US20070110559A1 - Integrated liquid cooling system - Google Patents

Integrated liquid cooling system Download PDF

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Publication number
US20070110559A1
US20070110559A1 US11/308,833 US30883306A US2007110559A1 US 20070110559 A1 US20070110559 A1 US 20070110559A1 US 30883306 A US30883306 A US 30883306A US 2007110559 A1 US2007110559 A1 US 2007110559A1
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US
United States
Prior art keywords
rotor
cooling system
liquid cooling
heat
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/308,833
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English (en)
Inventor
Tay-Jian Liu
Chuen-Shu Hou
Chao-Nien Tung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOU, CHUEN-SHU, LIU, TAY-JIAN, TUNG, CHAO-NIEN
Publication of US20070110559A1 publication Critical patent/US20070110559A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D1/00—Non-positive-displacement machines or engines, e.g. steam turbines
    • F01D1/34—Non-positive-displacement machines or engines, e.g. steam turbines characterised by non-bladed rotor, e.g. with drilled holes
    • F01D1/36—Non-positive-displacement machines or engines, e.g. steam turbines characterised by non-bladed rotor, e.g. with drilled holes using fluid friction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00—Pumping installations or systems
    • F04D13/02—Units comprising pumps and their driving means
    • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0673—Units comprising pumps and their driving means the pump being electrically driven the motor being of the inside-out type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/04—Shafts or bearings, or assemblies thereof
    • F04D29/046—Bearings
    • F04D29/047—Bearings hydrostatic; hydrodynamic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/12—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas
    • H02K5/128—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas using air-gap sleeves or air-gap discs
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/08—Structural association with bearings
    • H02K7/085—Structural association with bearings radially supporting the rotary shaft at only one end of the rotor
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/08—Structural association with bearings
    • H02K7/086—Structural association with bearings radially supporting the rotor around a fixed spindle; radially supporting the rotor directly
    • H02K7/088—Structural association with bearings radially supporting the rotor around a fixed spindle; radially supporting the rotor directly radially supporting the rotor directly
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/14—Structural association with mechanical loads, e.g. with hand-held machine tools or fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to a liquid cooling system for dissipation of heat from heat-generating components, and more particularly to an integrated liquid cooling system suitable for removing heat from electronic components of computers.
  • the heat-absorbing member, the heat-dissipating member and the pump are connected together generally by a plurality of connecting tubes so as to form the heat transfer loop.
  • the typical liquid cooling system has a big volume and occupies more room in a computer system, and is not adapted to the small size necessary for a personal computer.
  • the liquid cooling system has many connecting tubes with a plurality of connections, which are prone to leakage of the coolant so giving the system low reliability and high cost.
  • the heat-absorbing member, the heat-dissipating member and the pump are to be located at different locations when mounted to the computer system. In this situation, mounting of the liquid cooling system to the computer system or demounting of the liquid cooling system from the computer system is tiresome and time-consuming work. In addition, vibration and noise produced by the reciprocating pump adversely affect the heat-generating component and the computer system.
  • An integrated liquid cooling system in accordance with an embodiment for removing heat from a heat-generating electronic component includes a base, a pump mounted in the base and a heat-dissipating member communicating with the pump and coupling with the base.
  • the pump includes a casing having a chamber.
  • a rotor, a partition seat and a stator are in turn received in the chamber.
  • a top cover is attached on the casing.
  • the casing includes a bottom plate absorbing heat generated by the electronic component.
  • a plurality of pairs of interconnecting surfaces are formed between the partition seat and the rotor and the bottom plate, one surface of the at least one pair of interconnecting surfaces forming a plurality of grooves or protrusions, thereby forming a fluid film therebetween for dynamically supporting thrust on the rotor during rotation of the rotor.
  • FIG. 1 is an assembled, isometric view of a liquid cooling system in accordance with a preferred embodiment of the present invention
  • FIG. 2 is an exploded view of FIG. 1 , but shown from another aspect
  • FIG. 3 is an isometric view of a heat-dissipating member of the liquid cooling system of FIG. 2 ;
  • FIG. 4 is an exploded view of a pump of the liquid cooling system of FIG. 2 ;
  • FIG. 5 is a view similar to FIG. 4 , but shown from a different aspect
  • FIGS. 6-8 , 11 , 14 are isometric views of a rotor in accordance with other embodiments.
  • FIG. 9 is an exploded view of a pump of the liquid cooling system of FIG. 2 with a minor modification
  • FIGS. 10 , 12 - 13 are isometric views of a partition seat in accordance with other embodiments.
  • FIG. 15 is an exploded view of a pump of a liquid cooling system in accordance with a second embodiment
  • FIG. 16 is an exploded view of a pump of a liquid cooling system in accordance with a third embodiment
  • FIG. 17 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fourth embodiment
  • FIG. 18 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fifth embodiment.
  • FIG. 19 is an assembled, cross-sectional view of the pump and the base of FIG. 18 .
  • FIG. 1 and FIG. 2 illustrate a liquid cooling system in accordance with a preferred embodiment of the present invention.
  • the liquid cooling system includes a base 10 , a pump 20 mounted in the base 10 , and a heat-dissipating member 30 communicating with the pump 20 and coupling with the base 10 .
  • the base 10 , the pump 20 and the heat-dissipating member 30 are connected together in series without any connecting tubes.
  • a heat transfer loop is formed by the base 10 , the pump 20 and the heat dissipating member 30 .
  • a coolant such as water is filled into the pump 20 and is circulated through the heat transfer loop under force from the pump 20 .
  • the base 10 is made from Polyethylene (PE) or Acrylonitrile Butadiene Styrene (ABS), and has a rectangular configuration.
  • the base 10 defines an opening 100 in a central portion thereof for receiving and securing the pump 20 therein.
  • the base 10 forms a pair of ears 12 extending from left and right sides thereof, wherein a pair of mounting holes 120 is defined in each ear 12 for receiving screws 40 with springs 42 therein.
  • Annular rings 44 are used to snap into recesses (not labeled) defined in lower portions of the screws 40 thereby to attach the screws 40 and the springs 42 to the base 10 before the liquid cooling system is mounted on a supporting member (not shown), for example, a printed circuit board on which a heat-generating electronic component is mounted.
  • a pair of rectangular slots 102 , 104 is symmetrically defined at two opposite sides of the base 10 beside the opening 100 .
  • a pair of rectangular channels 106 , 108 is respectively defined between the opening 100 and the slots 102 , 104 .
  • the channels 106 , 108 communicate the opening 100 with the slots 102 , 104 .
  • the pump 20 comprises a hollow casing 21 , a magnetic rotor 22 , a partition seat 23 , a stator 24 and a top cover 25 hermetically attached to a top end of the casing 21 .
  • the casing 21 is made of a metallic material with good heat conductivity, and defines a chamber 212 for receiving the rotor 22 , the partition seat 23 and the stator 24 one on top of the other in that order therein.
  • the casing 21 comprises a bottom plate 214 having a blind hole 213 defined in a central portion thereof.
  • the bottom plate 214 serves as a heat-absorbing plate to contact with the heat-generating electronic component and absorb heat generated by the electronic component.
  • An inlet 26 corresponding to the channel 106 of the base 10 and an outlet 27 corresponding to the channel 108 of the base 10 are formed at two opposite sides of an outer surface of the casing 21 , so that the coolant is capable of entering into casing 21 via the inlet 26 and exiting the casing 21 via the outlet 27 .
  • the magnetic rotor 22 has a hollow cylindrical configuration and is mounted in the chamber 212 of the casing 21 .
  • the rotor 22 includes an impeller having a wall 220 and a substrate 227 connecting with a bottom end of the wall 220 , and a magnetic ring 222 securely abutting against an inner surface of the wall 220 of the impeller.
  • An upper axle 226 extends upwardly from a center of the substrate 227 of the impeller.
  • a lower axle 228 extends downwardly from the center of the substrate 227 of the impeller, for engaging in the blind hole 213 of the bottom plate 214 of the casing 21 . Referring to FIGS.
  • an agitator 223 is formed on a bottom surface of the substrate 227 and received in the chamber 212 of the casing 21 , for agitating the coolant of the chamber 212 .
  • the agitator 223 comprises a plurality of agitating plates 225 .
  • the shape of the agitating plate 225 is linear (shown in FIG. 6 ).
  • the agitating plates 225 may have a curvilinear configuration (shown in FIGS. 7-8 ), wherein the agitating plates 225 of FIG. 8 are configured circularly around the lower axle 228 without connection with the lower axle 228 .
  • the impeller forms a plurality of plate-shaped vanes 224 extending radially and outwardly from an outer surface of the wall 220 . When the rotor 22 rotates, the plate-shaped vanes 224 agitate the coolant in the chamber 212 of the casing 21 , for providing a pressure to the coolant and to thereby circulate the coolant in the liquid cooling system.
  • the partition seat 23 is mounted between the rotor 22 and the stator 24 for isolating the coolant from the stator 24 to prevent the coolant from entering the stator 24 and short-circuiting the stator 24 .
  • the partition seat 23 comprises a cylindrical body 231 having an outer circumferential surface mating with the magnetic ring 222 .
  • the body 231 has an inner space 230 and an annular plate 233 extending outwardly from a top of the cylindrical body 231 .
  • a shaft 236 extends upwardly from a center of a bottom portion 232 of the cylindrical body 231 .
  • a mating hole 238 is defined in a center of the bottom portion 232 , for receiving the upper axle 226 of the rotor 22 therein.
  • the rotor 22 mates with the casing 21 and the partition seat 23 to form a plurality of interconnecting surfaces therebetween, such as between a bottom surface of the annular plate 233 and a top surface of the wall 220 of the rotor 22 , and between the outer surface of the body 231 of the partition seat 23 and the inner surface of the magnetic ring 222 of the rotor 22 , between a bottom surface of the substrate 227 of the rotor 22 and a top surface of the bottom plate 214 of the casing 21 , and between an outer surface of the lower axle 228 and an inner surface of the blind hole 213 .
  • one surface of the at least one pair of interconnecting surfaces forms a plurality of dynamic pressure generating grooves or protrusion means, thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during rotation of the rotor 22 .
  • a plurality of dynamic pressure generating grooves 235 is formed on the outer circumferential surface of the body 231 mating with the smooth inner surface of the magnetic ring 222 of the impeller.
  • the plurality of grooves 235 has a herringbone groove pattern.
  • the herringbone groove pattern of the radial dynamic pressure generating grooves 235 are so formed as to provide a pumping action for thrusting the coolant between the outer circumferential surface of the body 231 and the inner surface of the magnetic ring 222 of the rotor 22 as the rotor 22 rotates, thereby forming a fluid film therebetween for dynamically supporting a radial thrust on the impeller.
  • the thrust dynamic pressure generating grooves 235 may be formed on the inner surface of the magnetic ring 222 of the rotor for mating with the outer surface of the body 231 which is smooth according to the modification.
  • the dynamic pressure generating grooves 235 of the partition seat 23 of FIGS. 4-5 may be replaced by a plurality of protrusions 234 which are formed on the outer circumferential surface of the body 231 mating with the smooth inner surface of the magnetic ring 222 of the impeller to form a fluid film therebetween for dynamically supporting a radial thrust on the impeller.
  • a plurality of dynamic pressure generating grooves 237 is formed on the bottom surface of the annular plate 233 engaging with the smooth top surface of the wall 220 of the impeller of FIG. 5 .
  • the plurality of grooves 237 has a herringbone groove pattern.
  • the herringbone groove pattern of the dynamic pressure generating grooves 237 are so formed as to provide a pumping action for thrusting the coolant toward the bottom surface of the annular plate 233 of the partition seat 23 and the top surface of the impeller as the rotor 22 rotates, thereby forming a fluid film therebetween for dynamically supporting an axial thrust on the impeller.
  • the dynamic pressure generating grooves 237 is formed on the bottom surface of the bottom portion 232 engaging with the smooth top surface of the substrate 227 of the rotor 22 .
  • the dynamic pressure generating grooves 237 may be formed on a bottom surface of the substrate 227 .
  • the dynamic pressure generating grooves (not shown) may be formed on the top surface of the wall 220 of the impeller to engage with the smooth bottom surface of the annular plate 233 of the partition seat 23 .
  • the grooves formed on the top surface of the wall 220 of the impeller may be replaced by a plurality of protrusions 2222 (shown in FIG. 9 ), thereby forming a fluid film between the top surface of the wall 220 and the smooth bottom surface of the annular plate 233 of the partition seat 23 for dynamically supporting an axial thrust on the impeller.
  • the stator 24 is received in the space 230 of the partition seat 23 .
  • the stator 24 comprises a cylindrical center portion 241 having a center hole 243 defined therein, six generally T-shaped pole members 240 extending radially and outwardly from the center portion 241 .
  • the center hole 243 of the center portion 241 fittingly receives the shaft 236 of the partition seat 23 .
  • Each pole member 240 of the stator 24 is surrounded by a coil 242 .
  • a printed circuit board (not shown) is mounted on a top of the center portion 241 and electrically connects with the coils of the stator 24 .
  • the top cover 25 defines a center hole 250 therein, for providing passage of lead wires of the printed circuit board therethough. An edge of the top cover 25 hermetically contacts with the top of the casing 21 .
  • the heat-dissipating member 30 includes a plurality of metal fins 301 , a plurality of heat-dissipating conduits 304 , and a pair of opposite fluid tanks 302 , 303 connected to ends of the heat-dissipating conduits 304 .
  • the fluid tanks 302 , 303 have openings 3020 , 3030 corresponding to openings 1020 , 1040 of the slots 102 , 104 of the base 10 .
  • the pump 20 is mounted in the center opening 100 of the base 10 , wherein the inlet 26 and the outlet 27 are respectively received in the channels 106 , 108 , and a pair of blocks 110 , 112 surrounding around the inlet 26 and the outlet 27 is clamped in the channels 106 , 108 , for fixing the inlet 26 and the outlet 27 to the channels 106 , 108 .
  • the inlet 26 and the outlet 27 communicate with the slots 102 , 104 , respectively.
  • the heat-dissipating member 30 is mounted on the base 10 , wherein the openings 3020 , 3030 of the fluid tanks 302 , 303 are communicated with the openings 1020 , 1040 of the slots 102 , 104 , respectively, so that the fluid tanks 302 , 303 of the heat-dissipating member 30 are in fluid communication with the slots 102 , 104 of the base 10 .
  • the base 10 , the pump 20 and the heat-dissipating member 30 are connected together without any connecting tubes, and the pump 20 is in fluid communication with both the base 10 and the heat-dissipating member 30 so as to drive the coolant to circulate through the chamber 212 of the pump 20 , the slots 102 , 104 of the base 10 and the fluid tanks 302 , 303 and the conduits 304 of the heat-dissipating member 30 .
  • the combination of the base 10 , the pump 20 and the heat-dissipating member 30 is fixed to the printed circuit board such that the bottom plate 214 of the pump 20 intimately contacts with the electronic component on the printed circuit board.
  • the coils 242 of the stator 24 are powered firstly to drive the magnetic ring 222 to rotate.
  • the impeller is driven to rotate with the magnetic ring 222 .
  • the impeller thus rotates with the plate-shaped vanes 224 to circulate the coolant in the liquid cooling system.
  • heat generated by the electronic component is absorbed by the bottom plate 214 of the pump 20 and then is transferred to the coolant contained in the chamber 212 of the casing 21 of the pump 20 .
  • the rotatable impeller quickly agitates the coolant via the plate-shaped vanes 224 thereof and forces the coolant to circulate in the liquid cooling system.
  • the coolant absorbing the heat has a higher temperature and is driven out of the casing 21 of the pump 20 via the outlet 27 , and flows to the heat-dissipating member 30 via the slot 104 of the base 10 and the fluid tank 303 of the heat-dissipating member 30 . Thereafter, the coolant flows to the fluid tank 302 through the conduits 304 where the heat is dissipated to ambient air via the fins 301 . After releasing the heat, the coolant having a lower temperature is brought back to the chamber 212 of the pump 20 via the inlet 26 , thus continuously transporting the heat away from the electronic component.
  • FIG. 15 shows a pump 20 in accordance with a second embodiment.
  • the pump 20 of the second embodiment is similar to that of the previous preferred embodiment.
  • a magnetic ring 222 ′ replaces the magnetic ring 222 of the rotor 22 of the previous preferred embodiment.
  • the magnetic ring 222 ′ is embedded in the top annular surface of the substrate 227 of the rotor 22 and abuts against an inner surface of the wall 220 ′.
  • the magnetic ring 222 ′ is so configured as to reduce weight of the rotor 22 .
  • the partition seat 23 has a larger inner space 230 ′ than the inner space 230 of the previous preferred embodiment.
  • one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 and the casing 21 may form a plurality of dynamic pressure generating grooves or protrusion means 234 , 2222 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during rotation of the rotor 22 .
  • FIG. 16 shows a pump 20 in accordance with a third embodiment.
  • the pump 20 of the third embodiment is similar with that of the previous preferred embodiment of FIG. 5 .
  • a rotor 22 ′ replaces the rotor 22 .
  • the rotor 22 ′ includes an annular impeller having a wall 220 , and a magnetic ring 222 securely abutting against the inner surface of the wall 220 of the impeller.
  • the impeller forms a plurality of plate-shaped vanes 224 extending radially and outwardly from an outer surface of the wall 220 .
  • An agitator 223 in a form like spokes is formed at a bottom of the rotor 22 ′ below the magnetic ring 222 and received in the chamber 212 of the casing 21 , for agitating the coolant of the chamber 212 .
  • the agitator 223 comprises a plurality of agitating plates 225 extending radially and outwardly around a center hole 221 of the rotor 22 to connect an inner surface of the wall 220 .
  • the partition seat 23 forms a lower shaft 238 ′ at a center of the bottom portion 232 thereof, for passing through the hole 221 of the rotor 22 ′ and engaging in the blind hole 213 of the bottom plate 214 of the casing 21 .
  • one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 ′ and the casing 21 may form a plurality of dynamic pressure generating grooves 235 or protrusion means 234 , 2222 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of the rotor 22 ′.
  • FIG. 17 shows a pump 20 and a base 10 ′ in accordance with a fourth embodiment.
  • a base 10 ′ replaces the base 10 of the aforementioned embodiments.
  • the base 10 ′ forms joint flanges 105 , 107 at a top of the slots 102 , 104 thereof, for hermetically engaging in the openings 3020 , 3030 of the fluid tanks 302 , 303 of the heat-dissipating member 30 .
  • one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 and the casing 21 may form a plurality of dynamic pressure generating grooves (not shown) or protrusion means 234 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of the rotor 22 .
  • FIGS. 18-19 show a pump 20 ′ and a base 10 ′ in accordance with a fifth embodiment.
  • a pump 20 ′ replaces the pump 20 of the aforementioned embodiments and the base 10 ′ is the same as the base 10 ′ of the fourth embodiment.
  • Most parts of the pump 20 ′ of the fifth embodiment are the same as the aforementioned embodiments.
  • a main difference is that in the fifth embodiment the pump 20 ′ comprises a casing 21 ′ having a plate-shaped configuration, while in the aforementioned embodiments the casing 21 has a cylindrical chamber.
  • the casing 21 ′ comprises a disk-like plate 214 ′ having a top surface and a bottom surface. The bottom surface contacts with the heat-generating electronic component and absorbs the heat generated by the electronic component.
  • a protrusion portion 215 ′ extends upwardly from the top surface of the plate 214 ′, for extending into the base 10 ′ and hermetically engaging in the opening 100 of the base 10 ′.
  • the protrusion portion 215 ′ defines a blind hole 216 ′ in a central portion thereof, for receiving the lower axle 228 of the rotor 22 therein.
  • one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 and the casing 21 may form a plurality of dynamic pressure generating grooves 235 or protrusion means 2222 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of the rotor 22 .
  • the magnetic rotor 22 , the partition seat 23 , the stator 24 are sequentially mounted in the opening 100 .
  • the top cover 25 is secured to the base 10 ′ and covers a top of the opening 100 .

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
US11/308,833 2005-11-16 2006-05-12 Integrated liquid cooling system Abandoned US20070110559A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2005101015024A CN100468710C (zh) 2005-11-16 2005-11-16 整合式液冷散热装置
CN200510101502.4 2005-11-16

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US20070110559A1 true US20070110559A1 (en) 2007-05-17

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US20190307019A1 (en) * 2018-03-30 2019-10-03 Nidec Corporation Cooling apparatus
US20190307020A1 (en) * 2018-03-30 2019-10-03 Nidec Corporation Cooling apparatus
CN112696382A (zh) * 2019-10-23 2021-04-23 建准电机工业股份有限公司 薄型泵
US11391520B2 (en) * 2019-08-13 2022-07-19 Shenzhen APALTEK Co., Ltd. Liquid cooling device with water tank structure
GB2622110A (en) * 2022-09-02 2024-03-06 City Univ Of London Pump
WO2024047226A1 (en) * 2022-09-02 2024-03-07 City, University of London Pump

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CN101451531B (zh) * 2007-11-30 2012-07-04 富准精密工业(深圳)有限公司 泵
CN110867424B (zh) * 2019-11-21 2022-02-18 上海交通大学 内置微转子强化纳米流体换热的微通道热沉系统
CN113190926B (zh) * 2021-04-20 2023-02-10 西安理工大学 一种含非金属夹杂物的微凸体接触的建模方法
CN114307551A (zh) * 2021-12-29 2022-04-12 高邮市环创资源再生科技有限公司 一种高塔废气处理设备

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