US20020031921A1 - Contact structure of lead - Google Patents
Contact structure of lead Download PDFInfo
- Publication number
- US20020031921A1 US20020031921A1 US09/902,262 US90226201A US2002031921A1 US 20020031921 A1 US20020031921 A1 US 20020031921A1 US 90226201 A US90226201 A US 90226201A US 2002031921 A1 US2002031921 A1 US 2002031921A1
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- US
- United States
- Prior art keywords
- bump
- lead
- plating
- insulative sheet
- contact structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Definitions
- This invention relates to a contact structure in which a bump is annexed to a lead extending on an insulative sheet.
- U.S. Pat. No. 5,354,205 discloses a probe pad in which a lead and a bump are formed of a single metal by plating growth and the bump is press contacted with an electrode pad of a circuit element to be tested.
- the metal of which the bump is formed is required to have durability enough to withstand repeated contact and hardness enough to break an oxide film on a surface of the electrode pad.
- nickel or nickel alloy is normally used as such metal.
- the metal of which the lead is formed is required to have excellent conductivity and comparatively flexible property.
- copper or copper alloy is normally used.
- the bump and the lead are formed of a same metal. This involves such a problem that if copper or copper alloy good for the lead is selected, it cannot satisfy the requirement for the bump and if, on the contrary, nickel or nickel alloy good for the bump is selected, crack is liable to occur when the lead is bent.
- Another object of the present invention is to provide a contact structure of a lead in which a bump and a lead are soundly connected together in terms of electricity and strength.
- a contact structure includes a lead formed by etching a conductive foil and a bump formed by electric casting by means of plating.
- the bump and the lead are formed of different metals, respectively.
- the bump is connected to a surface of the lead through a conductive connecting material.
- the lead is intimately contacted at a surface, on which the bump is disposed, with a first main surface of a holeless insulative sheet.
- a basal portion of the bump is forcibly pierced into and extended all the way through a material of the holeless insulative sheet and a side surface of the basal portion of the bump is fusion-adhered to an inner wall surface of the through-hole.
- a distal portion of the bump is projected from a second main surface of the insulative sheet so as to be subjected to press contact with an electrode pad of a given electric part.
- a contact structure according to a second aspect of the present invention includes a lead formed by plating and a bump formed by electric casting by means of plating.
- the bump and the lead are formed of different metals, respectively.
- the bump is connected, by plating, to a surface of the lead.
- the lead is intimately contacted at a surface, on which the bump is disposed, with a first main surface of a holeless insulative sheet.
- a basal portion of the bump is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet and a side surface of the basal portion of the bump is fusion-adhered to an inner wall surface of the through-hole.
- a distal portion of the bump is projected from a second main surface of the insulative sheet so as to be press contacted with an electrode pad of a given electric part.
- a contact structure according to a third aspect of the present invention includes a lead formed by plating and a bump formed by electric casting by means of plating.
- the bump and the lead are formed of different metals, respectively.
- the lead is intimately contacted with and extended on a surface of an insulative sheet, and the bump is connected, by plating, to a surface of the lead.
- the bump has a recess formed in the plate-connecting surface and the lead has a protrusion portion connected, by plating, along an inner wall surface of the recess.
- a part of the lead connected, by plating, to the bump is embedded in the insulative sheet.
- FIGS. 1 (A) to 1 (F) are sectional views showing the manufacturing processes of a contact structure according to a first embodiment of the present invention
- FIGS. 1 (A) to 1 (F) are sectional views showing the manufacturing processes of a contact structure according to a second embodiment of the present invention.
- FIG. 3 is a perspective view of a bump obtained by the above various manufacturing processes and by the manufacturing processes to be described below;
- FIGS. 4 (A) to 4 (D) are sectional views showing the manufacturing processes of a contact structure according to a third embodiment of the present invention.
- FIGS. 5 (A) to 4 (E) are sectional views showing the manufacturing processes of a contact structure according to a fourth embodiment of the present invention.
- a first embodiment of the present invention will now be described with reference to FIGS. 1 and 3.
- a contact structure according to the first embodiment is manufactured in the following manners.
- a bump forming plate 1 formed of a stainless steel or the like has a plurality of bump forming recesses 2 which are open at a surface of the plate 1 .
- the overall area of the bump forming plate 1 only excluding the area where the bump forming recesses 2 are formed is covered with a resist layer 3 . Then, bump forming holes 4 are formed in the resist layer 3 such that the holes 4 correspond to the recesses 2 , individually.
- each bump forming recess 2 and bump forming hole 4 so that the interior of each recess 2 and hole 4 is filled with a plating-grown metal as represented by a nickel or nickel alloy. That is to say, the bump 5 is formed in each recess 2 and hole 4 by electric casting.
- a conical or spherical press contact portion 6 is formed on a distal end portion of this bump 5 within the bump forming recess 2
- a flange 7 is formed on a basal portion of the bump 5 within the bump forming hole 4 .
- the flange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of the bump 5 , with a dent 9 .
- a conductive a holeless insulative sheet 8 is superimposed upon the surface of the bump forming plate 1 and flatly thermally pressed.
- a liquid crystal polymer sheet 1 is used as a preferred material of this insulative sheet 8 .
- the insulative sheet 8 is plasticized by this thermal press.
- the basal end portion of the bump 5 is forcibly pierced into the plasticized insulative sheet 8 while pushing aside the material of the sheet 8 and extended all the way through the thickness of the sheet 8 so as to be exposed at the surface of the insulative sheet 8 opposite to the superimposing surface.
- the above liquid crystal polymer is small in expansion/contraction against heat and small in viscosity at the time of thermal softening. Accordingly the polymer readily allows the piercing of the bump 5 and the sound fusion adhesion can be achieved therebetween.
- the bump 5 formed by the plating-growth has the dent 9 formed in its basal end face. As shown in FIG. 1(D), a conductive paste 10 is charged into this dent 9 such that the paste 10 is bulged from an open surface of the dent 9 .
- the charging of the conductive paste 10 is performed by printing or through a nozzle.
- a conductive foil 11 preferably made of a copper or copper alloy is thermally press adhered to the surface of the insulative sheet 8 in a laminated state, and the foil 11 and the bump 5 are adhered together through the conductive pate 10 .
- the conductive foil 11 and the insulative sheet 8 are thermally press adhered together by thermally melting the surface of the sheet 8 .
- the conductive foil 11 is subjected to etching treatment so that a plurality of leads 12 formed of a copper or copper alloy are formed.
- the leads 12 are then peeled off the bump forming plate 1 .
- the leads 12 may be formed by etching the foil 11 .
- the insulative sheet 8 may be laminated on the surface of the bump forming plate 1 through a peeling material in FIGS. 1 (B) and 1 (C).
- the contact structure manufactured through the processes of FIGS. 1 (A) to 1 (F) includes the lead 12 formed by etching the conductive foil 11 and the bump 5 formed by electric casting by means of plating.
- the bump 5 and the lead 12 are formed of different metals.
- the lead 12 is formed of a copper or copper alloy and the bump 5 is formed of a nickel or nickel alloy.
- the bump 5 is connected to the surface of the lead 12 through the conductive connecting material 10 .
- the lead 12 is intimately contacted at the surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8 .
- a basal portion of the bump 5 is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 is fusion-adhered to an inner wall surface of the through-hole 17 and a bottom surface of the basal portion of the bump 5 is exposed from the surface of the insulative sheet 8 .
- a distal end of the bump 5 is projected from a second main surface 16 of the insulative sheet 8 so as to form a press contact portion 6 .
- This press contact portion 6 is subjected to press contact with an electrode pad of a given electric part.
- a second embodiment of the present invention will now be described with reference to FIGS. 2 and 3.
- a contact structure according to the second embodiment is manufactured in the following manners.
- a lead 12 formed of a copper or copper alloy is formed on a surface of an insulative sheet 8 of FIG. 2(C) by plating as shown in FIGS. 2 (D) and 2 (E).
- an underground plating layer 13 is formed on the surface of the insulative sheet 8 of FIG. 2(C) in an intimately contacted and laminated state by vapor deposition, sputtering or chemical plating.
- a resist layer 14 having a lead pattern forming groove is formed on a surface of the underground plating layer 13 , the underground plating layer 13 is exposed within the lead pattern forming groove, and the lead 12 is plate-grown on the underground plating layer 13 within the groove. That is to say, the lead 12 is formed by electric casting by means of plating. By this, the lead 12 is plate-connected to the bump 5 .
- the bump 5 formed of a nickel or nickel alloy which is formed by the plating growth is provided at a basal end face thereof, i.e., the plate-connecting surface with a dent 9 , while the lead 12 includes a protrusion 18 plate-connected along an inner wall surface of the dent 9 .
- the bump 5 and the lead 12 are plate-connected with each other at an interface of a region including the protrusion 18 and at an interface of a region including the flange 7 , respectively.
- the connection area and connection strength are increased and electrical reliability is ensured.
- a conical or spherical press contact portion 6 is formed on a distal end portion of the bump 5 of FIG. 3 within the bump forming recess 2
- a flange 7 is formed on a basal end portion of the bump 5 within the bump forming hole 4 .
- the flange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of the bump 5 , with a dent 9 .
- the contact structure manufactured through the processes of FIGS. 2 (A) to 1 (F) includes the lead 12 formed by plating and the bump 5 formed by electric casting by means of plating.
- the bump 5 and the lead 12 are formed of different metals.
- the lead 12 is formed of a copper or copper alloy and the bump 5 is formed of a nickel or nickel alloy.
- the bump 5 is plate-connected to the surface of the lead 12 .
- the lead 12 is intimately contacted at the surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8 .
- a basal portion of the bump 5 is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 is fusion-adhered to an inner wall surface of the through-hole 17 and a bottom surface of the basal portion of the bump 5 is exposed from the surface of the insulative sheet 8 .
- a distal end of the bump 5 is projected from a second main surface 16 of the insulative sheet 8 so as to form a press contact portion 6 .
- This press contact portion 6 is subjected to press contact with an electrode pad of a given electric part.
- a third embodiment of the present invention will now be described with reference to FIGS. 4 and 3.
- a contact structure according to the third embodiment is manufactured in the following manners.
- a bump forming plate 1 formed of a stainless steel or the like has a plurality of bump forming recesses 2 which are open at a surface of the plate 1 .
- the overall area of the bump forming plate 1 only excluding the area where the bump forming recesses 2 are formed is covered with a resist layer 3 . Then, bump forming holes 4 are formed in the resist layer 3 such that the holes 4 correspond to the recesses 2 , individually.
- each bump forming recess 2 and bump forming hole 4 so that the interior of each recess 2 and hole 4 is filled with a plating-grown metal as represented by a nickel or nickel alloy. That is to say, the bump 5 is formed in each recess 2 and hole 4 by electric casting.
- a conical or spherical press contact portion 6 is formed on a distal end portion of this bump 5 within the bump forming recess 2
- a flange 7 is formed on a basal portion of the bump 5 within the bump forming hole 4 .
- the flange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of the bump 5 , with a dent 9 .
- a conductive plating layer 11 ′ formed of a copper or copper alloy is laminated on the surface of the bump forming plate 1 by plating.
- the conductive plating layer 11 ′ includes a protrusion 18 plate-connected along an inner wall surface of the dent 9 .
- an insulative sheet 8 is laminated on the surface of the conductive plating layer 11 ′ by thermal press adhesion.
- the laminated member formed in FIG. 3(C) is peeled off the bump forming plate 1 and the conductive plating layer 11 ′ is subjected to etching treatment. By doing so, a plurality of leads 12 formed of a copper or copper alloy are formed.
- the contact structure manufactured through the processes of FIGS. 4 (A) to 4 (D) includes the lead 12 formed by plating and the bump 5 formed by electric casting by means of plating.
- the bump 5 and the lead 12 are formed of different metals.
- the lead 12 is formed of a copper or copper alloy and the bump 5 is formed of a nickel or nickel alloy.
- the lead 12 is intimately contacted with and extended along the surface of the insulative sheet 8 , and the bump 5 is plate-connected to the surface of the lead 12 .
- the bump 5 has a dent 9 formed in the plate-connecting surface, and the lead 12 has a protrusion 18 plate-connected along an inner wall surface of the dent 9 .
- the bump 5 and the lead 12 are plate-connected with each other at an interface of a region including the protrusion 18 and at an interface of a region including the flange 7 , respectively.
- the connection area and connection strength are increased and electrical reliability is ensured.
- a part of the lead 12 connected, by plating, to the bump 5 is embedded in the insulative sheet 8 .
- a fourth embodiment of the present invention will now be described with reference to FIGS. 5 and 3.
- a contact structure according to the fourth embodiment is manufactured in the following manners.
- a bump forming plate 1 formed of a stainless steel or the like has a plurality of bump forming recesses 2 which are open at a surface of the plate 1 .
- the overall area of the bump forming plate 1 only excluding the area where the bump forming recesses 2 are formed is covered with a resist layer 3 . Then, bump forming holes 4 are formed in the resist layer 3 such that the holes 4 correspond to the recesses 2 , individually.
- each bump forming recess 2 and bump forming hole 4 so that the interior of each recess 2 and hole 4 is filled with a plating-grown metal as represented by a nickel or nickel alloy. That is to say, the bump 5 is formed in each recess 2 and hole 4 by electric casting.
- a conical or spherical press contact portion 6 is formed on a distal end portion of this bump 5 within the bump forming recess 2
- a flange 7 is formed on a basal portion of the bump 5 within the bump forming hole 4 .
- the flange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of the bump 5 , with a dent 9 .
- a photo sensitive resin layer 8 ′ as represented by photo sensitive polyimide is laminated on the surface of the bump forming plate 1 .
- the photo sensitive layer 8 ′ is subjected to exposure and a plating-grown hole 19 communicating with the dent 9 is formed in a part of the layer 8 ′ corresponding to the basal end face of the bump 5 .
- an insulative sheet having no photo sensitive property such as polyimide is laminated on the surface of the bump forming plate 1 and the plating grown hole 19 communicating with the dent 9 is formed in a part of the insulative sheet corresponding to the basal end face of the bump 5 by laser beam.
- the surface of the photo sensitive resin layer 8 ′ or insulative sheet 8 is subjected to plating treatment so that a conductive plating layer 11 ′ as represented by a copper or copper alloy is laminated thereon.
- the conductive layer 11 ′ is subjected to etching treatment so that the lead 12 formed of a copper or copper alloy is formed. Then, the laminated member is peeled off the bump forming plate 1 .
- the lead 12 may be formed directly by plating by through an additive method. Since this method is known, detailed description thereof is omitted.
- the contact structure manufactured through the processes of FIGS. 5 (A) to 5 (E) includes the lead 12 formed by plating and the bump 5 formed by electric casting by means of plating.
- the bump 5 and the lead 12 are formed of different metals.
- the lead 12 is formed of a copper or copper alloy and the bump 5 is formed of a nickel or nickel alloy.
- the lead 12 is intimately contacted with and extended along the surface of the insulative sheet 8 , and the bump 5 is plate-connected to the surface of the lead 12 .
- a conical or spherical press contact portion 6 is formed on a distal end portion of this bump 5 within the bump forming recess 2
- a flange 7 is formed on a basal portion of the bump 5 within the bump forming hole 4 .
- the flange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of the bump 5 , with a dent 9 .
- the bump 5 has a dent 9 formed in the plate-connecting surface
- the lead 12 has a protrusion 18 plate-connected along an inner wall surface of the dent 9 .
- the bump 5 and the lead 12 are plate-connected with each other at an interface of a region including the protrusion 18 and at an interface of a region including the flange 7 , respectively.
- the connection area and connection strength are increased and electrical reliability is ensured.
- the protrusion 18 plate-connected to the bump 5 is embedded in the insulative sheet 8 formed of the photo sensitive resin layer 8 ′.
- a contact structure of a lead in which a contact structure having a lead and a bump formed of proper metals, respectively can easily be formed and a bump and a lead are soundly connected together in terms of electricity and strength.
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- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
- This invention relates to a contact structure in which a bump is annexed to a lead extending on an insulative sheet.
- U.S. Pat. No. 5,354,205 discloses a probe pad in which a lead and a bump are formed of a single metal by plating growth and the bump is press contacted with an electrode pad of a circuit element to be tested.
- The metal of which the bump is formed is required to have durability enough to withstand repeated contact and hardness enough to break an oxide film on a surface of the electrode pad. As such metal, nickel or nickel alloy is normally used.
- On the other hand, the metal of which the lead is formed is required to have excellent conductivity and comparatively flexible property. As such metal, copper or copper alloy is normally used.
- In the above-mentioned U.S. Pat. No. 354,205, the bump and the lead are formed of a same metal. This involves such a problem that if copper or copper alloy good for the lead is selected, it cannot satisfy the requirement for the bump and if, on the contrary, nickel or nickel alloy good for the bump is selected, crack is liable to occur when the lead is bent.
- It is, therefore, an object of the present invention to provide a contact structure of a lead which is capable of solving the above problem amicably.
- Another object of the present invention is to provide a contact structure of a lead in which a bump and a lead are soundly connected together in terms of electricity and strength.
- A contact structure according to a first aspect of the present invention includes a lead formed by etching a conductive foil and a bump formed by electric casting by means of plating. The bump and the lead are formed of different metals, respectively.
- The bump is connected to a surface of the lead through a conductive connecting material. The lead is intimately contacted at a surface, on which the bump is disposed, with a first main surface of a holeless insulative sheet.
- A basal portion of the bump is forcibly pierced into and extended all the way through a material of the holeless insulative sheet and a side surface of the basal portion of the bump is fusion-adhered to an inner wall surface of the through-hole. A distal portion of the bump is projected from a second main surface of the insulative sheet so as to be subjected to press contact with an electrode pad of a given electric part.
- A contact structure according to a second aspect of the present invention includes a lead formed by plating and a bump formed by electric casting by means of plating. The bump and the lead are formed of different metals, respectively.
- The bump is connected, by plating, to a surface of the lead. The lead is intimately contacted at a surface, on which the bump is disposed, with a first main surface of a holeless insulative sheet.
- A basal portion of the bump is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet and a side surface of the basal portion of the bump is fusion-adhered to an inner wall surface of the through-hole. A distal portion of the bump is projected from a second main surface of the insulative sheet so as to be press contacted with an electrode pad of a given electric part.
- A contact structure according to a third aspect of the present invention includes a lead formed by plating and a bump formed by electric casting by means of plating. The bump and the lead are formed of different metals, respectively.
- The lead is intimately contacted with and extended on a surface of an insulative sheet, and the bump is connected, by plating, to a surface of the lead.
- The bump has a recess formed in the plate-connecting surface and the lead has a protrusion portion connected, by plating, along an inner wall surface of the recess.
- A part of the lead connected, by plating, to the bump is embedded in the insulative sheet.
- FIGS.1(A) to 1(F) are sectional views showing the manufacturing processes of a contact structure according to a first embodiment of the present invention;
- FIGS.1(A) to 1(F) are sectional views showing the manufacturing processes of a contact structure according to a second embodiment of the present invention;
- FIG. 3 is a perspective view of a bump obtained by the above various manufacturing processes and by the manufacturing processes to be described below;
- FIGS.4(A) to 4(D) are sectional views showing the manufacturing processes of a contact structure according to a third embodiment of the present invention; and
- FIGS.5(A) to 4(E) are sectional views showing the manufacturing processes of a contact structure according to a fourth embodiment of the present invention.
- A first embodiment of the present invention will now be described with reference to FIGS. 1 and 3. A contact structure according to the first embodiment is manufactured in the following manners.
- As shown in FIG. 1(A), a
bump forming plate 1 formed of a stainless steel or the like has a plurality ofbump forming recesses 2 which are open at a surface of theplate 1. - The overall area of the
bump forming plate 1 only excluding the area where thebump forming recesses 2 are formed is covered with aresist layer 3. Then,bump forming holes 4 are formed in theresist layer 3 such that theholes 4 correspond to therecesses 2, individually. - Subsequently, plating growth is encouraged in each
bump forming recess 2 andbump forming hole 4 so that the interior of eachrecess 2 andhole 4 is filled with a plating-grown metal as represented by a nickel or nickel alloy. That is to say, thebump 5 is formed in eachrecess 2 andhole 4 by electric casting. - As shown in FIG. 3, a conical or spherical
press contact portion 6 is formed on a distal end portion of thisbump 5 within thebump forming recess 2, and aflange 7 is formed on a basal portion of thebump 5 within thebump forming hole 4. Theflange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of thebump 5, with adent 9. - As shown in FIG. 4(B), after the
resist layer 3 is removed, a conductive a holelessinsulative sheet 8 is superimposed upon the surface of thebump forming plate 1 and flatly thermally pressed. As a preferred material of thisinsulative sheet 8, a liquidcrystal polymer sheet 1 is used. - The
insulative sheet 8 is plasticized by this thermal press. The basal end portion of thebump 5 is forcibly pierced into the plasticizedinsulative sheet 8 while pushing aside the material of thesheet 8 and extended all the way through the thickness of thesheet 8 so as to be exposed at the surface of theinsulative sheet 8 opposite to the superimposing surface. - The above liquid crystal polymer is small in expansion/contraction against heat and small in viscosity at the time of thermal softening. Accordingly the polymer readily allows the piercing of the
bump 5 and the sound fusion adhesion can be achieved therebetween. - The
bump 5 formed by the plating-growth has thedent 9 formed in its basal end face. As shown in FIG. 1(D), aconductive paste 10 is charged into thisdent 9 such that thepaste 10 is bulged from an open surface of thedent 9. The charging of theconductive paste 10 is performed by printing or through a nozzle. - Then, as shown in FIG. 1(E), a
conductive foil 11 preferably made of a copper or copper alloy is thermally press adhered to the surface of theinsulative sheet 8 in a laminated state, and thefoil 11 and thebump 5 are adhered together through theconductive pate 10. Theconductive foil 11 and theinsulative sheet 8 are thermally press adhered together by thermally melting the surface of thesheet 8. - Subsequently, as shown in FIG. 1(F), the
conductive foil 11 is subjected to etching treatment so that a plurality ofleads 12 formed of a copper or copper alloy are formed. Theleads 12 are then peeled off thebump forming plate 1. In the alternative, only after theconductive foil 11 is peeled off without being subjected to etching treatment, theleads 12 may be formed by etching thefoil 11. In order to facilitate easy peel-off, theinsulative sheet 8 may be laminated on the surface of thebump forming plate 1 through a peeling material in FIGS. 1(B) and 1(C). - The contact structure manufactured through the processes of FIGS.1(A) to 1(F) includes the
lead 12 formed by etching theconductive foil 11 and thebump 5 formed by electric casting by means of plating. Thebump 5 and thelead 12 are formed of different metals. - As one preferred example, the
lead 12 is formed of a copper or copper alloy and thebump 5 is formed of a nickel or nickel alloy. - The
bump 5 is connected to the surface of thelead 12 through the conductive connectingmaterial 10. Thelead 12 is intimately contacted at the surface, on which thebump 5 is disposed, with a firstmain surface 15 of aholeless insulative sheet 8. - A basal portion of the
bump 5 is forcibly pierced into and extended all the way through the thickness of a material of theholeless insulative sheet 8 and a side surface of the basal portion of thebump 5 is fusion-adhered to an inner wall surface of the through-hole 17 and a bottom surface of the basal portion of thebump 5 is exposed from the surface of theinsulative sheet 8. A distal end of thebump 5 is projected from a secondmain surface 16 of theinsulative sheet 8 so as to form apress contact portion 6. Thispress contact portion 6 is subjected to press contact with an electrode pad of a given electric part. - A second embodiment of the present invention will now be described with reference to FIGS. 2 and 3. A contact structure according to the second embodiment is manufactured in the following manners.
- After the processes of FIGS.2(A) to 2(C) are carried out as in FIGS. 1(A) to 1(C), a lead 12 formed of a copper or copper alloy is formed on a surface of an
insulative sheet 8 of FIG. 2(C) by plating as shown in FIGS. 2(D) and 2(E). - More specifically, as shown in FIG. 2(D), an
underground plating layer 13 is formed on the surface of theinsulative sheet 8 of FIG. 2(C) in an intimately contacted and laminated state by vapor deposition, sputtering or chemical plating. Then, as shown in FIG. 2(E), a resist layer 14 having a lead pattern forming groove is formed on a surface of theunderground plating layer 13, theunderground plating layer 13 is exposed within the lead pattern forming groove, and thelead 12 is plate-grown on theunderground plating layer 13 within the groove. That is to say, thelead 12 is formed by electric casting by means of plating. By this, thelead 12 is plate-connected to thebump 5. - After the resist layer14 is removed, an unnecessary part of the
underground plating layer 13 is removed by etching. Then, the remainingunderground plating layer 13 is peeled off thebump forming plate 1. By doing so, a contact structure of thelead 12 of FIG. 2(F) is obtained. - As shown in FIGS.2(A), 2(B) and 2(C), the
bump 5 formed of a nickel or nickel alloy which is formed by the plating growth is provided at a basal end face thereof, i.e., the plate-connecting surface with adent 9, while thelead 12 includes aprotrusion 18 plate-connected along an inner wall surface of thedent 9. - Accordingly, the
bump 5 and thelead 12 are plate-connected with each other at an interface of a region including theprotrusion 18 and at an interface of a region including theflange 7, respectively. By this, the connection area and connection strength are increased and electrical reliability is ensured. - As previously mentioned, a conical or spherical
press contact portion 6 is formed on a distal end portion of thebump 5 of FIG. 3 within thebump forming recess 2, and aflange 7 is formed on a basal end portion of thebump 5 within thebump forming hole 4. Theflange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of thebump 5, with adent 9. - The contact structure manufactured through the processes of FIGS.2(A) to 1(F) includes the
lead 12 formed by plating and thebump 5 formed by electric casting by means of plating. Thebump 5 and thelead 12 are formed of different metals. - As one preferred example, the
lead 12 is formed of a copper or copper alloy and thebump 5 is formed of a nickel or nickel alloy. - The
bump 5 is plate-connected to the surface of thelead 12. Thelead 12 is intimately contacted at the surface, on which thebump 5 is disposed, with a firstmain surface 15 of aholeless insulative sheet 8. - A basal portion of the
bump 5 is forcibly pierced into and extended all the way through the thickness of a material of theholeless insulative sheet 8 and a side surface of the basal portion of thebump 5 is fusion-adhered to an inner wall surface of the through-hole 17 and a bottom surface of the basal portion of thebump 5 is exposed from the surface of theinsulative sheet 8. A distal end of thebump 5 is projected from a secondmain surface 16 of theinsulative sheet 8 so as to form apress contact portion 6. Thispress contact portion 6 is subjected to press contact with an electrode pad of a given electric part. - A third embodiment of the present invention will now be described with reference to FIGS. 4 and 3. A contact structure according to the third embodiment is manufactured in the following manners.
- As shown in FIG. 4(A), a
bump forming plate 1 formed of a stainless steel or the like has a plurality ofbump forming recesses 2 which are open at a surface of theplate 1. - The overall area of the
bump forming plate 1 only excluding the area where thebump forming recesses 2 are formed is covered with a resistlayer 3. Then,bump forming holes 4 are formed in the resistlayer 3 such that theholes 4 correspond to therecesses 2, individually. - Subsequently, plating growth is encouraged in each
bump forming recess 2 and bump forminghole 4 so that the interior of eachrecess 2 andhole 4 is filled with a plating-grown metal as represented by a nickel or nickel alloy. That is to say, thebump 5 is formed in eachrecess 2 andhole 4 by electric casting. - As shown in FIG. 3, a conical or spherical
press contact portion 6 is formed on a distal end portion of thisbump 5 within thebump forming recess 2, and aflange 7 is formed on a basal portion of thebump 5 within thebump forming hole 4. Theflange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of thebump 5, with adent 9. - As shown in FIG. 4(B), after the resist
layer 3 is removed, aconductive plating layer 11′ formed of a copper or copper alloy is laminated on the surface of thebump forming plate 1 by plating. - The
conductive plating layer 11′ includes aprotrusion 18 plate-connected along an inner wall surface of thedent 9. - Then, as shown in FIG. 4(C), an
insulative sheet 8 is laminated on the surface of theconductive plating layer 11′ by thermal press adhesion. - Then, as shown in FIG. 4(D), the laminated member formed in FIG. 3(C) is peeled off the
bump forming plate 1 and theconductive plating layer 11′ is subjected to etching treatment. By doing so, a plurality ofleads 12 formed of a copper or copper alloy are formed. - The contact structure manufactured through the processes of FIGS.4(A) to 4(D) includes the
lead 12 formed by plating and thebump 5 formed by electric casting by means of plating. Thebump 5 and thelead 12 are formed of different metals. - As one preferred example, the
lead 12 is formed of a copper or copper alloy and thebump 5 is formed of a nickel or nickel alloy. - The
lead 12 is intimately contacted with and extended along the surface of theinsulative sheet 8, and thebump 5 is plate-connected to the surface of thelead 12. - The
bump 5 has adent 9 formed in the plate-connecting surface, and thelead 12 has aprotrusion 18 plate-connected along an inner wall surface of thedent 9. - Accordingly, the
bump 5 and thelead 12 are plate-connected with each other at an interface of a region including theprotrusion 18 and at an interface of a region including theflange 7, respectively. By this, the connection area and connection strength are increased and electrical reliability is ensured. - A part of the
lead 12 connected, by plating, to thebump 5 is embedded in theinsulative sheet 8. - A fourth embodiment of the present invention will now be described with reference to FIGS. 5 and 3. A contact structure according to the fourth embodiment is manufactured in the following manners.
- As shown in FIG. 5(A), a
bump forming plate 1 formed of a stainless steel or the like has a plurality ofbump forming recesses 2 which are open at a surface of theplate 1. - The overall area of the
bump forming plate 1 only excluding the area where thebump forming recesses 2 are formed is covered with a resistlayer 3. Then,bump forming holes 4 are formed in the resistlayer 3 such that theholes 4 correspond to therecesses 2, individually. - Subsequently, plating growth is encouraged in each
bump forming recess 2 and bump forminghole 4 so that the interior of eachrecess 2 andhole 4 is filled with a plating-grown metal as represented by a nickel or nickel alloy. That is to say, thebump 5 is formed in eachrecess 2 andhole 4 by electric casting. - As shown in FIG. 3, a conical or spherical
press contact portion 6 is formed on a distal end portion of thisbump 5 within thebump forming recess 2, and aflange 7 is formed on a basal portion of thebump 5 within thebump forming hole 4. Theflange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of thebump 5, with adent 9. - As shown in FIG. 5(B), after the resist
layer 3 is removed, a photosensitive resin layer 8′ as represented by photo sensitive polyimide is laminated on the surface of thebump forming plate 1. - As shown in FIG. 5(C), the photo
sensitive layer 8′ is subjected to exposure and a plating-grownhole 19 communicating with thedent 9 is formed in a part of thelayer 8′ corresponding to the basal end face of thebump 5. - It is also accepted that instead of the photo
sensitive resin layer 8′, an insulative sheet having no photo sensitive property such as polyimide is laminated on the surface of thebump forming plate 1 and the plating grownhole 19 communicating with thedent 9 is formed in a part of the insulative sheet corresponding to the basal end face of thebump 5 by laser beam. - Then, as shown in FIG. 5(D), the surface of the photo
sensitive resin layer 8′ orinsulative sheet 8 is subjected to plating treatment so that aconductive plating layer 11′ as represented by a copper or copper alloy is laminated thereon. - Subsequently, as shown in FIG. 5(E), the
conductive layer 11′ is subjected to etching treatment so that thelead 12 formed of a copper or copper alloy is formed. Then, the laminated member is peeled off thebump forming plate 1. - As one method for forming the
lead 12, thelead 12 may be formed directly by plating by through an additive method. Since this method is known, detailed description thereof is omitted. - The contact structure manufactured through the processes of FIGS.5(A) to 5(E) includes the
lead 12 formed by plating and thebump 5 formed by electric casting by means of plating. Thebump 5 and thelead 12 are formed of different metals. - As one preferred example, the
lead 12 is formed of a copper or copper alloy and thebump 5 is formed of a nickel or nickel alloy. - The
lead 12 is intimately contacted with and extended along the surface of theinsulative sheet 8, and thebump 5 is plate-connected to the surface of thelead 12. - As shown in FIG. 3, a conical or spherical
press contact portion 6 is formed on a distal end portion of thisbump 5 within thebump forming recess 2, and aflange 7 is formed on a basal portion of thebump 5 within thebump forming hole 4. Theflange 7 is provided at a central area thereof, i.e., a central area of a bottom surface of thebump 5, with adent 9. - That is to say, the
bump 5 has adent 9 formed in the plate-connecting surface, and thelead 12 has aprotrusion 18 plate-connected along an inner wall surface of thedent 9. - Accordingly, the
bump 5 and thelead 12 are plate-connected with each other at an interface of a region including theprotrusion 18 and at an interface of a region including theflange 7, respectively. By this, the connection area and connection strength are increased and electrical reliability is ensured. - The
protrusion 18 plate-connected to thebump 5 is embedded in theinsulative sheet 8 formed of the photosensitive resin layer 8′. - According to the present invention, there can be provided a contact structure of a lead in which a contact structure having a lead and a bump formed of proper metals, respectively can easily be formed and a bump and a lead are soundly connected together in terms of electricity and strength.
- Obviously, many modifications and variations of the present invention are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described.
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-278313 | 2000-09-13 | ||
JP2000278313A JP2002090388A (en) | 2000-09-13 | 2000-09-13 | Contact structure for lead |
Publications (2)
Publication Number | Publication Date |
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US20020031921A1 true US20020031921A1 (en) | 2002-03-14 |
US6398561B1 US6398561B1 (en) | 2002-06-04 |
Family
ID=18763496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/902,262 Expired - Fee Related US6398561B1 (en) | 2000-09-13 | 2001-07-11 | Contact structure of lead |
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US (1) | US6398561B1 (en) |
JP (1) | JP2002090388A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007098290A2 (en) * | 2006-02-27 | 2007-08-30 | Sv Probe Pte Ltd. | Approach for fabricating probe elements for probe card assemblies using a reusable substrate |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100477258B1 (en) * | 2002-03-29 | 2005-03-17 | 삼성전기주식회사 | Method for creating bump and making printed circuit board using the said bump |
KR100761706B1 (en) * | 2006-09-06 | 2007-09-28 | 삼성전기주식회사 | Fabrication method for printed circuit board |
US10750614B2 (en) * | 2017-06-12 | 2020-08-18 | Invensas Corporation | Deformable electrical contacts with conformable target pads |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2643754B1 (en) | 1989-02-28 | 1993-09-17 | Thomson Brandt Armements | PROCESS FOR MAKING A FLAT CONNECTION |
JPH07105420B2 (en) | 1991-08-26 | 1995-11-13 | ヒューズ・エアクラフト・カンパニー | Electrical connection with molded contacts |
JP2867209B2 (en) * | 1993-08-27 | 1999-03-08 | 日東電工株式会社 | Method of connecting flexible circuit board to contact object and structure thereof |
US6230402B1 (en) * | 1999-02-17 | 2001-05-15 | Scitex Digital Printing, Inc. | Electrical contact termination for a flexible circuit |
-
2000
- 2000-09-13 JP JP2000278313A patent/JP2002090388A/en active Pending
-
2001
- 2001-07-11 US US09/902,262 patent/US6398561B1/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007098290A2 (en) * | 2006-02-27 | 2007-08-30 | Sv Probe Pte Ltd. | Approach for fabricating probe elements for probe card assemblies using a reusable substrate |
US20070222466A1 (en) * | 2006-02-27 | 2007-09-27 | Keith Heinemann | Approach for fabricating probe elements for probe card assemblies using a reusable substrate |
WO2007098290A3 (en) * | 2006-02-27 | 2007-11-01 | Sv Probe Pte Ltd | Approach for fabricating probe elements for probe card assemblies using a reusable substrate |
US7637009B2 (en) * | 2006-02-27 | 2009-12-29 | Sv Probe Pte. Ltd. | Approach for fabricating probe elements for probe card assemblies using a reusable substrate |
Also Published As
Publication number | Publication date |
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JP2002090388A (en) | 2002-03-27 |
US6398561B1 (en) | 2002-06-04 |
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