US20040159945A1 - Underfill process for flip-chip device - Google Patents
Underfill process for flip-chip device Download PDFInfo
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- US20040159945A1 US20040159945A1 US10/774,869 US77486904A US2004159945A1 US 20040159945 A1 US20040159945 A1 US 20040159945A1 US 77486904 A US77486904 A US 77486904A US 2004159945 A1 US2004159945 A1 US 2004159945A1
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- underfill material
- curing
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- mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a method of packaging a microelectronic device that, in one embodiment, uses a vacuum-assisted underfill process. One embodiment of the method uses a curing process with a tacky film disposed over the device to prevent wicking of the underfill material after the underfill material is in place. One embodiment of the method uses a curing process that utilizes a non-tacky tacky film with a curing process to prevent wicking of the underfill material after the underfill material is in place.
Description
- The application is a divisional of U.S. patent application Ser. No. 10/032,115, filed Dec. 21, 2001, which is incorporated herein by reference.
- The present invention relates to microelectronic device packaging. More particularly, the present invention relates to underfill packaging of a flip-chip package. In particular, the present invention relates to a vacuum-assisted underfill process.
- As the process of miniaturization progresses, chip packaging is also required to be miniaturized. This requirement has resulted in chip-scale packaging, wherein the ultimate goal is to have the chip and the chip package be virtually the same size.
- A chip package usually includes a mounting substrate and a semiconductor chip or die that is located on or in the mounting substrate. One class of chip packaging includes semiconductor chips that are produced with C4 (controlled collapse chip connect) solder connections, on an active surface thereof, for purposes of electrically contacting the integrated circuit on the active surface of the chip to contact pads on the mounting substrate. The term active surface of a semiconductor chip or die, as used herein, means the surface of the chip or die which carries integrated circuitry. The term back surface, as used herein, means a side of the semiconductor chip or die that is opposite and parallel planar with the active surface.
- During chip packaging, an epoxy is introduced under capillary action into a space between the die and the mounting substrate and is cured thereafter. The epoxy acts to bond the die to the mounting substrate and to protect the C4 solder connections during the temperature cycling it will experience during the product's lifetime.
- As depicted in FIG. 1A and FIG. 1B, a
chip package 10 includes a die 12, amounting substrate 14, anelectrical connection 16 such as a C4 bump, and anunderfill material 18 that has been inserted between the die 12 and themounting substrate 14 by capillary action. FIG. 1A depicts anonuniform profile underfill material 18 including afillet portion interstitial portion 24 that is sandwiched between thedie 12 and themounting substrate 14. It is noted in FIG. 1B that there is atongue 25 ofepoxy underfill material 18 on one side thereof. Accordingly, thefillet portion profiles mounting substrate 14 as depicted in FIG. 1B. Although thistongue 25 ofepoxy underfill material 18 may be of no consequence in some prior art embodiments, the pressure to miniaturize and to get even tighter bump pitch and chip-to-package gap height causes the presence of thetongue 25 to be undesirable. - One possible solution that is used in production is depicted in FIG. 2A and FIG. 2B. Processing is accomplished by directing a mold press26 against a
die 12 and amounting substrate 14. Between the mold press 26 and thedie 12 and mountingsubstrate 14, an adhesion-resistant film 28 is placed that is stretched and held while an underfillmaterial feed tube 30 and a vent or vacuum tube 32 are used to flowunderfill material 18 between die 12 and mountingsubstrate 14. After theunderfill material 18 has been properly flowed therebetween to formuniform fillet portions 22 and theinterstitial portion 24, the adhesionresistant film 28 and the mold press 26 are removed as depicted in FIG. 2B. As the adhesionresistant film 28 and the mold press 26 are removed, some wicking action between the adhesionresistant film 28 and theunderfill material 18 forms an uneven surface 34 (depicted in an arbitrary shape and surface roughness) that often must be smoothed after curing. Additionally, and more serious to process yield, somewick spillage 36 forms on theback surface 38 of die 12 that must be removed. - In order that the manner in which embodiments of the present invention are obtained, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. Understanding that these drawings depict only typical embodiments of the invention that are not necessarily drawn to scale and are not therefore to be considered to be limiting of its scope, the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
- FIG. 1A is a cross section of a prior art chip package;
- FIG. 1B is a top plan view of the chip package depicted in FIG. 1A;
- FIG. 2A is a cross section of a prior art chip package during processing;
- FIG. 2B is a cross section of the chip package depicted in FIG. 2 after further processing;
- FIG. 3A is a cross section of a chip package during processing according to an embodiment;
- FIG. 3B is a cross section of the chip package depicted in FIG. 3A after further processing;
- FIG. 3C is a cross section of the chip package depicted in FIG. 3A after further processing;
- FIG. 4A is a cross section of a chip package during processing according to an embodiment;
- FIG. 4B is a cross section of the chip package depicted in FIG. 4A after further processing;
- FIG. 5 is a top plan view of the chip package that is achieved according to an embodiment; and
- FIG. 6 is a process flow block diagram of the inventive process.
- An embodiment of the present invention relates to a chip packaging process. A semiconductor chip, a semiconductor package, a method of assembling a semiconductor package, and a method of producing a semiconductor chip are also described as embodiments. One embodiment relates to a method of forming a chip package that allows underfill material to be flowed to the chip assembly with no wick spillage onto the back side of the die.
- The following description includes terms, such as upper, lower, first, second, etc. that are used for descriptive purposes only and are not to be construed as limiting. The embodiments of a device or article of the present invention described herein can be manufactured, used, or shipped in a number of positions and orientations. The term “substrate” generally refers to the physical object that is the basic workpiece that is transformed by various process operations into the desired article. A substrate may be made of silica glass or the like, or it may be made of plastic. A substrate may also be referred to as a wafer. Wafers may be made of semiconducting, non-semiconducting, or combinations of semiconducting and non-semiconducting materials.
- Reference will now be made to the drawings wherein like structures will be provided with like reference designations. In order to show the structures of the present invention most clearly, the drawings included herein are diagrammatic representations of inventive articles. Thus, the actual appearance of the fabricated structures, for example in a photomicrograph, may appear different while still incorporating the essential structures of the present invention. Moreover, the drawings show only the structures necessary to understand the present invention. Additional structures known in the art have not been included to maintain the clarity of the drawings.
- FIG. 3A illustrates a process of underfilling a die according to an embodiment. In a cross-sectional view, FIG. 3A illustrates a flip-
chip assembly 110 during underfill processing. The flip-chip assembly 110 includes asemiconductor die 112, according to one embodiment of the invention, that has aback surface 114 and anactive surface 116. In one embodiment, the semiconductor die 112 is from about 4 mils thick to about 50 mils thick. - Upon the
active surface 116, the semiconductor die 112 includes a plurality ofC4 solder connections 118 thereon. Thesolder connections 118 may be substituted by solder columns, gold solder connections, or any other connecting structure that is capable of providing electrical interconnect between the semiconductor die 112 and a host device, such as a mountingsubstrate 120, motherboard, or the like. FIG. 3A also illustrates a plurality ofelectrical contact pads 122 thereon. The semiconductor die 112 is located on the mountingsubstrate 120 so that theC4 solder connections 118 on theactive surface 116 of the semiconductor die 112 electrically contact theelectrical contact pads 122. - Mechanical and electrical connection between the semiconductor die112 and the mounting
substrate 120 is achieved by passing the flip-chip assembly 110 through a reflow oven using a defined reflow profile for the selected solder material. - FIG. 3A also illustrates the presence of an
underfill material 124 that has been applied in a space provided between the semiconductor die 112 and the mountingsubstrate 120. Theunderfill material 124 provides protection for theC4 solder connections 118 during temperature cycles. In one embodiment, theunderfill material 124 is a substance which has a coefficient of thermal expansion which is similar to the coefficient of thermal expansion of theC4 solder connections 118. Theunderfill material 124 also acts to bond semiconductor die 112 to mountingsubstrate 120. In one embodiment, theunderfill material 124 contains silicon dioxide particles in order to provide theunderfill material 124 with a coefficient of thermal expansion which closely matches the coefficient of thermal expansion of theC4 solder connections 118. In one embodiment, the silicon dioxide particles are substantially spherical. - The
underfill material 124 is introduced on a side of the semiconductor die 112 by afeed conduit 126 and agas outlet conduit 128. The process of getting theunderfill material 124 to flow into the space provided between the semiconductor die 112 and the mountingsubstrate 120 includes capillary action, pressure feeding throughfeed conduit 126, and pulling a vacuum throughgas outlet conduit 128. It is noted that one, two, or three of these actions may be combined to get theunderfill material 124 to properly flow. Underfill material that flows by any or all of these actions is known in the art. - In a general embodiment, the
film 130 is depicted in FIG. 3A as having been stretched over the flip-chip assembly 110 and amold press 132 is depicted as rendering a cross-sectional profile to film 130, and consequently to theunderfill material 124. Ofunderfill material 124, it may be referred to as afillet portion 134 and aninterstitial portion 136 between the die 112 and the mountingsubstrate 120. - In a first specific embodiment class, a method of forming a package includes the use of a
tacky film 130 that achieves a release under thermal processing conditions. The method includes placing thetacky film 130 against the flip-chip assembly 110, and particularly stretching it over the semiconductor die 112 and onto the mountingsubstrate 120. The form that thetacky film 130 takes is influenced by the shape of themold press 132 that seals thetacky film 130 against the mountingsubstrate 120. After sealing thetacky film 130 against the mountingsubstrate 120, underfilling of the die is accomplished with theunderfill material 124. Thereafter, themold press 132 is withdrawn, and thetacky film 130 holds the underfill material in place and retains its cross-sectional profile imparted to it by themold press 132 as depicted in FIG. 3B. - After removing the
mold press 132, the flip-chip assembly 110 is placed in a heating environment to cure theunderfill material 124. At some time after beginning the curing of theunderfill material 124, thetacky film 130 releases due to the heat effect on the tacky substance, and thetacky film 130 is removed. Tacky film materials such as No. 3195VS film from Lockwood Industries, of Canoga Park, Calif., are currently used for heat-releasable applications and are known in the art. - Conditions that cause the
tacky film 130 to release from the flip-chip assembly 110 depend upon the specific tacky film. Various curing schemes may be used. In one embodiment, a two-stage heat curing scheme is used. According to this embodiment, the method proceeds to a time after beginning curing theunderfill material 124. Heating of the package is carried out in a curing oven under conditions to cause thetacky film 130 to release from the flip-chip assembly 110. This heating scheme includes a first temperature ramp from the ambient after underfilling, to a temperature range from about 100° C. to about 140° C. Next, a temperature hold is maintained at a temperature in this range. The temperature hold may be from about 10 seconds to about 30 minutes. The first temperature hold achieves an initial cure of theunderfill material 124. Thereafter, a second temperature ramp is accomplished to get thetacky film 130 to release from the flip-chip assembly 110. The second temperature ramp is carried out to a temperature range from about 140° C. to about 260° C. After achieving a selected temperature in this range, it may be held from about 10 seconds to about 30 minutes. However, in one embodiment, no substantial hold time is required as thetacky film 130 releases upon achieving a selectedtacky film 130 releasing temperature. Thereafter, ambient cooling of flip-chip assembly 110 may be done. Removal of thetacky film 130 may precede or follow the ambient cooling. - According to the first specific embodiment class, another embodiment uses a single temperature-ramp curing scheme. In this embodiment, a linear continuous curing oven is set to a selected temperature and flip-
chip assembly 110 heats to desired temperatures as it passes through the oven. In one embodiment, the temperature ramp begins at the post-underfill ambient, and ends in a range from about 140° C. to about 240° C. The oven time ranges from about 10 seconds to about 90 minutes. Thereafter, ambient cooling of flip-chip assembly 110 may be done. Removal of thetacky film 130 may precede or follow the ambient cooling. - As depicted in FIG. 3C, flip-
chip assembly 110 has been heat cured according to an embodiment. It is noted that the curedunderfill material 124 includes thefillet portion 134 and theinterstitial portion 136 that is between the die 112 and the mountingsubstrate 120. It is further noted that thefillet portion 134 includes asurface roughness 138 and pattern that is characteristic of the surface roughness and pattern that was impressed into thefillet portion 134 by thetacky film 130. Further, it is noted that the wherein thefillet portion 134 exhibits a concave curvilinear cross-sectional profile along itssurface roughness 138. This optional concave curvilinear cross-sectional profile is caused by contraction of theunderfill material 124 during the curing process according to an embodiment. - In a second specific method embodiment class, a non-tacky film is used as depicted in FIG. 4A. In a cross-sectional view, FIG. 4A illustrates a flip-
chip assembly 210 during underfill processing. The flip-chip assembly 210 includes asemiconductor die 212, according to one embodiment of the invention, that has aback surface 214 and anactive surface 216 as set forth herein. In one embodiment, thedie 212 is from about 4 mils thick to about 50 mils thick. - Upon the
active surface 216, the semiconductor die 212 includes a plurality ofC4 solder connections 218 thereon similar to what is depicted in FIG. 3A. FIG. 4A also illustrates a plurality ofelectrical contact pads 222 thereon. - FIG. 4A also illustrates the presence of an
underfill material 224. Theunderfill material 224 is introduced on a side of the semiconductor die 212 by a feed conduit (not pictured) and a gas outlet conduit (not pictured) that are similar to the embodiment depicted in FIG. 3A. Anon-tacky film 230 is depicted in FIG. 4A as having been stretched over the flip-chip assembly 210 and amold press 232 is depicted as rendering a cross-sectional profile tonon-tacky film 230, and consequently to theunderfill material 224. Ofunderfill material 224, it includes afillet portion 234 and aninterstitial portion 236 between the die 212 and the mountingsubstrate 220. - The method includes placing the
non-tacky film 230 against the flip-chip assembly 210, and stretching it over the semiconductor die 212 and onto the mountingsubstrate 220. The form that thenon-tacky film 230 takes is influenced by the shape of themold press 232 that holds thenon-tacky film 230 against the mountingsubstrate 220. After securely holding thenon-tacky film 230 against the mountingsubstrate 220, underfilling of thedie 212 is accomplished with theunderfill material 224. - The
mold press 232 has a heater element 238 (depicted schematically). In one embodiment, theheater element 238 acts to cure a portion of theunderfill material 224 that is in contact with thenon-tacky film 230. FIG. 4B depicts the flip-chip assembly 210 after thenon-tacky film 230 has been removed, but before a completed cure of theunderfill material 224 has been accomplished. A conductive heat transfer process has been carried out between the mold press 232 (FIG. 4A) by its heater element 238 (FIG. 4A), and theunderfill material 224 is partially cured, gelled, and solidified. - After removing the mold press232 (FIG. 4A) and the non-tacky film 230 (FIG. 4A), further processing is carried out to cure the bulk of the
underfill material 224. Based on the underfill material and heating approach, there may or may not be a characteristic grain orsolidification morphology 240 as depicted in FIG. 4B. In an embodiment after removing themold press 232 and thenon-tacky film 230, curing the underfill material that is between the die and the mounting substrate, is carried out by placing the package into a curing oven. - In another embodiment, the
mold press 232 remains in place during the curing process. In one variant of this embodiment, themold press 232 acts as the entire heat source for curing. In another variant of this embodiment, themold press 232 is assisted in the curing process by another heat source such as a curing oven as set forth herein. - In any event, oven curing according to this embodiment entails a two-stage ramp-and-hold process, or a single-ramp process as set forth herein. Similar to the embodiment depicted in FIG. 3C, the embodiment depicted in FIG. 4B includes a cured
underfill material 224, including thefillet portion 234, and aninterstitial portion 224 between the die 212 and the mountingsubstrate 220. The concave curvilinear cross-sectional profile is caused by contraction of theunderfill material 224 during the curing process according to an embodiment. - Various curing schemes may be used. In one embodiment, a two-stage heat curing scheme is used. According to this embodiment, the method accordingly proceeds to a time after beginning curing the bulk of the
underfill material 224. This heating scheme includes a first temperature ramp to a temperature range from about 100° C. to about 180° C. Next, a temperature hold is maintained at a temperature in this range. The temperature hold may be from about 10 seconds to about 90 minutes. The first temperature hold achieves a cure of the bulk of theunderfill material 224. Thereafter, a second temperature ramp is accomplished. The second temperature ramp is carried out to a temperature range from about 140° C. to about 260° C. After achieving a selected temperature in this range, it may be held from about 10 seconds to about 30 minutes. However, in one embodiment, no substantial hold time is required as thenon-tacky film 230 may be removed at any time after the gelling of theunderfill material 224. Thereafter, ambient cooling of the flip-chip assembly 210 may be done. As set forth herein, removal of thenon-tacky film 230 may precede or follow the ambient cooling. - In another embodiment, a single ramp-ramp curing scheme is used. In this embodiment, a linear continuous curing oven is set to a selected temperature and flip-
chip assembly 210 heats as it passes through the oven. In one embodiment, the single step temperature ramp is in a range from about 140° C. to about 240° C. Thereafter, ambient cooling of flip-chip assembly 210 may be done. As set forth herein, removal of thenon-tacky film 230 may precede or follow the ambient cooling. - FIG. 5 illustrates a top plan view of an embodiment that is achievable by either of the processes depicted in FIGS. 3 and 4. A flip-
chip assembly 310 includes asemiconductor die 312, a mountingsubstrate 314, and thefillet portion 316 of an underfill material. Unlike the prior art structures, it is noted that thefillet portion 316 is determined by the press mold an in most cases exhibits a symmetricalrectilinear footprint 318 on the mountingsubstrate 314. Further, thefillet portion 316 fillet portion includes a surface roughness and pattern that is characteristic of the imprint that an interstitial film surface roughness and pattern leaves according to the embodiments set forth herein. - FIG. 6 illustrates a
process flow embodiment 600. In a first process flow, a film is placed 610 against a flip-chip assembly. The film may be a tacky film or a non-tacky film as set forth herein. The flip-chip assembly includes a die, an electrical connection, and a mounting substrate. Next, the die is underfilled 620 with underfill material by any method set forth herein. Next, curing 630 of the underfill material is carried out, but at some time after beginning curing 630 the underfill material, the film is removed 640.Removal 640 may be done according to the sticky-film process embodiments or the non-sticky film embodiments as set forth herein. - It will be readily understood to those skilled in the art that various other changes in the details, material, and arrangements of the parts and method stages which have been described and illustrated in order to explain the nature of this invention may be made without departing from the principles and scope of the invention as expressed in the subjoined claims.
Claims (26)
1. A method of forming a package, comprising:
placing a film against a flip-chip assembly, wherein the flip-chip assembly includes a die, an electrical connection, and a mounting substrate;
underfilling the die with underfill material;
curing the underfill material; and
after beginning curing the underfill material, removing the film.
2. The method according to claim 1 , wherein the film includes a tacky film.
3. The method according to claim 1 , wherein the film includes a tacky film, and wherein curing the underfill material is carried out under heat that causes the tacky film to release from the flip-chip assembly.
4. The method according to claim 1 , wherein after beginning curing the underfill material and removing the film, curing includes:
curing the underfill material that is in contact with the film;
removing the film; and thereafter
curing the underfill material that is between the die and the mounting substrate.
5. The method according to claim 1 , wherein after beginning curing the underfill material and removing the film, curing includes:
curing the underfill material that is in contact with the film by conductive heat transfer from a mold press;
removing the film; and thereafter
curing the underfill material that is between the die and the mounting substrate by placing the package into a curing oven.
6. The method according to claim 1 , wherein after beginning curing the underfill material and removing the film, curing includes:
heating the package in a curing oven under conditions to cause the tacky film to release from the flip-chip assembly.
7. The method according to claim 1 , wherein after beginning curing the underfill material and removing the film, curing includes:
heating the package in a curing oven under conditions to cause the tacky film to release from the flip-chip assembly, wherein heating includes a first temperature ramp to a temperature range from about 100° C. to about 180° C., a temperature hold at a temperature in this range, a second temperature ramp to a temperature range from about 140° C. to about 260° C., and cooling.
8. The method according to claim 1 , wherein after beginning curing the underfill material and removing the film, curing includes:
heating the package in a curing oven under conditions to cause the tacky film to release from the flip-chip assembly, wherein heating includes a single step temperature ramp to a temperature in a range from about 140° C. to about 240° C.; and
cooling.
9. The method according to claim 1 , wherein the underfill material has a viscosity that causes it to draw between the die and the mounting substrate without the assistance of a pressure differential.
10. The method according to claim 1 , wherein the underfill material has a viscosity that causes it to draw between the die and the mounting substrate, further including:
flowing the underfill material from a first edge of the die to an opposite, second edge of the die by a pressure differential.
11. A method of forming a package, comprising:
stretching a flexible film over die that is mounted on a mounting substrate to seal the flexible film thereupon;
flowing underfill material between the die and the mounting substrate with a source and a vent;
heating the underfill material to a first curing temperature; and
after reaching the first curing temperature, removing the flexible film.
12. The method according to claim 11 , wherein the film is selected from a non-tacky film and a tacky film.
13. The method according to claim 11 , wherein the film includes a tacky film, and wherein heating the underfill material to a first curing temperature is carried out to cause the underfill material to cure, and wherein the first curing temperature is reached to a temperature range from about 100° C. to about 180° C.; and
wherein the second curing temperature causes the tacky film to release from the die and mounting substrate, and wherein the second curing temperature is reached to a temperature range from 140° C. to about 260° C.
14. The method according to claim 11 , wherein the film is a non-tacky film and wherein after heating the underfill material to a first curing temperature and removing the film, curing includes:
gelling the underfill material that is in contact with the film;
removing the film; and the process further including:
curing the underfill material that is between the die and the mounting substrate.
15. The method according to claim 11 , wherein heating the underfill material to a first curing temperature includes:
heating along a first temperature ramp to a first temperature range from about 100° C. to about 180° C.; and further including:
holding the first temperature;
heating along a second ramp to a temperature range from about 140° C. to about 260°0 C.; and
cooling.
16. The method according to claim 11 , wherein the underfill material has a viscosity that causes it to draw between the die and the mounting substrate, further including:
flowing the underfill material from a first edge of the die to an opposite, second edge of the die by a pressure differential.
17. A chip package comprising:
a die;
a mounting substrate;
an electrical connection disposed between the mounting substrate and the die;
a cured underfill material including a fillet portion, and an interstitial portion disposed between the die and the mounting substrate, wherein the fillet portion includes a surface roughness and pattern that is characteristic of an interstitial film surface roughness and pattern.
18. The chip package according to claim 17 , wherein the interstitial film surface roughness and pattern is derived from a film selected from a tacky film and a non-tacky film.
19. The chip package according to claim 17 , wherein the fillet portion exhibits a single-stage solidification profile in cross section.
20. The chip package according to claim 17 , wherein the fillet portion exhibits a symmetrical rectilinear or other controllable footprint on the mounting substrate.
21. The chip package according to claim 17 , wherein the fillet portion exhibits a concave curvilinear cross-sectional profile.
22. The chip package according to claim 17 , wherein the electrical connection disposed between the mounting substrate and the die is selected from a ball grid array, a collapsed ball grid array, and a pin grid array.
23. A chip-packaging process system comprising:
a die;
a mounting substrate;
an electrical connection disposed between the mounting substrate and the die;
a tacky film that is disposed over the die and stretched onto the mounting substrate;
a mold press that gives a shape to the film;
an underfill material disposed between the die and the mounting substrate; and
an underfill inlet and outlet system that communicates through the film.
24. The chip-packaging process system according to claim 23 , wherein the underfill inlet and outlet system includes an underfill conduit and a vent.
25. The chip-packaging process system according to claim 23 , wherein the underfill material includes a fillet shape disposed between the die and the mounting substrate, and wherein the a mold press that gives shape to the film includes a heater element disposed at the fillet.
26. The chip-packaging process system according to claim 23 , further including:
a first heating source for ramping the temperature of the underfill material to a first cure state; and
a second heating source for causing the tacky film to release from the die, the fillet, and the mounting substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/774,869 US20040159945A1 (en) | 2001-12-21 | 2004-02-09 | Underfill process for flip-chip device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/032,115 US6703299B2 (en) | 2001-12-21 | 2001-12-21 | Underfill process for flip-chip device |
US10/774,869 US20040159945A1 (en) | 2001-12-21 | 2004-02-09 | Underfill process for flip-chip device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/032,115 Division US6703299B2 (en) | 2001-12-21 | 2001-12-21 | Underfill process for flip-chip device |
Publications (1)
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US20040159945A1 true US20040159945A1 (en) | 2004-08-19 |
Family
ID=21863182
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US10/032,115 Expired - Lifetime US6703299B2 (en) | 2001-12-21 | 2001-12-21 | Underfill process for flip-chip device |
US10/774,869 Abandoned US20040159945A1 (en) | 2001-12-21 | 2004-02-09 | Underfill process for flip-chip device |
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US10/032,115 Expired - Lifetime US6703299B2 (en) | 2001-12-21 | 2001-12-21 | Underfill process for flip-chip device |
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US20100044882A1 (en) * | 2008-08-19 | 2010-02-25 | Park Soomoon | Integrated circuit package system flip chip |
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US6703299B2 (en) * | 2001-12-21 | 2004-03-09 | Intel Corporation | Underfill process for flip-chip device |
US7015592B2 (en) * | 2004-03-19 | 2006-03-21 | Intel Corporation | Marking on underfill |
US7372134B2 (en) * | 2005-03-31 | 2008-05-13 | Intel Corporation | Integrated circuit edge protection method and apparatus |
US20110300673A1 (en) * | 2010-06-08 | 2011-12-08 | Texas Instruments Incorporated | Post-dispense vacuum oven for reducing underfill voids during ic assembly |
US8796075B2 (en) | 2011-01-11 | 2014-08-05 | Nordson Corporation | Methods for vacuum assisted underfilling |
CN103109361B (en) * | 2011-04-06 | 2016-04-13 | 北京大学深圳研究生院 | Primer fill method in a kind of semiconductor packages and equipment |
US8962392B2 (en) * | 2012-03-13 | 2015-02-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Underfill curing method using carrier |
SG11201504347RA (en) | 2012-12-07 | 2015-07-30 | Baxter Int | Hemostatic foam |
JP6307729B1 (en) * | 2016-11-30 | 2018-04-11 | 株式会社新川 | Bonding apparatus and bonding method |
US11024595B2 (en) * | 2017-06-16 | 2021-06-01 | Micron Technology, Inc. | Thermocompression bond tips and related apparatus and methods |
US11410964B2 (en) * | 2019-11-22 | 2022-08-09 | Micron Technology, Inc. | Contaminant control in thermocompression bonding of semiconductors and associated systems and methods |
US11574848B2 (en) * | 2021-01-26 | 2023-02-07 | International Business Machines Corporation | Underfill injection for electronic devices |
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Also Published As
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US20030116864A1 (en) | 2003-06-26 |
US6703299B2 (en) | 2004-03-09 |
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