US20090008064A1 - Cooling System for Electronic Substrates - Google Patents

Cooling System for Electronic Substrates Download PDF

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Publication number
US20090008064A1
US20090008064A1 US11/573,002 US57300205A US2009008064A1 US 20090008064 A1 US20090008064 A1 US 20090008064A1 US 57300205 A US57300205 A US 57300205A US 2009008064 A1 US2009008064 A1 US 2009008064A1
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US
United States
Prior art keywords
heat transfer
transfer fluid
cooling system
fluid
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/573,002
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English (en)
Inventor
Celine Nicole
Clemens J.M. Lasance
Menno Willem Jose Prins
Jean-Christophe Baret
Michel Marcel Jose Decre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N V reassignment KONINKLIJKE PHILIPS ELECTRONICS N V ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BARET, JEAN-CHRISTOPHE, DECRE, MICHEL MARCEL JOSE, LASANCE, CLEMENS J.M., NICOLE, CELINE, PRINS, MENNO WILLEM JOSE
Publication of US20090008064A1 publication Critical patent/US20090008064A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium

Definitions

  • the present invention relates to a cooling system for an electronic substrate comprising a heat transfer fluid.
  • Liquid cooling is a method already used in portable computers, i.e. laptops.
  • a particular application that requires cooling is solid-state lighting.
  • White light or colour controlled solid-state lighting requires the use of a multi-chip module wherein several LEDs are placed very close to each other in order to define an optical point source.
  • This design causes high power densities in the silicon submount, in the order 100 W/cm 2 .
  • Liquids are significantly better heat transfer media than air, because their thermal conductivity and thermal capacity are higher (10 to 1000 times better).
  • Forced convection micro channels liquid cooling has proven to be highly efficient in the industrial world (metallic micro channel structures) and in industrial research (silicon micro channel device). The main inconvenience of this technique is that liquid is pumped through the channels by a pump, which makes it less suited for miniaturized and integrated consumer products and electronics.
  • O'Connor et al disclose an example of a cooling system with a pump in US 2002/0039280 A1.
  • the invention by O'Connor et al. concerns a micro fluidic heat exchange system for cooling an electronic component internal to a device, such as a computer.
  • the heat exchange device is substantially in interfacial contact with a heat-generating electronic component and supplies an internal operating fluid to a heat exchange zone.
  • Operating fluids flows into the heat exchange zone at a first fluid temperature that is lower than the component temperature, and then exits the zone at a second fluid temperature higher than the first fluid temperature.
  • a cooling system for an electronic substrate comprises a heat transfer fluid, wherein the heat transfer fluid is arranged to flow along a path by capillary force.
  • the essential feature of the present invention is the use of a technique to move fluids at a micro scale in order to achieve integrated and compact cooling of an electronic component, for instance a chip submount.
  • k is the thermal conductivity of water (0.628 Wm ⁇ 1 K ⁇ 1 )
  • D is the hydraulic diameter (10 ⁇ 3 m)
  • Nu is the Nusselt number, which is given by
  • v av is estimated to be in the order of 1 m/s, which gives, depending on the cross-sectional area, a volumetric flow in the order of 10 to 100 ⁇ l/s.
  • the system further comprises an electrode arranged for applying a voltage to the heat transfer fluid for changing the surface tension of the heat transfer fluid.
  • the electrowetting principle allows moving several hundreds of ⁇ l/s in a sequence of droplets. Stated in a slightly different way, the energy transport rate P (J/s) is given by
  • Electrowetting involves a change of surface tension by electrostatic charges, resulting in a movement of a fluid/fluid meniscus.
  • the movement can be provided in at least two different ways, namely (i) by actuating a fluid/fluid meniscus in one or several channels or slits or (ii) by transporting droplets over a surface.
  • the maximum meniscus speed demonstrated by electrowetting is 0.1 m/s or a little higher.
  • the maximum pressure modulation that can be generated by electrowetting is given by 2 ⁇ /R, where ⁇ is the change of surface tension and R the curvature of the meniscus. ⁇ can be of the order of 0.1 N/m. For a curvature of 100 ⁇ m, the maximum pressure is about 2000 Pa.
  • the gravitational pressure drop in the system has to be lower than the maximum modulation of electrowetting pressure.
  • the gravitational pressure drop equals ⁇ gL, with L the projected length.
  • Maximum orientational freedom can be ensured by using fluids with similar mass density, by minimizing the column heights of one of the fluids, and by using balanced geometries.
  • flow velocities of 0.1 n/s can be reached in channels with a length of 2 cm and a diameter of 300 ⁇ m. This gives a volumetric flow rate of 7 ⁇ l/s per micro channel. In other words, a volumetric flow rate of 140 ⁇ l/s can be achieved in an actuated-actuated system with about 20 micro channels.
  • At least one micro channel is connected to a heat transfer fluid reservoir.
  • a heat transfer fluid reservoir With fluid reservoirs disposed around the heat source and proper heat sinking of these reservoirs, heat is efficiently removed.
  • the electrode is situated outside the heated region.
  • the actuated-actuated flow generates a transport of energy in the device, from a concentrated heating region to a larger cooling region.
  • the actuated electrodes are situated outside the heated region, because this will improve the lifetime of the device.
  • the fluid system is preferably a closed system. This will decrease the risk for evaporation and leakage of fluids.
  • the cooling system comprises two immiscible fluids with different electrical conductivity, for instance, air/water, water/oil, etc.
  • Actuated actuation requires that an electrode is present in the vicinity of the fluid/fluid meniscus.
  • the electrode generally consists of a material with metallic conductance, coated with an insulating layer.
  • the insulating coating can for example be 1 ⁇ m-10 ⁇ m of parylene, or 10 nm-1 ⁇ m of a fluoropolymer layer, or a combination of such layers.
  • the different micro channels can be hydrostatically separated from each other or they can join in certain junctions or channels (e.g. common channels or reservoirs). Care should be taken to ensure integrity of the menisci in the micro channels, e.g. to avoid fluid of one type to enter a reservoir for fluid of the second type.
  • the system is arranged such that the fluid is actuated in a bi-directional manner.
  • the fluid flow can be uni-directional or bi-directional.
  • the fluid is actuated in a bi-directional manner, so that fluid contact to the heated region can be limited to only one type of fluid. This will improve the lifetime of the device.
  • a bi-directional flow is achieved by applying a pulsating voltage that will result in a reciprocating flow of heat transfer fluid.
  • the system preferably comprises two sets of micro channels arranged in a counter flow relationship.
  • FIG. 1 shows an example of a multi chip module for a solid state lighting application.
  • FIG. 2 shows an example of droplet flow.
  • FIG. 3 shows one micro channel for fluid transport between a hot and a cold region.
  • FIGS. 4 a and 4 b show a cooling unit with several micro channels connected to a reservoir.
  • FIG. 5 a shows a system according to the invention with ring geometry.
  • FIG. 5 b shows an enlarged view of a portion of the system in FIG. 5 a.
  • FIG. 6 a shows a system according to the invention with a counterflow arrangement.
  • FIG. 6 b shows an enlarged view of a portion of the system in FIG. 6 a.
  • FIG. 7 a shows a radial system according to the invention.
  • FIG. 7 b shows an enlarged view of a portion of the system in FIG. 7 a.
  • FIG. 8 shows a radial system with channels having non-continuous width.
  • FIG. 1 shows a general view of a multi chip module with 9 LEDs 1 (light emitting diodes).
  • White light or colour controlled solid state lighting requires the need of a multi chip module where several LEDs 1 are placed very close to each other in order to define an optical point source.
  • This design causes high power densities on the silicon submount 2 .
  • By integrating an active liquid cooling droplet based actuated pump in the silicon submount 2 the required cooling can be achieved.
  • the size of the silicon submount is 5 mm ⁇ 6 mm and the submount 2 is arranged adjacent to reservoirs/collectors 3 .
  • the reservoirs/collectors 3 comprises a heat transfer fluid for removal of the heat energy produced by the LEDs 1 .
  • FIG. 2 the principle of the droplet transport is shown.
  • Heat transfer fluid droplets 4 are flowing in a channel 5 from a reservoir/collector 3 .
  • the droplets are made to move by a voltage applied on the fluid via electrodes 6 .
  • heat will now be transferred from the silicon submount 2 to the droplets 4 .
  • the droplets 4 will subsequently be cooled in a reservoir/collector 3 .
  • the energy absorbed by the reservoirs/collectors 3 will subsequently be transferred from the reservoirs/collectors 3 with the help of a separate cooling system (not shown).
  • the heated chip is part of a larger device consisting for example of printed circuit board material, a moulded-interconnect-device (MID), a glass, a metal device, etc. Each of these materials can contain electrodes and channel structures.
  • a hole can be provided so that the silicon chip can be exposed to the heat transfer fluid as well as being electrically interconnected.
  • FIG. 3 is a diagrammatic drawing of one micro channel 5 for fluid transport between a hot region 7 and a cold region 8 .
  • the electrodes are not drawn.
  • a plug 9 of one of the fluids is used to “push” the other fluid 10 that acts primarily as the heat transfer fluid.
  • the electrodes preferably applies pulsating voltage to the plug 9 such that the plug 9 , and consequently the heat transfer fluid 10 , is actuated in a bi-directional manner, i.e. a reciprocating flow of the heat transfer fluid, in order to avoid the plug entering the hot region 7 .
  • This will improve the lifetime of the device.
  • a requirement is that the two fluids are immiscible fluids, for instance a plug of oil in a surplus of water.
  • FIGS. 4 a and 4 b illustrates a multi channel system comprising a heat transfer fluid reservoir 3 .
  • a no voltage is applied and all heat transfer fluid remains in the reservoir 3 .
  • FIG. 4 b a voltage has been applied and the heat transfer fluid has started to flow in the micro channels 11 .
  • the applied voltage is turned off, the heat transfer fluid returns to the reservoir 3 .
  • FIGS. 5 a and 5 b An example of channels 11 made in a “loop” shape can be seen in FIGS. 5 a and 5 b , the latter being an enlarged view of a portion of the former.
  • the embodiment comprises two reservoirs 3 as heat sinks for the heat transfer fluid.
  • FIG. 6 a shows a cooling system according to the invention comprising two reservoirs 3 of heat transfer fluid arranged with separate sets of channels 11 arranged in a counter current relationship. This arrangement helps in reducing the temperature gradient across the silicon chip and consequently the lifetime of the silicon chip is increased due to a more even heat load.
  • FIG. 6 b is an enlarged view of a portion of the embodiment shown in FIG. 6 a.
  • FIGS. 7 a and 7 b , 7 b being an enlarged view of a portion of the embodiment in FIG. 7 a , is shown an embodiment according to the present invention with radial cooling and the heat source in the centre.
  • the heat transfer fluid travels from the reservoir 3 in the micro channels 11 towards the centre. Outside the reservoir a heat sink is connected (not shown).
  • FIG. 8 shows yet another embodiment of a system according to the present invention.
  • the system comprises two reservoirs 3 interconnected with channels 12 .
  • the channel width varies between the two reservoirs 3 for optimising the capillary flow of the heat transfer fluid.
  • the filling of the liquid should be done at the latest stage by a hole/channel in the device.
  • all micro channels are filled simultaneously, e.g. via filling channels that run perpendicular to the micro channels.
  • the whole liquid device should be entirely sealed after filling.
  • a pressure damper could be included to avoid pressure built up in the set-up.
  • a flexible reservoir can be included (e.g. with a membrane, or a pocket containing an air bubble) to allow expansion and contraction of fluids.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
US11/573,002 2004-08-05 2005-07-21 Cooling System for Electronic Substrates Abandoned US20090008064A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP04103775.5 2004-08-05
EP04103775 2004-08-05
PCT/IB2005/052461 WO2006016293A1 (en) 2004-08-05 2005-07-21 A cooling system for electronic substrates

Publications (1)

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US20090008064A1 true US20090008064A1 (en) 2009-01-08

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US11/573,002 Abandoned US20090008064A1 (en) 2004-08-05 2005-07-21 Cooling System for Electronic Substrates

Country Status (7)

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US (1) US20090008064A1 (zh)
EP (1) EP1797388A1 (zh)
JP (1) JP2008509550A (zh)
KR (1) KR20070040835A (zh)
CN (1) CN1993596B (zh)
TW (1) TW200616182A (zh)
WO (1) WO2006016293A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100277868A1 (en) * 2009-04-30 2010-11-04 General Electric Company Insulated metal substrates incorporating advanced cooling
US20110103578A1 (en) * 2009-10-30 2011-05-05 General Dynamics C4 Systems, Inc. Systems and methods for efficiently creating digests of digital data
US20120168131A1 (en) * 2009-09-14 2012-07-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Heat exchange device with improved efficiency
WO2015142607A1 (en) * 2014-03-21 2015-09-24 Board Of Regents, The University Of Texas System Heat pipes with electrical pumping of condensate
US9146596B2 (en) 2012-04-10 2015-09-29 Google Inc. Apparatus and methods for thermal management of a computing device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2950134B1 (fr) * 2009-09-14 2011-12-09 Commissariat Energie Atomique Dispositif d'echange thermique a ebullition convective et confinee a efficacite amelioree
TWI506238B (zh) * 2009-12-29 2015-11-01 Foxconn Tech Co Ltd 微型液體冷卻裝置
EP2395549B1 (en) 2010-06-10 2014-06-25 Imec Device for cooling integrated circuits
US9030824B2 (en) 2012-10-02 2015-05-12 Hamilton Sundstrand Corporation Dielectrophoretic cooling solution for electronics
EP3396710B1 (en) * 2012-10-01 2021-09-22 Hamilton Sundstrand Corporation Dielectrophoretic cooling solution for electronics
US8848371B2 (en) * 2012-10-01 2014-09-30 Hamilton Sundstrand Corporation Dielectrophoretic restriction to prevent vapor backflow
US9038407B2 (en) * 2012-10-03 2015-05-26 Hamilton Sundstrand Corporation Electro-hydrodynamic cooling with enhanced heat transfer surfaces
WO2018161462A1 (zh) * 2017-03-08 2018-09-13 华为技术有限公司 平板热管、微通道散热系统和终端
US10375855B2 (en) * 2017-11-08 2019-08-06 Honeywell International Inc. Systems and methods for zero power automatic thermal regulation
CN112944952A (zh) * 2021-01-28 2021-06-11 中山大学 一种针对高温表面热防护与热控制的发汗冷却系统

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US4396055A (en) * 1981-01-19 1983-08-02 The United States Of America As Represented By The Secretary Of The Navy Electrohydrodynamic inductively pumped heat pipe
US5072780A (en) * 1988-11-18 1991-12-17 Agency Of Industrial Science & Technology, Ministry Of International Trade & Industry Method and apparatus for augmentation of convection heat transfer in liquid
US5769155A (en) * 1996-06-28 1998-06-23 University Of Maryland Electrohydrodynamic enhancement of heat transfer
US20020039280A1 (en) * 2000-09-29 2002-04-04 Nanostream, Inc. Microfluidic devices for heat transfer
US20020114715A1 (en) * 2001-02-20 2002-08-22 Korea Advanced Institute Of Science And Technology Micropump driven by movement of liquid drop induced by continuous electrowetting
US6443222B1 (en) * 1999-11-08 2002-09-03 Samsung Electronics Co., Ltd. Cooling device using capillary pumped loop
US6443704B1 (en) * 2001-03-02 2002-09-03 Jafar Darabi Electrohydrodynamicly enhanced micro cooling system for integrated circuits
US20030037910A1 (en) * 2001-08-27 2003-02-27 Genrikh Smyrnov Method of action of the pulsating heat pipe, its construction and the devices on its base
US6698502B1 (en) * 1999-06-04 2004-03-02 Lee Jung-Hyun Micro cooling device
US20040112568A1 (en) * 2002-12-12 2004-06-17 Min-Sheng Liu Enhanced heat transfer device with electrodes
US20040244397A1 (en) * 2003-06-09 2004-12-09 Lg Electronics Inc. Heat dissipating structure for mobile device
US20040250994A1 (en) * 2002-11-05 2004-12-16 Lalit Chordia Methods and apparatuses for electronics cooling
US6863118B1 (en) * 2004-02-12 2005-03-08 Hon Hai Precision Ind. Co., Ltd. Micro grooved heat pipe
US6888721B1 (en) * 2002-10-18 2005-05-03 Atec Corporation Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes

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TW200306402A (en) * 2001-12-21 2003-11-16 Tth Res Inc Loop heat pipe method and apparatus
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Publication number Priority date Publication date Assignee Title
US3682239A (en) * 1971-02-25 1972-08-08 Momtaz M Abu Romia Electrokinetic heat pipe
US4396055A (en) * 1981-01-19 1983-08-02 The United States Of America As Represented By The Secretary Of The Navy Electrohydrodynamic inductively pumped heat pipe
US5072780A (en) * 1988-11-18 1991-12-17 Agency Of Industrial Science & Technology, Ministry Of International Trade & Industry Method and apparatus for augmentation of convection heat transfer in liquid
US5769155A (en) * 1996-06-28 1998-06-23 University Of Maryland Electrohydrodynamic enhancement of heat transfer
US6698502B1 (en) * 1999-06-04 2004-03-02 Lee Jung-Hyun Micro cooling device
US6443222B1 (en) * 1999-11-08 2002-09-03 Samsung Electronics Co., Ltd. Cooling device using capillary pumped loop
US20020039280A1 (en) * 2000-09-29 2002-04-04 Nanostream, Inc. Microfluidic devices for heat transfer
US20020114715A1 (en) * 2001-02-20 2002-08-22 Korea Advanced Institute Of Science And Technology Micropump driven by movement of liquid drop induced by continuous electrowetting
US6629826B2 (en) * 2001-02-20 2003-10-07 Korea Advanced Institute Of Science And Technology Micropump driven by movement of liquid drop induced by continuous electrowetting
US6443704B1 (en) * 2001-03-02 2002-09-03 Jafar Darabi Electrohydrodynamicly enhanced micro cooling system for integrated circuits
US20030037910A1 (en) * 2001-08-27 2003-02-27 Genrikh Smyrnov Method of action of the pulsating heat pipe, its construction and the devices on its base
US6888721B1 (en) * 2002-10-18 2005-05-03 Atec Corporation Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes
US20040250994A1 (en) * 2002-11-05 2004-12-16 Lalit Chordia Methods and apparatuses for electronics cooling
US20040112568A1 (en) * 2002-12-12 2004-06-17 Min-Sheng Liu Enhanced heat transfer device with electrodes
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US6863118B1 (en) * 2004-02-12 2005-03-08 Hon Hai Precision Ind. Co., Ltd. Micro grooved heat pipe

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100277868A1 (en) * 2009-04-30 2010-11-04 General Electric Company Insulated metal substrates incorporating advanced cooling
US8232637B2 (en) 2009-04-30 2012-07-31 General Electric Company Insulated metal substrates incorporating advanced cooling
US20120168131A1 (en) * 2009-09-14 2012-07-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Heat exchange device with improved efficiency
US20110103578A1 (en) * 2009-10-30 2011-05-05 General Dynamics C4 Systems, Inc. Systems and methods for efficiently creating digests of digital data
US8290147B2 (en) 2009-10-30 2012-10-16 General Dynamics C4 Systems, Inc. Systems and methods for efficiently creating digests of digital data
US9146596B2 (en) 2012-04-10 2015-09-29 Google Inc. Apparatus and methods for thermal management of a computing device
WO2015142607A1 (en) * 2014-03-21 2015-09-24 Board Of Regents, The University Of Texas System Heat pipes with electrical pumping of condensate
US10168113B2 (en) 2014-03-21 2019-01-01 Board Of Regents, The University Of Texas System Heat pipes with electrical pumping of condensate

Also Published As

Publication number Publication date
JP2008509550A (ja) 2008-03-27
TW200616182A (en) 2006-05-16
KR20070040835A (ko) 2007-04-17
CN1993596B (zh) 2011-04-20
WO2006016293A1 (en) 2006-02-16
EP1797388A1 (en) 2007-06-20
CN1993596A (zh) 2007-07-04

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Owner name: KONINKLIJKE PHILIPS ELECTRONICS N V, NETHERLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NICOLE, CELINE;LASANCE, CLEMENS J.M.;PRINS, MENNO WILLEM JOSE;AND OTHERS;REEL/FRAME:018829/0630

Effective date: 20060302

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