that the forces (indicated by the straight arrows) cause the polishing film 204 and the pad 206 to contour and conform to the edge 104 of the substrate 100 . In some embodiments, if the substrate 100 was not present, the pad 206 would have a flat surface where the substrate 100 is shown compressing the pad 206 . Likewise, if the substrate 100 was not present, the polishing film 204 would lie flat and be represented by a straight line in both views.
- an example edge polishing apparatus 400 may include a base or frame 402 that includes a head 404 which supports polishing film 204 tensioned between spools 208 , 210 and further supported by a pad 206 . As shown, the pad 206 may by mounted to the head 404 via a biasing device 406 (e.g., a spring).
- the edge polishing apparatus 400 of FIG. 4 also may include one or more drive rollers 408 (two shown) and guide rollers 410 (two shown) that are adapted to rotate the edge 104 of the substrate 100 against the polishing film 204 .
- the drive rollers 408 may themselves each be driven by drivers 412 (e.g., motors, gears, belts, chains, etc.).
- the drive rollers 408 and guide rollers 410 may include a groove that allows the rollers 408 , 410 alone to support the substrate 100 .
- the groove within the drive rollers 408 may have a diameter of approximately 2.5 inches and the groove within the guide rollers 410 may have a diameter of approximately 1 inch. Other dimensions are possible.
- the area of the drive rollers 408 in contact with the substrate 100 may include texturing or cross-grooves to allow the drive rollers 408 to grip the substrate 100 .
- the drive rollers 408 and guide rollers 410 may be constructed from materials such as polyurethane, polyvinyl difloride (PVDF), etc. Other materials may be used.
- another example edge polishing apparatus 500 may include a base or frame 502 that includes a head 504 which supports polishing film 204 tensioned between spools 208 , 210 and further supported by a pad 206 .
- the pad 206 may by mounted to the head 504 via an actuator 506 (e.g., a pneumatic slide, hydraulic ram, servo motor driven pusher, etc.).
- the edge polishing apparatus 500 of FIG. 5 also may include a vacuum chuck 508 coupled to a driver 510 (e.g., motor, gear, belt, chain, etc.).
- a driver 510 e.g., motor, gear, belt, chain, etc.
- FIGS. 6 through 8B some details of features of the example embodiments of FIGS. 4 and 5 are described. Note that features from the different embodiments may be combined in many different practicable ways to serve different design principals or concerns.
- FIG. 6 depicts details of the frame 502 including the head 504 of FIG. 5 .
- a head 504 supports polishing film 204 tensioned between spools 208 , 210 .
- the frame 502 (that includes head 504 ) may be adapted to be angularly translated (relative to an axis that is tangential to the edge 104 of a substrate 100 held in the edge polishing apparatus 500 ( FIG. 5 )) by a driver 600 (e.g., a servo motor) and pivot 602 .
- the angular translation of the frame (and polishing film 204 ) is described in more detail below with respect to FIGS. 9A through 10C .
- the spools 208 , 210 that are mounted to the head 504 may be driven by one or more drivers 604 (e.g., servo motors).
- the drivers 604 may provide both an indexing capability to allow a specific amount of unused polishing film 204 to be advanced or continuously fed to the substrate edge, and a tensioning capability to allow the polishing film to be stretched taught and to apply pressure to the substrate edge.
- the optional pad 206 may by mounted to the head 504 via an actuator 506 that is adapted to adjustably press and contour the polishing film 204 against a substrate edge 104 ( FIG. 5 ). Further, one or more support rollers 606 may also be mounted to the head 504 to guide and align the polishing film 204 in a plane perpendicular to the major surface 102 ( FIG. 1 ) of a substrate 100 held in the edge polishing apparatus 500 ( FIG. 5 ).
- the length of the polishing film 204 is disposed orthogonal to the edge 104 of a substrate 100 being polished. This is in contrast to the embodiment depicted in FIG. 2 , wherein the longitudinal direction of the polishing film 204 is aligned with the edge 104 of a substrate 100 being polished.
- Other polishing film orientations and configurations may be employed.
- the polishing film 204 may be held diagonally relative to the major surface 102 of the substrate 100 .
- FIGS. 7A and 7B close-up perspective views of two different embodiments of replaceable cassettes 700 A, 700 B are depicted.
- Cassettes 700 A, 700 B may be adapted to provide the features of the head 404 and polishing film 204 in a disposable, refillable, and/or replaceable package which may be quickly and easily mounted on and/or removed from the frames 402 , 502 of different edge polishing apparatuses 400 , 500 .
- the cassette 700 A may include head 404 which supports polishing film 204 which spans from supply reel 208 to take-up reel 210 .
- the polishing film 204 may be guided and aligned by support rollers 606 mounted to the head 404 .
- a pad 206 may be provided to further support the polishing film 204 as described above.
- a biasing device 406 e.g., a spring
- an adjustable actuator 506 FIG. 6
- the head 404 may simply rely on the tension of the polishing film 204 to provide lateral pressure to the substrate edge 104 ( FIG. 1 ).
- the head 404 may include a notch 702 as shown in FIG. 7B to accommodate the substrate 100 .
- a pad 206 A may include a concave surface that matches the contour of the edge 104 of a substrate 100 .
- the pad 206 B may include a double concave surface to better match the contour of the edge 104 of a substrate 100 .
- a pad 206 may include a shaped groove that precisely matches the contour of the edge 104 of a substrate 100 including the bevels 112 , 114 and outer edge 110 ( FIG. 1 ).
- the pads 206 , 206 A, 206 B may be made of material such as, for example, an acetal resin (e.g., Delrin® manufactured by DuPont Corporation), PVDF, polyurethane closed cell foam, silicon rubber, etc. Other materials may be used. Such materials may have a resilience or an ability to conform that is a function of the thickness or density of the pad. The material may be selected based upon its resilience. The desired resilience may be selected based upon the type of polishing required.
- an acetal resin e.g., Delrin® manufactured by DuPont Corporation
- PVDF polyurethane closed cell foam
- silicon rubber etc.
- Other materials may be used.
- Such materials may have a resilience or an ability to conform that is a function of the thickness or density of the pad. The material may be selected based upon its resilience. The desired resilience may be selected based upon the type of polishing required.
- the pad 206 , 206 A, 206 B may have an adjustable amount of ability to conform to the substrate's edge.
- the pad 206 , 206 A, 206 B may be or include an inflatable bladder such that by adding more air or liquid or other fluid, the pad becomes harder and by reducing the amount of air or liquid or other fluid in the bladder, the pad becomes more conforming.
- FIG. 8C depicts an embodiment of a pad 206 C that includes an inflatable bladder 802 that may be filled (and/or emptied) via a fluid channel 804 with fluid from a fluid supply 806 .
- the fluid supply 806 may inflate/deflate the bladder 802 under the direction of an operator or a programmed and/or user operated controller.
- an elastomeric material such as silicon rubber or the like, may be used for the bladder 802 to further enhance the pad's ability to stretch and conform to the substrate's edge 104 .
- an elastomeric material such as silicon rubber or the like, may be used for the bladder 802 to further enhance the pad's ability to stretch and conform to the substrate's edge 104 .
- Such an embodiment would allow an operator/controller to precisely control how far beyond the bevels 112 , 114 (if at all) and into the exclusion region 108 and/or 108 ′ ( FIG. 1 ) the polishing film 204 is made to contact the substrate 100 by, e.g., limiting the amount of fluid pumped into the bladder 802 .
- the bladder 802 may be inflated so that the pad 206 C is forced to wrap around and conform to the outer edge 110 and bevel(s) 112 , 114 of the substrate 100 without wrapping around to the device region 106 , 106 ′ of the substrate 100 .
- multiple bladders may be used in a pad and that differently shaped inflatable bladders may be used within differently shaped pads 206 , 206 A, 206 B.
- fluids used to aid in the polishing may be delivered to the substrate edge via the pads 206 , 206 A, 206 B.
- a fluid channel may be provided to drip or spray the fluid on or into the pads.
- an inflatable pad may include a bladder with a semi-permeable membrane that allows fluid to be slowly released and transmitted to the polishing film 204 (e.g., through the pad).
- the pads 206 , 206 A, 206 B may be covered by, made of, and/or include material that absorbs and/or retains the fluids used (e.g., polyvinyl alcohol (PVA), etc.).
- PVA polyvinyl alcohol
- FIGS. 9A through 9C and FIGS. 10A through 10C depict examples of different possible head positions of the alternative edge polishing apparatuses 400 , 500 respectively, described above.
- the present invention is adapted to bring polishing film 204 in contact with the bevels 112 , 114 , and outer edge 110 of a substrate 100 without contacting the device region 106 of the substrate 100 . In operation, this is achieved by angularly translating a head 404 , 504 (and consequently, a portion of polishing film in contact with and contoured to the edge 104 of a substrate 100 ) around an axis that is tangential to the outer edge 110 of the substrate 100 as it is rotated. Referring to FIGS. 9A through 9C and FIGS.
- this axis of angular translation may be represented by a line extending perpendicular out of the paper upon which the FIGs. are drawn at the point labeled “P.”
- the heads 404 , 504 may be held in various positions to clean desired portions of the substrate edge 104 as the substrate 100 is rotated. In some embodiments, the heads 404 , 504 may be adapted to continuously or intermittently oscillate between the various positions depicted and/or other positions.
- the heads 404 , 504 may be moved on the frame 502 by drivers 600 ( FIG. 6 ) under the direction of a programmed or user operated controller. Alternatively, the heads 404 , 504 may be fixed and/or only adjusted while the substrate is not being rotated.
- the substrate may be held fixed while the heads are oscillated (as described above) as well as rotated circumferentially around the substrate 100 .
- the polishing film 204 may be mounted on the heads 404 , 504 in a continuous loop and/or the polishing film 204 may be continuously (or intermittently) advanced to polish the substrate edge 104 .
- the advancement of the film may be used to create or enhance the polishing motion. Any combination of the above described polishing motions and/or methods that are practicable may be employed.
- FIGS. 11 through 12 additional embodiments of an edge polishing apparatus are depicted.
- FIG. 11 depicts an edge polishing apparatus 1100 including three heads 404
- FIG. 12 depicts an edge polishing apparatus 1200 including two heads 504
- FIG. 13 depicts an edge polishing apparatus 1300 including four heads 1304 .
- any number and type of heads 404 , 504 , 1304 may be used in any practicable combination.
- each head 404 , 504 , 1304 may used a differently configured or type of polishing film 204 (e.g., different grits, materials, tensions, pressures, etc.).
- heads 404 , 504 , 1304 may be used concurrently, individually, and/or in a sequence. Different heads 404 , 504 , 1304 may be used for different substrates 100 or different types of substrates.
- a first head 404 with a stiff biasing device 406 supporting a pad 206 such as the concave pad 206 B and a coarse grit polishing film 204 may initially be used to remove a relatively large amount of rough material from the substrate bevels 112 , 114 ( FIG. 1 ).
- the first head 404 may be appropriately positioned to access the bevels 112 , 114 .
- the first head 404 may be backed away from the substrate 100 , and a second head 504 with a fine grit polishing film 204 (and without a pad) may be moved into position to polish the bevels 112 , 114 and the outer edge 110 .
- the take-up reel 210 ( FIG. 4 ) may be driven to draw the polishing film 204 by a fixed amount from the supply reel 210 ( FIG. 4 ) toward the take-up reel 210 .
- an unused portion of the polishing film 204 may be provided between the take-up reel 210 and supply reel 208 .
- the unused portion of the polishing film 204 may be employed to subsequently clean one or more other substrates 100 in a manner similar to that described above. Consequently, the apparatus 1100 , 1200 may replace a worn portion of polishing film 204 with an unused portion with little or no impact on substrate processing throughput.
- replaceable cassettes 700 A are employed, impact on throughput may be minimized by quickly replacing the cassettes 700 A when all the polishing film 204 in the cassette 700 A is used.
- a frame 1302 that supports multiple heads 1304 is depicted in schematic form.
- the heads 1304 are each mounted to the frame 1302 and each include an actuator 1306 (e.g., pneumatic piston, servo driven slide, hydraulic ram, etc.) adapted to press a pad 206 and a length of polishing film 204 against the edge 104 of a substrate 100 in response to a control signal from a controller 1308 (e.g., a programmed computer, an operator directed valve system, an embedded real time processor, etc.).
- the controller 1308 is coupled (e.g., electrically, mechanically, pneumatically, hydraulically, etc.) to each of the actuators 1306 .
- a fluid supply 806 may be coupled to and under the control of the controller 1308 .
- the fluid supply 806 may be controlled to independently deliver fluids (e.g., DI water, cleaning chemistry, sonicated fluids, gas, air, etc.) to each of the heads 1304 via one or more fluid channels 212 .
- various fluids may be selectively delivered to the pads 206 , the polishing film 204 , and/or the substrate edge 104 via the fluid channels 212 .
- the fluid may be for use in polishing, lubricating, particle removal/rinsing, and/or inflating a bladder 802 ( FIG. 8C ) within the pads 206 .
- the same fluid delivered through a permeable pad 206 may be used for both polishing and inflating the pad 206 while a different fluid, delivered to the same head 1304 via a second channel (not shown) is used for rinsing and lubricating.
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Abstract
A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.
Description
- This application is a division of, and claims priority to, U.S. Non-Provisional patent application Ser. No. 11/299,295, filed Dec. 9, 2005, and titled, “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10121), which is hereby incorporated by reference herein in its entirety for all purposes.
- The present invention is related to U.S. patent application Ser. No. 11/298,555 filed on Dec. 9, 2005 and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10414) which is hereby incorporated herein by reference for all purposes.
- The present invention relates generally to substrate processing, and more particularly to methods and apparatus for cleaning an edge of a substrate.
- Conventional systems, which contact a substrate edge with an abrasive film to clean the edge, may not thoroughly clean the edge. For example, the abrasive film may not sufficiently contact both bevels of the edge during cleaning. Additionally, the abrasive film may become worn from use, and therefore, lose its ability to sufficiently clean the substrate and require frequent replacement, which may affect semiconductor device manufacturing throughput. Accordingly improved methods and apparatus for cleaning an edge of a substrate are desired.
- In a first aspect of the invention, an apparatus adapted to polish an edge of a substrate includes a polishing film, a frame adapted to tension the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply tension to the substrate, contour to an edge of the substrate which includes at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated.
- In a second aspect of the invention an apparatus adapted to polish an edge of a substrate includes a plurality of polishing films, a frame adapted to tension each of the polishing films so that at least a portion of each of the films are supported in a respective plane, and a substrate rotation driver adapted to rotate a substrate against at least one of the respective planes of the polishing films such that any polishing films contacting the substrate apply pressure to the substrate, contour to an edge of the substrate, and polish the edge as the substrate is rotated.
- In a third aspect of the invention an apparatus adapted to polish an edge of a substrate includes a polishing film having a polishing side and a second side, an inflatable pad disposed adjacent the second side of the polishing film, a frame adapted to support the polishing film and the inflatable pad, and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film. The polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate and the polishing film contacts the edge of the substrate.
- In a fourth aspect of the invention a method of cleaning an edge of a substrate includes (a) supporting a polishing film, (b) conforming the polishing film to an edge of a substrate, the edge including an outer edge and at least one bevel, and (c) rotating the substrate.
- Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.
-
FIG. 1 is a schematic illustration of a cross-section of a portion of a substrate. -
FIG. 2 is a schematic illustration depicting an example embodiment of an edge cleaning apparatus according to the present invention. -
FIGS. 3A and 3B are close-up front and side cross-sectional schematic views, respectively, of a portion of the edge cleaning apparatus ofFIG. 2 . -
FIG. 4 is a perspective view depicting an example embodiment of an edge cleaning apparatus according to the present invention. -
FIG. 5 is a perspective view depicting another example embodiment of an edge cleaning apparatus according to the present invention. -
FIG. 6 is a perspective view of a portion of the example embodiment depicted inFIG. 5 . -
FIGS. 7A and 7B are close-up perspective views of different embodiments of replaceable cassettes for use with embodiments of the present invention. -
FIGS. 8A through 8C are close-up perspective views of different embodiments of pads for use with embodiments of the present invention. -
FIGS. 9A through 9C are plan views of examples of different possible head positions of the example edge polishing apparatus ofFIG. 4 . -
FIGS. 10A through 10C are plan views of examples of different possible head positions of the example edge polishing apparatus ofFIG. 5 . -
FIG. 11 is a perspective view of an embodiment of a multiple head edge polishing apparatus according to the present invention. -
FIG. 12 is a perspective view of another embodiment of a multiple head edge polishing apparatus according to the present invention. -
FIG. 13 is a perspective view of yet another embodiment of a multiple head edge polishing apparatus according to the present invention. - The present invention provides improved methods and apparatus for cleaning and/or polishing the edge of a substrate. With reference to
FIG. 1 , asubstrate 100 may include twomajor surfaces edge 104. Eachmajor surface substrate 100 may include adevice region exclusion region major surfaces exclusion regions device regions edge 104. Theedge 104 of asubstrate 100 may include anouter edge 110 andbevels bevels outer edge 110 and theexclusion regions major surfaces outer edge 110 and at least onebevel substrate 100 without affecting thedevice regions exclusion regions - The present invention provides a frame for supporting a film (e.g., an abrasive polishing film) or abrasive buffer against the
edge 104 of asubstrate 100 as thesubstrate 100 is rotated (e.g., by a vacuum chuck, drive rollers, etc.). The film may be pressed against the rotatingsubstrate edge 104 using a pad pushed by an actuator and/or an inflatable pad. In either case, the pad and/or inflatable pad may be soft and/or include or develop contours to conform with the shape of thesubstrate edge 104. Depending on the amount of force applied by the actuator, the resiliency of the pad selected, the amount of inflation of an inflatable pad, and/or the amount of tension on the film, a controlled amount of pressure may be applied to polish theedge 104. Alternatively or additionally, the film may be under tension within the frame such that the film itself is adapted to apply a variable amount of tension to thesubstrate edge 104 and to contour to both theouter edge 110 and at least one of thebevels 112, 114 (e.g., with or without additional support from a pad). Thus, the present invention provides precise control of an edge polish process which may be used to compensate for different edge geometries and changes in thesubstrate 100 as material is removed from theedge 104. - In some embodiments, the frame may support multiple heads, each head being adapted to support polishing film. The heads may support different types of films (e.g., films of different abrasive grits) which may be used concurrently, in a predefined sequence, or at different times. The heads may be disposed in different positions to allow the supported films to polish different portions of the
edge 104 of the rotatingsubstrate 100. The heads may be adapted to be moved (e.g., angularly translated about a tangential axis of thesubstrate 100 and/or circumferentially relative to the substrate 100) around theedge 104 by the frame so as to polish different portions of theedge 104. In some embodiments, the heads may continuously oscillate around therotating edge 104 of thesubstrate 100. Each head may include an indexed spool of film and/or be contained in a replaceable cassette. - Additionally or alternatively, the present invention may include facilities to deliver fluids to the
substrate edge 104 being polished. In some embodiments, one or more channels may be provided to direct chemicals or water to thesubstrate edge 104 to assist in the polishing and/or to wash away particles resulting from the polishing. The chemicals may be sprayed directly onto thesubstrate 100, at the substrate/polishing film interface, and/or may be applied to and/or through the film and/or pad. The fluids may be sprayed from either or both sides of thesubstrate 100 and the present invention may employ gravity or suction to cause the runoff not to contaminate or contact other parts of thesubstrate 100 or apparatus of the invention. Further, energy (e.g., megasonic energy) may be applied to thesubstrate edge 104 via fluid carrying such energy. - The
substrate 100 may be rotated in a horizontal plane. In additional or alternative embodiments, thesubstrate 100 may be rotated in a vertical plane, other non-horizontal plane, and/or be moved between different planes of rotation. - Turning to
FIG. 2 , a schematic view of anedge polishing apparatus 200 is depicted. Aframe 202 supports and tensions apolishing film 204 in a plane perpendicular to themajor surfaces substrate 100 such that theedge 104 of thesubstrate 100 may be pressed against (e.g., as indicated by the straightdownward arrows polishing film 204 and the polishingfilm 204 may contour to thesubstrate edge 104. As indicated by thecurved arrow 205 c, thesubstrate 100 may be rotated against the polishingfilm 204. Thesubstrate 100 may be rotated at a rate ranging from about 50 to 300 RPM, for example, although other rates may be used. Thesubstrate 100 may contact the polishingfilm 204 for about 15 to 150 seconds depending on the type of film used, the grit of the film, the rate of rotation, the amount of polishing required, etc. More or less time may be used. In some embodiments, the polishingfilm 204 may be supported by apad 206 disposed adjacent a backside (e.g., a non-abrasive side) of the polishingfilm 204 and mounted on theframe 202. As indicated by the straightupward pointing arrow 207, theframe 202 including the tensionedpolishing film 204 and/or thepad 206 may be pushed against theedge 104 of thesubstrate 100. In some embodiments, the substrate may be pushed against the polishing film with an amount of force ranging from about 0.5 lbs. to about 2.0 lbs. Other amounts of force may be used. - Additionally or alternatively, an additional length of the polishing
film 204 may be supported and tensioned byspools frame 202. Asupply spool 208 may includeunused polishing film 204 available to be unwound and pulled into position adjacent thesubstrate 100 while a take-upspool 210 may be adapted to receive used and/orworn polishing film 204. One or both of thespools film 204 that is advanced. The polishingfilm 204 may be made from many different materials including aluminum oxide, silicon oxide, silicon carbide, etc. Other materials may also be used. In some embodiments, the abrasives used may range from about 0.5 microns up to about 3 microns in size although other sizes may be used. Different widths ranging from about 1 inch to about 1.5 inches may be used (although other widths may be used). In one or more embodiments, the polishing film may be about 0.002 to about 0.02 of an inch thick and be able to withstand about 1 to 5 lbs. of tension in embodiments that use apad 206 and from about 3 to about 8 lbs. of tension in embodiments without a pad. Other films having different thicknesses and strengths may be used. Thespools film 204, and may be constructed from any practicable materials such as polyurethane, polyvinyl difloride (PVDF), etc. Other materials may be used. Theframe 202 may be constructed from any practicable materials such as aluminum, stainless steel, etc. - In some embodiments, one or more fluid channels 212 (e.g., a spray nozzle or bar) may be provided to deliver chemicals and/or water to aid in the polishing/cleaning of the
substrate edge 104, lubricate the substrate, and/or to wash away removed material. Thefluid channel 212 may be adapted to deliver fluid to thesubstrate 100, to thepolishing film 204, and/or to thepad 206. The fluids may include deionized water which may serve as a lubricant and to flush particles away. A surfactant and/or other known cleaning chemistries may also be included. In some embodiments, sonic (e.g., megasonic) nozzles may be used to deliver sonicated fluids to thesubstrate edge 104 to supplement the cleaning. Fluid also may be delivered through the polishingfilm 204 and/or pad 206 to theedge 104. - Turning to
FIGS. 3A and 3B , close-up front and side cross-sectional schematic views, respectively, of the polishingfilm 204 and pad 206 ofFIG. 2 are depicted. Note that the forces (indicated by the straight arrows) cause thepolishing film 204 and thepad 206 to contour and conform to theedge 104 of thesubstrate 100. In some embodiments, if thesubstrate 100 was not present, thepad 206 would have a flat surface where thesubstrate 100 is shown compressing thepad 206. Likewise, if thesubstrate 100 was not present, the polishingfilm 204 would lie flat and be represented by a straight line in both views. - Turning now to
FIGS. 4 and 5 , two additional alternative embodiments of anedge polishing apparatus FIG. 4 , an exampleedge polishing apparatus 400 may include a base or frame 402 that includes ahead 404 which supports polishingfilm 204 tensioned betweenspools pad 206. As shown, thepad 206 may by mounted to thehead 404 via a biasing device 406 (e.g., a spring). Theedge polishing apparatus 400 ofFIG. 4 also may include one or more drive rollers 408 (two shown) and guide rollers 410 (two shown) that are adapted to rotate theedge 104 of thesubstrate 100 against the polishingfilm 204. Thedrive rollers 408 may themselves each be driven by drivers 412 (e.g., motors, gears, belts, chains, etc.). - The
drive rollers 408 and guiderollers 410 may include a groove that allows therollers substrate 100. In some embodiments the groove within thedrive rollers 408 may have a diameter of approximately 2.5 inches and the groove within theguide rollers 410 may have a diameter of approximately 1 inch. Other dimensions are possible. The area of thedrive rollers 408 in contact with thesubstrate 100 may include texturing or cross-grooves to allow thedrive rollers 408 to grip thesubstrate 100. Thedrive rollers 408 and guiderollers 410 may be constructed from materials such as polyurethane, polyvinyl difloride (PVDF), etc. Other materials may be used. - As shown in
FIG. 5 , another exampleedge polishing apparatus 500 may include a base or frame 502 that includes ahead 504 which supports polishingfilm 204 tensioned betweenspools pad 206. As shown, thepad 206 may by mounted to thehead 504 via an actuator 506 (e.g., a pneumatic slide, hydraulic ram, servo motor driven pusher, etc.). Theedge polishing apparatus 500 ofFIG. 5 also may include avacuum chuck 508 coupled to a driver 510 (e.g., motor, gear, belt, chain, etc.). An advantage of the embodiment depicted inFIG. 5 is that theapparatus 500 does not need to contact theedge 104 being polished. Thus, the potential of particles accumulating on drive rollers and being re-deposited on theedge 104 is eliminated. The need to clean rollers also is eliminated. Further, the possibility of rollers damaging or scratching the edge is also eliminated. By holding the substrate in a vacuum chuck, high speed rotation without vibration may be achieved. - Turning now to
FIGS. 6 through 8B , some details of features of the example embodiments ofFIGS. 4 and 5 are described. Note that features from the different embodiments may be combined in many different practicable ways to serve different design principals or concerns. -
FIG. 6 depicts details of theframe 502 including thehead 504 ofFIG. 5 . As described above, ahead 504supports polishing film 204 tensioned betweenspools edge 104 of asubstrate 100 held in the edge polishing apparatus 500 (FIG. 5 )) by a driver 600 (e.g., a servo motor) andpivot 602. The angular translation of the frame (and polishing film 204) is described in more detail below with respect toFIGS. 9A through 10C . - Additionally, the
spools head 504, may be driven by one or more drivers 604 (e.g., servo motors). Thedrivers 604 may provide both an indexing capability to allow a specific amount ofunused polishing film 204 to be advanced or continuously fed to the substrate edge, and a tensioning capability to allow the polishing film to be stretched taught and to apply pressure to the substrate edge. - As can more clearly be seen in
FIG. 6 (as compared toFIG. 5 ), theoptional pad 206 may by mounted to thehead 504 via anactuator 506 that is adapted to adjustably press and contour thepolishing film 204 against a substrate edge 104 (FIG. 5 ). Further, one ormore support rollers 606 may also be mounted to thehead 504 to guide and align thepolishing film 204 in a plane perpendicular to the major surface 102 (FIG. 1 ) of asubstrate 100 held in the edge polishing apparatus 500 (FIG. 5 ). - Note that in the embodiment depicted in
FIGS. 5 and 6 , the length of the polishingfilm 204 is disposed orthogonal to theedge 104 of asubstrate 100 being polished. This is in contrast to the embodiment depicted inFIG. 2 , wherein the longitudinal direction of the polishingfilm 204 is aligned with theedge 104 of asubstrate 100 being polished. Other polishing film orientations and configurations may be employed. For example, the polishingfilm 204 may be held diagonally relative to themajor surface 102 of thesubstrate 100. - Turning to
FIGS. 7A and 7B , close-up perspective views of two different embodiments ofreplaceable cassettes Cassettes head 404 and polishingfilm 204 in a disposable, refillable, and/or replaceable package which may be quickly and easily mounted on and/or removed from theframes edge polishing apparatuses - As shown in
FIG. 7A , thecassette 700A may includehead 404 which supports polishingfilm 204 which spans fromsupply reel 208 to take-upreel 210. The polishingfilm 204 may be guided and aligned bysupport rollers 606 mounted to thehead 404. Apad 206 may be provided to further support the polishingfilm 204 as described above. Also as described above, a biasing device 406 (e.g., a spring) may be employed to mount thepad 206 to thehead 404 to provide flexible/dynamic counter-pressure to thepad 206. Alternatively or additionally, an adjustable actuator 506 (FIG. 6 ) may be used to push thepad 206 against the polishingfilm 204 or to push theentire head 404 toward thesubstrate 100. - In yet another alternative embodiment, as shown in
FIG. 7B , instead of apad 206, thehead 404 may simply rely on the tension of the polishingfilm 204 to provide lateral pressure to the substrate edge 104 (FIG. 1 ). In some embodiments, thehead 404 may include anotch 702 as shown inFIG. 7B to accommodate thesubstrate 100. - Turning to
FIGS. 8A and 8B , two different alternative embodiments ofpads FIG. 6 ) that has a flat surface co-planar with the polishingfilm 204 when a substrate is not present, apad 206A may include a concave surface that matches the contour of theedge 104 of asubstrate 100. Alternatively, as shown inFIG. 8B , thepad 206B may include a double concave surface to better match the contour of theedge 104 of asubstrate 100. In yet other alternative embodiments, apad 206 may include a shaped groove that precisely matches the contour of theedge 104 of asubstrate 100 including thebevels FIG. 1 ). - The
pads - In some embodiments, the
pad pad FIG. 8C depicts an embodiment of apad 206C that includes aninflatable bladder 802 that may be filled (and/or emptied) via afluid channel 804 with fluid from afluid supply 806. In some embodiments, thefluid supply 806 may inflate/deflate thebladder 802 under the direction of an operator or a programmed and/or user operated controller. In such embodiments, an elastomeric material such as silicon rubber or the like, may be used for thebladder 802 to further enhance the pad's ability to stretch and conform to the substrate'sedge 104. Such an embodiment would allow an operator/controller to precisely control how far beyond thebevels 112, 114 (if at all) and into theexclusion region 108 and/or 108′ (FIG. 1 ) thepolishing film 204 is made to contact thesubstrate 100 by, e.g., limiting the amount of fluid pumped into thebladder 802. For example, once a substrateouter edge 110 is placed against apad 206C with a deflatedbladder 802, thebladder 802 may be inflated so that thepad 206C is forced to wrap around and conform to theouter edge 110 and bevel(s) 112, 114 of thesubstrate 100 without wrapping around to thedevice region substrate 100. Note that in some embodiments, multiple bladders may be used in a pad and that differently shaped inflatable bladders may be used within differently shapedpads - In some embodiments, fluids used to aid in the polishing may be delivered to the substrate edge via the
pads pads -
FIGS. 9A through 9C andFIGS. 10A through 10C depict examples of different possible head positions of the alternativeedge polishing apparatuses film 204 in contact with thebevels outer edge 110 of asubstrate 100 without contacting thedevice region 106 of thesubstrate 100. In operation, this is achieved by angularly translating ahead 404, 504 (and consequently, a portion of polishing film in contact with and contoured to theedge 104 of a substrate 100) around an axis that is tangential to theouter edge 110 of thesubstrate 100 as it is rotated. Referring toFIGS. 9A through 9C andFIGS. 10A through 10C , this axis of angular translation may be represented by a line extending perpendicular out of the paper upon which the FIGs. are drawn at the point labeled “P.” Theheads substrate edge 104 as thesubstrate 100 is rotated. In some embodiments, theheads heads frame 502 by drivers 600 (FIG. 6 ) under the direction of a programmed or user operated controller. Alternatively, theheads substrate 100. Further, the polishingfilm 204 may be mounted on theheads film 204 may be continuously (or intermittently) advanced to polish thesubstrate edge 104. For example, the advancement of the film may be used to create or enhance the polishing motion. Any combination of the above described polishing motions and/or methods that are practicable may be employed. - Turning to
FIGS. 11 through 12 , additional embodiments of an edge polishing apparatus are depicted.FIG. 11 depicts anedge polishing apparatus 1100 including threeheads 404,FIG. 12 depicts anedge polishing apparatus 1200 including twoheads 504, andFIG. 13 depicts anedge polishing apparatus 1300 including fourheads 1304. As suggested by the drawings, any number and type ofheads head heads Different heads different substrates 100 or different types of substrates. For example, afirst head 404 with astiff biasing device 406 supporting apad 206 such as theconcave pad 206B and a coarsegrit polishing film 204 may initially be used to remove a relatively large amount of rough material from the substrate bevels 112, 114 (FIG. 1 ). Thefirst head 404 may be appropriately positioned to access thebevels first head 404 is completed, thefirst head 404 may be backed away from thesubstrate 100, and asecond head 504 with a fine grit polishing film 204 (and without a pad) may be moved into position to polish thebevels outer edge 110. - After cleaning one or
more substrates 100, the portion of the polishingfilm 204 employed for such cleaning may become worn. Therefore, the take-up reel 210 (FIG. 4 ) may be driven to draw the polishingfilm 204 by a fixed amount from the supply reel 210 (FIG. 4 ) toward the take-upreel 210. In this manner, an unused portion of the polishingfilm 204 may be provided between the take-upreel 210 andsupply reel 208. The unused portion of the polishingfilm 204 may be employed to subsequently clean one or moreother substrates 100 in a manner similar to that described above. Consequently, theapparatus film 204 with an unused portion with little or no impact on substrate processing throughput. Likewise, ifreplaceable cassettes 700A are employed, impact on throughput may be minimized by quickly replacing thecassettes 700A when all thepolishing film 204 in thecassette 700A is used. - Regarding the example embodiment of an
edge polishing apparatus 1300 ofFIG. 13 specifically, aframe 1302 that supportsmultiple heads 1304 is depicted in schematic form. Theheads 1304 are each mounted to theframe 1302 and each include an actuator 1306 (e.g., pneumatic piston, servo driven slide, hydraulic ram, etc.) adapted to press apad 206 and a length of polishingfilm 204 against theedge 104 of asubstrate 100 in response to a control signal from a controller 1308 (e.g., a programmed computer, an operator directed valve system, an embedded real time processor, etc.). Note that thecontroller 1308 is coupled (e.g., electrically, mechanically, pneumatically, hydraulically, etc.) to each of theactuators 1306. - In addition, a
fluid supply 806 may be coupled to and under the control of thecontroller 1308. Thefluid supply 806 may be controlled to independently deliver fluids (e.g., DI water, cleaning chemistry, sonicated fluids, gas, air, etc.) to each of theheads 1304 via one or morefluid channels 212. Under the direction of thecontroller 1308, various fluids may be selectively delivered to thepads 206, the polishingfilm 204, and/or thesubstrate edge 104 via thefluid channels 212. The fluid may be for use in polishing, lubricating, particle removal/rinsing, and/or inflating a bladder 802 (FIG. 8C ) within thepads 206. For example, in some embodiments, the same fluid delivered through apermeable pad 206 may be used for both polishing and inflating thepad 206 while a different fluid, delivered to thesame head 1304 via a second channel (not shown) is used for rinsing and lubricating. - The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. For instance, although only examples of cleaning a round substrate are disclosed, the present invention could be modified to clean substrates having other shapes (e.g., a glass or polymer plate for flat panel displays). Further, although processing of a single substrate by the apparatus is shown above, in some embodiments, the apparatus may process a plurality of substrates concurrently.
- Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.
Claims (20)
1. A method of cleaning an edge of a substrate comprising:
tensioning a first polishing film in a frame;
contacting the first polishing film against an edge of a substrate;
conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and
rotating the substrate while the first polishing film remains in contact with the substrate.
2. The method of claim 1 further comprising:
delivering a fluid to the edge of the substrate.
3. The method of claim 2 wherein delivering the fluid further comprises:
applying at least one of water and a cleaning chemistry to the edge of the substrate via an inflatable pad.
4. The method of claim 2 wherein delivering the fluid further comprises:
applying at least one of water and a cleaning chemistry to the edge of the substrate via the first polishing film.
5. The method of claim 1 further comprising:
conforming a second polishing film to the edge of the substrate.
6. The method of claim 5 wherein the second polishing film includes a different type of polishing film compared to the first polishing film.
7. The method of claim 6 wherein the first and second
polishing films contact the edge of the substrate one of sequentially and simultaneously.
8. The method of claim 1 further comprising:
delivering fluid including sonic energy to the edge of the substrate.
9. The method of claim 1 further comprising:
rotating the substrate for between 5 and 150 seconds.
10. The method of claim 1 wherein the frame includes one or more heads adapted to conform the first polishing film to the edge of the substrate.
11. The method of claim 10 further comprising:
angularly translating the one or more heads and the first polishing film around an axis tangential to the outer edge of the substrate.
12. The method of claim 10 further comprising:
circumferentially rotating, with respect to the substrate, the one or more heads around the edge of the substrate.
13. The method of claim 1 further comprising:
advancing the first polishing film as it contacts the substrate edge.
14. The method of claim 10 wherein conforming the first polishing film further comprises:
pressing a conformable pad portion of the head against the first polishing film.
15. The method of claim 14 further comprising:
adjusting the pressure applied by the conformable pad against the first polishing film.
16. The method of claim 15 , wherein the pressure is adjusted by a controller based on a signal.
17. The method of claim 10 further comprising:
oscillating the one or more heads between positions that allow the first polishing film to contact at least one bevel and the outer edge of the substrate.
18. The method of claim 10 further comprising:
controlling the movement of the one or more heads with a controller.
19. The method of claim 10 further comprising:
polishing a predefined portion of the edge of the substrate with the one or more heads.
20. The method of claim 1 further comprising:
moving the edge of the substrate in a longitudinal direction; and
spanning the first polishing film between a supply spool and a take up spool in a longitudinal direction.
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US12/245,765 Abandoned US20090036033A1 (en) | 2005-12-09 | 2008-10-05 | Methods and apparatus for processing a substrate |
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US20080216867A1 (en) * | 2005-04-25 | 2008-09-11 | Applied Materials, Inc. | Methods and apparatus for cleaning an edge of a substrate |
US20090017731A1 (en) * | 2005-12-09 | 2009-01-15 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
US20070131654A1 (en) * | 2005-12-09 | 2007-06-14 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
US7993485B2 (en) | 2005-12-09 | 2011-08-09 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
US20070131653A1 (en) * | 2005-12-09 | 2007-06-14 | Ettinger Gary C | Methods and apparatus for processing a substrate |
US20090036042A1 (en) * | 2006-03-30 | 2009-02-05 | Applied Materials, Inc. | Methods and apparatus for polishing an edge of a substrate |
US20090036039A1 (en) * | 2006-03-30 | 2009-02-05 | Applied Materials, Inc. | Methods and apparatus for polishing an edge of a substrate |
US20090029629A1 (en) * | 2006-03-30 | 2009-01-29 | Applied Materials, Inc. | Methods and apparatus for polishing an edge of a substrate |
US20080293333A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for controlling the size of an edge exclusion zone of a substrate |
US20080293335A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for substrate edge polishing using a polishing arm |
US20080293341A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for using a rolling backing pad for substrate polishing |
US20080293337A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for polishing a notch of a substrate by substrate vibration |
US20080293334A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement |
US20080293329A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile |
US8142260B2 (en) | 2007-05-21 | 2012-03-27 | Applied Materials, Inc. | Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads |
US8986069B2 (en) | 2007-12-03 | 2015-03-24 | Ebara Corporation | Polishing apparatus and polishing method |
US10166647B2 (en) | 2007-12-03 | 2019-01-01 | Ebara Corporation | Polishing apparatus and polishing method |
US9517544B2 (en) | 2007-12-03 | 2016-12-13 | Ebara Corporation | Polishing apparatus and polishing method |
US20100105290A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Methods and apparatus for indicating a polishing tape end |
US20100105299A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Methods and apparatus for polishing an edge and/or notch of a substrate |
US20100178851A1 (en) * | 2009-01-13 | 2010-07-15 | Masayuki Nakanishi | Polishing apparatus and polishing method |
US20160005593A1 (en) * | 2013-02-13 | 2016-01-07 | Mipox Corporation | Method for manufacturing a circular wafer by polishing the periphery, including a notch or orientation flat, of a wafer comprising crystal material, by use of polishing tape |
US9496129B2 (en) * | 2013-02-13 | 2016-11-15 | Mipox Corporation | Method for manufacturing a circular wafer by polishing the periphery, including a notch or orientation flat, of a wafer comprising crystal material, by use of polishing tape |
US20160218001A1 (en) * | 2015-01-22 | 2016-07-28 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
US9748090B2 (en) * | 2015-01-22 | 2017-08-29 | Toshiba Memory Corporation | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
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