US20060248715A1 - Manufacturing method of solid-state image sensing device - Google Patents
Manufacturing method of solid-state image sensing device Download PDFInfo
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- US20060248715A1 US20060248715A1 US11/480,413 US48041306A US2006248715A1 US 20060248715 A1 US20060248715 A1 US 20060248715A1 US 48041306 A US48041306 A US 48041306A US 2006248715 A1 US2006248715 A1 US 2006248715A1
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Definitions
- the present invention relates to a method of manufacturing a solid-state image sensing device.
- a solid-state image sensing device is a photo-electric conversion device for converting an optical signal of image into an electric signal by using an array of pixels.
- an image sensing element On a first face of the substrate of the solid-state image sensing device, an image sensing element is placed with its light reception face oriented upward.
- a filter Over the image sensing element, a filter is provided and a lens is provided on the filter in a bottom-up order to form a stack supported on a frame.
- the frame is placed on the first face in such a way that the position of the lens coincides with the position of the image sensing element.
- a technology prescribing a relation between the position of an image sensing element and the position a lens on a solid-state image sensing device is described in documents such as Japanese Patent Laid-open No. 2001-245217.
- a protrusion for positioning use is provided at the bottom of a mirror frame of a image-taking module having a small size, and a hole to be engaged with the protrusion for positioning use is provided at a location relative to a reference position on a substrate for installing the frame.
- a protrusion on the lower face of a cover glass installation pedestal base is engaged with a through hole on a circuit substrate on which the solid-state image sensing device is installed so as to provide a configuration in which the cover glass installation pedestal base is installed at an accurate position on the circuit substrate.
- the inventors of the present invention discovered that the solid-state image sensing device had the following problems.
- the protruding resin raises a problem of formation of resin fins, resin flashes or the like and fills up the position adjustment hole. If the frame is mounted on the second face in this state, a small gap is formed between the frame and the second face. As a result, there is raised another problem that small foreign matters are injected into the frame by way of the small gap and stuck on an array of sensors, much increasing a rate of generation of black-point defects. A high rate of generation of black-point defects in turn lowers the yield of a camera module to an extremely small value. In order to avoid these problems, there is conceived a solution to temporarily fill up the position adjustment hole with a material prior to the encapsulation process.
- a hole formed on a substrate as a hole for adjusting the position of an image sensing element with respect to a frame is provided outside an encapsulation body in a process of manufacturing a solid-state image sensing device.
- a position adjustment pin provided on a frame as a pin for adjusting the position of an image sensing element with respect to the frame as well as a hole formed on a substrate are provided outside a junction face between the frame and the substrate in a process of manufacturing a solid-state image sensing device.
- the yield of the solid-state image sensing device can be increased.
- FIG. 1 is a diagram showing a typical cross section of a solid-state image sensing device implemented by an embodiment of the present invention
- FIG. 2 is a diagram showing a top view of an entire second face of a wiring substrate mother board used in a process to manufacture the solid-state image sensing device shown in FIG. 1 ;
- FIG. 3 is a diagram showing a top view of an entire first face on a side opposite to the second face shown in FIG. 2 ;
- FIG. 4 is a diagram showing a cross section along an X 1 -X 1 line shown in FIGS. 2 and 3 ;
- FIG. 5 is a diagram showing an entire top view of electronic components mounted on the first face shown in FIG. 3 ;
- FIG. 6 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XA shown in FIG. 5 ;
- FIG. 7 is a diagram showing a top view of the entire first faces of two wiring substrate mother boards including a state of an encapsulation body right after an encapsulation process following the state shown in FIG. 5 ;
- FIG. 8 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XB shown in FIG. 7 ;
- FIG. 9 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow YA shown in FIG. 7 ;
- FIG. 10 is a diagram showing an entire top view after a batch process in another embodiment of the present invention.
- FIG. 11 is a diagram showing an entire top view after a batch process in a further embodiment of the present invention.
- FIG. 12 is a diagram showing a top view of the entire first face of the wiring substrate mother board after a process following the state shown in FIG. 7 ;
- FIG. 13 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XC shown in FIG. 12 ;
- FIG. 14 is a side-view diagram showing main components of the wiring substrate mother board after a manufacturing process following the state shown in FIG. 12 ;
- FIG. 15 is a diagram showing a top view seen from the upper face of a lens barrel
- FIG. 16 is a diagram showing a top view of the rear face of the lens barrel shown in FIG. 15 ;
- FIG. 17 is a diagram showing a side view of the lens barrel shown in FIG. 15 ;
- FIG. 18 is a diagram showing a top view of the entire second face of the wiring substrate mother board after a process to mount a lens barrel;
- FIG. 19 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XD shown in FIG. 18 ;
- FIG. 20 is an enlarged diagram showing main components of the wiring substrate mother board shown in FIG. 18 ;
- FIG. 21 is a diagram partially showing a cross section at a position on an X 2 -X 2 line shown in FIG. 20 ;
- FIG. 22 is an explanatory diagram showing a process of bonding lens barrels
- FIG. 23 is an explanatory diagram showing a process of bonding lens barrels when seeing FIG. 22 in a side-face direction;
- FIG. 24 is a diagram showing a top view of a unit area of a metallic mask used in the bonding process shown in FIG. 22 ;
- FIG. 25 is a diagram showing a cross section along an X 3 -X 3 line shown in FIG. 24 ;
- FIG. 26 is a diagram showing a cross section along a Y 2 -Y 2 line shown in FIG. 24 ;
- FIG. 27 is a diagram showing a cross section at a position on the Y 2 -Y 2 line shown in FIG. 24 with the metallic mask removed from FIG. 26 ;
- FIG. 28 is an explanatory diagram showing a process of bonding a lens barrel following the process shown in FIG. 22 ;
- FIG. 29 is an explanatory diagram showing a process of bonding a lens barrel following the process shown in FIG. 28 ;
- FIG. 30 is a diagram showing a top view of the entire second face of the wiring substrate mother board after a process to stick a protection film
- FIG. 31 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow YB shown in FIG. 30 ;
- FIG. 32 is a diagram showing a top view of the entire first face of the wiring substrate mother board after a full dicing process
- FIG. 33 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow YC shown in FIG. 32 ;
- FIG. 34 is a diagram showing a side view in the course of a process to manufacture the solid-state image sensing device following the state shown in FIG. 33 ;
- FIG. 35 is a diagram showing a side view in the course of a process to manufacture the solid-state image sensing device following the state shown in FIG. 34 .
- each embodiment is explained by splitting the embodiment into a plurality of sections or a plurality of sub-embodiments and, unless otherwise specified, the sections or the sub-embodiments are not unrelated to each other. Instead, one section or one sub-embodiment is an implementation obtained by modifying a portion or all of another section or another sub-embodiment, or one section or one sub-embodiment is related to another section or another sub-embodiment in that the former is a detailed or supplementary explanation of the latter.
- a quantity mentioned in the embodiments described below does not mean a specific magnitude of the quantity, but may be greater or smaller than the specific magnitude of the quantity unless it is specified explicitly in particular or it is obvious from a known principle that the quantity is limited to the specific magnitude of the quantity.
- the quantity represents the number of elements, the number of items, a numerical value, an amount, a range and the like.
- a configuration element including an element step and the like in the embodiments described below is of course not necessarily required absolutely unless it is specified explicitly in particular or it is obvious from a known principle that the configuration element is considered to be absolutely required.
- the shape, a positional relation or the like of a configuration element or the like mentioned in the embodiments described below in essence implies a shape, a positional relation or the like, which is close or similar to the mentioned shape, the mentioned positional relation or the like unless it is specified explicitly in particular or it is obvious from a known principle that the mentioned shape, the mentioned positional relation or the like conceivably means neither other shapes, other positional relations nor the like.
- a hatched portion may be included, even if the diagram is a diagram showing a top view, in order to make the drawing easy to inspect.
- identical members shown in different drawings used for explaining embodiments are basically denoted by the same reference numeral, and their explanation is given only once. The embodiments of the present invention are explained in detail by referring to diagrams as follows.
- the solid-state image sensing device implemented by an embodiment is a camera module employed in a picture input unit of an apparatus such as a portable telephone, a TV telephone, a PC camera, a PDA (Personal Digital Assistant), an optical mouse, a door phone, a monitoring camera, a fingerprint recognition apparatus or a toy.
- an apparatus such as a portable telephone, a TV telephone, a PC camera, a PDA (Personal Digital Assistant), an optical mouse, a door phone, a monitoring camera, a fingerprint recognition apparatus or a toy.
- CMOS Complementary Metal Oxide Semiconductor
- CIF Common Immediate Format
- FIG. 1 is a diagram showing a typical cross section of an embodiment implementing a CM (camera module) of the CMOS sensor type.
- a wiring substrate 1 A of this camera module CM is a 4-layer print wiring substrate using typically resin of the glass epoxy group as an electrical-insulation material.
- the wiring substrate 1 A has a second face serving as a face for mounting optical components and a first face on the side opposite to the second face.
- the first face is a face for mounting system components.
- a semiconductor chip 2 A for optical-sensor use is mounted with its principal face oriented upward.
- the semiconductor chip 2 A is known as a second electronic component, which is referred to hereafter simply as a sensor chip.
- the principal face of the sensor chip 2 A is a light reception face or a face on which light reception elements are mounted.
- a CMOS image sensor circuit is formed on the principal face of the sensor chip 2 A.
- This CMOS image sensor circuit is made in a CMOS process used as a standard process in a process to fabricate a semiconductor device.
- the CMOS image sensor circuit has a sensor array and an analog circuit for processing an electrical signal generated by the sensor array.
- the sensor array comprises a plurality of light reception elements regularly arranged in the longitudinal and transversal directions on the principal face of the sensor chip 2 A.
- Each of the light reception elements is a pixel formed in the CMOS image sensor circuit and has a photo-electric conversion function to convert an incident optical signal into an electrical signal.
- the light reception element typically, a photo diode or a photo transistor is used.
- a plurality of bonding pads is provided on the outer circumference of the principal face of the sensor chip 2 A. Arranged along the outer circumference, the bonding pads are each formed as a drawn electrode of the CMOS image sensor circuit.
- a bonding pad is electrically connected to a wire and land (electrode) of the wiring substrate 1 A by a bonding wire 3 A.
- the bonding wire 3 A is made from a material such as gold (Au).
- a lens barrel (frame) 4 is mounted on the optical-component-mounting face of the wiring substrate 1 A to cover the sensor chip 2 A.
- the lens barrel 4 is mounted on the optical-component-mounting face of the wiring substrate 1 A in such a state that the planar position thereof relative to the sensor chip 2 A is adjusted with respect to the sensor chip 2 A.
- the lens barrel 4 is made of an insulation material such as PBT (Poly Butylene Terephthalate).
- the bottom of the foot portion of the lens barrel 4 is bonded substantially on the optical-component-mounting face of the wiring substrate 1 A by using a bonding agent.
- a dashboard 4 A for partitioning upper and lower chambers from each other.
- the opening 4 B is formed at a position exposed to the sensor array of the sensor chip 2 A.
- the opening 4 B is blocked up with an IR filter 5 installed on the dashboard 4 A.
- the IR filter 5 has a function of passing through visible rays but blocking unnecessary infrared rays having frequencies of at least a predetermined value.
- a lens holder (or a lens-holding unit, which is a member of a lens assembly) 6 is installed on the head of the lens barrel 4 to block up an opening of the head of the lens barrel 4 .
- the lens holder 6 and the lens barrel 4 are linked to each other by engaging a screw formed on the inner circumferential face of a cylinder on the head of the lens barrel 4 with another screw formed on an outer circumferential face of the lower portion of the lens holder 6 .
- the state of linking the lens holder 6 to the lens barrel 4 is kept substantially by further coating the outer circumference of the linkage portion of the lens holder 6 and the lens barrel 4 with a bonding agent.
- the lens holder 6 is made of typically the same material as the lens barrel 4 .
- An optical lens 7 is accommodated inside the lens holder 6 in a state of being substantially supported by a back diaphragm made of a metal.
- the optical lens 7 is made of an inexpensive and light material such as plastic and is set at a position exposed to the sensor array on the principal face of the chip sensor 2 .
- a light reception window 6 A having typically a plane circular shape is opened with its relative planar position adjusted with respect to the optical lens 7 .
- An external-field ray of the camera module CM is radiated to the sensor array of the chip sensor 2 A by way of the light reception window 6 A, the optical lens 7 following the light reception window 6 A and the IR filter 5 following the optical lens 7 .
- connection terminals 15 is provided on the optical-component-mounting face of the wiring substrate 1 A.
- the connection terminals 15 are laid out along one side of the wiring substrate 1 A.
- the connection terminals 15 are terminals electrically connecting a circuit inside the camera module CM to an external apparatus.
- the connection terminals 15 are electrically connected to the circuit inside the camera module CM by wires of the wiring substrate 1 A.
- the connection terminals 15 are electrically connected to wires of a flexible wiring substrate 10 by a junction member 9 such as an ACF (Anisotropic Conductive Film).
- the flexible wiring substrate 10 is further electrically connected to the external apparatus.
- the other components include a logic-use semiconductor chip 2 B, a memory-use semiconductor chip 2 C and a chip component 11 .
- the logic-use semiconductor chip 2 B is a first electronic component referred to hereafter simply as a logic chip.
- the memory-use semiconductor chip 2 C is also a first electronic component referred to hereafter simply as a memory chip.
- the chip component 11 is also a first electronic component.
- the logic chip 2 B, the memory chip 2 C and the chip component 11 are electronic components for mainly processing an electrical signal generated by the sensor chip 2 A.
- the logic chip 2 B, the memory chip 2 C and the chip component 11 are also electronic components used for constructing a system for controlling the operation of the CMOS image sensor circuit of the sensor chip 2 A.
- the logic chip 2 B includes a circuit formed therein to serve as a processing circuit carrying out digital-signal processing.
- An example of the processing circuit is a DSP (Digital Signal Processor).
- the logic chip 2 B is electrically connected to lands (electrodes) and wires of the wiring substrate 1 A by bonding wires 3 B.
- the memory chip 2 C includes a circuit formed therein to serve as a non-volatile memory circuit.
- An example of the non-volatile memory circuit is an EEPROM (Electrically Erasable Programmable Read Only Memory).
- the memory chip 2 C is also electrically connected to lands (electrodes) and wires of the wiring substrate 1 A by bonding wires 3 C.
- the bonding wires 3 C are made of typically gold (Au).
- the chip component 11 includes elements formed therein to serve as passive elements such as capacitors and resistors. Electrodes of the chip component 11 are joined to lands (electrodes) of the wiring substrate 1 A by typically soldering to form electrical connections with the lands.
- Components such as the logic chip 2 B, the memory chip 2 C, the chip component 11 as well as the bonding wires 3 B and 3 C, which are mounted the system-component-mounting face of the wiring substrate 1 A, are encapsulated by an encapsulation body 12 M.
- the encapsulation body 12 M is made from resin having a heat-curing characteristic. An example of such resin is resin of the epoxy group including silica fillers.
- FIG. 2 is a diagram showing a top view of the entire optical-component-mounting face of the wiring substrate mother board 1 .
- FIG. 3 is a diagram showing a top view of the entire system-component-mounting face on a side opposite to the optical-component-mounting face shown in FIG. 2 .
- FIG. 4 is a diagram showing a cross section along an X 1 -X 1 line shown in FIGS. 2 and 3 . It is to be noted that, in FIGS. 1 and 2 , notation X denotes a first direction and notation Y denotes a second direction perpendicular to the first direction X.
- the wiring substrate mother board 1 is the mother board of the wiring substrate 1 A.
- the plane shape of the wiring substrate mother board 1 is typically rectangular.
- the thickness of the wiring substrate mother board 1 is extremely small, having a typical value of the order of 0.3 mm.
- the wiring substrate mother board 1 has a structure comprising 4 wiring layers having typically resin of the glass epoxy group as a material for electrically insulating the wiring layers from each other.
- the wiring substrate mother board 1 is formed by adoption of typically a subtractive method. Typically, copper (Cu) is used as a wiring material of the wiring substrate mother board 1 .
- module regions MR each used for creation of a camera module are arranged regularly on the wiring substrate mother board 1 with a uniform orientation as shown as dashed-line blocks in FIGS. 2 and 3 .
- Each of the module regions MR is a unit area required for manufacturing a camera module CM.
- a plurality of connection terminals 15 is laid out to form an array in each of the module regions MR on the optical-component-mounting face.
- lands (electrodes) and other members are laid out in each of the module regions MR on the optical-component-mounting face. The lands are connected to the bonding wires 3 A and a chip-mounting pattern on which the sensor chip 2 A is mounted.
- connection terminals 15 , the chip-mounting patterns and the lands are made of typically copper, which is also used as the wire material cited above.
- the surfaces of the connection terminals 15 , the chip-mounting patterns and the lands are subjected to a metal-plating process using metals such as nickel (Ni) and gold (Au).
- a plurality of through holes 16 each called a boss hole is formed.
- the through holes 16 are used for adjusting the position of the lens barrel 4 with respect to the wiring substrate mother board 1 .
- a positioning pin provided on the lens barrel 4 is inserted into the through hole 16 provided on the wiring substrate mother board 1 .
- the positioning pin provided on the lens barrel 4 is referred to as a boss pin.
- a through hole 16 is positioned outside a module region MR.
- the through hole 16 is provided at a position outside the bottom of the foot of the lens barrel 4 as will be described later. Also as will be described later, on the system-component-mounting surface, the through hole 16 is provided at a position outside a region in which the encapsulation body 12 M is formed. For each of the module regions MR, two through holes 16 are provided.
- the two through holes 16 are provided at positions, which sandwich the module region MR, being connected to each other by a diagonal line of the module region MR. It is to be noted that, on the inner circumferential face of the through hole 16 and on areas surrounding the opening of the through hole 16 are coated with a conductor material in the same way as a through hole of an ordinary print wiring substrate.
- the conductor material is the same material as the material for making wires.
- a plurality of conductor patterns 17 A each having typically a plane rectangular shape is formed in areas in close proximity to the four sides of the optical-component-mounting face and system-component-mounting face of the wiring substrate mother board 1 .
- a plurality of conductor patterns 17 B each having typically a plane rectangular shape is laid out to form an array in an area in close proximity to one side of the system-component-mounting face at predetermined intervals.
- the conductor patterns 17 B are provided as patterns for making resin (used as an encapsulation material), which has been hardened inside a runner, easy to peel off and remove from the wiring substrate mother board 1 .
- Encapsulation groups are divided into groups each associated with a line for which one of the conductor pattern 17 B exists.
- the conductor patterns 17 A and 17 B are made of typically copper.
- the surfaces of the conductor patterns 17 A and 17 B are subjected to a metal-plating process using metals such as nickel (Ni) and gold (Au).
- a through hole 18 A used for adjusting the position of the wiring substrate mother board 1 with respect to the manufactured device.
- FIGS. 5 and 6 in each of the module regions MR on the system-component-mounting area of the wiring substrate mother board 1 , the logic chip 2 B and the memory chip 2 C are mounted after a process of mounting the chip component 11 . Subsequently, the logic chip 2 B and the memory chip 2 C are electrically connected to wires of the wiring substrate mother board 1 in the module region MR by bonding wires 3 B and 3 C respectively.
- FIG. 5 is a diagram showing an entire top view after the chip component 11 is mounted on the face shown in FIG. 3 .
- FIG. 6 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow XA shown in FIG. 5 .
- the logic chip 2 B and the memory chip 2 C are shown collectively as a single semiconductor chip.
- the wiring substrate mother board 1 is held by using upper and lower encapsulation metal molds in a state of being sandwiched by the upper and lower encapsulation metal molds in such a way that the logic chip 2 B, the memory chip 2 C as well as the bonding wires 3 B and 3 C are placed in a cavity between the upper and lower encapsulation metal molds, the system components including the logic chip 2 B, the memory chip 2 C and the chip component 11 , which are mounted on the system-component-mounting face, are encapsulated by an encapsulation material, which is typically resin having a heat-curing characteristic.
- An example of such resin is resin of the epoxy group including silica fillers.
- FIG. 7 is a diagram showing a state of a batch encapsulation body 12 MA right after the encapsulation process.
- FIG. 8 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow XB shown in FIG. 7 .
- FIG. 9 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow YA shown in FIG. 7 .
- FIG. 7 is a diagram showing a state with the encapsulation molds seen fluoroscopically.
- FIG. 8 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow XB shown in FIG. 7 .
- FIG. 9 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow YA shown in FIG. 7 .
- FIG. 7 is a diagram showing a state with the encapsulation molds seen fluoroscopically
- FIG. 7 shows a top view of a state of a batch encapsulation body 12 MA, encapsulation materials 12 are each shown as a hatched block in order to make the diagram easy to inspect. Furthermore, in the diagram of FIG. 7 , an encapsulation material 12 MC represents a portion corresponding to an encapsulation material inside a cull, an encapsulation material 12 MR represents a portion corresponding to an encapsulation material inside a runner and an encapsulation material 12 MG represents a portion corresponding to an encapsulation material inside a gate.
- a batch encapsulation method for encapsulating system components in the module regions MR by handling the components as a lump.
- the module regions MR of the wiring substrate mother board 1 are divided into a plurality of groups and the batch encapsulation method is applied to each of the groups by handling components in each group as a lump.
- system components of module regions MR laid out in the second direction Y shown in FIG. 7 are subjected to a batch encapsulation process by using the batch encapsulation bodies 12 MA.
- an encapsulation material 12 injected from a cull is split into a plurality of runners (each serving as an encapsulation-material-supplying passage) and gates (each serving as an encapsulation-material-supplying passage) for each of the groups.
- the encapsulation material 12 is then injected into a cavity for forming an encapsulation body in each of the groups via each runner and gate.
- a typical reason why the batch encapsulation bodies 12 MA are each provided at a location not superposed on through holes 16 is explained as follows. If a batch encapsulation body 12 MA is superposed on a through hole 16 , the encapsulation material 12 inevitably flows out from the system-component-mounting face to the optical-component-mounting face through the through hole 16 in the course of an encapsulation process. Thus, in areas surrounding the opening of the through hole 16 on the optical-component-mounting face, resin fins, resin flashes and the like are formed, and the through hole 16 is blocked up by the encapsulation material 12 .
- the adhesiveness and state of adhesion between the lens barrel 4 and the optical-component-mounting face deteriorate, forming a small gap between the lens barrel 4 and the optical-component-mounting face.
- foreign matters are injected into the lens barrel 4 by way of the gap and stuck on the sensor array of the sensor chip 2 A, much increasing a rate of generation of black-point defects.
- a high rate of generation of black-point defects raises a problem that the yield of the camera module is lowered to an extremely small value.
- the lens barrel 4 can be well stuck on the optical-component-mounting face without forming a gap, it is possible to reduce the quantity of foreign matters flowing into the lens barrel 4 by way of a gap formed between the lens barrel 4 and the optical-component-mounting face or even possible to completely prevent the foreign matters from flowing into the lens barrel 4 by way of the gap formed between the lens barrel 4 and the optical-component-mounting face.
- the rate of generation of black-point defects caused by introduction of foreign matters can be reduced, the yield of the camera module CM can be increased.
- the batch encapsulation bodies 12 MA are separated from each other in order to prevent the through holes 16 from being covered by the batch encapsulation bodies 12 MA.
- problems related to the through hole 16 can be solved.
- the shrinkage of the batch encapsulation body 12 MA applies a stress to the wiring substrate mother board 1 , inadvertently bending the wiring substrate mother board 1 in some cases.
- the individual batch encapsulation bodies 12 MA are separated from each other.
- the bonding wires 3 A may not be joined well in some cases.
- the batch encapsulation bodies 12 MA are separated from each other in this embodiment. It is thus possible to reduce the amount of bending, twist, etc. As a result, the bondability of the bond wires 3 A can be improved so that the yield of the camera module CM can also be increased as well.
- a configuration for separating the batch encapsulation bodies 12 MA from each other like one shown in FIG. 11 it is possible to solve problems related to through hole 16 and also reduce the magnitude of the stress.
- the wiring substrate mother board 1 is bent toward the center of the longitudinal direction of batch encapsulation bodies 12 MA.
- a depression 12 MA 1 extended from both the long sides of the batch encapsulation body 12 MA to the transversal-direction center of the batch encapsulation body 12 MA is further formed so that the width of the longitudinal-direction center of each batch encapsulation body 12 MA becomes partially smaller.
- the depressions 12 MA 1 are formed on the right and left long sides of a batch encapsulation body 12 MA symmetrically in the left-to-right direction with respect to the right and left long sides.
- each depression 12 MA 1 is formed in a surplus area outside a module region MR.
- the width of the longitudinal-direction center of each batch encapsulation body 12 MA as described above, the magnitude of the stress applied to the wiring substrate mother board 1 due to the shrinkage of each batch encapsulation body 12 MA can be further decreased.
- the amount of bending, twist, etc. resulting in the wiring substrate mother board 1 due to the stress can be further reduced too. Accordingly, the bondability of each bonding wire 3 A can be further improved.
- the position of the depression 12 MA 1 is not limited to the longitudinal-direction center of the batch encapsulation body 12 MA.
- a plurality of depressions 12 MA 1 can be formed at a plurality of positions on the right and left long sides of a batch encapsulation body 12 MA.
- FIG. 12 is a diagram showing a top view of the entire system-component-mounting face of the wiring substrate mother board 1 after the half-dicing process.
- FIG. 13 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow XC shown in FIG. 12 .
- the half-dicing process is carried out, being started from the system-component-mounting face on which the encapsulation bodies 12 A have been formed.
- a plurality of straight-line cut grooves 20 extended in the first direction X is formed, with the straight-line cut grooves 20 being separated from each other by predetermined intervals in the second direction Y on the system-component-mounting face of the wiring substrate mother board 1 .
- the cut grooves 20 are formed by using a dicing saw.
- the cut grooves 20 completely split the batch encapsulation body 12 MA into a plurality of completely separated portions located in the same plurality of module regions MR laid out in the second Y direction. Since the depth of each cut groove 20 is only about 2 ⁇ 3 the depth of the wiring substrate mother board 1 , however, the wiring substrate mother board 1 itself is not completely split.
- the magnitude of the stress applied to the wiring substrate mother board 1 due to the shrinkage of the batch encapsulation body 12 MA can be further decreased.
- bending and twist of the wiring substrate mother board 1 due to the stress are further reduced, whereby the bondability of each bonding wire 3 A can be further improved.
- the yield of the camera module CM can be further increased.
- the depth of the cut groove 20 does not have to reach the system-component-mounting face of the wiring substrate mother board 1 . Even if the depth of the cut groove 20 does not reach the system-component-mounting face of the wiring substrate mother board 1 , the magnitude of the stress applied to the wiring substrate mother board 1 due to the shrinkage of the batch encapsulation body 12 MA can be decreased. In addition, the depth of each cut groove 20 can be set at about half the depth of the batch encapsulation body 12 MA so that the batch encapsulation body 12 MA is not completely split into 2 separated portions. Even in this case, the magnitude of the stress applied to the wiring substrate mother board 1 due to the shrinkage of the batch encapsulation body 12 MA can be decreased.
- FIG. 14 is a side-view diagram showing main components in each module region MR of the wiring substrate mother board 1 after the wire-bonding process.
- FIG. 15 is a diagram showing a top view of the upper face of the lens barrel 4 .
- FIG. 16 is a diagram showing a top view of the rear face of the lens barrel 4 .
- FIG. 17 is a diagram showing a side view of the lens barrel 4 .
- An IR filter 5 has already been installed in the cylinder of the lens barrel 4 .
- the lens barrel 4 has protrusions 4 C, which are formed, being integrated with the lens barrel 4 .
- the protrusions 4 C are each extended all but horizontally on the optical-component-mounting face of the wiring substrate mother board 1 .
- the protrusions 4 C are provided at two corners at the ends of a diagonal line of the lens barrel 4 .
- the protrusions 4 C are provided at the foot of the lens barrel 4 .
- the protrusions 4 C are members used for adjusting the planar position of the lens barrel 4 with respect to the wiring substrate mother board 1 .
- a position adjustment pin 4 C 1 referred to as a boss pin is formed.
- the position adjustment pin 4 C 1 is extended vertically with respect to the optical-component-mounting face of the wiring substrate mother board 1 .
- FIG. 18 is a diagram showing a top view of the entire optical-component-mounting face of the wiring substrate mother board 1 after this lens-barrel-mounting process.
- FIG. 19 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow XD shown in FIG. 18 .
- FIG. 20 is an enlarged diagram showing main components of the wiring substrate mother board 1 shown in FIG. 18 .
- FIG. 21 is a diagram partially showing a partially ruptured cross section at a position on an X 2 -X 2 line shown in FIG. 20 . It is to be noted that 2-dotted-dashed lines L 1 shown in FIG. 21 are each a dicing line along which the camera module is cut out by cutting the wiring substrate mother board 1 in a later process.
- a plurality of lens barrel 4 is mounted at a uniform orientation.
- the position of each of the lens barrels 4 is well adjusted with respect to the wiring substrate mother board 1 by inserting the position adjustment pin 4 C 1 of the protrusion 4 C of the lens barrel 4 into a through hole 16 on the wiring substrate mother board 1 .
- no resin fins, resin flashes and the like are formed in areas surrounding the opening of the through hole 16 as described above.
- the through hole 16 is filled up with the encapsulation material 12 .
- the entire rear face of the lens barrel 4 can be stuck substantially on the optical-component-mounting face of the wiring substrate mother board 1 without forming a gap. It is thus possible to reduce the quantity of foreign matters flowing into the lens barrel 4 or even possible to prevent the foreign matters from flowing into the lens barrel 4 . As a result, since the rate of generation of black-point defects caused by introduction of foreign matters can be reduced, the yield of the camera module CM can be increased.
- the position adjustment pin 4 C 1 of the lens barrel 4 is provided at a position outside the adhesion face of the rear face of the lens barrel 4 .
- the adhesion face is a face stuck to the wiring substrate mother board 1 .
- the position adjustment pin 4 C 1 of the lens barrel 4 is provided at a position outside the adhesion face because, if the position adjustment pin 4 C 1 of the lens barrel 4 is provided on the adhesion face of the rear face of the lens barrel 4 , the position adjustment pin 4 C 1 will serve as an obstacle to a process to coat the rear face of the lens barrel 4 with a bonding agent so that the rear face of the lens barrel 4 cannot be coated well with the bonding agent.
- the position adjustment pin 4 C 1 of the lens barrel 4 is provided at a position outside the adhesion face of the rear face of the lens barrel 4 in this embodiment.
- the adhesion face of the rear face of the lens barrel 4 can be made flat.
- the entire adhesion face of the rear face of the lens barrel 4 can be coated with an adhesion agent uniformly, the entire adhesion face of the rear face of the lens barrel 4 can be stuck substantially on the optical-component-mounting face of the wiring substrate mother board 1 without generating a gap. Accordingly, since the rate of generation of black-point defects caused by introduction of foreign matters into the lens barrel 4 can be reduced, the yield of the camera module CM can be increased.
- the protrusions 4 C of any specific lens barrel 4 are provided at locations separated away from the locations of the protrusions 4 C of a lens barrel 4 adjacent to the specific lens barrel 4 so that the protrusions 4 C of the specific lens barrel 4 and the protrusions 4 C of the adjacent lens barrel 4 do not mutually interfere with each other.
- the lens barrels 4 arranged in the first direction X at positions adjacent to each other can be provided at squeezed intervals.
- the area of the wiring substrate mother board 1 does not increase only because protrusions 4 C are provided on each lens barrel 4 .
- the material cost does not increase and it is therefore possible to suppress the manufacturing cost of the camera module CM at a low level.
- a protrusion 4 C is provided at a corner at one end of a diagonal line of a lens barrel 4 and another protrusion 4 C is provided at another corner at the other end of the diagonal line.
- the cutoff quantity of a protrusion 4 C (that is, the width of each protrusion 4 C to be cut in a later process to cut off the wiring substrate mother board 1 can be reduced to a value smaller than a configuration in which 2 protrusions 4 C protrude off from one side of a lens barrel 4 . It is thus possible to reduce the magnitude of a force applied to the lens barrel 4 in the cutoff process.
- the number of protrusions 4 C per lens barrel 4 is not limited to two. Instead, the number of protrusions 4 C per lens barrel 4 can be changed to any value. For example, the number of protrusions 4 C per lens barrel 4 can be set at one or three. In addition, it is also possible to provide a configuration in which two protrusions 4 C protrude off from one side of a lens barrel 4 .
- FIG. 22 is an explanatory diagram showing a process of bonding lens barrels 4 .
- FIG. 23 is an explanatory diagram showing a process of bonding lens barrels 4 when seeing FIG. 22 in a side-face direction.
- a lens-barrel jig 21 used in the process of bonding lens barrels 4 has a plurality of support depressions 21 A. First of all, a lens barrel 4 is accommodated in each of the support depressions 21 A with the rear face of the lens barrel 4 oriented upward. Then, the accommodated lens barrel 4 is fixed temporarily by vacuum suction.
- the upper face of the metallic mask 22 is coated with a bonding agent 23 having a predetermined quantity.
- the bonding agent 23 is dispersed by a movement of a squeegee 24 . In this way, the bonding agent 23 is dispersed over a plurality of lens barrels 4 through the metallic mask 22 in a single operation, being selectively applied to the adhesion face on the rear face of each of the lens barrels 4 .
- the position adjustment pins 4 C 1 of each lens barrel 4 are each provided at a position outside the adhesion face of the rear face of the lens barrel 4 and, thus, do not exist on the adhesion face of the rear face of the lens barrel 4 . Accordingly, the entire rear face of the lens barrel 4 can be coated with the adhesion agent 23 uniformly.
- the position adjustment pins 4 C 1 of the lens barrel 4 protrude off by way of through holes formed on the metallic mask 22 from the upper face of the metallic mask 22 by a distance of the order of 1 mm. In the process of coating the rear face of each lens barrel 4 with bonding agent 23 , however, the position adjustment pins 4 C 1 are prevented from being coated with the bonding agent 23 .
- a squeegee resembling comb teeth as shown in FIG. 22 is used as the squeegee 24 so that the teeth of the squeegee 24 do not hit the position adjustment pins 4 C 1 , that is, the position adjustment pins 4 C 1 are not coated with the bonding agent 23 .
- the bonding agent 23 it is possible to solve the problem that the lens-barrel jig 21 and the lens barrel 4 are bonded to each other by the bonding agent 23 .
- FIG. 24 is a diagram showing a top view of a unit area of the metallic mask 22 used in the process to bond lens barrels 4 .
- the unit area is an area occupied by one lens barrel 4 .
- FIG. 25 is a diagram showing a cross section along an X 3 -X 3 line shown in FIG. 24 .
- FIG. 26 is a diagram showing a cross section along a Y 2 -Y 2 line shown in FIG. 24 .
- a print area 22 A shown in FIG. 24 as a top view of a frame corresponds to the bonding-agent-coating area on the rear face of the lens barrel 4 .
- the outside and inside of the print area 22 A are used as a mask area 22 B.
- a through hole 22 C is formed to penetrate the metallic mask 22 from the upper face to the lower face.
- the position adjustment pin 4 C 1 of the lens barrel 4 is inserted into the through hole 22 C.
- the print area 22 A of the metallic mask 22 is divided into a network portion 22 A 1 occupying spaces in the upper half in the depth direction of the metallic mask 22 and a hollow portion 22 A 2 occupying the rest of the metallic mask 22 .
- the metallic mask 22 is mounted on the lens-barrel jig 21 in such a way that, in the bonding-agent-coating process, the hollow portion 22 A 2 is exposed to the rear face of the lens barrel 4 .
- the bonding agent 23 applied to the upper face of the metallic mask 22 is injected into the hollow portion 22 A 2 by way of infinitesimal openings of the network portion 22 A 1 as shown by arrow A in FIGS. 25 and 26 .
- the rear face of the lens barrel 4 is then coated with the bonding agent 23 accommodated in the hollow portion 22 A 2 .
- the network portion 22 A 1 is formed by carrying out an etching process on a metal plate used as the basic material of the metallic mask 22 to form a net pattern.
- the hollow portion 22 A 2 is formed by carrying out an etching process to remove a portion of the metal plate used as the basic material of the metallic mask 22 up to a depth ending at a level in the middle of the thickness of the metallic mask 22 .
- a network portion 22 A 1 in the metallic mask 22 holes completely penetrating the metallic mask 22 from the upper face to the lower face can be formed. In this case, however, a suspension pattern for suspending a center mask area 22 B is required in the print area 22 A.
- the network portion 22 A 1 is formed so that the center mask area 22 B can be supported without providing a wide suspension pattern.
- the entire rear face of the lens barrel 4 can be coated with the bonding agent 23 .
- FIG. 27 is a diagram showing the state of the bonding agent 23 printed on the rear face of the lens barrel 4 with the metallic mask 22 removed.
- the bonding agent 23 is formed into the shape of the metallic mask 22 formed in the hollow portion 22 A 2 .
- the coating quantity of the bonding agent 23 printed on the rear face of the lens barrel 4 can be determined from the depth of the hollow portion 22 A 2 . It is thus possible to control the coating amount (the thickness of the coating film) of the bonding agent 23 on the entire rear face of the lens barrel 4 with a high degree of precision. As a result, in accordance with the embodiment, the entire bonding face of the rear face of the lens barrel 4 can be coated with the bonding agent 23 uniformly.
- the wiring substrate mother board 1 after the manufacturing process explained by referring to FIG. 14 is exposed to the lens barrels 4 accommodated in the lens-barrel jig 21 as shown in FIG. 28 .
- the optical-component-mounting face of the wiring substrate mother board 1 that is, the face on which the chip sensors 2 A of the wiring substrate mother board 1 are mounted, is exposed to the rear faces of the lens barrels 4 accommodated in the lens-barrel jig 21 .
- the wiring substrate mother board 1 is pushed toward the lens barrels 4 so that the optical-component-mounting face of the wiring substrate mother board 1 is stuck on the rear faces of the lens barrels 4 by the bonding agent 23 .
- the planar positions of the lens barrels 4 are adjusted with respect to the wiring substrate mother board 1 by inserting the position adjustment pin 4 C 1 of each of the lens barrels 4 into a through hole 16 provided on the wiring substrate mother board 1 .
- the entire rear face of the lens barrel 4 can be coated with the bonding agent 23 uniformly. Accordingly, the entire rear face of the lens barrel 4 can be stuck substantially on the optical-component-mounting face of the wiring substrate mother board 1 without forming a gap. It is thus possible to reduce the quantity of foreign matters flowing into the lens barrel 4 or even possible to completely prevent the foreign matters from flowing into the lens barrel 4 . As a result, since the rate of generation of black-point defects caused by introduction of the foreign matters can be reduced, the yield of the camera module CM can be increased.
- FIG. 30 is a diagram showing a top view of the entire optical-component-mounting face of the wiring substrate mother board 1 after the process to stick the protection film 25 .
- FIG. 31 is a side-view diagram showing main components with the wiring substrate mother board 1 seen in a horizontal direction indicated by an arrow YB shown in FIG. 30 .
- FIG. 32 is a diagram showing a top view of the entire system-component-mounting face of the wiring substrate mother board 1 after this full dicing process.
- Dicing lines L 1 and L 2 are each a line along which the wiring substrate mother board 1 is to be cut by using a dicing saw.
- the dicing line L 1 is a straight line extended in the second direction Y shown in FIG. 32 .
- the dicing line L 2 is a straight line extended in the first direction X perpendicular to the dicing line L 1 .
- the protrusions 4 C of the lens barrels 4 and the position adjustment pins 4 C 1 of the protrusions 4 C are also cut.
- the side portions of the batch encapsulation bodies 12 MA are cut as well so that a side face of the encapsulation body 12 M is formed all but perpendicularly to the lower and upper faces of the wiring substrate 1 A.
- the connection terminals 15 are joined to wires of the flexible wiring substrate 10 by using the junction member 9 such as an ACF.
- the lens holder 6 including the embedded optical lens 7 is installed on the head of the lens barrel 4 .
- the linkage portion of the lens holder 6 and the lens barrel 4 is further coated with a bonding agent to fix the lens holder 6 on the lens barrel 4 substantially.
- electrical-insulation material can be used as the electrical-insulation material of the wiring substrate 1 A of the camera module CM.
- the other electrical-insulation material are the BT resin and the aramid non-fabric material.
- CMOS image sensor which is a sensor in a field serving as the background of the present invention discovered by the inventors.
- the scope of the present invention is not limited to such a camera module.
- the present invention can also be applied to a camera module employing a CCD (Charge Coupled Device) image sensor.
- CCD Charge Coupled Device
Abstract
In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor chip, a lens barrel is joined to the wiring substrate mother board so as to cover the semiconductor chip. A position adjustment pin and a through hole are provided on the lens barrel and the wiring substrate mother board respectively outside a junction face between the lens barrel and the wiring substrate mother board to be used for adjusting the position of the lens barrel with respect to the wiring substrate mother board by inserting the position adjustment pin into the through hole.
Description
- This application is a Divisional application of U.S. application Ser. No. 10/659,433 filed Sep. 11, 2003. The present application claims priority from U.S. application Ser. No. 10/659,433 filed Sep. 11, 2003, which claims priority from Japanese application 2003-300217 filed on Aug. 25, 2003, the content of which is hereby incorporated by reference into this application.
- The present invention relates to a method of manufacturing a solid-state image sensing device.
- A solid-state image sensing device is a photo-electric conversion device for converting an optical signal of image into an electric signal by using an array of pixels. On a first face of the substrate of the solid-state image sensing device, an image sensing element is placed with its light reception face oriented upward. Over the image sensing element, a filter is provided and a lens is provided on the filter in a bottom-up order to form a stack supported on a frame. The frame is placed on the first face in such a way that the position of the lens coincides with the position of the image sensing element.
- A technology prescribing a relation between the position of an image sensing element and the position a lens on a solid-state image sensing device is described in documents such as Japanese Patent Laid-open No. 2001-245217. In accordance with this document, a protrusion for positioning use is provided at the bottom of a mirror frame of a image-taking module having a small size, and a hole to be engaged with the protrusion for positioning use is provided at a location relative to a reference position on a substrate for installing the frame.
- In addition, in accordance with a Registered Utility Model No. 3,084,092, a protrusion on the lower face of a cover glass installation pedestal base is engaged with a through hole on a circuit substrate on which the solid-state image sensing device is installed so as to provide a configuration in which the cover glass installation pedestal base is installed at an accurate position on the circuit substrate.
- However, the inventors of the present invention discovered that the solid-state image sensing device had the following problems.
- With miniaturization of the solid-state image sensing device and more advanced functions added to the solid-state image sensing device, there is resulted in a configuration in which electronic components for controlling the image sensing element and other electronic components or the like are provided on a second face on a side opposite to the first face of the substrate of the solid-state image sensing device, and those components are encapsulated by using resin. If a position adjustment hole provided on the substrate as a hole for adjusting the position of the frame (that is, the lens) with respect to the image sensing element penetrates the substrate to a resin creation area on the second face of the substrate, some resin will protrude from the second face of the substrate to the first face through the position adjustment hole in an encapsulation process. The protruding resin raises a problem of formation of resin fins, resin flashes or the like and fills up the position adjustment hole. If the frame is mounted on the second face in this state, a small gap is formed between the frame and the second face. As a result, there is raised another problem that small foreign matters are injected into the frame by way of the small gap and stuck on an array of sensors, much increasing a rate of generation of black-point defects. A high rate of generation of black-point defects in turn lowers the yield of a camera module to an extremely small value. In order to avoid these problems, there is conceived a solution to temporarily fill up the position adjustment hole with a material prior to the encapsulation process. However, this solution raises a further problem that it is difficult to select a suitable material with which the position adjustment hole is to be temporarily filled up and, even if the position adjustment hole is filled up with such a suitable material, the temporary filler material will be pushed out from the position adjustment hole by a resin injection pressure applied in the encapsulation process.
- In addition, if a position adjustment pin exists on an adhesion face of the frame (that is, the mirror frame or the cover glass installation pedestal base) as is described in Japanese Patent Laid-open No. 2001-245217 and the Registered Utility Model No. 3,084,092, the uniformity of a bonding agent on the adhesion face is lost due to the existence of the position adjustment pin. As a result, the frame does not well adhere to the substrate, forming a gap between the substrate and the frame. Accordingly, there is raised a problem of a much decreasing yield of the solid-state image sensing device for the same reason as that described above.
- It is thus an object of the present invention addressing the problems described above to provide a technology for increasing the yield of the solid-state image sensing device.
- The above and other objects of the present invention as well as novel characteristics thereof will probably become apparent from a study of the descriptions provided in this specification with reference to their accompanying diagrams.
- Outlines of representatives of the inventions disclosed in this specification are described briefly as follows.
- In accordance with the present invention, a hole formed on a substrate as a hole for adjusting the position of an image sensing element with respect to a frame is provided outside an encapsulation body in a process of manufacturing a solid-state image sensing device.
- In addition, in accordance with the present invention, a position adjustment pin provided on a frame as a pin for adjusting the position of an image sensing element with respect to the frame as well as a hole formed on a substrate are provided outside a junction face between the frame and the substrate in a process of manufacturing a solid-state image sensing device.
- Effects exhibited by the representatives of the inventions disclosed in this specification are described as follows.
- Since a hole formed on a substrate as a hole for adjusting the position of an image sensing element with respect to a frame is formed outside an encapsulation body in a process of manufacturing a solid-state image sensing device, the yield of the solid-state image sensing device can be increased.
-
FIG. 1 is a diagram showing a typical cross section of a solid-state image sensing device implemented by an embodiment of the present invention; -
FIG. 2 is a diagram showing a top view of an entire second face of a wiring substrate mother board used in a process to manufacture the solid-state image sensing device shown inFIG. 1 ; -
FIG. 3 is a diagram showing a top view of an entire first face on a side opposite to the second face shown inFIG. 2 ; -
FIG. 4 is a diagram showing a cross section along an X1-X1 line shown inFIGS. 2 and 3 ; -
FIG. 5 is a diagram showing an entire top view of electronic components mounted on the first face shown inFIG. 3 ; -
FIG. 6 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XA shown inFIG. 5 ; -
FIG. 7 is a diagram showing a top view of the entire first faces of two wiring substrate mother boards including a state of an encapsulation body right after an encapsulation process following the state shown inFIG. 5 ; -
FIG. 8 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XB shown inFIG. 7 ; -
FIG. 9 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow YA shown inFIG. 7 ; -
FIG. 10 is a diagram showing an entire top view after a batch process in another embodiment of the present invention; -
FIG. 11 is a diagram showing an entire top view after a batch process in a further embodiment of the present invention; -
FIG. 12 is a diagram showing a top view of the entire first face of the wiring substrate mother board after a process following the state shown inFIG. 7 ; -
FIG. 13 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XC shown inFIG. 12 ; -
FIG. 14 is a side-view diagram showing main components of the wiring substrate mother board after a manufacturing process following the state shown inFIG. 12 ; -
FIG. 15 is a diagram showing a top view seen from the upper face of a lens barrel; -
FIG. 16 is a diagram showing a top view of the rear face of the lens barrel shown inFIG. 15 ; -
FIG. 17 is a diagram showing a side view of the lens barrel shown inFIG. 15 ; -
FIG. 18 is a diagram showing a top view of the entire second face of the wiring substrate mother board after a process to mount a lens barrel; -
FIG. 19 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow XD shown inFIG. 18 ; -
FIG. 20 is an enlarged diagram showing main components of the wiring substrate mother board shown inFIG. 18 ; -
FIG. 21 is a diagram partially showing a cross section at a position on an X2-X2 line shown inFIG. 20 ; -
FIG. 22 is an explanatory diagram showing a process of bonding lens barrels; -
FIG. 23 is an explanatory diagram showing a process of bonding lens barrels when seeingFIG. 22 in a side-face direction; -
FIG. 24 is a diagram showing a top view of a unit area of a metallic mask used in the bonding process shown inFIG. 22 ; -
FIG. 25 is a diagram showing a cross section along an X3-X3 line shown inFIG. 24 ; -
FIG. 26 is a diagram showing a cross section along a Y2-Y2 line shown inFIG. 24 ; -
FIG. 27 is a diagram showing a cross section at a position on the Y2-Y2 line shown inFIG. 24 with the metallic mask removed fromFIG. 26 ; -
FIG. 28 is an explanatory diagram showing a process of bonding a lens barrel following the process shown inFIG. 22 ; -
FIG. 29 is an explanatory diagram showing a process of bonding a lens barrel following the process shown inFIG. 28 ; -
FIG. 30 is a diagram showing a top view of the entire second face of the wiring substrate mother board after a process to stick a protection film; -
FIG. 31 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow YB shown inFIG. 30 ; -
FIG. 32 is a diagram showing a top view of the entire first face of the wiring substrate mother board after a full dicing process; -
FIG. 33 is a side-view diagram showing main components with the wiring substrate mother board seen in a horizontal direction indicated by an arrow YC shown inFIG. 32 ; -
FIG. 34 is a diagram showing a side view in the course of a process to manufacture the solid-state image sensing device following the state shown inFIG. 33 ; and -
FIG. 35 is a diagram showing a side view in the course of a process to manufacture the solid-state image sensing device following the state shown inFIG. 34 . - If necessary, in the following description, each embodiment is explained by splitting the embodiment into a plurality of sections or a plurality of sub-embodiments and, unless otherwise specified, the sections or the sub-embodiments are not unrelated to each other. Instead, one section or one sub-embodiment is an implementation obtained by modifying a portion or all of another section or another sub-embodiment, or one section or one sub-embodiment is related to another section or another sub-embodiment in that the former is a detailed or supplementary explanation of the latter. In addition, a quantity mentioned in the embodiments described below does not mean a specific magnitude of the quantity, but may be greater or smaller than the specific magnitude of the quantity unless it is specified explicitly in particular or it is obvious from a known principle that the quantity is limited to the specific magnitude of the quantity. In this case, the quantity represents the number of elements, the number of items, a numerical value, an amount, a range and the like. Furthermore, a configuration element including an element step and the like in the embodiments described below is of course not necessarily required absolutely unless it is specified explicitly in particular or it is obvious from a known principle that the configuration element is considered to be absolutely required. Similarly, the shape, a positional relation or the like of a configuration element or the like mentioned in the embodiments described below in essence implies a shape, a positional relation or the like, which is close or similar to the mentioned shape, the mentioned positional relation or the like unless it is specified explicitly in particular or it is obvious from a known principle that the mentioned shape, the mentioned positional relation or the like conceivably means neither other shapes, other positional relations nor the like. These broad implications of the shape, a positional relation or the like of a configuration element or the like hold true of the aforementioned numerical value and the aforementioned range. Moreover, in a diagram used for explaining an embodiment, a hatched portion may be included, even if the diagram is a diagram showing a top view, in order to make the drawing easy to inspect. In addition, identical members shown in different drawings used for explaining embodiments are basically denoted by the same reference numeral, and their explanation is given only once. The embodiments of the present invention are explained in detail by referring to diagrams as follows.
- The solid-state image sensing device implemented by an embodiment is a camera module employed in a picture input unit of an apparatus such as a portable telephone, a TV telephone, a PC camera, a PDA (Personal Digital Assistant), an optical mouse, a door phone, a monitoring camera, a fingerprint recognition apparatus or a toy.
- The following embodiments implement the present invention applied to a camera module of a 110,000-pixel CMOS (Complementary Metal Oxide Semiconductor) sensor type compatible with a CIF (Common Immediate Format).
-
FIG. 1 is a diagram showing a typical cross section of an embodiment implementing a CM (camera module) of the CMOS sensor type. Awiring substrate 1A of this camera module CM is a 4-layer print wiring substrate using typically resin of the glass epoxy group as an electrical-insulation material. Thewiring substrate 1A has a second face serving as a face for mounting optical components and a first face on the side opposite to the second face. The first face is a face for mounting system components. On the optical-component-mounting face of thewiring substrate 1A, asemiconductor chip 2A for optical-sensor use is mounted with its principal face oriented upward. Thesemiconductor chip 2A is known as a second electronic component, which is referred to hereafter simply as a sensor chip. The principal face of thesensor chip 2A is a light reception face or a face on which light reception elements are mounted. On the principal face of thesensor chip 2A, a CMOS image sensor circuit is formed. This CMOS image sensor circuit is made in a CMOS process used as a standard process in a process to fabricate a semiconductor device. The CMOS image sensor circuit has a sensor array and an analog circuit for processing an electrical signal generated by the sensor array. The sensor array comprises a plurality of light reception elements regularly arranged in the longitudinal and transversal directions on the principal face of thesensor chip 2A. Each of the light reception elements is a pixel formed in the CMOS image sensor circuit and has a photo-electric conversion function to convert an incident optical signal into an electrical signal. As the light reception element, typically, a photo diode or a photo transistor is used. On the outer circumference of the principal face of thesensor chip 2A, a plurality of bonding pads is provided. Arranged along the outer circumference, the bonding pads are each formed as a drawn electrode of the CMOS image sensor circuit. A bonding pad is electrically connected to a wire and land (electrode) of thewiring substrate 1A by abonding wire 3A. Thebonding wire 3A is made from a material such as gold (Au). - In addition, a lens barrel (frame) 4 is mounted on the optical-component-mounting face of the
wiring substrate 1A to cover thesensor chip 2A. Thelens barrel 4 is mounted on the optical-component-mounting face of thewiring substrate 1A in such a state that the planar position thereof relative to thesensor chip 2A is adjusted with respect to thesensor chip 2A. Thelens barrel 4 is made of an insulation material such as PBT (Poly Butylene Terephthalate). The bottom of the foot portion of thelens barrel 4 is bonded substantially on the optical-component-mounting face of thewiring substrate 1A by using a bonding agent. In the cylinder of thelens barrel 4, there is provided adashboard 4A for partitioning upper and lower chambers from each other. At the center of thedashboard 4A, there is formed a planerectangular opening 4B penetrating thedashboard 4A from the upper face to lower face of thedashboard 4A. Theopening 4B is formed at a position exposed to the sensor array of thesensor chip 2A. Theopening 4B is blocked up with anIR filter 5 installed on thedashboard 4A. TheIR filter 5 has a function of passing through visible rays but blocking unnecessary infrared rays having frequencies of at least a predetermined value. A lens holder (or a lens-holding unit, which is a member of a lens assembly) 6 is installed on the head of thelens barrel 4 to block up an opening of the head of thelens barrel 4. Thelens holder 6 and thelens barrel 4 are linked to each other by engaging a screw formed on the inner circumferential face of a cylinder on the head of thelens barrel 4 with another screw formed on an outer circumferential face of the lower portion of thelens holder 6. The state of linking thelens holder 6 to thelens barrel 4 is kept substantially by further coating the outer circumference of the linkage portion of thelens holder 6 and thelens barrel 4 with a bonding agent. Thelens holder 6 is made of typically the same material as thelens barrel 4. Anoptical lens 7 is accommodated inside thelens holder 6 in a state of being substantially supported by a back diaphragm made of a metal. Theoptical lens 7 is made of an inexpensive and light material such as plastic and is set at a position exposed to the sensor array on the principal face of the chip sensor 2. On the upper face of thelens holder 6, alight reception window 6A having typically a plane circular shape is opened with its relative planar position adjusted with respect to theoptical lens 7. An external-field ray of the camera module CM is radiated to the sensor array of thechip sensor 2A by way of thelight reception window 6A, theoptical lens 7 following thelight reception window 6A and theIR filter 5 following theoptical lens 7. - In addition, a plurality of
connection terminals 15 is provided on the optical-component-mounting face of thewiring substrate 1A. Theconnection terminals 15 are laid out along one side of thewiring substrate 1A. Theconnection terminals 15 are terminals electrically connecting a circuit inside the camera module CM to an external apparatus. To put it in detail, theconnection terminals 15 are electrically connected to the circuit inside the camera module CM by wires of thewiring substrate 1A. On the other hand, theconnection terminals 15 are electrically connected to wires of aflexible wiring substrate 10 by ajunction member 9 such as an ACF (Anisotropic Conductive Film). Theflexible wiring substrate 10 is further electrically connected to the external apparatus. - Other components are also mounted on the system-component-mounting face of the
wiring substrate 1A. The other components include a logic-use semiconductor chip 2B, a memory-use semiconductor chip 2C and achip component 11. The logic-use semiconductor chip 2B is a first electronic component referred to hereafter simply as a logic chip. The memory-use semiconductor chip 2C is also a first electronic component referred to hereafter simply as a memory chip. Likewise, thechip component 11 is also a first electronic component. Thelogic chip 2B, thememory chip 2C and thechip component 11 are electronic components for mainly processing an electrical signal generated by thesensor chip 2A. Thelogic chip 2B, thememory chip 2C and thechip component 11 are also electronic components used for constructing a system for controlling the operation of the CMOS image sensor circuit of thesensor chip 2A. Thelogic chip 2B includes a circuit formed therein to serve as a processing circuit carrying out digital-signal processing. An example of the processing circuit is a DSP (Digital Signal Processor). Thelogic chip 2B is electrically connected to lands (electrodes) and wires of thewiring substrate 1A by bondingwires 3B. Thememory chip 2C includes a circuit formed therein to serve as a non-volatile memory circuit. An example of the non-volatile memory circuit is an EEPROM (Electrically Erasable Programmable Read Only Memory). Thememory chip 2C is also electrically connected to lands (electrodes) and wires of thewiring substrate 1A by bondingwires 3C. Thebonding wires 3C are made of typically gold (Au). Thechip component 11 includes elements formed therein to serve as passive elements such as capacitors and resistors. Electrodes of thechip component 11 are joined to lands (electrodes) of thewiring substrate 1A by typically soldering to form electrical connections with the lands. Components such as thelogic chip 2B, thememory chip 2C, thechip component 11 as well as thebonding wires wiring substrate 1A, are encapsulated by anencapsulation body 12M. Theencapsulation body 12M is made from resin having a heat-curing characteristic. An example of such resin is resin of the epoxy group including silica fillers. - The following description explains a typical method of manufacturing the camera module described above.
- First of all, a wiring
substrate mother board 1 such as ones shown in FIGS. 2 to 4 is prepared.FIG. 2 is a diagram showing a top view of the entire optical-component-mounting face of the wiringsubstrate mother board 1.FIG. 3 is a diagram showing a top view of the entire system-component-mounting face on a side opposite to the optical-component-mounting face shown inFIG. 2 .FIG. 4 is a diagram showing a cross section along an X1-X1 line shown inFIGS. 2 and 3 . It is to be noted that, inFIGS. 1 and 2 , notation X denotes a first direction and notation Y denotes a second direction perpendicular to the first direction X. - The wiring
substrate mother board 1 is the mother board of thewiring substrate 1A. The plane shape of the wiringsubstrate mother board 1 is typically rectangular. The thickness of the wiringsubstrate mother board 1 is extremely small, having a typical value of the order of 0.3 mm. The wiringsubstrate mother board 1 has a structure comprising 4 wiring layers having typically resin of the glass epoxy group as a material for electrically insulating the wiring layers from each other. The wiringsubstrate mother board 1 is formed by adoption of typically a subtractive method. Typically, copper (Cu) is used as a wiring material of the wiringsubstrate mother board 1. - Typically, 48 module regions MR each used for creation of a camera module are arranged regularly on the wiring
substrate mother board 1 with a uniform orientation as shown as dashed-line blocks inFIGS. 2 and 3 . Each of the module regions MR is a unit area required for manufacturing a camera module CM. A plurality ofconnection terminals 15 is laid out to form an array in each of the module regions MR on the optical-component-mounting face. In addition, lands (electrodes) and other members are laid out in each of the module regions MR on the optical-component-mounting face. The lands are connected to thebonding wires 3A and a chip-mounting pattern on which thesensor chip 2A is mounted. In order to makeFIG. 2 easy to view, the lands are omitted from the figure. Similarly, lands are laid out in each of the module regions MR on the system-component-mounting face. These lands are connected to a chip-mounting pattern, thebonding wires chip component 11. This chip-mounting pattern is a pattern on which thelogic chip 2B and thememory chip 2C are mounted. In order to makeFIG. 3 easy to view, the lands are omitted from the figure. It is to be noted that theconnection terminals 15, the chip-mounting patterns and the lands are made of typically copper, which is also used as the wire material cited above. In addition, the surfaces of theconnection terminals 15, the chip-mounting patterns and the lands are subjected to a metal-plating process using metals such as nickel (Ni) and gold (Au). - In close proximity to each of the module regions MR, a plurality of through
holes 16 each called a boss hole is formed. The through holes 16 are used for adjusting the position of thelens barrel 4 with respect to the wiringsubstrate mother board 1. To put it in detail, as will be described later, when thelens barrel 4 is joined to the wiringsubstrate mother board 1, a positioning pin provided on thelens barrel 4 is inserted into the throughhole 16 provided on the wiringsubstrate mother board 1. The positioning pin provided on thelens barrel 4 is referred to as a boss pin. By inserting the positioning pin provided on thelens barrel 4 into the throughhole 16 provided on the wiringsubstrate mother board 1, thelens barrel 4 can be joined to the wiringsubstrate mother board 1 with the planar position of thelens barrel 4 adjusted with respect to the wiringsubstrate mother board 1. In this embodiment, a throughhole 16 is positioned outside a module region MR. To be more specific, on the optical-component-mounting surface, the throughhole 16 is provided at a position outside the bottom of the foot of thelens barrel 4 as will be described later. Also as will be described later, on the system-component-mounting surface, the throughhole 16 is provided at a position outside a region in which theencapsulation body 12M is formed. For each of the module regions MR, two throughholes 16 are provided. The two throughholes 16 are provided at positions, which sandwich the module region MR, being connected to each other by a diagonal line of the module region MR. It is to be noted that, on the inner circumferential face of the throughhole 16 and on areas surrounding the opening of the throughhole 16 are coated with a conductor material in the same way as a through hole of an ordinary print wiring substrate. The conductor material is the same material as the material for making wires. - A plurality of
conductor patterns 17A each having typically a plane rectangular shape is formed in areas in close proximity to the four sides of the optical-component-mounting face and system-component-mounting face of the wiringsubstrate mother board 1. In addition, a plurality ofconductor patterns 17B each having typically a plane rectangular shape is laid out to form an array in an area in close proximity to one side of the system-component-mounting face at predetermined intervals. Theconductor patterns 17B are provided as patterns for making resin (used as an encapsulation material), which has been hardened inside a runner, easy to peel off and remove from the wiringsubstrate mother board 1. Encapsulation groups are divided into groups each associated with a line for which one of theconductor pattern 17B exists. Theconductor patterns conductor patterns substrate mother board 1, there is formed a throughhole 18A used for adjusting the position of the wiringsubstrate mother board 1 with respect to the manufactured device. - Then, as shown in
FIGS. 5 and 6 , in each of the module regions MR on the system-component-mounting area of the wiringsubstrate mother board 1, thelogic chip 2B and thememory chip 2C are mounted after a process of mounting thechip component 11. Subsequently, thelogic chip 2B and thememory chip 2C are electrically connected to wires of the wiringsubstrate mother board 1 in the module region MR bybonding wires FIG. 5 is a diagram showing an entire top view after thechip component 11 is mounted on the face shown inFIG. 3 .FIG. 6 is a side-view diagram showing main components with the wiringsubstrate mother board 1 seen in a horizontal direction indicated by an arrow XA shown inFIG. 5 . In order to simplify the diagrams ofFIGS. 5 and 6 , thelogic chip 2B and thememory chip 2C are shown collectively as a single semiconductor chip. - Then, after the wiring
substrate mother board 1 is held by using upper and lower encapsulation metal molds in a state of being sandwiched by the upper and lower encapsulation metal molds in such a way that thelogic chip 2B, thememory chip 2C as well as thebonding wires logic chip 2B, thememory chip 2C and thechip component 11, which are mounted on the system-component-mounting face, are encapsulated by an encapsulation material, which is typically resin having a heat-curing characteristic. An example of such resin is resin of the epoxy group including silica fillers.FIG. 7 is a diagram showing a state of a batch encapsulation body 12MA right after the encapsulation process.FIG. 8 is a side-view diagram showing main components with the wiringsubstrate mother board 1 seen in a horizontal direction indicated by an arrow XB shown inFIG. 7 .FIG. 9 is a side-view diagram showing main components with the wiringsubstrate mother board 1 seen in a horizontal direction indicated by an arrow YA shown inFIG. 7 . It is to be noted thatFIG. 7 is a diagram showing a state with the encapsulation molds seen fluoroscopically. In addition, whileFIG. 7 shows a top view of a state of a batch encapsulation body 12MA,encapsulation materials 12 are each shown as a hatched block in order to make the diagram easy to inspect. Furthermore, in the diagram ofFIG. 7 , an encapsulation material 12MC represents a portion corresponding to an encapsulation material inside a cull, an encapsulation material 12MR represents a portion corresponding to an encapsulation material inside a runner and an encapsulation material 12MG represents a portion corresponding to an encapsulation material inside a gate. - As an encapsulation method, there is adopted a batch encapsulation method for encapsulating system components in the module regions MR by handling the components as a lump. In this embodiment, however, the module regions MR of the wiring
substrate mother board 1 are divided into a plurality of groups and the batch encapsulation method is applied to each of the groups by handling components in each group as a lump. For this reason, on the system-component-mounting face of the wiringsubstrate mother board 1, system components of module regions MR laid out in the second direction Y shown inFIG. 7 are subjected to a batch encapsulation process by using the batch encapsulation bodies 12MA. In the first direction X shown inFIG. 7 , however, the batch encapsulation bodies 12MA are separated from each other in order to prevent the throughholes 16 for position adjustment from being covered by the batch encapsulation bodies 12MA. In such an encapsulation process, anencapsulation material 12 injected from a cull is split into a plurality of runners (each serving as an encapsulation-material-supplying passage) and gates (each serving as an encapsulation-material-supplying passage) for each of the groups. Theencapsulation material 12 is then injected into a cavity for forming an encapsulation body in each of the groups via each runner and gate. - A typical reason why the batch encapsulation bodies 12MA are each provided at a location not superposed on through
holes 16 is explained as follows. If a batch encapsulation body 12MA is superposed on a throughhole 16, theencapsulation material 12 inevitably flows out from the system-component-mounting face to the optical-component-mounting face through the throughhole 16 in the course of an encapsulation process. Thus, in areas surrounding the opening of the throughhole 16 on the optical-component-mounting face, resin fins, resin flashes and the like are formed, and the throughhole 16 is blocked up by theencapsulation material 12. If thelens barrel 4 is mounted on the optical-component-mounting face in this state, the adhesiveness and state of adhesion between thelens barrel 4 and the optical-component-mounting face deteriorate, forming a small gap between thelens barrel 4 and the optical-component-mounting face. As a result, in subsequent manufacturing processes, foreign matters are injected into thelens barrel 4 by way of the gap and stuck on the sensor array of thesensor chip 2A, much increasing a rate of generation of black-point defects. A high rate of generation of black-point defects raises a problem that the yield of the camera module is lowered to an extremely small value. In order to avoid this problem, there is conceived a solution to temporarily fill up the throughhole 16 with a material prior to the encapsulation process. However, this solution raises another problem that it is difficult to select a suitable material with which the throughhole 16 is to be temporarily filled up and, even if the throughhole 16 is filled up with such a material, the temporary filler material will be pushed out from thehole 16 by a resin injection pressure of theencapsulation material 12 applied in the encapsulation process. In the embodiment, on the other hand, the batch encapsulation bodies 12MA are separated from each other in order to prevent the throughholes 16 from being covered by the batch encapsulation bodies 12MA. It is thus possible to solve the problem that theencapsulation material 12 inevitably flows out from the system-component-mounting face to the optical-component-mounting face through the throughhole 16 in the course of an encapsulation process. As a result, since thelens barrel 4 can be well stuck on the optical-component-mounting face without forming a gap, it is possible to reduce the quantity of foreign matters flowing into thelens barrel 4 by way of a gap formed between thelens barrel 4 and the optical-component-mounting face or even possible to completely prevent the foreign matters from flowing into thelens barrel 4 by way of the gap formed between thelens barrel 4 and the optical-component-mounting face. Thus, since the rate of generation of black-point defects caused by introduction of foreign matters can be reduced, the yield of the camera module CM can be increased. In addition, since cumbersome works such as selection of a material with which the throughhole 16 is to be temporarily filled up and the process to fill up the throughhole 16 with the selected material are not required, it is possible to simplify the process of manufacturing the camera module CM and to shorten the manufacturing time. - In addition, it is possible to provide a configuration like one shown in
FIG. 10 . In this configuration, the batch encapsulation bodies 12MA are separated from each other in order to prevent the throughholes 16 from being covered by the batch encapsulation bodies 12MA. By providing such a configuration, problems related to the throughhole 16 can be solved. However, if a batch encapsulation process is carried out in a way suggested by the one shown inFIG. 10 , the shrinkage of the batch encapsulation body 12MA applies a stress to the wiringsubstrate mother board 1, inadvertently bending the wiringsubstrate mother board 1 in some cases. In order to solve this problem, in the embodiment shown inFIG. 7 , the individual batch encapsulation bodies 12MA are separated from each other. By separating the individual batch encapsulation bodies 12MA from each other, it is possible to reduce the magnitude of the stress applied to the wiringsubstrate mother board 1 due to the shrinkages of the individual batch encapsulation bodies 12MA to a value smaller than the magnitude of a stress applied in a batch encapsulation process carried out on system components of all module regions MR on the system-component-mounting face of the wiringsubstrate mother board 1. It is thus possible to reduce the amount of bending, twist, etc. resulting in the wiringsubstrate mother board 1 due to the stress. If bending, twist or the like exists in the wiringsubstrate mother board 1, in a junction process ofbonding wires 3A after a process to mount thesensor chip 2A on the optical-component-mounting face of the wiringsubstrate mother board 1, thebonding wires 3A may not be joined well in some cases. On the other hand, the batch encapsulation bodies 12MA are separated from each other in this embodiment. It is thus possible to reduce the amount of bending, twist, etc. As a result, the bondability of thebond wires 3A can be improved so that the yield of the camera module CM can also be increased as well. - In addition, it is also possible to provide a configuration for separating the batch encapsulation bodies 12MA from each other like one shown in
FIG. 11 . In this case, it is possible to solve problems related to throughhole 16 and also reduce the magnitude of the stress. However, when the magnitude of the stress may not be reduced sufficiently even in the configuration shown inFIG. 11 , the wiringsubstrate mother board 1 is bent toward the center of the longitudinal direction of batch encapsulation bodies 12MA. In order to solve this problem, in this embodiment, a depression 12MA1 extended from both the long sides of the batch encapsulation body 12MA to the transversal-direction center of the batch encapsulation body 12MA is further formed so that the width of the longitudinal-direction center of each batch encapsulation body 12MA becomes partially smaller. The depressions 12MA1 are formed on the right and left long sides of a batch encapsulation body 12MA symmetrically in the left-to-right direction with respect to the right and left long sides. In addition, each depression 12MA1 is formed in a surplus area outside a module region MR. In this embodiment, by reducing the width of the longitudinal-direction center of each batch encapsulation body 12MA as described above, the magnitude of the stress applied to the wiringsubstrate mother board 1 due to the shrinkage of each batch encapsulation body 12MA can be further decreased. Thus, the amount of bending, twist, etc. resulting in the wiringsubstrate mother board 1 due to the stress can be further reduced too. Accordingly, the bondability of eachbonding wire 3A can be further improved. As a result, the yield of the camera module CM can be further increased. However, the position of the depression 12MA1 is not limited to the longitudinal-direction center of the batch encapsulation body 12MA. For example, a plurality of depressions 12MA1 can be formed at a plurality of positions on the right and left long sides of a batch encapsulation body 12MA. - Then, a half-dicing process is carried out on the wiring
substrate mother board 1 as shown inFIGS. 12 and 13 to split a batch encapsulation body 12MA into portions located on different module regions MR.FIG. 12 is a diagram showing a top view of the entire system-component-mounting face of the wiringsubstrate mother board 1 after the half-dicing process.FIG. 13 is a side-view diagram showing main components with the wiringsubstrate mother board 1 seen in a horizontal direction indicated by an arrow XC shown inFIG. 12 . The half-dicing process is carried out, being started from the system-component-mounting face on which the encapsulation bodies 12A have been formed. A plurality of straight-line cut grooves 20 extended in the first direction X is formed, with the straight-line cut grooves 20 being separated from each other by predetermined intervals in the second direction Y on the system-component-mounting face of the wiringsubstrate mother board 1. Thecut grooves 20 are formed by using a dicing saw. Thecut grooves 20 completely split the batch encapsulation body 12MA into a plurality of completely separated portions located in the same plurality of module regions MR laid out in the second Y direction. Since the depth of each cutgroove 20 is only about ⅔ the depth of the wiringsubstrate mother board 1, however, the wiringsubstrate mother board 1 itself is not completely split. By splitting the batch encapsulation body 12MA into portions separated from each other by thecut grooves 20 as described above, the magnitude of the stress applied to the wiringsubstrate mother board 1 due to the shrinkage of the batch encapsulation body 12MA can be further decreased. Thus, bending and twist of the wiringsubstrate mother board 1 due to the stress are further reduced, whereby the bondability of eachbonding wire 3A can be further improved. As a result, the yield of the camera module CM can be further increased. - Even though a
cut groove 20 completely splits a batch encapsulation body 12MA into 2 completely separated portions, however, the depth of thecut groove 20 does not have to reach the system-component-mounting face of the wiringsubstrate mother board 1. Even if the depth of thecut groove 20 does not reach the system-component-mounting face of the wiringsubstrate mother board 1, the magnitude of the stress applied to the wiringsubstrate mother board 1 due to the shrinkage of the batch encapsulation body 12MA can be decreased. In addition, the depth of each cutgroove 20 can be set at about half the depth of the batch encapsulation body 12MA so that the batch encapsulation body 12MA is not completely split into 2 separated portions. Even in this case, the magnitude of the stress applied to the wiringsubstrate mother board 1 due to the shrinkage of the batch encapsulation body 12MA can be decreased. - Then, after a
sensor chip 2A is mounted on each module region MR of the optical-component-mounting face of the wiringsubstrate mother board 1 with the principal face (that is, the light reception face or a light reception device creation face) of thesensor chip 2A oriented upward as shown inFIG. 14 , eachsensor chip 2A and wires of the module region MR of the wiringsubstrate mother board 1 are electrically connected to each other by usingbonding wires 3A. At that time, in this embodiment, a wire-bonding process can be carried out at an extremely small amount of bending, twist, etc resulting on the wiringsubstrate mother board 1. Accordingly, the bondability of eachbonding wire 3A can be improved. It is to be noted thatFIG. 14 is a side-view diagram showing main components in each module region MR of the wiringsubstrate mother board 1 after the wire-bonding process. - Then, a
lens barrel 4 like one shown in FIGS. 15 to 17 is prepared.FIG. 15 is a diagram showing a top view of the upper face of thelens barrel 4.FIG. 16 is a diagram showing a top view of the rear face of thelens barrel 4.FIG. 17 is a diagram showing a side view of thelens barrel 4. AnIR filter 5 has already been installed in the cylinder of thelens barrel 4. Thelens barrel 4 hasprotrusions 4C, which are formed, being integrated with thelens barrel 4. Theprotrusions 4C are each extended all but horizontally on the optical-component-mounting face of the wiringsubstrate mother board 1. In the top views shown inFIGS. 15 and 16 , theprotrusions 4C are provided at two corners at the ends of a diagonal line of thelens barrel 4. In the side view shown inFIG. 17 , theprotrusions 4C are provided at the foot of thelens barrel 4. Theprotrusions 4C are members used for adjusting the planar position of thelens barrel 4 with respect to the wiringsubstrate mother board 1. At a back surface of each of theprotrusions 4C, a position adjustment pin 4C1 referred to as a boss pin is formed. The position adjustment pin 4C1 is extended vertically with respect to the optical-component-mounting face of the wiringsubstrate mother board 1. - Then, a plurality of
lens barrels 4 is joined to the optical-component-mounting face of the wiringsubstrate mother board 1 with each of thelens barrel 4 covering asensor chip 2A as shown in FIGS. 18 to 21.FIG. 18 is a diagram showing a top view of the entire optical-component-mounting face of the wiringsubstrate mother board 1 after this lens-barrel-mounting process.FIG. 19 is a side-view diagram showing main components with the wiringsubstrate mother board 1 seen in a horizontal direction indicated by an arrow XD shown inFIG. 18 .FIG. 20 is an enlarged diagram showing main components of the wiringsubstrate mother board 1 shown inFIG. 18 .FIG. 21 is a diagram partially showing a partially ruptured cross section at a position on an X2-X2 line shown inFIG. 20 . It is to be noted that 2-dotted-dashed lines L1 shown inFIG. 21 are each a dicing line along which the camera module is cut out by cutting the wiringsubstrate mother board 1 in a later process. - In each module region MR on the optical-component-mounting face of the wiring
substrate mother board 1, a plurality oflens barrel 4 is mounted at a uniform orientation. The position of each of the lens barrels 4 is well adjusted with respect to the wiringsubstrate mother board 1 by inserting the position adjustment pin 4C1 of theprotrusion 4C of thelens barrel 4 into a throughhole 16 on the wiringsubstrate mother board 1. In this embodiment, no resin fins, resin flashes and the like are formed in areas surrounding the opening of the throughhole 16 as described above. In addition, there is no case in which the throughhole 16 is filled up with theencapsulation material 12. Accordingly, the entire rear face of thelens barrel 4 can be stuck substantially on the optical-component-mounting face of the wiringsubstrate mother board 1 without forming a gap. It is thus possible to reduce the quantity of foreign matters flowing into thelens barrel 4 or even possible to prevent the foreign matters from flowing into thelens barrel 4. As a result, since the rate of generation of black-point defects caused by introduction of foreign matters can be reduced, the yield of the camera module CM can be increased. - In addition, in this embodiment, the position adjustment pin 4C1 of the
lens barrel 4 is provided at a position outside the adhesion face of the rear face of thelens barrel 4. The adhesion face is a face stuck to the wiringsubstrate mother board 1. The position adjustment pin 4C1 of thelens barrel 4 is provided at a position outside the adhesion face because, if the position adjustment pin 4C1 of thelens barrel 4 is provided on the adhesion face of the rear face of thelens barrel 4, the position adjustment pin 4C1 will serve as an obstacle to a process to coat the rear face of thelens barrel 4 with a bonding agent so that the rear face of thelens barrel 4 cannot be coated well with the bonding agent. Thus, a small gap is formed between thelens barrel 4 and the wiringsubstrate mother board 1 due to an adhesion defect and, accordingly, foreign matters generated in the course of a later process enter the inside of thelens barrel 4 by way of the gap, causing an optical defect such as a black-point defect to be generated. As a result, the yield of the camera module decreases to an extremely low value in some cases. On the other hand, the position adjustment pin 4C1 of thelens barrel 4 is provided at a position outside the adhesion face of the rear face of thelens barrel 4 in this embodiment. Thus, since the position adjustment pin 4C1 of thelens barrel 4 does not exist on the adhesion face of the rear face of thelens barrel 4, the adhesion face of the rear face of thelens barrel 4 can be made flat. As a result, since the entire adhesion face of the rear face of thelens barrel 4 can be coated with an adhesion agent uniformly, the entire adhesion face of the rear face of thelens barrel 4 can be stuck substantially on the optical-component-mounting face of the wiringsubstrate mother board 1 without generating a gap. Accordingly, since the rate of generation of black-point defects caused by introduction of foreign matters into thelens barrel 4 can be reduced, the yield of the camera module CM can be increased. - Consider
lens barrels 4 arranged in the first direction X ofFIG. 18 at positions adjacent to each other. In this embodiment, theprotrusions 4C of anyspecific lens barrel 4 are provided at locations separated away from the locations of theprotrusions 4C of alens barrel 4 adjacent to thespecific lens barrel 4 so that theprotrusions 4C of thespecific lens barrel 4 and theprotrusions 4C of theadjacent lens barrel 4 do not mutually interfere with each other. For this reason, the lens barrels 4 arranged in the first direction X at positions adjacent to each other can be provided at squeezed intervals. Thus, the area of the wiringsubstrate mother board 1 does not increase only becauseprotrusions 4C are provided on eachlens barrel 4. As a result, the material cost does not increase and it is therefore possible to suppress the manufacturing cost of the camera module CM at a low level. - In addition, in this embodiment, a
protrusion 4C is provided at a corner at one end of a diagonal line of alens barrel 4 and anotherprotrusion 4C is provided at another corner at the other end of the diagonal line. Thus, it is possible to improve the stability in sticking thelens barrel 4 on the optical-component-mounting face of the wiringsubstrate mother board 1. Furthermore, if aprotrusion 4C is provided at a corner at one end of a diagonal line of alens barrel 4 and anotherprotrusion 4C is provided at another corner at the other end of the diagonal line as described above, the cutoff quantity of aprotrusion 4C (that is, the width of eachprotrusion 4C to be cut in a later process to cut off the wiringsubstrate mother board 1 can be reduced to a value smaller than a configuration in which 2protrusions 4C protrude off from one side of alens barrel 4. It is thus possible to reduce the magnitude of a force applied to thelens barrel 4 in the cutoff process. - It is to be noted that the number of
protrusions 4C perlens barrel 4 is not limited to two. Instead, the number ofprotrusions 4C perlens barrel 4 can be changed to any value. For example, the number ofprotrusions 4C perlens barrel 4 can be set at one or three. In addition, it is also possible to provide a configuration in which twoprotrusions 4C protrude off from one side of alens barrel 4. - The following description explains a typical method of joining
lens barrels 4 to the wiringsubstrate mother board 1.FIG. 22 is an explanatory diagram showing a process of bonding lens barrels 4.FIG. 23 is an explanatory diagram showing a process ofbonding lens barrels 4 when seeingFIG. 22 in a side-face direction. A lens-barrel jig 21 used in the process of bonding lens barrels 4 has a plurality ofsupport depressions 21A. First of all, alens barrel 4 is accommodated in each of thesupport depressions 21A with the rear face of thelens barrel 4 oriented upward. Then, the accommodatedlens barrel 4 is fixed temporarily by vacuum suction. Subsequently, after ametallic mask 22 is mounted on the upper face of the lens-barrel jig 21, the upper face of themetallic mask 22 is coated with abonding agent 23 having a predetermined quantity. Thebonding agent 23 is dispersed by a movement of asqueegee 24. In this way, thebonding agent 23 is dispersed over a plurality oflens barrels 4 through themetallic mask 22 in a single operation, being selectively applied to the adhesion face on the rear face of each of the lens barrels 4. As described above, in the case of the embodiment, the position adjustment pins 4C1 of eachlens barrel 4 are each provided at a position outside the adhesion face of the rear face of thelens barrel 4 and, thus, do not exist on the adhesion face of the rear face of thelens barrel 4. Accordingly, the entire rear face of thelens barrel 4 can be coated with theadhesion agent 23 uniformly. The position adjustment pins 4C1 of thelens barrel 4 protrude off by way of through holes formed on themetallic mask 22 from the upper face of themetallic mask 22 by a distance of the order of 1 mm. In the process of coating the rear face of eachlens barrel 4 withbonding agent 23, however, the position adjustment pins 4C1 are prevented from being coated with thebonding agent 23. This is because, if the position adjustment pins 4C1 are coated with thebonding agent 23, thebonding agent 23 will flow into the inside of thelens barrel 4 through the through holes of themetallic mask 22, raising a problem that the lens-barrel jig 21 and thelens barrel 4 are bonded to each other by thebonding agent 23 in some cases. In order to solve this problem, in this embodiment, a squeegee resembling comb teeth as shown inFIG. 22 is used as thesqueegee 24 so that the teeth of thesqueegee 24 do not hit the position adjustment pins 4C1, that is, the position adjustment pins 4C1 are not coated with thebonding agent 23. In this way, it is possible to solve the problem that the lens-barrel jig 21 and thelens barrel 4 are bonded to each other by thebonding agent 23. -
FIG. 24 is a diagram showing a top view of a unit area of themetallic mask 22 used in the process to bond lens barrels 4. The unit area is an area occupied by onelens barrel 4.FIG. 25 is a diagram showing a cross section along an X3-X3 line shown inFIG. 24 .FIG. 26 is a diagram showing a cross section along a Y2-Y2 line shown inFIG. 24 . Aprint area 22A shown inFIG. 24 as a top view of a frame corresponds to the bonding-agent-coating area on the rear face of thelens barrel 4. The outside and inside of theprint area 22A are used as amask area 22B. In an area close to each of the four sides of theprint area 22A, a throughhole 22C is formed to penetrate themetallic mask 22 from the upper face to the lower face. The position adjustment pin 4C1 of thelens barrel 4 is inserted into the throughhole 22C. - In this embodiment, the
print area 22A of themetallic mask 22 is divided into a network portion 22A1 occupying spaces in the upper half in the depth direction of themetallic mask 22 and a hollow portion 22A2 occupying the rest of themetallic mask 22. Themetallic mask 22 is mounted on the lens-barrel jig 21 in such a way that, in the bonding-agent-coating process, the hollow portion 22A2 is exposed to the rear face of thelens barrel 4. Thebonding agent 23 applied to the upper face of themetallic mask 22 is injected into the hollow portion 22A2 by way of infinitesimal openings of the network portion 22A1 as shown by arrow A inFIGS. 25 and 26 . The rear face of thelens barrel 4 is then coated with thebonding agent 23 accommodated in the hollow portion 22A2. - The network portion 22A1 is formed by carrying out an etching process on a metal plate used as the basic material of the
metallic mask 22 to form a net pattern. On the other hand, the hollow portion 22A2 is formed by carrying out an etching process to remove a portion of the metal plate used as the basic material of themetallic mask 22 up to a depth ending at a level in the middle of the thickness of themetallic mask 22. Instead of forming a network portion 22A1 in themetallic mask 22, holes completely penetrating themetallic mask 22 from the upper face to the lower face can be formed. In this case, however, a suspension pattern for suspending acenter mask area 22B is required in theprint area 22A. Thus, it becomes impossible to coat the rear-face portion of thelens barrel 4 with thebonding agent 23 due to the fact that the suspension pattern becomes a mask. Accordingly, a gap is generated at the rear-face portion between thelens barrel 4 and the wiringsubstrate mother board 1. As a result, foreign matters are injected into thelens barrel 4 by way of the gap, lowering the yield of the camera module CM in some cases. In the case of the embodiment, on the other hand, the network portion 22A1 is formed so that thecenter mask area 22B can be supported without providing a wide suspension pattern. Thus, the entire rear face of thelens barrel 4 can be coated with thebonding agent 23. - In addition, the
bonding agent 23 applied to the rear face of thelens barrel 4 does not return to the supply side either due to the existence of the network portion 22A1.FIG. 27 is a diagram showing the state of thebonding agent 23 printed on the rear face of thelens barrel 4 with themetallic mask 22 removed. On the rear face of thelens barrel 4, thebonding agent 23 is formed into the shape of themetallic mask 22 formed in the hollow portion 22A2. In accordance with the embodiment, the coating quantity of thebonding agent 23 printed on the rear face of thelens barrel 4 can be determined from the depth of the hollow portion 22A2. It is thus possible to control the coating amount (the thickness of the coating film) of thebonding agent 23 on the entire rear face of thelens barrel 4 with a high degree of precision. As a result, in accordance with the embodiment, the entire bonding face of the rear face of thelens barrel 4 can be coated with thebonding agent 23 uniformly. - Then, after the rear face of the
lens barrel 4 is coated with thebonding agent 23 and themetallic mask 22 is removed as described above, the wiringsubstrate mother board 1 after the manufacturing process explained by referring toFIG. 14 is exposed to the lens barrels 4 accommodated in the lens-barrel jig 21 as shown inFIG. 28 . To be more specific, the optical-component-mounting face of the wiringsubstrate mother board 1, that is, the face on which thechip sensors 2A of the wiringsubstrate mother board 1 are mounted, is exposed to the rear faces of the lens barrels 4 accommodated in the lens-barrel jig 21. Then, with the planar positions of the lens barrels 4 adjusted with respect to the wiringsubstrate mother board 1, the wiringsubstrate mother board 1 is pushed toward the lens barrels 4 so that the optical-component-mounting face of the wiringsubstrate mother board 1 is stuck on the rear faces of the lens barrels 4 by thebonding agent 23. In pushing the wiringsubstrate mother board 1 toward the lens barrels 4, the planar positions of the lens barrels 4 are adjusted with respect to the wiringsubstrate mother board 1 by inserting the position adjustment pin 4C1 of each of the lens barrels 4 into a throughhole 16 provided on the wiringsubstrate mother board 1. By carrying out the operations described above, the wiringsubstrate mother board 1 and the lens barrels 4 are joined to each other. In this embodiment, the entire rear face of thelens barrel 4 can be coated with thebonding agent 23 uniformly. Accordingly, the entire rear face of thelens barrel 4 can be stuck substantially on the optical-component-mounting face of the wiringsubstrate mother board 1 without forming a gap. It is thus possible to reduce the quantity of foreign matters flowing into thelens barrel 4 or even possible to completely prevent the foreign matters from flowing into thelens barrel 4. As a result, since the rate of generation of black-point defects caused by introduction of the foreign matters can be reduced, the yield of the camera module CM can be increased. - Next, after a plurality of
lens barrels 4 is joined to the optical-component-mounting face of the wiringsubstrate mother board 1 as described above, aprotection film 25 is stuck on thelens barrel 4 so as to block the opening on the head of thelens barrel 4 as shown inFIGS. 30 and 31 .FIG. 30 is a diagram showing a top view of the entire optical-component-mounting face of the wiringsubstrate mother board 1 after the process to stick theprotection film 25.FIG. 31 is a side-view diagram showing main components with the wiringsubstrate mother board 1 seen in a horizontal direction indicated by an arrow YB shown inFIG. 30 . Foreign matters stuck on theIR filter 5 inside alens barrel 4 will cause a stain defect, which is a defect generated by a shadow thrown over thesensor chip 2A due to a blurred image of the foreign matters on theIR filter 5. Theprotection film 25 is thus provided as a protection member for preventing the foreign matters from entering thelens barrel 4 in the course of a subsequent manufacturing process. Then, as shown inFIGS. 32 and 33 , with theprotection film 25 stuck as it is, a full dicing process is carried out on the wiringsubstrate mother board 1 to completely split the wiringsubstrate mother board 1 intoindividual wiring substrates 1A.FIG. 32 is a diagram showing a top view of the entire system-component-mounting face of the wiringsubstrate mother board 1 after this full dicing process.FIG. 33 is a side-view diagram showing main components with the wiringsubstrate mother board 1 seen in a horizontal direction indicated by an arrow YC shown inFIG. 32 . The dicing process is carried out, starting from the optical-component-mounting face on which lens barrels 4 are mounted. Dicing lines L1 and L2 are each a line along which the wiringsubstrate mother board 1 is to be cut by using a dicing saw. The dicing line L1 is a straight line extended in the second direction Y shown inFIG. 32 . On the other hand, the dicing line L2 is a straight line extended in the first direction X perpendicular to the dicing line L1. In the dicing process, theprotrusions 4C of the lens barrels 4 and the position adjustment pins 4C1 of theprotrusions 4C are also cut. In addition, the side portions of the batch encapsulation bodies 12MA are cut as well so that a side face of theencapsulation body 12M is formed all but perpendicularly to the lower and upper faces of thewiring substrate 1A. - Then, as shown in
FIG. 34 , with theprotection film 25 stuck thereon as it is, theconnection terminals 15 are joined to wires of theflexible wiring substrate 10 by using thejunction member 9 such as an ACF. Subsequently, after theprotection film 25 is peeled off, as shown inFIG. 35 , thelens holder 6 including the embeddedoptical lens 7 is installed on the head of thelens barrel 4. The linkage portion of thelens holder 6 and thelens barrel 4 is further coated with a bonding agent to fix thelens holder 6 on thelens barrel 4 substantially. By carrying out the processes described above, the camera module CM shown inFIG. 1 is manufactured. - In the above description, the present invention discovered by inventors is explained concretely on the basis of embodiments. However, the scope of the present invention is not limited to the embodiments. It is of course possible to make a variety of changes in a domain not deviating from essentials of the present invention to the embodiments.
- For example, another kind of electrical-insulation material can be used as the electrical-insulation material of the
wiring substrate 1A of the camera module CM. Examples of the other electrical-insulation material are the BT resin and the aramid non-fabric material. - The above description explains the present invention applied mainly to a camera module employing a CMOS image sensor, which is a sensor in a field serving as the background of the present invention discovered by the inventors. However, the scope of the present invention is not limited to such a camera module. For example, the present invention can also be applied to a camera module employing a CCD (Charge Coupled Device) image sensor.
Claims (6)
1. A method of manufacturing a solid-state image sensing device comprising the steps of:
(a) preparing a wiring substrate mother board having a first face and a second face on the side opposite to said first face;
(b) mounting first electronic components over said first face of said wiring substrate mother board;
(c) encapsulating said first electronic components by using an encapsulation body;
(d) mounting second electronic components including image sensors over said second face of said wiring substrate mother board; and
(e) joining a frame to said second face of said wiring substrate mother board so as to cover said second electronic components,
wherein said frame has a position adjustment pin for adjusting the position of said frame with respect to said wiring substrate mother board,
wherein said wiring substrate mother board has a through hole into which said position adjustment pin is to be inserted, and
wherein in said step (c), said encapsulation body is formed in such a way that said through hole is avoided.
2. A method of manufacturing a solid-state image sensing device according to claim 1 ,
wherein said wiring substrate mother board has a plurality of module regions, and said step (c) is a step of forming said encapsulation body as a batch encapsulation body for encapsulating said first electronic components in said module regions in the aggregate.
3. A method of manufacturing a solid-state image sensing device according to claim 2 , wherein a plurality of said batch encapsulation bodies is formed over said first face of said wiring substrate parent substrate with said batch encapsulation bodies being separated from each other.
4. A method of manufacturing a solid-state image sensing device according to claim 3 , wherein a depression is formed in a portion of each of said batch encapsulation bodies.
5. A method of manufacturing a solid-state image sensing device according to claim 2 , wherein in said step (c), said module regions are divided into a plurality of groups and a plurality of said first electronic components in each of said groups is encapsulated in the aggregate.
6. A method of manufacturing a solid-state image sensing device according to claim 5 , wherein in said step (c), an encapsulation material is supplied to any particular one of said groups through an encapsulation-material-supplying path provided for said particular one of said groups so as to form said encapsulated body for said particular one of said groups in the aggregate.
Priority Applications (1)
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US11/480,413 US20060248715A1 (en) | 2003-08-25 | 2006-07-05 | Manufacturing method of solid-state image sensing device |
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Application Number | Priority Date | Filing Date | Title |
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JP2003-300217 | 2003-08-25 | ||
JP2003300217A JP4405208B2 (en) | 2003-08-25 | 2003-08-25 | Method for manufacturing solid-state imaging device |
US10/659,433 US7168161B2 (en) | 2003-08-25 | 2003-09-11 | Manufacturing method of solid-state image sensing device |
US11/480,413 US20060248715A1 (en) | 2003-08-25 | 2006-07-05 | Manufacturing method of solid-state image sensing device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/659,433 Division US7168161B2 (en) | 2003-08-25 | 2003-09-11 | Manufacturing method of solid-state image sensing device |
Publications (1)
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US20060248715A1 true US20060248715A1 (en) | 2006-11-09 |
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US10/659,433 Active 2024-08-27 US7168161B2 (en) | 2003-08-25 | 2003-09-11 | Manufacturing method of solid-state image sensing device |
US11/480,413 Abandoned US20060248715A1 (en) | 2003-08-25 | 2006-07-05 | Manufacturing method of solid-state image sensing device |
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US (2) | US7168161B2 (en) |
JP (1) | JP4405208B2 (en) |
CN (1) | CN1591885A (en) |
TW (1) | TW200509379A (en) |
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US20080006859A1 (en) * | 2006-06-19 | 2008-01-10 | Stmicroelectronics Rousset Sas | Method for manufacturing lenses, in particular for an imager comprising a diaphragm |
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US20080131131A1 (en) * | 2006-12-01 | 2008-06-05 | Hon Hai Precision Industry Co., Ltd. | Remote control module and portable electronic apparatus having same |
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Also Published As
Publication number | Publication date |
---|---|
CN1591885A (en) | 2005-03-09 |
JP2005072258A (en) | 2005-03-17 |
US7168161B2 (en) | 2007-01-30 |
JP4405208B2 (en) | 2010-01-27 |
US20050048692A1 (en) | 2005-03-03 |
TW200509379A (en) | 2005-03-01 |
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