US20050241815A1 - High thermal efficiency glass microfluidic channels and method for forming the same - Google Patents

High thermal efficiency glass microfluidic channels and method for forming the same Download PDF

Info

Publication number
US20050241815A1
US20050241815A1 US11/106,178 US10617805A US2005241815A1 US 20050241815 A1 US20050241815 A1 US 20050241815A1 US 10617805 A US10617805 A US 10617805A US 2005241815 A1 US2005241815 A1 US 2005241815A1
Authority
US
United States
Prior art keywords
sheet
glass
mold
channels
microfluidic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/106,178
Other languages
English (en)
Inventor
Philippe Caze
Thierry Dannoux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Assigned to CORNING INCORPORATED reassignment CORNING INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DANNOUX, THIERRY LUC ALAIN, CAZE, PHILIPPE
Publication of US20050241815A1 publication Critical patent/US20050241815A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/006—Constructions of heat-exchange apparatus characterised by the selection of particular materials of glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/12—Specific details about materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels

Definitions

  • the present invention relates generally to microfluidic devices and methods for producing such devices, and particularly to high-thermal-efficiency glass, glass-ceramic, or ceramic microchannel or microfludic devices and methods for producing such devices.
  • Microchannel or microfluidic devices are generally understood as devices containing fluid passages having a characteristic dimension that generally lies in the range of 10 micrometers ( ⁇ m) to 1000 ⁇ m in which fluids are directed and processed in various ways. Such devices have been recognized as holding great promise for enabling revolutionary changes in chemical and biological process technology, in particular because heat and mass transfer rates in microfluidic devices may be increased by orders of magnitude over rates achievable in conventional chemical processing systems.
  • Fluidic microcircuits in glass or glass-ceramic have the advantage of generally superior chemical resistance. But glass and glass-ceramics are relatively poor conductors of heat, and thermal exchange is a key feature in most chemical synthesis. Accurate and safe local heat management generally allows chemical processing at relatively higher concentrations, pressures and temperatures, leading in most cases to better yields and higher efficiency.
  • the present invention provides a device having microfluidic channels formed of thin glass, glass-ceramic or ceramic sheet material possessing good surface characteristics and good strength, and provides a process for reliably and efficiently producing such devices and channels.
  • the thin-walled microchannels allow efficient heat exchange while offering superior chemical durability and heat resistance.
  • the inventive forming process provides a simplified and reliable manufacturing process while providing a resulting device that maximizes thermal exchange.
  • a microfluidic device includes a formed sheet of glass or glass ceramic material.
  • the formed sheet is formed to have one or more first micro channels on a first surface thereof and one or more second micro channels on a second surface opposite the first.
  • the second channels are complementary to the first channels.
  • the first channels are substantially closed by a first sheet of glass or glass ceramic material bonded to the first surface of the formed sheet, and the second channels may be substantially closed by a second sheet of a glass or glass ceramic material bonded to the second surface.
  • the first or second sheet may also be a formed sheet if desired.
  • a method for forming a microfluidic device.
  • the method includes providing a single-surface mold, positioning a sheet of glass or ceramicizable glass on the mold, heating the mold and the sheet, and applying a differential gas pressure to the sheet to conform the sheet to the mold.
  • the result is the formation of micro channels on at least one surface of the sheet, generally on both surfaces.
  • Microchannels are then substantially closed or enclosed by bonding a plate of glass or ceramicizable glass over at least one surface of the sheet that includes microchannels.
  • a method for forming a microfluidic device including the step of rolling out a first soft glass sheet over a moving mold, the first sheet having a first surface opposite the mold and a second surface opposite the first surface and resting on said mold; the method further including vacuum forming said soft glass sheet to conform said sheet to said mold, forming thereby a conformed sheet having micro channels on both the first and second surfaces thereof; the method further including rolling out a second soft glass sheet onto said first surface of said conformed sheet, thereby bonding said second soft glass sheet to said conformed sheet and substantially closing said micro channels on said first surface; the method further including releasing said conformed sheet from said mold.
  • the method may additionally include rolling out a third soft glass sheet onto said second surface of said conformed sheet, thereby bonding said second soft glass sheet to said conformed sheet and substantially closing said micro channels on said second surface.
  • FIG. 1 is a cross-sectional view of a mold 20 and vacuum box 24 useful in connection with the present invention
  • FIG. 2 is the cross section of FIG. 1 after a thin sheet 30 has been positioned on the mold.
  • FIG. 3 is the cross section of FIG. 2 after vacuum forming of the thin sheet 30 to form a formed sheet 32 .
  • FIG. 4 is a cross section of the formed sheet 32 of FIG. 3 after it has been released from the mold 20 .
  • FIG. 5 is a cross section of an assembly 38 including the formed sheet 32 of FIG. 4 and top plate 34 and bottom plate 36 .
  • FIG. 6 is a cross section of a microfluidic device 50 according to an embodiment of the present invention, the device 50 having been formed by bonding together the assembly of FIG. 5 .
  • FIG. 7 is a cross section of the microfluidic device 50 of FIG. 6 including fluid connectors 52 .
  • FIG. 8 is a cross section of the microfluidic device of FIG. 6 showing the alternating channels in which a first fluid F 1 and a second fluid F 2 may be disposed.
  • FIG. 9 is a plan view of a microfluidic circuit design potentially useful with devices of the present invention, the design having parallel channels 54 each with two access holes 56 .
  • FIG. 10 is a plan view of another microfluidic circuit design potentially useful with devices of the present invention, the design having two concentric spiraling alternate channels each with an access hole at the edge of the spiral and at the center.
  • FIG. 11 is a cross section of a microfluidic device 50 including minimized channels 60 .
  • FIG. 12 is a plan view of another microfluidic circuit design potentially useful with devices of the present invention, the design including minimized channels 60 .
  • FIG. 13 is a cross-sectional view of the formed sheet 32 of FIG. 4 , indicating (within the dashed perimeter 41 ) a location at which material may be removed to establish fluid communication between neighboring alternate channels 43 and 45 .
  • FIGS. 14A-14F are cross sections illustrating certain of the steps of a presently preferred inventive method of forming devices of the present invention.
  • FIG. 15 is a cross-section of another embodiment of a microfluidic device 50 , having triangular-shaped channels 40 .
  • the present invention provides a device having microfluidic channels formed of thin glass, glass-ceramic or ceramic sheet material possessing good surface characteristics and good strength, and provides a process for reliably and efficiently producing such devices and channels.
  • the method of the present invention employs forming by means of differential gas pressure to achieve the desired thin-walled, high-surface quality microchannels of glass, glass-ceramic, or ceramic.
  • the resulting thin-walled microchannels allow efficient heat exchange while offering superior chemical durability and heat resistance.
  • the inventive forming process provides a simplified and reliable manufacturing process while providing a resulting device that maximizes thermal exchange.
  • micro channels are created by a process that includes closing a three dimensional glass, glass ceramic or ceramic shape, and not solely by stacking micro-structured plates.
  • An exemplary process constituting one aspect of the present invention will be described below with reference to FIGS. 1-7 .
  • FIG. 1 shows a cross-section of an apparatus 10 useful in connection with one aspect of the present invention.
  • the apparatus 10 includes a fluid-circuit mold 20 that has been previously machined or otherwise formed from a suitable material, such as a refractory steel plate NS 30/ASI 310, available from Thyssen-France, 78 Maurepas, France.
  • the mold 20 includes micro-passages 22 for vacuum distribution.
  • the mold 20 is placed in a vacuum-sealing structure such as a vacuum box 24 having a surface or ledge 26 for vacuum sealing surrounding the mold 20 .
  • the interior volume of the vacuum box 24 is connected to a vacuum source such as a vacuum pump not shown in the figure.
  • the mold 20 Prior to use, the mold 20 is coated with a suitable release agent, such as calcium hydroxide (Alcohol+Disperbick 190 at 0.5% suspension, for example). Disperbick 190 is readily available from BYK-Chemie Gmbh, Abelstr. 14 D-46483 Wesel, Gemany.)
  • the relief agent is desirably sprayed uniformly over the entire surface of the mold 20 .
  • a thin sheet 30 composed of a suitable glass material and having a surface area sized to cover the surface or ledge 26 , is then applied to the mold 20 .
  • the glass may be Corning 1737® for example, available from Corning Incorporated, Corning N.Y., USA.
  • the sheet 30 and the mold 20 are then heated together to a point above the annealing point of the glass material, and desirably near but below the softening point thereof.
  • the mold and sheet may be heated to about 870° C. over a period of about 20 minutes.
  • Vacuum is then applied to the vacuum box 24 for a sufficient time to cause the sheet 30 to conform to the profile of the mold 20 , resulting in formed sheet 32 as represented in FIG. 3 .
  • gas pressure could be applied to the surface of the thin sheet 30 opposite the mold 20 , and the micro-passages 22 could be used solely to relieve back pressure.
  • positive pressure from outside the mold and vacuum within the mold could be used at the same time.
  • the vacuum forming in addition to reshaping the thin sheet 30 into a formed sheet 32 , also has the effect of redrawing (“vacuum redrawing”) the sheet 30 , resulting a formed sheet 32 that is generally thinner than the originally thin sheet 30 , particularly in the areas where material was drawn into the mold.
  • This vacuum forming process thus allows reliable, repeatable formation of wall structures as thin as 0.3 mm or less, desirably in the range of about 0.2 mm to about 0.7 mm or less.
  • wall structures of greater thicknesses may also be formed using this process, including thicknesses in the range of about 0.7 mm to about 3 mm, which thicknesses may be useful in for use in high pressure or very high pressure applications.
  • the mold 20 and formed sheet 32 are cooled to a temperature sufficiently low to allow the formed sheet 32 to retain its formed shape, but desirably sufficiently high to allow easy removal from the mold 20 .
  • the sheet 30 may be cooled to about 750° C. over a 2 minute period.
  • a light air pressure is then applied to the vacuum channels 22 to remove the formed sheet 32 from the mold 20 .
  • the release agent significantly facilitates this step.
  • the resulting formed sheet 32 is depicted in cross section in FIG. 4 .
  • top and bottom plates 34 and 36 are positioned against the formed sheet 32 as shown in the cross section of FIG. 5 , forming an assembly 38 .
  • any desired input and output holes are formed through the top plate 34 and/or the bottom plate 36 , (and through the formed sheet 32 also, if desired) by drilling, grinding, or other suitable process, before the assembly 38 is bonded together.
  • the access holes may be formed in opposite plates as in the case of holes 42 and 44 (on the right side in the Figure) or, if desired, in the same plate, as in the case of holes 46 and 48 . Access holes may extend, as in the case of hole 48 , through both the top plate 34 and the formed sheet 32 .
  • the assembly 38 is then bonded to form a microfluidic device 50 having closed or enclosed microchannels or passages 40 , as shown in FIG. 6 , with sample access holes 42 , 44 , 46 , and 48 .
  • the bonding of the assembly 38 may desirably be accomplished by glass-to-glass thermal bonding of Corning 1737® glass plates to a Corning 1737® formed sheet, by maintaining the assembly 38 at about 870° C. for about 90 minutes. By drilling or otherwise forming the access holes prior to bonding, micro cracks and surface damage from the hole forming process, if any, can be annealed.
  • the above-described example of the inventive process is capable of forming, in the same process step, twin circuits separated by a thin glass layer.
  • the thickness of the sidewalls 58 may range from 0.4 to 0.3 mm, offering little barrier to heat exchange.
  • the sidewalls may be thicker if desired, by starting with a 0.7 mm or a 1 mm thick sheet.
  • Standard fluid connectors 52 shown in FIG. 7 , can be affixed by polymeric bonding or other compatible glass-bonding means.
  • Channels one side of the formed sheet 32 may contain a first fluid F 1
  • channels on the other side of the formed sheet 32 may contain a second fluid F 2 , as shown in FIG. 8 . Because the alternate channels are separated by a minimally thick sheet of glass, quick and efficient heat transfer is possible.
  • FIG. 9 shows a plan view of one possible orientation of alternate channels as in FIG. 8 in a microfluidic circuit.
  • the channels 54 may be positioned in a straight, parallel arrangement, with access holes 56 provided at each end of each channel.
  • Such channels can be used for two fluids in alternate channels in contrary flow, as suggested by the arrows and shading in the Figure, or in other configurations, such as in parallel flow if desired, for high-throughput heat exchange.
  • FIG. 10 shows a plan view of another possible orientation of alternate channels such as in FIG. 8 .
  • two alternate channels 54 are arranged together in a concentric spiral with access holes 56 at the outer edge and at the center of the spiral.
  • Microchannel arrangements created by the processes described herein need not be limited to alternating, non-communicating channel arrangements such as those shown in FIGS. 9 and 10 .
  • the mold on which the formed sheet 32 is formed may be designed to minimize the channel size of some or all channels on one side of the formed sheet 32 , resulting, in minimized channels 60 interspersed with regular channels 40 , such as shown in the microfluidic device 50 of FIG. 11 .
  • the resulting minimized channels may then be omitted from the fluid circuit design altogether.
  • the minimized channels 60 may alternatively be filled with air, helium or other gas, or even a partial vacuum to aid in thermally insulating adjacent fluid circuit channels.
  • the minimized channels may also be filled with water or other fluid if high thermal mass and relatively high thermal conductivity and temperature uniformity is desired.
  • FIG. 12 An embodiment of a device according to the present invention having minimized channel size on one side of the formed sheet is shown in plan view in FIG. 12 .
  • minimized channels 60 are not included in the microfluidic circuit, and the non-minimized channels 54 are provided with access holes 56 .
  • openings for fluid communication may be established, as desired, between the fluid channels on one side of the formed sheet 32 and the complementary fluid channels on the other side, by removing selected portions of the channel walls within the formed sheet 32 .
  • removal by grinding, drilling, or other suitable process
  • the removed material need not extend to any great length along the channels (in the direction in and out of the Figure), so the formed sheet 32 can substantially retain its structural integrity.
  • Microfluidic devices of the present invention have been successfully produced using various glass compositions, including Corning 0211, Corning 7059, Corning 1737, available from Corning Incorporated, Corning, N.Y., USA, and Glaverbel D 263, available from Glaverbel Group, 1170 Brussels, Belgium.
  • Corning 1737 offers the smallest coefficient of thermal expansion of about 37.6 ⁇ 10 ⁇ 7 C.
  • a microfluidic device formed of Corning 1737 is suitable for use with fluid temperatures of up to 650° C.
  • Alumino-boro-silicate glasses, such as Kerablack, (available from Keraglass, 77 Bagneau sur Loing, France) may also be used. After the microfluidic device is formed as above, then Kerablack would by ceramicized into vitroceram, providing an ultra-low coefficient of thermal expansion of about to ⁇ 2.10 ⁇ 7 .
  • two glass materials having reasonably close coefficients of thermal expansion may be used to form a single microfluidic device.
  • the formed sheet 32 may be formed of Corning 1737 while the top and bottom sheets 34 and 36 used to close the passages in the device 50 may be formed of Pyrex 7740 (see FIGS. 5 and 6 ).
  • the difference in softening point of these two glass materials of about 100° C. allows thermal sealing at about 780° C. This lower thermal sealing temperature can potentially help prevent post-vacuum-forming deformation of formed sheet 32 .
  • glass gob 70 is delivered from a tank feeder (not shown) onto two heated rotating rollers 72 and 74 .
  • a soft glass sheet 76 is then rolled out over a moving mold 78 and vacuum formed immediately, forming a formed sheet 80 as shown in FIG. 14B , with its thickness reduced relative to the soft glass sheet 76 by the vacuum redraw.
  • a second soft glass sheet 82 is put over the formed sheet 80 , as shown in FIG. 14C .
  • the second soft glass sheet immediately closes the upper surface of the formed sheet 80 , as shown in FIG. 14D , forming closed upper channels 90 .
  • the upper channels 90 are thus created and closed quickly, in as short as about 5 to 10 seconds.
  • the formed sheet with its closed upper channels 90 is then removed from the mold and placed in inverted position on a support 82 .
  • the previously unclosed complementary fluid circuit is then covered with a third soft glass sheet 84 , as shown in FIG. 14E , forming closed lower channels 100 and resulting in the microfluidic device 50 of FIG. 14F .
  • desirable thermal conditions are 1350° C. glass delivery onto 650° C. heated rollers and mold.
  • the release agent is desirably carbon black from acetylene cracking. The thinner the glass sheet, the higher the roller temperature should be. 0.8 mm rolled and vacuum formed sheets have been demonstrated, offering less than 0.2 mm thick glass at the bottom of the formed shape.
  • FIG. 15 shows a cross-sectional view of microfluidic device 50 having triangular channels 40 therein.
  • one formed sheet may be bonded to another formed sheet to form even higher-aspect-ratio channels, or to form complex passages between the two sheets.
  • the process and method of the present invention allow repeatable and reliable formation of very thin-walled glass microchannels.
  • the resulting microfluidic devices of the present invention are particularly suited to high-throughput microfluidic heat exchange.
  • the current invention also allows for the provision of increased wall surface area between adjacent channels relative to the cross-sectional area of the channels.
  • the large wall surface area is mainly attributable to the relatively high channel aspect ratios (ratios of channel height to channel width) achievable with the disclosed method, as high as 2:1 or more.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Clinical Laboratory Science (AREA)
  • Hematology (AREA)
  • General Health & Medical Sciences (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Micromachines (AREA)
US11/106,178 2004-04-30 2005-04-13 High thermal efficiency glass microfluidic channels and method for forming the same Abandoned US20050241815A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04291114 2004-04-30
EPEP04291114.9 2004-04-30

Publications (1)

Publication Number Publication Date
US20050241815A1 true US20050241815A1 (en) 2005-11-03

Family

ID=35185900

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/106,178 Abandoned US20050241815A1 (en) 2004-04-30 2005-04-13 High thermal efficiency glass microfluidic channels and method for forming the same

Country Status (3)

Country Link
US (1) US20050241815A1 (enrdf_load_stackoverflow)
JP (1) JP2005336049A (enrdf_load_stackoverflow)
CN (2) CN101967038A (enrdf_load_stackoverflow)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070261750A1 (en) * 2006-05-15 2007-11-15 Nedelec Yann P M Sintered glass and glass-ceramic structures and methods for producing
EP1964817A1 (en) * 2007-02-28 2008-09-03 Corning Incorporated Method for making microfluidic devices
EP1964816A1 (en) 2007-02-28 2008-09-03 Corning Incorporated Methods for forming compositions containing glass
WO2009027774A1 (en) * 2007-08-24 2009-03-05 Zer Teknoloji Sanayi Ve Ticaret Limited Sirketi Glass panel radiator
WO2009070289A1 (en) * 2007-11-29 2009-06-04 Corning Incorporated Devices and methods for radiation assisted chemical processing
WO2009120355A1 (en) * 2008-03-27 2009-10-01 Corning Incorporated Localized deposition system and method of localized deposition
US20100000259A1 (en) * 2008-07-02 2010-01-07 Ljerka Ukrainczyk Method of making shaped glass articles
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20100126222A1 (en) * 2008-11-25 2010-05-27 Thierry Luc Alain Dannoux Method and apparatus for forming and cutting a shaped article from a sheet of material
US20100127420A1 (en) * 2008-11-25 2010-05-27 Thierry Luc Alain Dannoux Method of forming a shaped article from a sheet of material
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US20120067556A1 (en) * 2010-09-22 2012-03-22 Raytheon Company Advanced heat exchanger
US20130248167A1 (en) * 2010-10-18 2013-09-26 Kryoz Technologies B.V. Micro-Cooling Device
US20140026618A1 (en) * 2012-07-27 2014-01-30 G-Tech Optoelectronics Corporation Forming mold and related forming device and forming method using same
US9050622B2 (en) 2005-08-18 2015-06-09 Corning Incorporated Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US20160105997A1 (en) * 2014-10-14 2016-04-14 MAGNETI MARELLI S.p.A. Liquid cooling system for an electronic component
WO2016201221A1 (en) * 2015-06-10 2016-12-15 Corning Incorporated Thermal cross-talk resistant flow reactor
US20170071604A1 (en) * 2006-03-29 2017-03-16 Swenora Biotech Ab Device for Spinal Cord Nerve Regeneration
WO2019209776A1 (en) * 2018-04-27 2019-10-31 Corning Incorporated Microfluidic devices and methods for manufacturing microfluidic devices
US20220279730A1 (en) * 2020-12-31 2022-09-08 Qatar University Self-cooling greenhouse for hot climate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2905690B1 (fr) * 2006-09-12 2008-10-17 Saint Gobain Procede de fabrication d'un dispositif microfluidique.
CN101786788B (zh) * 2009-01-22 2013-07-03 北京盛康宁科技开发有限公司 一种玻璃板及其制造方法以及该方法中使用的设备
KR101151221B1 (ko) 2010-03-11 2012-06-11 서울대학교산학협력단 마이크로 채널을 가진 구조물의 제조 방법 및 그 구조물

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1868271A (en) * 1931-06-10 1932-07-19 Schutte & Koerting Company Heat exchanger
US3279931A (en) * 1963-02-13 1966-10-18 Corning Glass Works Glass-ceramic body and method of making it
US3320044A (en) * 1964-04-29 1967-05-16 Corning Glass Works Method and apparatus for making ceramic or vitreous articles
US3433692A (en) * 1961-08-09 1969-03-18 Marc Wood Materials Sa Pour La Method for forming herringbone configurations for sandwich structures
US3885942A (en) * 1973-02-16 1975-05-27 Owens Illinois Inc Method of making a reinforced heat exchanger matrix
US3943994A (en) * 1972-12-07 1976-03-16 Gte Sylvania Incorporated Ceramic cellular structure having high cell density and method for producing same
US4248297A (en) * 1977-03-29 1981-02-03 Owens-Illinois, Inc. Glass-ceramic article and method of making same
US4386505A (en) * 1981-05-01 1983-06-07 The Board Of Trustees Of The Leland Stanford Junior University Refrigerators
US4392362A (en) * 1979-03-23 1983-07-12 The Board Of Trustees Of The Leland Stanford Junior University Micro miniature refrigerators
US4611474A (en) * 1984-05-14 1986-09-16 Kms Fusion, Inc. Microminiature refrigerator
US4955435A (en) * 1987-04-08 1990-09-11 Du Pont Canada, Inc. Heat exchanger fabricated from polymer compositions
US6983792B2 (en) * 2002-11-27 2006-01-10 The Aerospace Corporation High density electronic cooling triangular shaped microchannel device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE268642T1 (de) * 1999-07-07 2004-06-15 3M Innovative Properties Co Nachweisgerät mit einer fluid-kontroll- filmschicht mit kapillarkanälen
JP2003170411A (ja) * 2001-09-27 2003-06-17 Toto Ltd セラミックス成形体およびその製造方法
JP2003275575A (ja) * 2002-03-22 2003-09-30 Nippon Sheet Glass Co Ltd マイクロ化学システム用チップ部材のチャネル形成方法、及び該形成方法によってチャネルが形成されたマイクロ化学システム用チップ部材
JP2004066388A (ja) * 2002-08-06 2004-03-04 Nippon Sheet Glass Co Ltd マイクロ化学システム用チップ部材及びその製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1868271A (en) * 1931-06-10 1932-07-19 Schutte & Koerting Company Heat exchanger
US3433692A (en) * 1961-08-09 1969-03-18 Marc Wood Materials Sa Pour La Method for forming herringbone configurations for sandwich structures
US3279931A (en) * 1963-02-13 1966-10-18 Corning Glass Works Glass-ceramic body and method of making it
US3320044A (en) * 1964-04-29 1967-05-16 Corning Glass Works Method and apparatus for making ceramic or vitreous articles
US3943994A (en) * 1972-12-07 1976-03-16 Gte Sylvania Incorporated Ceramic cellular structure having high cell density and method for producing same
US3885942A (en) * 1973-02-16 1975-05-27 Owens Illinois Inc Method of making a reinforced heat exchanger matrix
US4248297A (en) * 1977-03-29 1981-02-03 Owens-Illinois, Inc. Glass-ceramic article and method of making same
US4392362A (en) * 1979-03-23 1983-07-12 The Board Of Trustees Of The Leland Stanford Junior University Micro miniature refrigerators
US4386505A (en) * 1981-05-01 1983-06-07 The Board Of Trustees Of The Leland Stanford Junior University Refrigerators
US4611474A (en) * 1984-05-14 1986-09-16 Kms Fusion, Inc. Microminiature refrigerator
US4955435A (en) * 1987-04-08 1990-09-11 Du Pont Canada, Inc. Heat exchanger fabricated from polymer compositions
US6983792B2 (en) * 2002-11-27 2006-01-10 The Aerospace Corporation High density electronic cooling triangular shaped microchannel device

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8304990B2 (en) 2005-08-18 2012-11-06 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US8435604B2 (en) 2005-08-18 2013-05-07 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US9050622B2 (en) 2005-08-18 2015-06-09 Corning Incorporated Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20170071604A1 (en) * 2006-03-29 2017-03-16 Swenora Biotech Ab Device for Spinal Cord Nerve Regeneration
US20070261750A1 (en) * 2006-05-15 2007-11-15 Nedelec Yann P M Sintered glass and glass-ceramic structures and methods for producing
US8021739B2 (en) * 2006-05-15 2011-09-20 Corning Incorporated Sintered glass and glass-ceramic structures and methods for producing
US20080230951A1 (en) * 2007-02-28 2008-09-25 Thierry Luc Alain Dannoux Methods for making microfluidic devices and devices produced thereof
WO2008106160A1 (en) 2007-02-28 2008-09-04 Corning Incorporated Method for making microfluid devices
EP1964816A1 (en) 2007-02-28 2008-09-03 Corning Incorporated Methods for forming compositions containing glass
EP1964817A1 (en) * 2007-02-28 2008-09-03 Corning Incorporated Method for making microfluidic devices
US8156762B2 (en) 2007-02-28 2012-04-17 Corning Incorporated Methods for making microfluidic devices and devices produced thereof
WO2009027774A1 (en) * 2007-08-24 2009-03-05 Zer Teknoloji Sanayi Ve Ticaret Limited Sirketi Glass panel radiator
WO2009070289A1 (en) * 2007-11-29 2009-06-04 Corning Incorporated Devices and methods for radiation assisted chemical processing
WO2009120355A1 (en) * 2008-03-27 2009-10-01 Corning Incorporated Localized deposition system and method of localized deposition
US20100000259A1 (en) * 2008-07-02 2010-01-07 Ljerka Ukrainczyk Method of making shaped glass articles
US9010153B2 (en) 2008-07-02 2015-04-21 Corning Incorporated Method of making shaped glass articles
US9688562B2 (en) 2008-07-02 2017-06-27 Corning Incorporated Method of making shaped glass articles
US20100126222A1 (en) * 2008-11-25 2010-05-27 Thierry Luc Alain Dannoux Method and apparatus for forming and cutting a shaped article from a sheet of material
US20100127420A1 (en) * 2008-11-25 2010-05-27 Thierry Luc Alain Dannoux Method of forming a shaped article from a sheet of material
US20120067556A1 (en) * 2010-09-22 2012-03-22 Raytheon Company Advanced heat exchanger
US12181229B2 (en) 2010-09-22 2024-12-31 Raytheon Company Heat exchanger with a glass body
US10429139B2 (en) 2010-09-22 2019-10-01 Raytheon Company Heat exchanger with a glass body
US10041747B2 (en) * 2010-09-22 2018-08-07 Raytheon Company Heat exchanger with a glass body
US20130248167A1 (en) * 2010-10-18 2013-09-26 Kryoz Technologies B.V. Micro-Cooling Device
US20140026618A1 (en) * 2012-07-27 2014-01-30 G-Tech Optoelectronics Corporation Forming mold and related forming device and forming method using same
US9067813B2 (en) * 2012-07-27 2015-06-30 G-Tech Optoelectronics Corporation Forming mold and related forming device and forming method using same
US20160105997A1 (en) * 2014-10-14 2016-04-14 MAGNETI MARELLI S.p.A. Liquid cooling system for an electronic component
WO2016201221A1 (en) * 2015-06-10 2016-12-15 Corning Incorporated Thermal cross-talk resistant flow reactor
US10399058B2 (en) 2015-06-10 2019-09-03 Corning Incorporated Thermal cross-talk resistant flow reactor
WO2019209776A1 (en) * 2018-04-27 2019-10-31 Corning Incorporated Microfluidic devices and methods for manufacturing microfluidic devices
US11752500B2 (en) 2018-04-27 2023-09-12 Corning Incorporated Microfluidic devices and methods for manufacturing microfluidic devices
US20220279730A1 (en) * 2020-12-31 2022-09-08 Qatar University Self-cooling greenhouse for hot climate
US12137648B2 (en) * 2020-12-31 2024-11-12 Qatar University Self-cooling greenhouse for hot climate

Also Published As

Publication number Publication date
JP2005336049A (ja) 2005-12-08
CN1693245A (zh) 2005-11-09
CN101967038A (zh) 2011-02-09

Similar Documents

Publication Publication Date Title
US20050241815A1 (en) High thermal efficiency glass microfluidic channels and method for forming the same
US8156762B2 (en) Methods for making microfluidic devices and devices produced thereof
US5882465A (en) Method of manufacturing microfluidic devices
US6425972B1 (en) Methods of manufacturing microfabricated substrates
US6769444B2 (en) Microfluidic device and manufacture thereof
US6289695B1 (en) Vacuum fusion bonding of glass plates
US6904966B2 (en) Flexible microchannel heat exchanger
TWI526407B (zh) 形成含有玻璃組成份之方法
US8887527B2 (en) Foaming process for preparing wafer-level glass micro-cavities
CN101905859B (zh) 正压热成型制备圆片级均匀尺寸玻璃微腔的方法
EP2099708A1 (en) Method for making microfluidic devices and devices resulting
CN101759138B (zh) 圆片级玻璃微流道的正压热成型制造方法
US20060147741A1 (en) Composite plate device for thermal transpiration micropump
CN114963813B (zh) 一种多层吹胀板式的板式换热器及制造方法
CN101817498B (zh) 低污染高成品率圆片级均匀尺寸玻璃微腔的制备方法
WO1999055630A1 (en) Vacuum pull down method for an enhanced bonding process
Sullivan Development and testing of microscale silicon heat exchangers for the MIT micro gas-turbine engine
CN114260351A (zh) 一种大面积阵列微结构跨尺度模压成形装置和方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: CORNING INCORPORATED, NEW YORK

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CAZE, PHILIPPE;DANNOUX, THIERRY LUC ALAIN;REEL/FRAME:016477/0955;SIGNING DATES FROM 20050404 TO 20050405

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION