US20060215376A1 - Secondary battery protecting module and lead mounting method - Google Patents
Secondary battery protecting module and lead mounting method Download PDFInfo
- Publication number
- US20060215376A1 US20060215376A1 US11/322,192 US32219205A US2006215376A1 US 20060215376 A1 US20060215376 A1 US 20060215376A1 US 32219205 A US32219205 A US 32219205A US 2006215376 A1 US2006215376 A1 US 2006215376A1
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- US
- United States
- Prior art keywords
- lead
- secondary battery
- printed board
- principal surface
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/296—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by terminals of battery packs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Combinations Of Printed Boards (AREA)
- Secondary Cells (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
Description
- This application claims priority to prior Japanese patent application JP 2005-90691, the disclosure of which is incorporated herein by reference.
- This invention relates to a secondary battery protecting module having a protection circuit for protecting a chargeable battery (secondary battery) such as a lithium ion battery and, in particular, to a method of mounting a lead to be connected to a terminal, such as a terminal of a secondary battery, to a printed board.
- Among various secondary batteries, in particular, a lithium ion battery is easily damaged by overdischarge and overcharge. It is therefore essential and indispensable to provide a secondary battery protection circuit for detecting an overdisharged state and an overcharged state of the lithium ion battery as a secondary battery to protect the secondary battery from the overdischarged state and the overcharged state. The secondary battery protection circuit comprises an overdischarge preventing mechanism and an overcharge preventing mechanism. For example, the secondary battery protection circuit is disclosed in Japanese Patent (JP-B) No. 2872365 or Japanese Unexamined Patent Application Publication (JP-A) No. 2001-169477. Typically, an IC chip (protection IC) is used as the secondary battery protection circuit.
- The above-mentioned secondary battery protection circuit (protection IC) is disposed on a printed board (circuit board) (for example, see Japanese Unexamined Patent Application Publication (JP-A) No. 2001-268808). On the printed board, a power MOSFET (power IC) serving as a discharge control switch and a charge control switch, and a plurality of electronic components, such as a resistor and a capacitor, are disposed. A combination of the printed board, the secondary battery protection circuit, the power MOSFET, and the electronic components is called a secondary battery protection module.
- The secondary battery protection module is electrically connected to terminals of the secondary battery such as the lithium ion battery. A combination of the secondary battery protection module and the secondary battery is called a battery pack.
- The secondary battery has an anode terminal and a cathode terminal as the terminals. In order to establish electrical connection with the anode terminal and the cathode terminal of the secondary battery, the secondary battery protection module has a pair of leads on the printed board. For example, each lead comprises a nickel lead. One of the leads which is to be connected to the anode terminal of the secondary battery is called an anode lead. The other lead to be connected to the cathode terminal of the secondary battery is called a cathode lead.
- On the other hand, in order to establish electrical connection with a load or a battery charger, the secondary battery protection module has a pair of external connection terminals on the printed board. One of the external connection terminals is a positive terminal. The other external connection terminal is a negative terminal.
- Referring to
FIG. 1 , a related secondarybattery protection module 10A will be described. The secondarybattery protection module 10A comprises the printed board (circuit board) 11 having aprincipal surface 11 a and aback surface 11 b opposite to each other. On the principal surface 1 a of the printedboard 11, the secondary battery protection circuit (protection IC), the power MOSFET (power IC), the electronic components, and the leads (the anode lead and the cathode lead) 21A (only the anode lead being illustrated inFIG. 1 ) are disposed. On the other hand, on theback surface 11 b of the printedboard 11, the external connection terminals (the positive terminal and the negative terminal) and so on are disposed. Between theanode lead 21A and the cathode lead, the secondary battery protection circuit (protection IC) is connected through an internal wiring of the printedboard 11. Between the cathode lead and the negative terminal, the power MOSFET (power IC) is connected through another internal wiring of the printed board. - As shown in
FIG. 1 , each of theleads 21A to be connected to the anode terminal and the cathode terminal of the secondary battery has an L shape. Specifically, the L-shaped lead 21A has a mounted part 21Aa to be mounted (or disposed) on theprincipal surface 11 a of the printedboard 11 and a connected part 21Ab to be connected to the terminal (the anode terminal or the cathode terminal) of the secondary battery. - In the secondary
battery protection module 10A, the L-shaped lead 21A is mounted on theprincipal surface 11 a of the printedboard 11 in the following manner. It is noted here that, on the principal surface 1 a of the printedboard 11, aland 50 is formed. At first, a flat lead is prepared. The mounted part 21Aa of the flat lead is connected and fixed to theland 50 of theprincipal surface 11 a of the printedboard 11 by using asolder 52. Thereafter, the connected part 21Ab of the flat lead is bent by 90° (right angle) with respect to the mounted part 21Aa. Thus, the flat lead is formed into the L-shaped lead 21A. - As described above, in the secondary
battery protection module 10A, the lead is mounted on theprincipal surface 11 a of the printedboard 11 by connecting and fixing the flat lead to theland 50 of theprincipal surface 11 a of the printedboard 11 using thesolder 52 and thereafter bending the flat lead by 90° to form the flat lead into the L-shaped lead 21A. - In the above-mentioned lead mounting method, when the flat lead is bent by 90°, a crack may be caused to occur in the
solder 52. In order to avoid occurrence of the crack, the flat lead is bent at a position spaced by a predetermined distance from an edge of theland 50 as shown inFIG. 1 . Therefore, the mounted part 21Aa has a length Lm′ greater than a length Ll of theland 50 in a bending direction. - However, even if the flat lead is bent at the position spaced from the edge of the
land 50, thesolder 52 is subjected to a force in a direction of separating thesolder 52 from theland 50. As a result, it is difficult to completely avoid occurrence of the crack in thesolder 52. - It is therefore an object of this invention to provide a lead mounting method capable of completely avoiding occurrence of a crack in a soldering portion.
- It is another object of this invention to provide a secondary battery protection module having a lead mounted by the method.
- Lead mounting methods according to this invention and secondary battery protection modules according to this invention are as follows:
- (1) A lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, the method comprising the steps of:
- preparing a flat lead which has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal;
- bending the flat lead into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead; and
- connecting and fixing the mounted part of the L-shaped lead onto the principal surface of the printed board by soldering.
- (2) A lead mounting method as described in section (1), wherein the terminal is a terminal of a secondary battery.
- (3) A lead mounting method as described in section (1), wherein the lead is a nickel lead.
- (4) A secondary battery protection module comprising:
- a printed board having a principal surface and a back surface opposite to each other;
- a protection circuit disposed on the principal surface of the printed board for protecting a secondary battery;
- switching means disposed on the principal surface of the printed board for turning on and off discharge and charge of the secondary battery under control of the protection circuit; and
- a pair of L-shaped leads disposed on the principal surface of the printed board to be connected to an anode terminal and a cathode terminal of the secondary battery, wherein:
- each of the L-shaped leads is mounted on the principal surface of the printed board by soldering with each of the L-shaped leads preliminarily formed by bending a flat lead into an L shape.
- (5) A secondary battery protection module as described in section (4), further comprising a pair of external connection terminals mounted on the rear surface of the printed board.
- (6) A secondary battery protection module as described in section (4) or (5), wherein each of the L-shaped leads has a mounted part to be mounted on the printed board, the mounted part having a length in a bending direction not greater than a length of a land formed on the printed board.
- In this invention, the flat lead is preliminarily formed into an L shape and thereafter mounted onto the principal surface of the printed board by soldering. It is therefore possible to completely avoid occurrence of a crack in a soldering portion.
-
FIG. 1 is a sectional view of a related secondary battery protection module; -
FIGS. 2A to 2D show a secondary battery protection module to which a lead mounting method according to an embodiment of this invention is applicable,FIG. 2A being a plan view,FIG. 2B being a rear view,FIG. 2C being a front view,FIG. 2D being a side view; and -
FIG. 3 is a sectional view of the secondary battery protection module illustrated inFIGS. 2A to 2D. - Now, an embodiment of this invention will be described in detail with reference to the drawing.
- Referring to
FIGS. 2A to 2D, description will be made of a secondarybattery protection module 10 to which a lead mounting method according to the embodiment of this invention is applicable. - As will later be described, the secondary
battery protection module 10 is electrically connected to a secondary battery (not shown) such as a lithium ion battery. The secondary battery has an anode terminal and a cathode terminal. A combination of the secondarybattery protection module 10 and the secondary battery is called a battery pack. - The secondary
battery protection module 10 comprises a printedboard 11. The printedboard 11 has aprincipal surface 11 a and aback surface 11 b opposite to each other. The printedboard 11 illustrated in the figure has a thickness of about 0.7 mm. - On the
principal surface 11 a of the printedboard 11, a secondary battery protection circuit (protection IC) 12, a power MOSFET (power IC) 13 serving as a discharge control switch and a charge control switch, a plurality ofelectronic components 14 such as a resistor and a capacitor are disposed. - The secondary
battery protection circuit 12 is a circuit for detecting an overdischarged state and an overcharged state of the secondary battery to protect the secondary battery from the overdischarged state and the overcharged state. Thepower MOSFET 13 serves as a switching member for turning on and off discharge and charge of the secondary battery under control of the secondarybattery protection circuit 12. - In order to establish electrical connection with the anode terminal and the cathode terminal of the secondary battery, the secondary
battery protection module 10 has a pair ofleads principal surface 11 a of the printedboard 11. For example, each of theleads lead 21 to be connected to the anode terminal of the secondary battery is called an anode lead while theother lead 22 to be connected to the cathode terminal of the secondary battery is called a cathode lead. - On the other hand, as illustrated in
FIG. 2B , in order to establish electrical connection with a lead or a battery charger, the secondarybattery protection module 10 has a pair ofexternal connection terminals back surface 11 b of the printedboard 11. One of the external connection terminals is apositive terminal 31 and the other is anegative terminal 32. Each of thepositive terminal 31 and thenegative terminal 32 is plated with gold and has a thickness greater than 0.5 μm. - Between the
anode lead 21 and thecathode lead 22, the secondary battery protection circuit (protection IC) 12 is connected through an internal wiring (not shown) of the printedboard 11. Between thecathode lead 22 and thenegative terminal 32, the power MOSFET (power IC) 13 is connected through another internal wiring (not shown) of the printedboard 11. - As illustrated in
FIG. 2D , each of theleads lead 21 has a mountedpart 21 a to be mounted (disposed) on theprincipal surface 11 a of the printedboard 11 and aconnected part 21 b to be connected to the anode terminal of the secondary battery. Likewise, the L-shapedlead 22 has a mountedpart 22 a to be mounted (disposed) on theprincipal surface 11 a of the printedboard 11 and aconnected part 22 b to be connected to the cathode terminal of the secondary battery. - Those circuit components mounted on the
principal surface 11 a of the printedboard 11, i.e., the secondarybattery protection circuit 12, thepower MOSFET 13, and theelectronic components 14 are encapsulated by aresin 40. - Next referring to
FIG. 3 in addition toFIGS. 2A to 2D, description will be made of a lead mounting method of mounting the L-shaped leads 21 and 22 onto theprincipal surface 11 a of the printedboard 11 according to the embodiment. On theprincipal surface 11 a of the printedboard 11, aland 50 is formed. InFIG. 3 , theanode lead 21 alone is shown in an enlarged scale. As will readily be understood, thecathode lead 22 is similar in structure. - At first, two flat leads are prepared. Next, the two flat leads are bent into an L shape so that the mounted
parts principal surface 11 a of the printedboard 11 are perpendicular to theconnected parts parts land 50 of theprincipal surface 11 a of the printedboard 11 by using asolder 52. Thus, the L-shaped leads 21 and 22 are mounted on theprincipal surface 11 a of the printedboard 11. - As described above, in the lead mounting method according to the embodiment of this invention, the flat lead is preliminarily formed into the L shape and thereafter mounted onto the
principal surface 11 a of the printedboard 11. Therefore, as compared with the above-mentioned lead mounting method in which the flat lead is bent by 90° after soldering using thesolder 50, it is possible to completely avoid occurrence of a crack in a soldering portion by thesolder 50. - As illustrated in
FIG. 3 , themounted part 21 a has a length Lm substantially equal to a length Ll of theland 50 in a bending direction. - While this invention has thus far been described in connection with the preferred embodiment, it will readily be understood that this invention is not limited to the foregoing embodiment. In
FIG. 3 , the length Ll of theland 50 is equal to the length Lm of themounted part 21 a. Alternatively, in order to more firmly attach the lead, the length Lm of themounted part 21 a may be slightly shorter than the length Ll of theland 50 so as to form a fillet. - In the foregoing embodiment, the nickel lead is used as the lead. However, the material of the lead is not limited to nickel. Further, in the foregoing embodiment, description has been directed to the lead mounting method in which the lead is electrically connected to the terminal (the anode terminal or the cathode terminal) of the secondary battery. However, the terminal is not limited to the terminal of the secondary battery.
Claims (7)
1. A lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, said method comprising the steps of:
preparing a flat lead which has a mounted part to be disposed on the principal surface of said printed board and a connected part to be connected to said terminal;
bending said flat lead into an L shape so that said mounted part and said connected part are perpendicular to each other to obtain an L-shaped lead; and
connecting and fixing the mounted part of said L-shaped lead onto the principal surface of said printed board by soldering.
2. A lead mounting method as claimed in claim 1 , wherein said terminal is a terminal of a secondary battery.
3. A lead mounting method as claimed in claim 1 , wherein said lead is a nickel lead.
4. A secondary battery protection module comprising:
a printed board having a principal surface and a back surface opposite to each other;
a protection circuit disposed on the principal surface of said printed board for protecting a secondary battery;
switching means disposed on the principal surface of said printed board for turning on and off discharge and charge of said secondary battery under control of said protection circuit; and
a pair of L-shaped leads disposed on the principal surface of said printed board to be connected to an anode terminal and a cathode terminal of said secondary battery, wherein:
each of said L-shaped leads is mounted on the principal surface of said printed board by soldering with each of said L-shaped leads preliminarily formed by bending a flat lead into an L shape.
5. A secondary battery protection module as claimed in claim 4 , further comprising a pair of external connection terminals mounted on the rear surface of said printed board.
6. A secondary battery protection module as claimed in claim 4 , wherein each of said L-shaped leads has a mounted part to be mounted on said printed board, said mounted part having a length in a bending direction not greater than a length of a land formed on said printed board.
7. A secondary battery protection module as claimed in claim 5 , wherein each of said L-shaped leads has a mounted part to be mounted on said printed board, said mounted part having a length in a bending direction not greater than a length of a land formed on said printed board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/252,258 US8305768B2 (en) | 2005-03-28 | 2008-10-15 | Secondary battery protecting module and lead mounting method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005090691A JP4877455B2 (en) | 2005-03-28 | 2005-03-28 | Secondary battery protection module and lead mounting method |
JP2005-90691 | 2005-03-28 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/252,258 Division US8305768B2 (en) | 2005-03-28 | 2008-10-15 | Secondary battery protecting module and lead mounting method |
Publications (1)
Publication Number | Publication Date |
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US20060215376A1 true US20060215376A1 (en) | 2006-09-28 |
Family
ID=36601232
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US11/322,192 Abandoned US20060215376A1 (en) | 2005-03-28 | 2005-12-29 | Secondary battery protecting module and lead mounting method |
US12/252,258 Expired - Fee Related US8305768B2 (en) | 2005-03-28 | 2008-10-15 | Secondary battery protecting module and lead mounting method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US12/252,258 Expired - Fee Related US8305768B2 (en) | 2005-03-28 | 2008-10-15 | Secondary battery protecting module and lead mounting method |
Country Status (3)
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US (2) | US20060215376A1 (en) |
EP (1) | EP1708553B1 (en) |
JP (1) | JP4877455B2 (en) |
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Also Published As
Publication number | Publication date |
---|---|
JP4877455B2 (en) | 2012-02-15 |
EP1708553A3 (en) | 2008-07-23 |
US8305768B2 (en) | 2012-11-06 |
JP2006277970A (en) | 2006-10-12 |
US20090072008A1 (en) | 2009-03-19 |
EP1708553B1 (en) | 2012-10-03 |
EP1708553A2 (en) | 2006-10-04 |
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AS | Assignment |
Owner name: MITSUMI ELECTRIC CO. LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAKEDA, ITARU;KATO, TOMOYUKI;SHOJI, YASUO;REEL/FRAME:017432/0287 Effective date: 20051222 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |