US20020124993A1 - Apparatus with air-conditioning system, and device manufacturing method using the same - Google Patents

Apparatus with air-conditioning system, and device manufacturing method using the same Download PDF

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Publication number
US20020124993A1
US20020124993A1 US09/536,637 US53663700A US2002124993A1 US 20020124993 A1 US20020124993 A1 US 20020124993A1 US 53663700 A US53663700 A US 53663700A US 2002124993 A1 US2002124993 A1 US 2002124993A1
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Prior art keywords
air
heat exchanger
chamber
coolant
refrigerant
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Abandoned
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US09/536,637
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English (en)
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Hitoshi Nakano
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Canon Inc
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Individual
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Assigned to CANON KABUSHIKI KAISHA reassignment CANON KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKANO, HITOSHI
Publication of US20020124993A1 publication Critical patent/US20020124993A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/0001—Control or safety arrangements for ventilation
    • F24F2011/0002—Control or safety arrangements for ventilation for admittance of outside air
    • F24F2011/0004—Control or safety arrangements for ventilation for admittance of outside air to create overpressure in a room

Definitions

  • This invention relates to an apparatus having an air-conditioning chamber wherein a high temperature stability is required and, more particularly, to an apparatus having an air-conditioning system to be connected to a high precision optical measurement system or to an environment chamber surrounding the same, such as, for example, a semiconductor manufacturing apparatus or an inspection or measuring apparatus.
  • the linewidth of a semiconductor integrated circuit has been narrowed more and more.
  • a pattern of a linewidth of 0.1 micron order can be formed through mass production.
  • a very strict level of 40-25 nm is required.
  • a much more strict level is required for the dimensional precision of a reticle.
  • the wafer size is changing, from prevalently used 8-inch wafers to 12-inch wafers.
  • the measurement precision for the position of a wafer is one of critical error factors. This is also with the case of a registration inspecting apparatus.
  • the precise measurement is made by use of a laser interferometer measuring system wherein a change in refractive index in an ambience of a laser light path or a change in temperature thereof has an adverse influence on the measurement error.
  • a laser interferometer measuring system is used in a reticle coordinate measuring system for measuring a pattern on a reticle, or a surface shape measuring system for measuring the surface shape of an object, particularly, an optical element.
  • a temperature change in a gas including a projection optical system from a reticle to a wafer, or a temperature change in the projection optical system itself, will adversely affect the image quality of a reticle pattern to be transferred to the wafer.
  • the whole of and/or a portion of the apparatus may be surrounded by an environment chamber, and an air-conditioning system may be connected thereto.
  • an air-conditioning system may be directly connected to the apparatus so that only a desired portion is placed in a temperature-stabilized gas flow.
  • the smallest linewidth of a pattern to be transferred to a wafer is about 0.2-0.3 micron.
  • the required registration precision is about 1 ⁇ 5 to 1 ⁇ 4 of the smallest linewidth and, in this example, it is about 40-50 nm.
  • the measurement precision required for a laser interferometer measuring system to accomplish the above-described registration precision is 1 ⁇ 5 or less of the registration precision and, in this example, it is about 10 nm or less.
  • an interferometric measuring system having a He—Ne laser as a light source is placed in an atmosphere, there may occur a measurement error attributable to a change in refractive index of the air. It may be about ⁇ 1 ppm with respect to an air temperature change of 1° C.
  • the wafer stage measurement distance required for an exposure apparatus to meet 8-inch wafers is more than 300 mm. Therefore, the air temperature stability around the measurement light path should be less than 0.03° C.
  • an apparatus comprising: a chamber having an inner space; and an air conditioner for controlling an air supplied or to be supplied into the inner space of said chamber, said air conditioner including (i) a refrigerator using a refrigerant, (ii) a first heat exchanger for exchanging a heat between the refrigerant and a coolant, and (iii) a second heat exchanger for exchanging a heat between an air supplied or to be supplied into said chamber and the coolant; wherein the refrigerant is circulated between said refrigerator and said first heat exchanger, and wherein said coolant is circulated between said first and second heat exchangers.
  • a water, an anti-freeze, or a fluoride inert liquid more specifically, a liquid having a large heat capacity such as a pure water, an ethylene glycol aqueous solution, or a PFC liquid, for example, may be used as a secondary refrigerant.
  • a refrigerator, a secondary refrigerant cooling heat exchanger, and a secondary refrigerant circulating means may be disposed in a casing, separate from the chamber, while an air heating means and a air cooling heat exchanger may be disposed adjacent the chamber.
  • a manufacturing apparatus such as a semiconductor manufacturing apparatus or an inspecting or measuring apparatus may be disposed in a chamber.
  • a refrigerant to be used with a refrigerator may function to cool a coolant, in a first heat exchanger (evaporator), and the cooled coolant may be introduced into a second heat exchanger, to cool an air-conditioning air.
  • the coolant may comprise a liquid such as a pure water, an ethylene glycol aqueous solution, or a PFC liquid, for example, which may have a large heat capacity as compared with a refrigerant (e.g., Flon, substitute Flon, propane, etc.) to be used with the refrigerator.
  • a refrigerant e.g., Flon, substitute Flon, propane, etc.
  • any pressure change does not directly cause a temperature change. For these reasons, any temperature change in the refrigerant may be sufficiently smoothed by the coolant having a large heat capacity.
  • a coolant being stable with small temperature change may be introduced into an air cooling heat exchanger by means of a circulation pump to cool an air-conditioning air.
  • a conditioning air having a very high temperature stability of 0.01° C. or less, substantially free from a temperature change in a refrigerant.
  • a liquid to be used as the coolant may have a large heat capacity
  • the temperature distribution of the air-cooling heat exchanger itself can be suppressed to small.
  • the uniformness of temperature distribution of the conditioning air to be cooled there can be improved more.
  • a refrigerator or the like which may be a vibration source may be isolated from a secondary refrigerant cooling heat exchanger or a secondary refrigerant circulating means, and it may be disposed separately from a chamber. This is effective to much reduce the vibration to be transmitted to the chamber.
  • FIG. 1 is a schematic view of an environment chamber and an air-conditioning system, according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view of an environment chamber and an air-conditioning system, according to a second embodiment of the present invention.
  • FIG. 3 is a schematic view of an environment chamber and an air-conditioning system, to be compared with the present invention.
  • FIG. 4 is a flow chart of semiconductor device manufacturing processes.
  • FIG. 5 is a flow chart for explaining details of a wafer process in the procedure of FIG. 4.
  • FIG. 3 shows a comparative example for better understanding of the present invention, and it illustrates an example of an air-conditioning chamber for use in a semiconductor exposure apparatus or an inspecting apparatus, for example, as well as an air-conditioning system connected to the chamber.
  • FIG. 3 disposed inside an air-conditioning system 2 are a cooling heat exchanger (evaporator) 3 for cooling an air, a heating heat exchanger 4 for raising and adjusting the temperature of the cooled air to a predetermined temperature, and an air blower 5 for supplying an air from the air-conditioning system 2 into an environment chamber 1 .
  • air means an ordinary air or a pure gas such as an inert gas, for example.
  • a cooling system comprising a refrigerator 6 , and a refrigerant is circulated between the cooling heat exchanger (evaporator) 3 and the refrigerator 6 .
  • the cooling heat exchanger (evaporator) 3 comprises a plate fin coil type heat exchanger which includes a plurality of plate fins disposed equidistantly and a plurality of tubes, providing refrigerant flow passages and extending through the fins orthogonally thereto.
  • the refrigerator 6 includes at least a compressor 7 and a condenser 8 .
  • various cooling flow rate regulating valves flow control valves
  • other regulating valves not shown
  • accumulator not shown
  • the refrigerant b HCHC such as R22, R134a or R407c, for example, HFC gas, ammonia or methane gas, for example, is used.
  • the refrigerant gas b as pressurized and heated by the compressor 7 of the refrigerator 6 is subject to heat exchange, at the condenser 8 and with a cooling water c, whereby it is cooled and liquefied. Further, this refrigerant liquid passes through an expansion valve or capillary 30 , and it is flown to the cooling heat exchanger (evaporator) 3 , as a refrigerant b′ having its temperature lowered by evaporation and adiabatic expansion. Then, after depriving the heat of the conditioning air at the cooling heat exchanger (evaporator) 3 , the refrigerant is pressurized again by the compressor 7 . Through a refrigerating cycle wherein expansion, compression and heat wasting of a refrigerant are made continuously in a closed circuit, the conditioning air is cooled by wasting its heat into the cooling water.
  • an air a is cooled by the cooling heat exchanger (evaporator) 3 and then it is held at a predetermined temperature by the heating heat exchanger 4 .
  • the heating heat exchanger 4 is provided with an electric heater 4 ′.
  • a temperature sensor 9 and this electric heater 4 ′ which are disposed inside the environment chamber 1 or the air-conditioning system 2 , are electrically communicated with each other through a temperature adjusting device 10 and an output converter (not shown).
  • the temperature adjusting device 10 controls the output of the electric heater 4 ′ through the output converter, in accordance with a control algorithm such as PID control, for example, such that the temperature as detected by the temperature sensor 9 is kept at a predetermined level.
  • the air a′ maintained at a predetermined temperature by the heating heat exchanger 4 is then sucked up by the air blower 5 and is flown to the environment chamber 1 .
  • the environment chamber 1 is provided with a filter box 12 having a dust removing filter 11 such as HEPA or ULPA filter accommodated therein.
  • the air a′′ having its dust or particles removed by the filter 11 is supplied to a space 14 in which an exposure apparatus 13 is placed.
  • the air a′′ supplied to the space 14 is discharged through a returning port 15 provided in the air-conditioning system 2 , such that it is circulated between the air-conditioning system 2 and the environment chamber 1 .
  • the space 14 is kept at a pressurized state slightly higher than the atmospheric pressure of the external environment in which the environment chamber 1 is placed. To this end, an air of 5-10% of the circulation air quantity is introduced thereinto, from an outside air introducing port 16 .
  • an impurity removing filter may be disposed along the outside air introducing path or the circulation path, so as to remove an organic (gas) or acid or alkali gas in the air to meet a chemical amplification resist or blurring of an optical element.
  • the response speed of the electric heater 4 ′ inside the heating heat exchanger 4 is too slow to cancel the same through control of the heater 4 ′.
  • a temperature change of about 0.02° C. will undesirably remain in the air-conditioning air a′.
  • vibration of the air-conditioning system 2 is transmitted to the main assembly 13 of the manufacturing apparatus via the environment chamber 1 or the floor on which the chamber is placed. This adversely affects the measurement error, and it causes a large factor for degradation of the registration precision or image performance. This is because the compressor 7 of the refrigerator 6 or the air blower 5 , provided in the air-conditioning system, functions as a major vibration source.
  • FIG. 1 is a schematic view of an apparatus having an air-conditioning chamber according to a first embodiment of the present invention.
  • the invention is applied to a semiconductor manufacturing apparatus such as a stepper, for example.
  • FIG. 1 As compared with the example shown in FIG. 3, there is a circulation circuit for a coolant, which is added to an air-conditioning system 2 . More specifically, there are additional components such as a coolant cooling heat exchanger (evaporator) 17 which functions as a first heat exchanger for cooling a coolant d with use of a refrigerant b′ of a refrigerator 6 , an air-conditioning air cooling heat exchanger 3 ′ for cooling the air-conditioning air through heat exchange with the coolant having been cooled by the heat exchanger 17 , a reservoir 18 for temporarily reserving the coolant, and a pump 19 for feeding out the coolant reserved in the reservoir 18 .
  • a coolant cooling heat exchanger (evaporator) 17 which functions as a first heat exchanger for cooling a coolant d with use of a refrigerant b′ of a refrigerator 6
  • an air-conditioning air cooling heat exchanger 3 ′ for cooling the air-conditioning air through heat exchange with the coolant having been cooled
  • a pressure regulating valve for preventing pressurization of the reservoir 18
  • a flow rate control valve for regulating the circulation flow rate of the coolant
  • a pressure monitoring device for monitoring the pressure inside the circulation path
  • the heat exchanger (evaporator) 17 a plate type heat exchanger, a heat exchanger having tubes or coils embedded in a shell, or a double tube type heat exchanger may be used.
  • the refrigerant gas b as pressurized and heated by the compressor 7 of the refrigerator 6 is subject to heat exchange, at the condenser 8 and with a cooling water c, whereby it is cooled and liquefied. Further, this refrigerant liquid passes through an expansion valve or capillary 30 , and it is flown into the cooling heat exchanger (evaporator) 17 , as a refrigerant b′ having its temperature lowered by evaporation and adiabatic expansion. Then, after depriving the heat of the coolant d at the heat exchanger (evaporator) 17 , it is pressurized again by the compressor 7 .
  • the coolant d fed by the pump 19 and cooled by the heat exchanger (evaporator) 17 is flown to an air-conditioning air cooling heat exchanger 3 ′ (second heat exchanger) to cool the air-conditioning air there.
  • the coolant d having deprived the heat of the air-conditioning air is collected into the reservoir 18 , and again it is fed by the pump 19 into the heat exchanger (evaporator) 17 .
  • the coolant is circulated between the heat exchanger (evaporator) 17 and the heat exchanger 3 ′, by which the heat of the air-conditioning air is transferred to the refrigerator 6 .
  • a liquid such as pure water, anti-freeze liquid, or PFC liquid, for example, may be used.
  • These liquids have a large product of specific heat capacity and specific gravity, and the heat capacity to be transferred per a unit temperature is very large as compared with that of ordinary refrigerant.
  • ordinary refrigerant a phase change follows and it can not be compared simply.
  • a temperature change resulting from heat radiation and reception is considerably small with these coolants.
  • a pressure change does not directly apply an influence to a change in temperature.
  • the anti-freeze liquid may comprise a solution of ethylene glycol, for example, mixed into a pure water or tap water, for prevention of freezing.
  • the PFC liquid is a fluorine series inert liquid. Since it has a good electric insulation property, it may be used preferably in a case where a risk of short-circuit due to leakage of the liquid should be avoided.
  • HFE hydrofluoro ether
  • HFPE hydrofluoro polyether
  • FIG. 2 is a schematic view of an apparatus with a cooling system, according to a second embodiment of the present invention.
  • An environment chamber has the same structure as of the first embodiment, and it is not illustrated.
  • the second embodiment has a similar structure as of the first embodiment except for the following points.
  • An air-conditioning air cooling heat exchanger 3 ′ and a coolant tube are left in an air-conditioning system 2 , while on the other hand, various components including a refrigerator 6 for cooling the coolant as well as a pump 19 and a reservoir 18 are structured into a cooling system 20 which is made separate from the air-conditioning system 2 .
  • the cooling system 20 and the air-conditioning system 2 are connected with each other through pipes for circulating the coolant between them.
  • the length of this piping may be made more than 20 m, such that the cooling system 20 and the air-conditioning system 2 can be mounted at completely different places, such as, for example, a place below a clean room or a separate room.
  • the connection pipes may be surrounded by a heat insulative material if necessary, by which transfer of heat from the outside environment into the coolant can be prevented efficiently.
  • a refrigerant of a refrigerator is used to cool a coolant, and the coolant is circulated as a cooling medium for a second heat exchanger.
  • a coolant having a large heat capacity as compared with that of the refrigerant for the refrigerator can be used and introduced into the second heat exchanger, to perform cooling of the air-conditioning air.
  • the temperature change of or any temperature non-uniformness in the air to be cooled and conditioned can therefore be reduced significantly.
  • the temperature change in the air-conditioning air to be supplied into the chamber can be reduced to 0.01° C. or less.
  • the refrigerator or the like which may function as a vibration source can be disposed away from the chamber. This effectively reduces transmission of vibration to the chamber.
  • a measuring apparatus having a laser interferometric measuring system particularly, a semiconductor exposure apparatus such as a stepper, a registration inspecting apparatus, a reticle inspecting apparatus or a surface shape measuring apparatus, for example, are disposed in a chamber, a measurement error due to a temperature change or vibration can be reduced significantly.
  • FIG. 4 is a flow chart of procedure for manufacturing microdevices such as semiconductor chips (e.g. ICs or LSIs), liquid crystal panels, CCDs, thin film magnetic heads or micro-machines, for example.
  • semiconductor chips e.g. ICs or LSIs
  • liquid crystal panels e.g. LCDs, LCDs, thin film magnetic heads or micro-machines, for example.
  • Step 1 is a design process for designing a circuit of a semiconductor device.
  • Step 2 is a process for making a mask on the basis of the circuit pattern design.
  • Step 3 is a process for preparing a wafer by using a material such as silicon.
  • Step 4 is a wafer process (called a pre-process) wherein, by using the so prepared mask and wafer, circuits are practically formed on the wafer through lithography.
  • Step 5 subsequent to this is an assembling step (called a post-process) wherein the wafer having been processed by step 4 is formed into semiconductor chips.
  • This step includes an assembling (dicing and bonding) process and a packaging (chip sealing) process.
  • Step 6 is an inspection step wherein operation check, durability check and so on for the semiconductor devices provided by step 5 , are carried out. With these processes, semiconductor devices are completed and they are shipped (step 7 ).
  • FIG. 5 is a flow chart showing details of the wafer process.
  • Step 11 is an oxidation process for oxidizing the surface of a wafer.
  • Step 12 is a CVD process for forming an insulating film on the wafer surface.
  • Step 13 is an electrode forming process for forming electrodes upon the wafer by vapor deposition.
  • Step 14 is an ion implanting process for implanting ions to the wafer.
  • Step 15 is a resist process for applying a resist (photosensitive material) to the wafer.
  • Step 16 is an exposure process for printing, by exposure, the circuit pattern of the mask on the wafer through the exposure apparatus described above.
  • Step 17 is a developing process for developing the exposed wafer.
  • Step 18 is an etching process for removing portions other than the developed resist image.
  • Step 19 is a resist separation process for separating the resist material remaining on the wafer after being subjected to the etching process. By repeating these processes, circuit patterns are superposedly formed on the wafer.

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US09/536,637 1999-03-29 2000-03-28 Apparatus with air-conditioning system, and device manufacturing method using the same Abandoned US20020124993A1 (en)

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JP11085610A JP2000283500A (ja) 1999-03-29 1999-03-29 環境制御装置、半導体製造装置および検査・測定装置
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CN100395493C (zh) * 2006-01-17 2008-06-18 南京航空航天大学 复合式冷风发生装置
US7958738B2 (en) * 2008-06-06 2011-06-14 Colmac Coil Mfg., Inc. Direct expansion ammonia refrigeration system and a method of direct expansion ammonia refrigeration
US20120279591A1 (en) * 2011-05-03 2012-11-08 Krones Ag Sealing water system
US20170176037A1 (en) * 2015-12-17 2017-06-22 Eisenmann Se Supply air system
CN106944871A (zh) * 2015-11-26 2017-07-14 发那科株式会社 加工系统
US20170355246A1 (en) * 2016-06-08 2017-12-14 Truma Geraetetechnik Gmbh & Co. Kg Air conditioning system and method for leakage detection in an air conditioning system
WO2018153501A1 (de) * 2017-02-24 2018-08-30 M. Braun Inertgas-Systeme Gmbh Vorrichtung und verfahren zum austausch eines gases aus einem arbeitsraum eines begehbaren inertgas-gehäuses
US10596881B2 (en) 2015-02-12 2020-03-24 Carrier Corporation Chiller for refrigeration system
EP4212959A1 (en) * 2022-01-12 2023-07-19 Mycronic Ab Temperature stabilization of climate chamber

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JP4795709B2 (ja) * 2005-03-31 2011-10-19 エスペック株式会社 恒温恒湿装置
JP2010192779A (ja) * 2009-02-20 2010-09-02 Orion Mach Co Ltd 冷却装置

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Publication number Priority date Publication date Assignee Title
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