US20060048333A1 - Tool for cleaning particles from wafer stage - Google Patents
Tool for cleaning particles from wafer stage Download PDFInfo
- Publication number
- US20060048333A1 US20060048333A1 US10/989,321 US98932104A US2006048333A1 US 20060048333 A1 US20060048333 A1 US 20060048333A1 US 98932104 A US98932104 A US 98932104A US 2006048333 A1 US2006048333 A1 US 2006048333A1
- Authority
- US
- United States
- Prior art keywords
- tool
- cleaning
- driving device
- wafer stage
- recited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 79
- 239000002245 particle Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L13/00—Implements for cleaning floors, carpets, furniture, walls, or wall coverings
- A47L13/10—Scrubbing; Scouring; Cleaning; Polishing
- A47L13/40—Cleaning implements actuated by electrostatic attraction; Devices for cleaning same; Magnetic cleaning implements
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L5/00—Structural features of suction cleaners
- A47L5/12—Structural features of suction cleaners with power-driven air-pumps or air-compressors, e.g. driven by motor vehicle engine vacuum
- A47L5/22—Structural features of suction cleaners with power-driven air-pumps or air-compressors, e.g. driven by motor vehicle engine vacuum with rotary fans
- A47L5/24—Hand-supported suction cleaners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
Definitions
- the present invention relates to a cleaning tool, and more particularly, to a tool for cleaning particulars from wafer stage.
- Particles generated on the wafer stage of a mask aligner are the cause of a variety of defocus problems during subsequent lithography steps. Once a wafer defocus had happened, the process for fabricating wafer must be stopped immediately to remove the particles on the wafer stage.
- the most common method used for cleaning particles from a wafer stage is substantially a manual operation of using a none-duct cloth soaked with alcohol to wipe the wafer stage illuminated by a flashlight.
- it is generally difficult and troublesome for a maintenance personnel to manually wipe the wafer stage in an ordinary 12-inch semiconductor equipment since there are usually many delicate devices disposed in the proximity of the wafer stage, and there is only a limited space for the wiping operation, in addition to that, the wafer stage is usually being arranged deep inside the semiconductor equipment.
- even the maintenance person proceeds with the wiping operation with extreme cautious there is still a high probability to come into contact with those delicate devices and thus damage the semiconductor equipment.
- the conventional method for cleaning particles from wafer stage has at least the following shortcomings
- the present invention provides a small and extendable cleaning tool, capable of cleaning any location of the wafer stage without the worry of dead corners, which is further equipped with a suitable cleaning module enabling the tool to be able to sufficiently removal particles on the wafer stage.
- the tool for cleaning particulars from a wafer stage comprises:
- the tool of the invention is further equipped with a illuminating device for enable the particles deposited on the wafer stage to be easily spotted so as to accelerate the speed of cleaning procedure.
- the cleaning module of the invention utilizes the rotating of the E-chunk for cleaning particles from the wafer stage, however, a plurality cleaning modules of different characteristic, such as electrostatic, vacuum suction, and so on, can be selected as the cleaning module of the invention with respect to different cleaning requirement and environment.
- FIG. 1 is a schematic illustration showing a tool for cleaning particles from a wafer stage according to a preferred embodiment of the invention.
- FIG. 2 is a flow chart showing the method applying the tool for cleaning particles from a wafer stage according to a preferred embodiment of the invention.
- the tool for cleaning particulars from a wafer stage comprises: a main body 100 , composed of a handle section 100 b and a cleaning module section 100 a disposed with respect to the handle section 100 b ; a driving device 101 , disposed inside the main body 100 ; a power supply 102 , disposed inside the main body 100 and coupled to the driving device 101 ; and a cleaning module 103 , disposed inside the main body 100 and coupled to the driving device 101 ; wherein the cleaning module 103 is driven by the driving device 101 to clean particles from the wafer stage.
- the overall length of the main body 100 is not fixed, for a extendable rod can be used to connect the handle section 100 b and the cleaning module section 100 a enabling the tool to have an adjustable length, such that the tool is adapted for cleaning every location of the wafer stage without the worry of dead corners.
- an accommodating space 1001 is arranged inside the cleaning module section 100 a for receiving the driving device 101 , which is used for driving the cleaning module 103 .
- the driving device 101 is substantially a motor.
- the power supply 102 is coupled to the driving device 101 for providing power to the same.
- the power supply 102 is substantially a battery or battery set since the power consumption of motor can be sustained by using batteries. The use of batteries can save a complex circuit for providing power using another kind of power source that it is cost-saving and convenient.
- the driving device 101 and the power supply is disposed for providing power to the cleaning module 103 , it is preferred as shown in FIG. 1 that the driving device 101 is disposed in the accommodating space 1001 for connecting to the cleaning module 103 directly, and the power supply 102 is disposed in the handle section and is coupled to the driving device 101 .
- the driving device 102 and the power supply 102 can be arranged as require at any location inside the main body 100 where the driving device 101 is coupled to the power supply 1032 by mechanical devices.
- the cleaning module 103 is coupled to the driving device 101 such that the cleaning module 103 is driven by the driving device 100 for perform a cleaning operation.
- the cleaning module 103 performs the cleaning operation by a rotating manner, where the cleaning module 103 is consisted of a rotary base 1031 , an elastic member 1032 and a turntable 1033 .
- the rotary base 1031 is connected to the driving device 101 and the turntable 1033 is connected to the rotary base 1031 so that the resilience generated by the elastic member 1032 disposed between the rotary base 1031 and the turntable 1033 can counter the stress generated during the cleaning operation of rotating manner, and thus the damage of wafer stage can be avoid.
- the power provide by the driving device 101 forces the turntable 1033 to rotate so as to remove particles from the wafer stage.
- the cleaning module 103 of the embodiment utilizes the rotating of the turntable 1033 for cleaning particles from the wafer stage, however, a plurality cleaning modules of different characteristic, such as electrostatic, vacuum suction, and so on, can be selected as the cleaning module of the invention with respect to different cleaning requirement and environment.
- an illuminating device 104 is further coupled to the cleaning module section 100 a which is used as the light source for the cleaning operation.
- the preferred object of adding the illuminating device 104 is to illuminate the position where it is being cleaned.
- the switch 105 is used for controlling the driving device 101
- the switch 106 is used for controlling the illuminating device 104 .
- the operating of the switches 105 , 106 is familiar to those skilled in the art and will not be described further hereinafter.
- the positioning of the switches 105 , 106 can be varied as require and are not limited by the embodiment.
- FIG. 2 is a flow chart showing the method applying the tool for cleaning particles from a wafer stage according to a preferred embodiment of the invention.
- the method for cleaning particles from a wafer stage comprises the steps of:
- the present invention discloses a small and extendable tool for cleaning particles from a wafer stage, which is equipped with a illuminating device and has a changeable cleaning module capable of adapting to different cleaning environments.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Radio Transmission System (AREA)
Abstract
The present invention discloses a tool for cleaning particles from a wafer stage, comprising: a main body, a driving device, a power supply, and a cleaning module composed of a rotary base, a turntable, and an elastic member, wherein the main body is designed to be extendable, having a accommodating space disposed at the front thereof, and the driving device is arranged in the accommodating space for driving the cleaning module, and the power supply is coupled to the driving device for providing power to the same. Moreover, the rotary base is connected to the turntable by way of the elastic member, so that the driving device can drive the turntable to rotate for cleaning the wafer stage. A plurality turntables of different characteristic can be selected to be used in the cleaning module of the invention with respect to different cleaning requirement and environment.
Description
- The present invention relates to a cleaning tool, and more particularly, to a tool for cleaning particulars from wafer stage.
- Particles generated on the wafer stage of a mask aligner are the cause of a variety of defocus problems during subsequent lithography steps. Once a wafer defocus had happened, the process for fabricating wafer must be stopped immediately to remove the particles on the wafer stage.
- The most common method used for cleaning particles from a wafer stage is substantially a manual operation of using a none-duct cloth soaked with alcohol to wipe the wafer stage illuminated by a flashlight. However, it is generally difficult and troublesome for a maintenance personnel to manually wipe the wafer stage in an ordinary 12-inch semiconductor equipment, since there are usually many delicate devices disposed in the proximity of the wafer stage, and there is only a limited space for the wiping operation, in addition to that, the wafer stage is usually being arranged deep inside the semiconductor equipment. As the consequence, even the maintenance person proceeds with the wiping operation with extreme cautious, there is still a high probability to come into contact with those delicate devices and thus damage the semiconductor equipment.
- In view of the above description, the conventional method for cleaning particles from wafer stage has at least the following shortcomings;
-
- (a) There may exists several dead corner that are not accessible by the conventional method for cleaning particles from wafer stage since there is only a limited space for the wiping operation in a semiconductor equipment and the wafer stage is usually being arranged deep inside the semiconductor equipment.
- (b) The yield of wafer manufacturing is affected by poor cleaning quality of the conventional cleaning method since the cleaning quality is low due to the complexity and difficulty of the cleaning procedure that are the cause of the insufficient illumination provided by the conventional cleaning method.
- (c) The manual wiping operation adopted by the conventional cleaning method will have difficult to remove those particles with high viscosity, such that the yield of wafer manufacturing is reduced.
- (d) Particles can not be remove rapidly using the conventional cleaning method since there are many delicate devices disposed in the proximity of the wafer stage so that it is difficult to perform the manual wiping without coming into contact with any one of the same and causing damage to the semiconductor equipment.
- It is the primary object of the invention to provide a tool for cleaning particles from a wafer stage, which is adapted for being used in a limited space with respect to the positioning of the wafer stage for increasing the convenience of cleaning the wafer stage so as to clean the wafer stage rapidly and sufficiently.
- To achieve the abovementioned object, the present invention provides a small and extendable cleaning tool, capable of cleaning any location of the wafer stage without the worry of dead corners, which is further equipped with a suitable cleaning module enabling the tool to be able to sufficiently removal particles on the wafer stage.
- In a preferred embodiment of the invention, the tool for cleaning particulars from a wafer stage comprises:
-
- a main body, composed of a handle section and a cleaning module section disposed with respect to the handle section;
- a driving device, disposed inside the main body;
- a power supply, disposed inside the main body and coupled to the driving device; and
- a cleaning module, disposed inside the main body and coupled to the driving device;
- wherein, the cleaning module is driven by the driving device to clean particles from the wafer stage.
- In another preferred embodiment, the tool of the invention is further equipped with a illuminating device for enable the particles deposited on the wafer stage to be easily spotted so as to accelerate the speed of cleaning procedure. In addition, the cleaning module of the invention utilizes the rotating of the E-chunk for cleaning particles from the wafer stage, however, a plurality cleaning modules of different characteristic, such as electrostatic, vacuum suction, and so on, can be selected as the cleaning module of the invention with respect to different cleaning requirement and environment.
-
FIG. 1 is a schematic illustration showing a tool for cleaning particles from a wafer stage according to a preferred embodiment of the invention. -
FIG. 2 is a flow chart showing the method applying the tool for cleaning particles from a wafer stage according to a preferred embodiment of the invention. - For your esteemed members of reviewing committee to further understand and recognize the fulfilled functions and structural characteristics of the invention, several preferable embodiments cooperating with detailed description are presented as the follows.
- Please refer to
FIG. 1 , which a schematic illustration showing a tool for cleaning particles from a wafer stage according to a preferred embodiment of the invention. As seen inFIG. 1 , the tool for cleaning particulars from a wafer stage comprises: amain body 100, composed of ahandle section 100 b and acleaning module section 100 a disposed with respect to thehandle section 100 b; adriving device 101, disposed inside themain body 100; apower supply 102, disposed inside themain body 100 and coupled to thedriving device 101; and acleaning module 103, disposed inside themain body 100 and coupled to thedriving device 101; wherein thecleaning module 103 is driven by thedriving device 101 to clean particles from the wafer stage. Moreover, the overall length of themain body 100 is not fixed, for a extendable rod can be used to connect thehandle section 100 b and thecleaning module section 100 a enabling the tool to have an adjustable length, such that the tool is adapted for cleaning every location of the wafer stage without the worry of dead corners. - In addition, an
accommodating space 1001 is arranged inside thecleaning module section 100 a for receiving thedriving device 101, which is used for driving thecleaning module 103. Generally, thedriving device 101 is substantially a motor. Thepower supply 102 is coupled to thedriving device 101 for providing power to the same. In a preferred embodiment of the invention, thepower supply 102 is substantially a battery or battery set since the power consumption of motor can be sustained by using batteries. The use of batteries can save a complex circuit for providing power using another kind of power source that it is cost-saving and convenient. - Since the
driving device 101 and the power supply is disposed for providing power to thecleaning module 103, it is preferred as shown inFIG. 1 that thedriving device 101 is disposed in theaccommodating space 1001 for connecting to thecleaning module 103 directly, and thepower supply 102 is disposed in the handle section and is coupled to thedriving device 101. However, thedriving device 102 and thepower supply 102 can be arranged as require at any location inside themain body 100 where thedriving device 101 is coupled to thepower supply 1032 by mechanical devices. - The
cleaning module 103 is coupled to thedriving device 101 such that thecleaning module 103 is driven by thedriving device 100 for perform a cleaning operation. In a preferred embodiment of the invention, thecleaning module 103 performs the cleaning operation by a rotating manner, where thecleaning module 103 is consisted of arotary base 1031, anelastic member 1032 and aturntable 1033. As seen inFIG. 1 , therotary base 1031 is connected to thedriving device 101 and theturntable 1033 is connected to therotary base 1031 so that the resilience generated by theelastic member 1032 disposed between therotary base 1031 and theturntable 1033 can counter the stress generated during the cleaning operation of rotating manner, and thus the damage of wafer stage can be avoid. Moreover, the power provide by thedriving device 101 forces theturntable 1033 to rotate so as to remove particles from the wafer stage. Thecleaning module 103 of the embodiment utilizes the rotating of theturntable 1033 for cleaning particles from the wafer stage, however, a plurality cleaning modules of different characteristic, such as electrostatic, vacuum suction, and so on, can be selected as the cleaning module of the invention with respect to different cleaning requirement and environment. - In another preferred embodiment, an
illuminating device 104 is further coupled to thecleaning module section 100 a which is used as the light source for the cleaning operation. The preferred object of adding theilluminating device 104 is to illuminate the position where it is being cleaned. As seen inFIG. 1 , theswitch 105 is used for controlling thedriving device 101, and theswitch 106 is used for controlling theilluminating device 104. As for the operating of theswitches switches - Please refer to
FIG. 2 , which is a flow chart showing the method applying the tool for cleaning particles from a wafer stage according to a preferred embodiment of the invention. The method for cleaning particles from a wafer stage comprises the steps of: -
- step 200: detecting particles deposited on the wafer stage, that is, particles is detected while a defocus is happened during a lithography process enabling an operator to perform an examination procedure;
- step 201: measuring the flatness of the wafer stage so that the operator can spot the location of the particles;
- step 202: proceeding with a clean procedure by turning on the
switches FIG. 1 , while the operator can select asuitable turntable 1033 according to the characteristics of the particles spotted; - step 203: making an evaluation to determine whether the cleaning process is complete by measuring the flatness of the wafer stage; if the flatness is still beyond a predefined level, the flow proceeds back to
step 202; - step 204: stopping the cleaning procedure while the measured flatness meets with t the predefined level.
- To sum up, the present invention discloses a small and extendable tool for cleaning particles from a wafer stage, which is equipped with a illuminating device and has a changeable cleaning module capable of adapting to different cleaning environments. Although this invention has been disclosed and illustrated with reference to particular embodiments, the principles involved are susceptible for use in numerous other embodiments that will be apparent to persons skilled in the art. This invention is, therefore, to be limited only as indicated by the scope of the appended claims.
- While the preferred embodiment of the invention has been set forth for the purpose of disclosure, modifications of the disclosed embodiment of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.
Claims (12)
1. A tool for cleaning particles from a wafer stage, comprising:
a main body, comprising a handle section and a cleaning module section disposed with respect to the handle section;
a driving device, disposed inside the main body;
a power supply, disposed inside the main body and coupled to the driving device; and
a cleaning module, disposed inside the main body and coupled to the driving device.
2. The tool as recited in claim 1 , further comprising an accommodating space arranged inside the cleaning module section for receiving the driving device.
3. The tool as recited in claim 1 , wherein the length of the main body is extendable.
4. The tool as recited in claim 1 , further comprising a switch coupled to the power supply.
5. The tool as recited in claim 4 , wherein the switch is arranged at the handle section.
6. The tool as recited in claim 1 , wherein the driving device is substantially a motor.
7. The tool as recited in claim 1 , wherein the power supply is substantially a battery set.
8. The tool as recited in claim 1 , wherein the cleaning module further comprises:
a rotary base;
a turntable, coupled to the rotary base; and
an elastic member, disposed between the rotary base and the turntable.
9. The tool as recited in claim 1 , further comprising an illuminating device connected to the cleaning module section.
10. The tool as recited in claim 9 , further comprising a switch arranged at the handle section for controlling the illuminating device.
11. The tool as recited in claim 10 , wherein the cleaning module performs a cleaning procedure by an electrostatic suction manner.
12. The tool as recited in claim 1 , wherein the cleaning module performs a cleaning procedure by a vacuum suction manner.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093126933A TWI246148B (en) | 2004-09-07 | 2004-09-07 | Cleaning fixture for wafer stage of semiconductor tool |
TW93126933 | 2004-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060048333A1 true US20060048333A1 (en) | 2006-03-09 |
Family
ID=35994732
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/938,530 Abandoned US20060052077A1 (en) | 2004-09-07 | 2004-09-13 | Tunable compensation device and method for received signals |
US10/989,321 Abandoned US20060048333A1 (en) | 2004-09-07 | 2004-11-17 | Tool for cleaning particles from wafer stage |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/938,530 Abandoned US20060052077A1 (en) | 2004-09-07 | 2004-09-13 | Tunable compensation device and method for received signals |
Country Status (2)
Country | Link |
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US (2) | US20060052077A1 (en) |
TW (1) | TWI246148B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI462164B (en) * | 2009-11-13 | 2014-11-21 | Inotera Memories Inc | Method for cleaning a wafer stage |
CN109482579A (en) * | 2018-12-07 | 2019-03-19 | 杭州鸿星电子有限公司 | A kind of cleaning system and cleaning method of quartz wafer jig |
CN114623862B (en) * | 2020-12-11 | 2024-04-16 | 中国科学院微电子研究所 | Semiconductor measuring equipment and cleaning method |
CN112934848B (en) * | 2021-01-29 | 2022-10-11 | 芜湖米格半导体检测有限公司 | Dust cleaning equipment for semiconductor preparation |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3864780A (en) * | 1973-12-26 | 1975-02-11 | Jasper Watkins | Cleaning brush with revolving bristles |
US3932909A (en) * | 1974-10-25 | 1976-01-20 | George Beldon Johnson | Personal self-powered scrub brush |
US4158246A (en) * | 1977-09-07 | 1979-06-19 | Disston, Inc. | Portable cordless scrubber |
US4724563A (en) * | 1986-04-16 | 1988-02-16 | Fry Raymond A | Personal care power brush |
US6185781B1 (en) * | 1999-06-24 | 2001-02-13 | The Hoover Company | Hand scrub tool with interchangeable scrub drives |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6201955B1 (en) * | 1998-05-29 | 2001-03-13 | Motorola, Inc. | Method and apparatus for receiving a radio frequency signal using a plurality of antennas |
US7039135B2 (en) * | 2001-10-11 | 2006-05-02 | D.S.P.C. Technologies Ltd. | Interference reduction using low complexity antenna array |
KR100548321B1 (en) * | 2003-01-07 | 2006-02-02 | 엘지전자 주식회사 | Method and apparatus for in-phase combining diversity |
-
2004
- 2004-09-07 TW TW093126933A patent/TWI246148B/en active
- 2004-09-13 US US10/938,530 patent/US20060052077A1/en not_active Abandoned
- 2004-11-17 US US10/989,321 patent/US20060048333A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3864780A (en) * | 1973-12-26 | 1975-02-11 | Jasper Watkins | Cleaning brush with revolving bristles |
US3932909A (en) * | 1974-10-25 | 1976-01-20 | George Beldon Johnson | Personal self-powered scrub brush |
US4158246A (en) * | 1977-09-07 | 1979-06-19 | Disston, Inc. | Portable cordless scrubber |
US4724563A (en) * | 1986-04-16 | 1988-02-16 | Fry Raymond A | Personal care power brush |
US6185781B1 (en) * | 1999-06-24 | 2001-02-13 | The Hoover Company | Hand scrub tool with interchangeable scrub drives |
Also Published As
Publication number | Publication date |
---|---|
US20060052077A1 (en) | 2006-03-09 |
TWI246148B (en) | 2005-12-21 |
TW200610088A (en) | 2006-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: PSC POWERCHIP SEMICONDUCTOR CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, HUNG-CHI;KUO, CHUNG-MING;LIN, WEI-FENG;REEL/FRAME:015997/0194 Effective date: 20041105 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |