US20050183844A1 - Hotspot spray cooling - Google Patents

Hotspot spray cooling Download PDF

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Publication number
US20050183844A1
US20050183844A1 US10/786,452 US78645204A US2005183844A1 US 20050183844 A1 US20050183844 A1 US 20050183844A1 US 78645204 A US78645204 A US 78645204A US 2005183844 A1 US2005183844 A1 US 2005183844A1
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United States
Prior art keywords
film
cooling
hotspot
zone
heat flux
Prior art date
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Abandoned
Application number
US10/786,452
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English (en)
Inventor
Charles Tilton
Donald Tilton
Thomas Weir
Tahir Cader
Paul Knight
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Isothermal Systems Research Inc
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Isothermal Systems Research Inc
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Application filed by Isothermal Systems Research Inc filed Critical Isothermal Systems Research Inc
Priority to US10/786,452 priority Critical patent/US20050183844A1/en
Assigned to ISOTHERMAL SYSTEMS RESEARCH reassignment ISOTHERMAL SYSTEMS RESEARCH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CADER, TAHIR, KNIGHT, PAUL A., TILTON, CHARLES L., TILTON, DONALD E., WEIR, THOMAS D.
Priority to JP2007500863A priority patent/JP2007538384A/ja
Priority to CA002556666A priority patent/CA2556666A1/en
Priority to PCT/US2005/004444 priority patent/WO2005081812A2/en
Priority to EP05722976A priority patent/EP1754011A4/de
Publication of US20050183844A1 publication Critical patent/US20050183844A1/en
Assigned to ISOTHERMAL SYSTEMS RESEARCH, INC. reassignment ISOTHERMAL SYSTEMS RESEARCH, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE OFFICIAL COMPANY NAME OF THE PREVIOUSLY NAMED ASSIGNEE, PREVIOUSLY RECORDED ON REEL 015789 FRAME 0072. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF PATENT APPLICATION NUMBER 10/786,452 FILED FEBRUARY 24, 2004.. Assignors: WEIR, THOMAS D., KNIGHT, PAUL A., CADER, TAHIR, TILTON, CHARLES L., TILTON, DONALD E.
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to spray cooling thermal management systems and more specifically it relates to a spray cooling system that provides high heat flux evaporative cooling of electronic component hotspots.
  • Liquid cooling is well known in the art of cooling electronics. As air cooling heat sinks continue to be pushed to new performance levels, so has their cost, complexity, and weight. For some time, liquid cooling solutions have been developed and tested, but other than specialty applications they have yet to gain widespread commercial adoption. As computer power consumptions continue to increase, liquid cooling will provide significant advantages to computer manufacturers which will force its use. The present invention provides significant advantages over both air cooling and prior art liquid cooling solutions.
  • Liquid cooling technologies use a cooling fluid for removing heat from an electronic component. Liquids can hold and transfer heat at a rate many times that of air. Single-phase liquid cooling systems place a pure liquid in thermal contact with the component to be cooled. With these systems, the cooling fluid absorbs heat as sensible energy. Other liquid cooling systems, such as spray cooling, are two-phase processes. In these systems, heat is absorbed by the cooling fluid as latent energy gains. Two-phase cooling, or commonly referred to as evaporative cooling, provides the ability to deliver more efficient, more compact and higher performing liquid cooling systems than single-phase systems.
  • Spray cooling uses a pump for supplying fluid to one or more nozzles that transform the coolant supply into droplets. These droplets impinge the surface of the component to be cooled and can create a thin coolant film. Energy is transferred from the surface of the component to the thin-film. Because the fluid is dispensed at or near its saturation point, the absorbed heat causes the thin-film to turn to vapor. This vapor is then condensed, often by means of a heat exchanger, or condenser, and returned to the pump.
  • U.S. Pat. No. 5,220,804 provides a method of increasing a spray cooling system's ability to remove heat.
  • the '804 patent describes a method of managing system vapor that further thins the coolant film which increases evaporation, improves convective heat transfer, and liquid and vapor reclaim.
  • Today's microprocessors may be constructed on a silicon die roughly 1 cm by 1 cm.
  • the die may have multiple zones for different functions. Such zones may be for inputs and outputs (I/Os), level 1 cache, level 2 cache, and the core.
  • the core may be roughly 0.5 cm by 0.5 cm and is where the main computer processing takes place. Although the core may only be 25% of the total area of the die, it creates almost the entire heat generation by the chip and may be considered a chip “hotspot”.
  • a chip might be rated for an average heat load of 110 watts, with an average heat flux of 110 watts per centimeter squared, the core may generate 100 watts of that heat and have a heat flux of 400 wafts per centimeter squared.
  • This non-uniform heat flux distribution poses a significant challenge to the cooling system as it is desirable to keep the entire chip at nearly the same operating temperature. Cooling systems that rely on heat spreading may not provide this ability as they rely on conduction spreading, resulting in significant temperature gradients across the chip.
  • One method of cooling the core of a computer chip is to divide the chip into thermal zones and to cool each of the chip's zones at a different rate.
  • U.S. Pat. No. 6,443,323 describes a method of variably cooling a computer component through the use of incremental sprayers. The incremental sprayers deposit fluid onto each zone at a mass flow rate necessary for complete phase change. Drops are ejected from an orifice in serial. Although this method improves the efficiency of the system, that is in attaining complete phase change of all dispensed fluid, the incremental dispensing method does not provide dispensing characteristics necessary to create high heat flux thin-film evaporative cooling and high performance cooling of hotspots.
  • Yet another method of cooling the core is two-phase microchannels, such as described by U.S. Pat. No. 4,450,472. Although this method does not use spray cooling, the design does provide the ability to remove heat in the range of 400-1000 watts per square centimeter using water.
  • the system discloses a method of placing a very small microchannel array on an electronic component. Although microchannel cooling methods may effectively lower the temperature of the core, due to large pressure drops and resulting size limitations they do not efficiently address the needs of the non-hotspot areas of the die.
  • the present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces.
  • Liquid coolant is dispensed upon the surface of the component.
  • the liquid coolant is dispensed as a continuous atomized droplet pattern.
  • the atomized pattern creates a high heat flux evaporative cooling thin-film over the one or more core areas.
  • the present invention optimizes the atomized pattern for maximum heat removal rates. Any excess, non-vaporized, fluid flowing outward from the hotspot is used to cool the lower heat flux (non-core) areas of the component through the creation of a thick coolant film thereon.
  • inventions include supplemental nozzles that deposit cooling fluid into the thick-film. This embodiment provides an efficient and simple method of controlling the cooling rates over the less critical system zones and provides further flexibility in optimizing the atomization for the high heat flux areas.
  • Another embodiment of the present invention utilizes an atomizer that dispenses the coolant at a non-perpendicular angle to one or more component hotspots. This embodiment provides directional control of the excess fluid of the hot spot. The thick-film is encouraged to flow in a predetermined direction.
  • Another embodiment of the present invention uses a liquid-vapor separator for separating liquid and vapor from the exit stream of a spray module prior to condensing the vapor.
  • the result is a near pure vapor at the inlet of the condenser which is potentially more efficient and has a more repeatable performance than a condenser with substantial two-phase flow at its inlet.
  • Yet another embodiment of the present invention enhances the surface of the chip to be spray cooled through the use of etched open microchannels. These microchannels are formed either directly into the top surface of the chip or through the use of a secondary etched microchannel plate bonded to the top surface of the chip.
  • FIG. 1 is a perspective view of a computer chip mounted onto a substrate
  • FIG. 2 is a top view of computer chip with multiple zones
  • FIG. 3 is a perspective view of a spray module mounted onto the substrate and encompassing the chip from FIG. 1 ;
  • FIG. 4 is a section view, along line A-A of FIG. 3 , showing the inside the a spray module according to the present invention
  • FIG. 5 is a partial view of FIG. 4 showing a spray plate located over the chip to be cooled according to the present invention
  • FIG. 6 is a side view of a spray plate with hotspot vapor management protrusions
  • FIG. 7 is an alternative embodiment of the present invention showing a secondary nozzle spraying onto the thick-film
  • FIG. 8 is another alternative embodiment of the present invention showing an angled atomizer
  • FIG. 9 is a bottom perspective view of a spray plate with a hotspot vapor management protrusion
  • FIG. 10 is a block diagram of a simple spray cool system
  • FIG. 11 is a block diagram of a spray cool system using a liquid and vapor separator
  • FIG. 12 is a side section view of a separator of FIG. 11 ;
  • FIG. 13 is a side partial view of a spray cooled secondary etched microchannel plate, with the microchannels enlarged for clarity.
  • a computer chip 2 is shown mounted to a substrate 4 , as typical in computing applications.
  • Computer chip 2 may be a microprocessor, Field Programmable Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), or any other commonly used electronic component.
  • Chip 2 is attached to substrate 4 using any one of a wide range of commonly known packaging technologies (not shown), including: ball grid array, pin grid array, land grid array, and wirebond.
  • the present invention is not limited to any one particular interconnect or packaging method.
  • FIG. 2 shows a typical microprocessor version of chip 2 .
  • the top surface of chip 2 has several zones, each with a unique function, unique power consumption, and thus, a unique heat generation rate. Although multiple zones are identified by FIG. 2 , they can be lumped into high and low heat flux zones. Low heat generation zones may be, but are not limited to, memory (L1 and L2 cache), I/Os and controllers.
  • a core 3 where significant computations take place, generates heat at a much greater rate than the low heat generation zones.
  • a chip may have multiple hotspots as areas of execution and floating point calculations may be done in separate locations on the die, each hotspot located over a core.
  • FIG. 3 shows a spray module 10 attached to substrate 4 and encompassing chip 2 .
  • Spray module 10 may be attached to substrate 4 through the use of adhesives, soldering, or mechanical fastening such as but not limited to the methods described by U.S. Pat. No. 6,108,201 incorporated herein by this reference.
  • Spray module 10 is used for dispensing a supply of liquid coolant onto the surface of chip 2 . Fluid enters module 10 through an inlet 14 and exits through an outlet 16 . Although only one outlet 16 is shown, multiple are possible. In fact, wherein computer desktops are most often orientated in one of two orientations, desktop or tower, it may be preferable to have a plurality of outlet 16 at ninety degree angles to each other.
  • Spray module 10 is part of a well known and understood two-phase cooling cycle (shown in FIG. 10 ).
  • a pump 5 is used for supplying a cooling fluid at an optimal spray cooling flow rate and pressure level.
  • the cooling fluid can be any one of the well known spray cooling fluids, including but not limited to FC-72, Fluorinert (a Trademark of 3M), water and water mixtures.
  • the high pressure cooling fluid enters spray module 10 where it absorbs heat from chip 2 .
  • a condenser 8 cools the fluid and returns liquid to pump 5 .
  • the system and components of the spray cool system are well known and understood in the field, and thus, they will not be discussed in further detail.
  • Spray module 10 has an outer housing 12 that provides the structural rigidity to the overall module.
  • Housing 12 can be constructed from many materials, including aluminum and plastic. Ideally, housing 12 is designed to provide the ability to be molded or die-casted (as shown in FIG. 4 ), thus providing low manufacturing costs.
  • a fluid supply enters inlet 14 located at the top of housing 12 , by means of a supply tube (not shown).
  • the connection between inlet 14 and the supply tube is preferably removable through the use of a common quick disconnect fitting.
  • the coolant flowing through inlet 14 then enters a manifold area created between housing 12 and a spray plate 30 .
  • Spray plate 30 provides the means for dispensing the cooling fluid onto chip 2 .
  • Plate 30 is shown inserted into a pocket within housing 12 , where it can be glued, fastened or swaged into place. Due to the one piece design of housing 12 , it is not necessary to provide a fluid tight seal between spray plate 30 and housing 12 , but it is desirable to provide a tight fit and thus minimize pressure losses.
  • Spray plate 30 contains one or more nozzles that provide the means of transforming the supply of coolant into one or more continuous droplet streams.
  • an atomizer 32 is shown located over core 3 .
  • atomizer 32 Although one atomizer 32 is shown, depending upon the type of fluid used, the size of core 3 , and the spray cone angle of atomizer 32 , there may be one or more atomizers placed above core 3 . To minimize mixing between adjacent atomizers, it is preferable to use a single atomizer per hotspot.
  • a method of creating spray plate 30 is described by U.S. Pat. No. 5,860,602 and U.S. Pat. No. 6,016,969 for a laminated pressure swirl atomizer. Another method is to insert button-style atomizers into plate 30 .
  • chip 2 produces highly variable heat fluxes as a function of time, that is it cycles from peak performance to “sleep” mode, it may be advantageous to make atomizer 32 variable and controllable as described by U.S. patent application Ser. No. 10/281,391.
  • the variable atomizer in conjunction with an electronic control system makes it possible to achieve direct component temperature feedback and overall thermal performance control.
  • Atomizer 32 provides the means for removing significant amounts of heat directly from core 3 .
  • droplet size, distribution and momentum can all be controlled and optimized in a fashion that provides a thin-film 40 over core 3 , as shown in FIG. 5 .
  • the thickness of thin-film 40 can significantly affect the ability of the coolant to remove heat. Generally, the thinner thin-film 40 becomes the more heat it can remove.
  • a supercritical thin-film may be, but is not limited to, the range of 100 micrometer to 400 micrometers thick, and the jumped thick-film may be in the range, but is not limited to, 3000 micrometers to 4000 micrometers using water.
  • a hydraulic jump provides the means of creating thin-film 40 and thick-film 42 and the ability to cool core 3 of chip 2 at a rate greater than the non-core areas of chip 2 .
  • a hydraulic jump may also provide a thermal buffer in the event that spray becomes momentarily interrupted.
  • atomizer 32 is located generally over core 3 so that thin-film 40 is also created directly over core 3 .
  • the present invention optimizes its spray characteristics over just core 3 . This is likely to result in a jumped thick-film 42 over the non-core areas of chip 2 .
  • thin-film 40 may be capable of absorbing heat fluxes up to a thousand or more watts per square centimeter over the small area of core 3
  • thick-film 42 may be capable of efficiently and reliably providing heat removal rates generally less than 100 watts per square centimeter over the large area low-heat-flux zones of chip 2 .
  • Heat removal rates of both zones, 40 and 42 may be improved the use of surface enhancements.
  • One such enhancement is etched microchannels on the top surface of chip 2 .
  • the process of etching microchannels is described by U.S. Pat. No. 4,450,472 and U.S. patent application Ser. No. 10/052,859, both are herein incorporated by reference. Although these methods are disclosed as part of closed channel microchannel cooling systems, open etched microchannels may significantly increase the effectiveness of the present spray cooling invention. Open channel spray cooled microchannels are not limited by pressure drops created by the need for small hydraulic diameters, as is the case with closed microchannel systems. Open microchannel spray cooling is also limited by the need to use fluid manifolding.
  • open microchannel spray cooling may provide the ability to have smaller hydraulic diameters, and higher resulting heat transfer coefficients, than closed microchannel cooling systems.
  • a secondary etched microchannel plate 44 may be thermally attached to chip 2 providing the benefits of surface enhancements and the potential use of a non-dielectric fluid. Both open channel spray cooling microchannel methods provide increased nucleation sites, improved vaporization conditions and increased surface areas; all of which are known to benefit spray cooling.
  • a hotspot vapor management protrusion 34 extends from spray plate 30 in the direction of and in a spaced apart relationship to chip 2 .
  • vapor management protrusion 34 forces the vapor within the system, and more particularly vapor in close proximity to the atomization zone, to flow downward and outward along thin-film 40 . The result is a further thinning of thin-film 40 and increased heat removal rates.
  • the gap between chip 2 and vapor management protrusion 34 is a variable of design, often optimized through experimentation, but ISR typically uses gaps between 1 ⁇ 2 mm and 3 ⁇ 4 mm. In the event that multiple hotspots are present on a given chip, it may be desirable to have multiples of atomizer 32 and multiples of vapor management protrusion 34 . Also located in protrusion 34 , and shown in FIG. 9 , is a plurality of vapor return orifices 37 which allow for the recirculation of vapor within spray module 10 .
  • FIG. 7 shows a secondary nozzle 36 used to assist in the creation and performance of thick-film 42 .
  • nozzle 36 may simply add fluid to thick-film 42 in the event that atomizer 32 does not produce enough excess fluid to maintain thick-film 42 over the low heat flux areas of chip 2 .
  • nozzle 36 is not required to produce a thin evaporative film capable of very large heat fluxes.
  • nozzle 36 may be, but is not limited to, an incremental sprayer, a drop on demand orifice, a jet orifice, a piezoelectric actuated jet impingement orifice, or an actuated atomizer. All methods provide the means of supplementing the cooling fluid to thick-film 42 .
  • FIG. 8 shows another alternative embodiment of the present invention.
  • atomizer 32 dispenses fluid at a generally non-perpendicular angle to core 3 .
  • thick-film 42 is further encouraged to flow over and cover the non-hotspot areas of chip 2 .
  • This embodiment may also achieve benefits through they the addition of secondary nozzle 36 or vapor management protrusion 34 .
  • Angled spray cooling may also benefit from the addition of etched microchannels parallel to the direction of spray.
  • Cooling fluid that exits spray module 10 is not likely to be a pure vapor, as ideal in terms of cycle efficiency.
  • prior art systems try to optimize the spray system for complete fluid vaporization within module 10
  • the present invention is optimized for cooling the performance enhancing core of a chip.
  • FIG. 12 shows an addition to the system that simplifies its design and use.
  • a separator 7 may be placed between condenser 8 and spray module 10 . Separator 7 separates liquid from vapor and transfers the higher energy vapor to condenser 8 and the lower energy liquid to pump 5 ( FIG. 13 ).
  • vapor and liquid may be separated through the use of a spiral separator as described by U.S. Pat. No. 5,314,529. Liquid—vapor separation allows the size of condenser 8 to be minimized.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US10/786,452 2004-02-24 2004-02-24 Hotspot spray cooling Abandoned US20050183844A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/786,452 US20050183844A1 (en) 2004-02-24 2004-02-24 Hotspot spray cooling
JP2007500863A JP2007538384A (ja) 2004-02-24 2005-02-14 ホットスポット噴霧冷却（関連出願）なし（連邦政府の後援による研究又は開発に関する記述）本発明は、空軍研究所により発注された＃ｆ３３６１５−０３−ｍ−２３１６契約により政府の支援のもとなされた。政府は、本発明に一定の権利を有する。
CA002556666A CA2556666A1 (en) 2004-02-24 2005-02-14 Hotspot spray cooling
PCT/US2005/004444 WO2005081812A2 (en) 2004-02-24 2005-02-14 Hotspot spray cooling
EP05722976A EP1754011A4 (de) 2004-02-24 2005-02-14 Heissstellen-spritzkühlung

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US10/786,452 US20050183844A1 (en) 2004-02-24 2004-02-24 Hotspot spray cooling

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US (1) US20050183844A1 (de)
EP (1) EP1754011A4 (de)
JP (1) JP2007538384A (de)
CA (1) CA2556666A1 (de)
WO (1) WO2005081812A2 (de)

Cited By (23)

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US20050210906A1 (en) * 2004-03-26 2005-09-29 Ebm-Papst St. Georgen Gmbh & Co. Kg Heat sink
US20050241804A1 (en) * 2004-04-29 2005-11-03 Foxconn Technology Co.,Ltd Liquid cooling device
US20070133173A1 (en) * 2005-12-13 2007-06-14 Industrial Technology Research Institute Compact spray cooling module
US20070206648A1 (en) * 2006-03-06 2007-09-06 U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Thin-Film Evaporative Cooling For Side-Pumped Laser
US20080047701A1 (en) * 2006-05-23 2008-02-28 Purdue Research Foundation Electrowetting based heat spreader
EP1931930A2 (de) * 2005-09-06 2008-06-18 Isothermal Systems Research, Inc. Sprühkühlsystem für engspaltquerverdunstungssprühkühlung
US20090014158A1 (en) * 2007-07-12 2009-01-15 Honeywell International Inc. Nano shower for chip-scale cooling
WO2010141482A2 (en) * 2009-06-01 2010-12-09 The Board Of Trustees Of The University Of Illinois Nanofiber covered micro components and method for micro component cooling
CN101461059B (zh) * 2006-06-13 2010-12-22 丰田自动车株式会社 冷却器
CN102209452A (zh) * 2010-03-29 2011-10-05 研能科技股份有限公司 雾化散热冷却系统
CN102322751A (zh) * 2011-09-01 2012-01-18 东南大学 用于高热流热源冷却的喷雾冷却装置
US20120090825A1 (en) * 2009-06-01 2012-04-19 The Board Of Trustees Of The University Of Illinois Nanofiber covered micro components and methods for micro component cooling
CN102451802A (zh) * 2010-10-14 2012-05-16 研能科技股份有限公司 用以去除气泡式的封闭式雾化系统
CN106288501A (zh) * 2016-08-29 2017-01-04 江苏大学 一种高负荷cpu喷雾相变制冷装置冷却液循环系统及其控制方法
WO2019018597A1 (en) * 2017-07-21 2019-01-24 Massachusetts Institute Of Technology MODULAR MICROJET COOLING OF CONDITIONED ELECTRONIC COMPONENTS
US10215457B2 (en) 2011-12-09 2019-02-26 Applied Materials, Inc. Heat exchanger for cooling a heating tube and method thereof
CN110099555A (zh) * 2019-06-13 2019-08-06 北京丰联奥睿科技有限公司 一种漏斗式分区液冷服务器机柜
CN110270387A (zh) * 2019-06-11 2019-09-24 南京理工大学 一种基于介质上电润湿的精确散热装置及其控制方法
US10651112B2 (en) 2016-11-01 2020-05-12 Massachusetts Institute Of Technology Thermal management of RF devices using embedded microjet arrays
WO2020257923A1 (en) * 2019-06-27 2020-12-30 Hypertechnologie Ciara Inc. Microgap system for cooling electronics with direct contact
US11464137B2 (en) * 2015-03-03 2022-10-04 International Business Machines Corporation Active control for two-phase cooling
US20230204260A1 (en) * 2021-12-27 2023-06-29 Chroma Ate Inc. Heat exchange device and cooling system having the same
US20230309269A1 (en) * 2022-03-22 2023-09-28 Baidu Usa Llc Contactless device and chip thermal management plate

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EP1754011A2 (de) 2007-02-21
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CA2556666A1 (en) 2005-09-09
JP2007538384A (ja) 2007-12-27
WO2005081812A2 (en) 2005-09-09

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