US20040005418A1 - Laminate with an electrically conductive layer formed as an antenna structure - Google Patents

Laminate with an electrically conductive layer formed as an antenna structure Download PDF

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Publication number
US20040005418A1
US20040005418A1 US10/609,872 US60987203A US2004005418A1 US 20040005418 A1 US20040005418 A1 US 20040005418A1 US 60987203 A US60987203 A US 60987203A US 2004005418 A1 US2004005418 A1 US 2004005418A1
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US
United States
Prior art keywords
layer
antenna structure
packaging material
material according
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/609,872
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English (en)
Inventor
Gunter Schmid
Hagen Klauk
Marcus Halik
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Publication of US20040005418A1 publication Critical patent/US20040005418A1/en
Priority to US11/124,593 priority Critical patent/US7254883B2/en
Abandoned legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42Details of containers or of foldable or erectable container blanks
    • B65D5/4212Information or decoration elements, e.g. content indicators, or for mailing
    • B65D5/4233Cards, coupons, labels or the like formed separately from the container or lid
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • B32B2439/70Food packaging
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2203/00Decoration means, markings, information elements, contents indicators
    • B65D2203/10Transponders
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062Prior to assembly
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • Y10T29/49018Antenna or wave energy "plumbing" making with other electrical component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • the invention relates to a laminate comprising a carrier layer and an electrically conductive layer.
  • Laminates of this type are used, for example, for the production of beverage cartons.
  • Transponder technology permits data to be read from and stored in a microchip without contact.
  • the microchip is connected to an antenna, with which electromagnetic radiation required to write to or read from the microchip can be received and transmitted.
  • an external transmitting and receiving unit it is possible to communicate with the microchip via electromagnetic radiation.
  • the microchip generally does not have its own power supply. Instead, the radiation used to write to or read from the microchip is also used to supply power to the microchip.
  • the transponder technology is used to find buried pipelines or it is employed for rapid detection of animals in a herd.
  • the animals are given a transponder implanted under the skin.
  • the animals can then be driven very simply past a transmitting and receiving station, in which the data stored on the microchip can be read out without contact, in order for example to identify the animal.
  • a further field of application is the electronic anti-theft protection of expensive luxury goods, such as fur coats, perfumes, CD-ROMs etc.
  • the retail trade has to be equipped with appropriate devices for reading from the microchips.
  • Further applications are, for example, monitoring important documents and files in government or administrative buildings, the files being registered electronically at the individual processing stations in order to follow their path more easily or in order to find the files easily again.
  • a transmitting and receiving station can be fitted, for example, in a door frame, so that the files are registered electronically when they are moved into a given room and out of the room.
  • Another exemplary application is the administration of unloading of pieces of luggage in railroad stations, harbors or airports. It is thereby necessary for the piece of luggage to be led to a specific location aimed at a specific destination.
  • an individual per piece price of approximately 0.50 ⁇ for a label which comprises a memory chip and a transmitting and receiving unit represents the cutoff price for profitability.
  • transponder technology has primarily been used for goods which have a very long life or a very high value.
  • the comparatively high costs have hitherto prevented the introduction of transponder technology on a broader basis.
  • the costs for the microchip have to be reduced, and secondly the costs for the transmitting and receiving unit, such as the antenna.
  • coils are mostly used as the antenna.
  • these antennas are far too costly for the applications described above.
  • antennas made of metal foil the antenna structure being produced first and then being applied to a carrier.
  • the antenna structure can be produced in various ways, such as:
  • a metal film is laminated to the carrier over its entire surface and then structured subtractively by selective etching
  • the antenna structure is printed or sprayed onto the carrier by using electrically conductive pastes
  • a mask is defined photolithographically on the carrier (for example by using a photoresist); the interspaces not covered by the mask on the carrier are then metalized without using power.
  • a packaging material comprising:
  • a microchip conductively connected to said antenna structure, for enabling contact-free data interchange between said microchip and a transmitting and receiving station via said antenna structure.
  • the objects of the invention are achieved by a laminate that is formed of at least one carrier layer, or substrate layer, and an electrically conductive layer applied to the carrier layer.
  • the antenna structure is formed from the electrically conductive layer in at least in one segment of the conductive layer.
  • the laminates according to the invention make use of structures such as are already used for the packaging of foodstuffs to provide an antenna structure.
  • laminates which comprise metal-containing films or metal layers.
  • the metal layer in this case acts as an oxygen barrier and prevents the rapid spoiling of the foodstuffs, whose contents would otherwise oxidize as a result of atmospheric oxygen penetrating in.
  • the metal layer is applied to a carrier which has the required robustness.
  • a carrier which has the required robustness.
  • packaging boards for the production of beverage packages or plastic films for the production of chip bags are suitable.
  • the metal layer contained in such a laminate has a sufficient electrical conductivity to be able to produce an antenna structure from this layer.
  • An important constituent part of the laminate according to the invention is, therefore, the presence of an antenna as a constituent part of the electrically conductive layer, which permits data and information to be written into a memory, which is connected to the antenna structure, or read from said chip by a transmitter or receiver located outside.
  • the laminate according to the invention therefore comprises a carrier layer, which is used for mechanical stabilization, and an electrically conductive layer applied to the carrier layer.
  • the antenna structure is formed as part of this electrically conductive layer.
  • the arrangement of the antenna structure in the electrically conductive layer is not subject to any restrictions.
  • any desired, sufficiently large, free area on the electrically conductive layer is considered.
  • a plurality of antenna structures can also be formed on the electrically conductive layer. In this case, it is necessary for the antenna density to be matched to the size of the package. In order to ensure the functionality of the transponder structure produced, it is sufficient for only one antenna structure to be connected to a microchip.
  • the size of the antenna within the scope of the space required is also arbitrary, since in principle the entire surface of the laminate or of the electrically conductive layer contained in the latter is available.
  • the laminates according to the invention can be provided in relatively large containers, for example in rolled-up form, or as relatively large sheets of a laminated board.
  • appropriate pieces which in each case comprise one or more antenna structures, are then separated from the roll or punched out of a larger board and processed further to form a package.
  • the known apparatus can be used for the production and filling of packages.
  • a covering layer is applied to the electrically conductive layer.
  • This covering layer can be, for example, a varnish layer or a further layer of a board.
  • a layer of a plastic is likewise possible.
  • the covering layer consists of a water-repellent material since, as a result, firstly possible corrosion of the electrically conductive layer is prevented and-secondly the penetration of water-soluble contaminants into the laminate and the interior of the package is ruled out.
  • the covering layer used is a layer of a plastic, such as is usual, for example, in beverage packages, such as milk cartons.
  • the laminate therefore comprises a carrier layer, for example of board, an electrically conductive layer, for example an aluminum layer, and a plastic layer, these being arranged on one another in this order.
  • the electrically conductive layer contains the antenna structure.
  • the covering layer can also be formed as an adhesive layer, so that the laminate can be stuck onto an object which is to be provided with corresponding labeling, such as a file or another document.
  • the adhesive layer can also be formed as a separate layer and, for example, applied to the carrier layer or to the covering letter.
  • the embodiment as a packaging material is preferred, the layer having an electrically conductive layer that is continuous in the surface, and sections of the electrically conductive latter being formed into an antenna structure.
  • the electrically conductive layer preferably contains at least one metal.
  • Most metals are relatively good electrical conductors and are therefore very suitable for the construction of the antenna structure. Furthermore, the metals needed are relatively easy to produce and uncomplicated to process. In particular, it is possible to shape most metals into thin layers with a conductivity which is still adequate, by which means the expenditure on material is reduced to a low extent and the material costs can be kept low in a countermove.
  • the metal is aluminum, since this metal is easily accessible and has a very good electrical conductivity. In addition, this metal has mechanical properties (extensibility, rolling behavior) which are advantageous for processing to form foil material.
  • aluminum is widespread in the production of packages for foodstuffs. In other applications, in which no statutory foodstuffs regulations have to be met, other metals can also be used, for example copper.
  • the electrically conductive layer of the laminate according to the invention can also contain at least one conductive organic compound.
  • electrically conductive polymers such as condensed aromatic materials or semiconductors based on polythiophene or polyaniline which, in order to increase the electrical conductivity, are provided with doping (for example camphor-sulfonic acid-doped polyaniline, polystyrene sulfonic acid-doped poly(ethylenedioxy)thiophene).
  • electrically conductive organic materials such as polyaniline doped with camphor sulfonic acid or poly(ethylenedioxy)thiophene doped with polystyrene sulfonic acid can advantageously be used, since the bridge structure in this case can be produced very simply by means of printing techniques.
  • Conductive organic compounds can generally easily be processed by means of printing techniques. Since work is being carried out intensively on the development microchips based on organic semiconductors, the transmitter unit and memory module can be produced simultaneously with such chips. As compared with some metals, in particular noble metals, the production costs of organic semiconductors are also lower. Furthermore, organic materials often have more beneficial deformability characteristics and therefore make further processing easier.
  • the carrier layer is built up from a paper-like material, since paper has a low weight and nevertheless imparts sufficient stability and strength to the laminate.
  • Paper-like materials are all materials which contain cellulose as a basic constituent part, that is to say, in addition to paper, also paperboard, papier maché, board, wood, etc.
  • polymers as carrier material is also preferred.
  • polymers in addition to the plastics which can be produced synthetically with a wide range of material characteristics, polymers is also to be understood to mean naturally occurring polymers such as silk, natural fibers, cotton, etc.
  • synthetic polymers have a very low specific weight, can be loaded mechanically extremely highly and produced cost-effectively.
  • the laminate is shaped into a package which encloses a hollow space.
  • the laminate serves as a package and a storage medium for data about the packaged goods, for example their date of manufacture or their price.
  • the package can also bear a decorative imprint, for example the product name.
  • the production of the package and its filling are carried out in accordance with known methods and with known apparatuses. Specific rebuilding of these apparatuses is therefore not required.
  • the laminate configured as a package is suitable in particular for packaging foodstuffs.
  • the laminate according to the invention therefore comprises, at least in some sections, a layer of an oxygen-impermeable material.
  • a layer of an oxygen-impermeable material In this way, the passage of oxygen into the interior of package, even into the sections not covered by the electrically conductive layer, can be prevented and, as a result, spoiling and rotting processes which require oxygen, that is to say aerobic processes, can be slowed down and therefore the ability of the relevant foodstuff to be kept can be increased.
  • the non-metalized area, as a result of the antenna being cut out, is extremely small as compared with the total area of the package, so the quality of the foodstuff is generally not impaired.
  • Oxygen diffusion through the cutouts may be prevented completely by the interspaces being filled with a suitable polymer film.
  • oxygen diffusion can also be prevented by the application of a covering film to the antenna structure.
  • a covering film of this type is also needed for mechanical protection of a microchip produced from polymer materials.
  • a packaging board with small cutouts is laminated on. The positioning accuracy of 100-200 ⁇ m, normally achievable, of the lamination operation is completely adequate for the contact opening.
  • an information carrier is provided which is conductively connected to the antenna structure.
  • Various items of information about the product contained in the package can be stored on this information carrier, for example type of product, price, date of manufacture, best-before date and the like.
  • Suitable in particular as an information carrier is a microchip which is capable of storage, since the production technology for this type of component is well-developed and production costs are correspondingly low.
  • the microchip is based on organic semiconductor materials, since microchips of this type can be produced cost-effectively.
  • a microchip produced using conventional silicon technology can also be used.
  • an electronic capacitor which is electrically conductively connected to the antenna structure.
  • the capacitor improves the resonant behavior considerably via its capacitive effect. Should an additional electrode be needed, this can be formed by the electrically conductive layer
  • the antenna structure has turns, since in this geometric shape, the resonant behavior is most beneficial.
  • an optimum number of turns exists.
  • the number of turns that can be produced should lie as close as possible to the optimum value in order to achieve a high efficiency.
  • the efficiency is higher the greater the enclosed area.
  • the efficiency also depends on the size of the read coil. The efficiency should be selected optimally in order to optimize the injection of the energy of the high frequency with regard to its efficiency. The better the injection of energy into the antenna structure, the higher are the reading distance and the reading integrity that can be achieved.
  • the high resistances caused by the low layer thickness of the electrically conductive layer can be balanced out by means of broader structures.
  • the production of the laminate according to the invention is carried out on normal production lines, which are extended by one stage for structuring the conductive layer, generally an aluminum layer.
  • the first possible way of producing the substrate according to the invention consists in the use of a shadow mask.
  • This shadow mask has openings which correspond to the antenna structure.
  • the shadow mask is placed on the carrier, for example a plastic film or a board, and fixed.
  • the shadow mask can be held firmly, for example, by a magnet.
  • the shadow mask should be built up from any magnetizable material.
  • aluminum for example, can be vapor-deposited directly onto the carrier and the shadow mask arranged thereon. Following the vapor deposition, the shadow mask with the excess aluminum can be removed, so that only the desired antenna structure remains on the section of packaging film.
  • vapor-deposition with aluminum is carried out using known apparatuses, such as are already known for the production of packaging materials.
  • the deposition of the metal, for example aluminum is particularly preferably carried out by means of directed deposition. If the shadow mask has an adequate thickness, then only slight coverage occurs at the edges of the cutouts which correspond to the antenna structure. The shadow mask can then be taken off the carrier very easily again, since the aluminum layer can be severed very easily at the edges of the shadow mask, and the aluminum layer is therefore not lifted off the carrier.
  • a microchip can then be adhesively bonded to the packaging film with an electrically conductive adhesive and connected to the end of the antenna structure. Contact with a microchip can also be made with a nonconductive adhesive, if the contact is produced by appropriate bridge structures (bumps).
  • the negative image of the antenna is printed onto the carrier with a water-soluble varnish.
  • a suitable water-soluble varnish is, for example, a polymeric alcohol, such as polyvinyl alcohol.
  • a suitable printing process is, for example, pad printing. The layer thickness of the varnish film is about 2 ⁇ m in this case. If the mask can be separated again in the subsequent method, then in principle other printing techniques, for example offset, flexographic or gravure printing) are also suitable for the application of the mask.
  • the film can also be structured by known mechanical methods.
  • the structuring can also be carried out during a gas-phase deposition process.
  • Films are usually produced from a polymer material which is built up from non-polar hydrocarbon monomers.
  • the film material consequently has a considerably hydrophobic character.
  • Many types of particle and, in particular, also metal vapors are adsorbed preferentially on hydrophobic surfaces, since they themselves have hydrophobic properties.
  • CVD chemical gas-phase deposition process
  • the laminate according to the invention permits a considerable reduction in the production costs and may be produced without difficulty by means of the processes already used in industrial fabrication, these having to be modified only slightly.
  • the advantages of the laminate according to the invention are summarized once again in the following text:
  • the antenna can be formed at any desired point on the package; it is possible for a plurality of antennas to be provided on one package, only one antenna being necessary for the electrical function of the transponder; the antenna density merely has to be adapted to the size of the package;
  • the antenna can be configured to be very large, since the entire surface of the object to be identified is available;
  • the layer thickness of the metalization of the film is generally low, the higher resistances of the antenna which are produced as a result can be balanced out by broader conductor tracks;
  • the number of turns can be increased as desired within the available area, which increases the efficiency of the coupling of energy and therefore the reading distance or the reading integrity;
  • FIG. 1 is a plan view onto a radiofrequency identification label according to the prior art
  • FIG. 2 is an enlarged view of a shadow mask for the production of an antenna structure
  • FIG. 3 is an assembly showing a package that has been produced from the laminate according to the invention, and a transmitting and receiving device arranged at a specific distance;
  • FIG. 4 is a partial section taken in the plane IV in FIG. 3 and viewed from the right-hand side in FIG. 3.
  • FIG. 1 there is shown a radiofrequency identification label according to the prior art.
  • An antenna structure 2 built up from a plurality of turns is applied to a flexible film 1 , which serves as a carrier layer or substrate.
  • the ends of the antenna structure 2 are conductively connected to a silicon microchip 3 .
  • the two ends of the antenna structure are connected to each other via a bridge structure 2 a.
  • the carrier layer 1 can be provided with adhesive layer on its rear side, in order to be able to fix the label to an object to be identified, for example a file.
  • the antenna structure 2 is first produced separately and then affixed to the film 1 . The production of such a label is therefore complicated.
  • FIG. 2 there is illustrated a shadow mask 4 which can be used for the production of the antenna structure in the laminate according to the invention.
  • the shadow mask 4 comprises shadow regions 5 , which are illustrated with dark shading in the figure.
  • a spiral opening 6 that is illustrated in a white spiral.
  • the opening 6 corresponds to the turns of the antenna to be represented.
  • the shadow mask therefore constitutes a negative structure of the antenna to be produced.
  • Packaging films are, for example, vapor-deposited with aluminum from the gas phase in the roll-to-roll process.
  • the shadow mask 4 is placed on the substrate at a previously defined location. If the shadow mask consists of a magnetizable material, the shadow mask can, for example, be held firmly on the film magnetically.
  • the aluminum is then vapor-deposited onto the film over its entire surface, the regions shadowed by the dark sections 5 of the shadow mask 4 remaining free of aluminum. Following the vapor-deposition of aluminum, the shadow mask 4 is removed from the surface of the film. A microchip can then be adhesively bonded onto the square electrode surface 7 with the aid of a conductive adhesive.
  • FIG. 3 shows an application of the laminate according to the invention as a package.
  • the laminate comprises a continuous layer of aluminum, which is covered on one side by a board layer and on the other side by a plastic.
  • an area 8 in which an antenna structure 9 is formed from the aluminum layer.
  • the antenna structure 9 is connected to a microchip 10 in which pertinent information such as, for example, date of manufacture, keeping date and price of the consumable article contained in the package are stored.
  • the interspace 11 between turns of the antenna structure 9 and between the antenna structure 9 and the aluminum layer surrounding the latter is filled with an oxygen-impermeable layer.
  • a non-illustrated film of an oxygen-impermeable material can be adhesively bonded to the antenna structure.
  • a transmitting and receiving installation 12 Via a transmitting and receiving installation 12 , by means of electromagnetic radiation 13 , data can be read out from the microchip 10 without contact via the antenna structure 9 conductively connected to the microchip 10 , or can be read into said microchip.
  • the transmitting and receiving installation 12 can, for example, be connected to the cash register of a supermarket, in order to read the data out from the microchip. However, it can also be fitted to a production line and there, for example, read data about the date of manufacture, the type of product or the price into the microchip 10 .
  • the laminate of the package box is formed of a cardboard substrate 14 , the electrically conductive layer 15 , and a covering layer 16 .
  • the conductive layer 15 in a preferred embodiment, is a vapor-deposited aluminum layer.
  • the covering layer 15 is illustrated only on the side of the box that carries the antenna according to the invention. It is understood that the covering layer 15 may completely encase the entire box.
  • the covering layer may be a varnish layer or a further layer of a board.
  • a layer of a plastic is likewise possible.
  • the additional layer leads not only to protection against external influences, but also provides for a higher mechanical stability of the laminate.
  • the covering layer consists of a water-repellent material. This prevents possible corrosion of the electrically conductive layer and also prevents the penetration of water-soluble contaminants into the laminate and the interior of the package.
  • a particularly preferable material for the covering layer 15 is a layering plastic, such as is usual, for example, in beverage packages.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Aerials (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
US10/609,872 2002-06-28 2003-06-30 Laminate with an electrically conductive layer formed as an antenna structure Abandoned US20040005418A1 (en)

Priority Applications (1)

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US11/124,593 US7254883B2 (en) 2002-06-28 2005-05-06 Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure

Applications Claiming Priority (2)

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DE10229168A DE10229168A1 (de) 2002-06-28 2002-06-28 Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht
DE10229168.3 2002-06-28

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US11/124,593 Expired - Fee Related US7254883B2 (en) 2002-06-28 2005-05-06 Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure

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US (2) US20040005418A1 (de)
EP (1) EP1375131B1 (de)
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SG (1) SG110059A1 (de)

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EP1628245A1 (de) * 2004-08-17 2006-02-22 Sony DADC Austria AG Verpackung, Verfahren und Vorrichtung zum Herstellen einer Verpackung
US20060187053A1 (en) * 2005-01-13 2006-08-24 Werner Koele Identifiable packaging
US20060220877A1 (en) * 2005-03-28 2006-10-05 Ferguson Scott W Method for making RFID device antennas
EP1837811A1 (de) * 2006-03-21 2007-09-26 Stmicroelectronics Sa Verfahren zur Herstellung eines elektronischen RFID-Etiketts
US20070222613A1 (en) * 2006-03-21 2007-09-27 Stmicroelectronics Sa Method for manufacturing a RFID electronic tag
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US20110009925A1 (en) * 2006-10-17 2011-01-13 Cochlear Limited Transcutaneous receiving antenna device for implant
US20130240251A1 (en) * 2010-04-12 2013-09-19 Trustees Of Boston University Silk electronic components
US9922215B2 (en) 2014-12-22 2018-03-20 Smartrac Investment B.V. Method for retrieving a shut state and/or a location of a closable container
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JP5099134B2 (ja) * 2007-07-04 2012-12-12 株式会社村田製作所 無線icデバイス及び無線icデバイス用部品
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ITPI20100025A1 (it) * 2010-03-10 2011-09-11 Daniele Murabito Supporto per la memorizzazione dati su documenti cartacei.
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WO2005123186A1 (en) * 2004-06-09 2005-12-29 Medtronic, Inc. Implantable medical device package antenna
AU2005255571B2 (en) * 2004-06-18 2011-11-03 Sicpa Holding Sa Item carrying at least two data storage elements
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EP1837811A1 (de) * 2006-03-21 2007-09-26 Stmicroelectronics Sa Verfahren zur Herstellung eines elektronischen RFID-Etiketts
US20110009925A1 (en) * 2006-10-17 2011-01-13 Cochlear Limited Transcutaneous receiving antenna device for implant
US20130240251A1 (en) * 2010-04-12 2013-09-19 Trustees Of Boston University Silk electronic components
US9603243B2 (en) * 2010-04-12 2017-03-21 Tufts University Silk electronic components
US9922215B2 (en) 2014-12-22 2018-03-20 Smartrac Investment B.V. Method for retrieving a shut state and/or a location of a closable container
USD917434S1 (en) * 2018-04-25 2021-04-27 Dentsply Sirona Inc. Dental tool with transponder

Also Published As

Publication number Publication date
DE50306428D1 (de) 2007-03-22
US7254883B2 (en) 2007-08-14
US20050210658A1 (en) 2005-09-29
CN101141024B (zh) 2012-01-04
CN101141024A (zh) 2008-03-12
CN1482705A (zh) 2004-03-17
EP1375131A1 (de) 2004-01-02
DE10229168A1 (de) 2004-01-29
EP1375131B1 (de) 2007-01-31
SG110059A1 (en) 2005-04-28

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