CN219900582U - Tin dragging piece, furnace passing jig and wave soldering equipment - Google Patents

Abstract

The utility model relates to the technical field of welding and discloses a tin dragging piece, a furnace passing jig and wave soldering equipment. The furnace passing jig is provided with a tin receiving surface, and the tin dragging piece comprises a tin dipping part, a tin isolation part and a first tin dipping prevention layer; the tin separating part and the tin dipping part are arranged in a lamination way, and the tin separating part is used for being connected with a tin receiving surface of the furnace passing jig; the first tin-dipping prevention layer is arranged on the tin-separating part and used for preventing the tin-separating part from being adhered with the soldering tin. The tin dragging piece provided by the utility model has lower risk of being adhered with soldering tin when being applied to a furnace passing jig.

Description

Tin dragging piece, furnace passing jig and wave soldering equipment

Technical Field

The utility model relates to the technical field of welding, in particular to a tin dragging part, a furnace passing jig and wave soldering equipment.

Background

The wave soldering equipment adopts wave soldering technology to directly contact welding points such as welding pads, pins of plug-in components and the like with high-temperature tin liquid in a soldering furnace, so that the purpose of soldering is achieved. Specifically, the high-temperature molten tin in the welding furnace is kept to be an inclined plane, and is processed and kept to be in a wave shape by a special pump driving device. In the process that the circuit board to be welded passes through the solder pot and is tin-plated, the circuit board is carried and conveyed forward by the solder pot jig, when the solder pot jig passes through high-temperature tin liquid, the top end (namely wave crest) of the liquid surface of the wave-shaped tin liquid contacts with the welding spot on the circuit board through the welding hole (namely the hollowed-out part) on the solder pot jig to realize welding, so the welding process is called wave soldering.

The circuit board to be soldered may have a plurality of different structural configurations due to the differences in the distribution of the actual circuit elements. In order to reduce the volume of the circuit board and meet the actual use requirement, a plurality of intensive welding spots are often distributed on the circuit board, and the distance between adjacent welding spots in the intensive welding spots is shorter, so that when the intensive welding spots are connected and welded by the wave soldering process, the adjacent welding spots are easy to be short-circuited due to the adhesion of tin liquid, and poor tin connection occurs.

In the related art, a material capable of wetting and adhering with solder is used to make a tin drawing member, the tin drawing member is generally in a sheet-like or block-like structure, and the tin drawing member is disposed on the bottom surface of the furnace passing jig. Because the tin dragging piece can be wetted with soldering tin and is adhered, when the tin dragging piece is arranged on the periphery of a welding hole of the furnace passing jig, the tin dragging piece can adhere and remove redundant soldering tin on the periphery of the welding hole in the furnace passing process, the risk of short circuit of adjacent soldering points due to tin liquid adhesion is reduced, but a tin dragging piece is generally close to the welding hole, the soldering tin adhered on the tin dragging piece can be adhered with the soldering point on a circuit board, and the circuit board can not be separated from the furnace passing jig after the furnace passing, so that the circuit board is scrapped.

Disclosure of Invention

The utility model mainly aims to provide a tin dragging piece, which aims to reduce the risk of adhesion of the tin dragging piece and a circuit board.

In order to achieve the above object, the present utility model provides a tin drawing member applied to a furnace passing jig, the furnace passing jig having a tin receiving surface, the tin drawing member comprising:

a tin dipping part;

the tin isolation part is arranged in a lamination way with the tin dipping part and is used for being connected with the tin receiving surface of the furnace passing jig; and

the first tin-dipping prevention layer is arranged on the tin separation part to prevent the tin separation part from being adhered with soldering tin.

In an embodiment of the utility model, the tin pick-up portion is made of tin plate;

and/or the material of the tin isolation part is metal;

and/or the material of the first tin-dipping prevention layer is metal nitride.

In an embodiment of the utility model, a thickness of the first tin pick-proof layer is greater than or equal to 1 μm and less than or equal to 50 μm.

In an embodiment of the utility model, the tin dipping portion is provided with a first through hole, the first through hole is used for realizing installation and fixation of the tin dipping portion, the tin separation portion is provided with a second through hole corresponding to the first through hole, and the tin dipping portion and the tin separation portion are riveted or screwed on the tin receiving surface of the furnace jig through the first through hole and the second through hole.

In order to achieve the above object, the present utility model further provides a furnace passing jig, which includes:

the carrier is provided with a tin receiving surface, and is provided with a first welding hole penetrating through the tin receiving surface; and

the tin separating part of the tin dragging piece is arranged on the tin receiving surface and is positioned at the periphery of the first welding hole; the tin dipping part of the tin dragging piece is positioned at one side of the tin isolation part, which is away from the tin receiving surface.

In an embodiment of the present utility model, a distance between the tin isolation portion and the first solder hole is greater than or equal to 1 mm and less than or equal to 1.5 mm.

In an embodiment of the utility model, the overload tool is further provided with a second welding hole penetrating through the tin-receiving surface, and the furnace passing tool further comprises a heat conduction patch;

the heat conduction patch is arranged on the tin receiving surface of the furnace passing jig and covers the second welding hole;

the heat conduction patch is provided with a first avoidance hole corresponding to the second welding hole, and the first avoidance hole is used for enabling soldering tin to enter the second welding hole.

In an embodiment of the utility model, the heat-conducting patch includes a heat-conducting substrate and a second tin pick-proof layer;

the heat conducting substrate is arranged on the tin receiving surface of the carrier, the heat conducting substrate is provided with the first avoidance holes, the second tin dipping prevention layer is arranged on the heat conducting substrate, and the second tin dipping prevention layer is provided with the second avoidance holes corresponding to the first avoidance holes.

In an embodiment of the present utility model, a thermal conductivity of the thermally conductive substrate is greater than or equal to 15W/(m.k);

and/or the melting point of the heat conducting matrix is greater than or equal to 500 ℃;

and/or the heat conducting matrix is made of metal;

and/or the material of the second tin-dipping prevention layer is metal nitride;

and/or the thickness of the second tin-dipping prevention layer is more than or equal to 1 mu m and less than or equal to 50 mu m.

In order to achieve the above purpose, the utility model also provides wave soldering equipment, which comprises the furnace passing jig.

According to the technical scheme, the tin dipping part and the tin separating part of the tin pulling piece are arranged in a stacked mode, and the first tin dipping preventing layer is arranged on the tin separating part, so that when the tin pulling piece is assembled on the furnace passing jig, the tin separating part of the tin pulling piece can be connected with the tin receiving surface of the boiler jig, the tin dipping part is arranged on one side of the tin separating part, which is opposite to the tin receiving surface of the furnace passing jig, and the tin separating part is prevented from being adhered to soldering tin by means of the first tin dipping preventing layer on the tin separating part, so that the risk of adhesion between the tin separating part and soldering spots on the furnace passing jig and the circuit board is reduced. In addition, the soldering tin around the welding spot of the circuit board can be adhered and removed through the adhesion of the tin adhering part to the soldering tin, so that the problem of poor connection of the soldering tin in the furnace passing process is effectively relieved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a furnace tool according to the present utility model;

FIG. 2A is a schematic view of a tin pick-up portion of the solder sheet of FIG. 1;

FIG. 2B is a schematic view of the tin-separating portion of the tin plate of FIG. 1;

FIG. 3A is a schematic cross-sectional view of the furnace tool of FIG. 1 in a first embodiment;

FIG. 3B is a schematic cross-sectional view of the furnace tool of FIG. 1 in a second embodiment;

FIG. 4 is a schematic diagram of the heat conductive patch of FIG. 1;

FIG. 5A is a schematic cross-sectional view of the furnace tool of FIG. 1 in a third embodiment;

fig. 5B is a schematic cross-sectional structure of the furnace tool in fig. 1 in a fourth embodiment.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				1	Boiler jig	121	Tin-receiving surface
11	Tin dragging piece	12a	First welding hole
				111	Tin dipping part	12b	Second welding hole
1111	Tin plating layer	13	Heat conduction patch
				111a	First through hole	131	Heat conducting matrix
112	Tin isolation part	13a	First avoidance hole
				112a	Second through hole	132	Second tin-dipping-preventing layer
113	First tin-dipping-preventing layer	2	Circuit board
				12	Carrier tool	21	Welding spot

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. The meaning of "and/or", "and/or" as used throughout is intended to include three side-by-side schemes, for example "a and/or B", including a scheme, or B scheme, or a scheme where a and B meet at the same time. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The embodiment of the utility model provides a tin drawing piece 11, which is applied to a furnace passing jig, wherein the furnace passing jig is provided with a tin receiving surface 121 facing the liquid level of tin liquid in a furnace passing process. As shown in fig. 1 to 3B, the tin drawing member 11 includes a tin dipping portion 111, a tin separating portion 112, and a first tin dipping preventing layer 113, wherein the tin separating portion 112 is laminated with the tin dipping portion 111, and the tin separating portion 112 is connected with a tin receiving surface 121 of the furnace passing jig; the first anti-sticking layer 113 is disposed on the solder separating portion 112 to prevent the solder separating portion 112 from adhering to solder.

In the present embodiment, the solder tail 11 can be integrally manufactured into a sheet-like or block-like structure, and the tin pick-up portion 111 of the solder tail 11 is used for sticking out solder around the solder joints 21 on the circuit board 2 to solve the poor solder connection problem between the solder joints 21. When the tin drawing member 11 is mounted on the tin receiving surface 121 of the furnace jig, the tin dipping portion 111 is located at one side of the tin separating portion 112 facing away from the tin receiving surface 121, and can be connected to the tin separating portion 112 by screwing, welding or the like, so that the tin separating portion 112 and the tin dipping portion 111 are stacked up and down. The tin-plated portion 111 may be made of tin (tin-plated iron), stainless steel, or the like; when tin-plated portion 111 is tin, the thickness of tin-plated layer 1111 is not less than 1 μm and not more than 30 μm, and the thickness of tin-plated layer 1111 is not less than 10 μm.

The tin isolation part 112 in the tin dragging piece 11 is used for being matched with the first tin dipping prevention layer 113 to isolate soldering tin (namely high-temperature tin liquid in a furnace passing procedure), the tin isolation part 112 can be made of a metal material with excellent heat conduction performance and high temperature resistance, and thus the tin isolation part 112 can efficiently conduct heat of the high-temperature tin liquid to the furnace passing jig and the welding spots 21 on the circuit board 2, and stable tin feeding temperature and welding quality on the welding spots 21 are ensured; the high temperature resistance of the tin isolation part 112 can also prevent the tin isolation part 112 from being molten and corroded by high temperature molten tin, so that the service life of the tin dragging piece 11 is prolonged; in addition, when the tin isolation part 112 is made of metal, the tin isolation part 112 is easy to manufacture and mold, and the processing of the tin isolation part 112 can be facilitated.

As shown in fig. 3A and 3B, the first tin-pick-proof layer 113 in the tin-drawing member 11 is disposed on the tin-separating portion 112, and covers the outer sidewall of the tin-separating portion 112 and the surface of the tin-separating portion 112 facing and/or facing away from the tin-pick-up portion 111, and the first tin-pick-proof layer 113 may be fabricated on the surface of the tin-separating portion 112 by a physical or chemical vapor deposition process, or may be plated and welded on the tin-separating portion 112. The first anti-tin-wetting layer 113 is made of a material which is not wet with solder, such as a solder-repellent material such as titanium alloy, so that the first anti-tin-wetting layer 113 is not easy to adhere to the solder when in contact with high-temperature soldering, the solder is prevented from adhering to the solder joint 21 on the circuit board 2 of the tin-wetting portion 111, and the risk that the solder joint 21 of the circuit board 2 is adhered to the tin-wetting portion 111 to prevent the circuit board 2 from being removed from the carrier 12 is reduced.

In this embodiment, the tin-dipping portion 111 and the tin-separating portion 112 of the tin-pulling member 11 are stacked, and the first tin-dipping preventing layer 113 is disposed on the tin-separating portion 112, so that when the tin-pulling member 11 is assembled on the passing jig, the tin-separating portion 112 of the tin-pulling member 11 can be connected with the tin-receiving surface 121 of the boiler jig 1, and the tin-dipping portion 111 is located at one side of the tin-separating portion 112 facing away from the tin-receiving surface 121 of the passing jig, and the tin-separating portion 112 is prevented from adhering to solder by means of the first tin-dipping preventing layer 113 on the tin-separating portion 112, so that the risk of adhering the tin-separating portion 112 to the passing jig and the solder joint 21 on the circuit board 2 is reduced. In addition, the solder around the solder joint 21 of the circuit board 2 can be adhered and removed by the adhesion of the tin adhering part 111, so that the poor tin connection problem in the furnace passing process can be effectively relieved.

In an embodiment of the utility model, as shown in fig. 3A, the tin pick-up portion 111 is made of tin; and/or, the material of the tin isolation part 112 is metal; and/or, the material of the first tin pick-proof layer 113 is metal nitride.

In this embodiment, when the material of the tin pick-up portion 111 is tin, the tin pick-up portion 111 is advantageous to enhance the soldering capability of the tin pick-up portion 111 by virtue of good wetting property of the tin pick-up portion and the tin, so that the tin pick-up portion 111 can efficiently and reliably pick up the excessive tin around the soldering points 21 when being located around the soldering points 21 of the circuit board 2, and the risk of shorting between the soldering points 21 due to soldering is reduced.

When the material of the tin isolation part 112 is metal, the tin isolation part has the characteristics of heat conduction and easy processing and forming, the tin isolation part 112 is conveniently manufactured into various shapes and various sizes, so that the tin isolation part 112 can be adapted to welding holes and welding spots 21 with different shapes, the tin isolation part 112 can be matched with the first tin dipping prevention layer 113 to achieve a more reliable tin isolation effect, the tin is prevented from being adhered to the tin dipping part 111 and the welding spots 21 on the circuit board 2 at the same time, and the purpose of improving the welding quality and reliability of the welding spots 21 of the circuit board 2 is achieved. Specifically, the material of the tin-isolation portion 112 may be stainless steel, copper, or the like.

When the material of the first tin-dipping prevention layer 113 is CrN, tin, alicn, alin, crNA l, tisin and other metal nitrides, the first tin-dipping prevention layer 113 has high thermal conductivity while resisting high-temperature soldering corrosion and being non-wetting with soldering tin, so that the first tin-dipping prevention layer 113 meets the requirements of tin isolation and heat transfer, and the welding quality of the wave soldering equipment adopting the tin-pulling piece 11 is improved. In addition, when the first tin-preventing layer 113 is a metal nitride layer, the tin-preventing layer can be deposited on the tin-separating portion 112 made of metal through a physical or chemical vapor deposition process, and the bonding force between the first tin-preventing layer made of metal nitride and the tin-separating portion 112 made of metal is better, so that the whole tin-separating portion 112 and the first tin-preventing layer 113 have high wear resistance, the service life of the tin-drawing piece 11 can be prolonged, and according to experimental test data, the tin-drawing piece provided by the embodiment can meet the use requirement of a furnace passing program for more than fifty thousand times, and the replacement period and cost of the tin-drawing piece are greatly reduced. In addition, the manufacturing cost of the tin-drawing member 11 can be greatly reduced by adopting vapor deposition to manufacture the first tin-pick-proof layer 113 of the metal nitride coating layer, compared with directly adopting a welding-resistant material such as titanium alloy to realize solder anti-sticking.

In an embodiment of the utility model, as shown in fig. 3A and 3B, the thickness of the first tin pick-proof layer 113 is greater than or equal to 1 μm and less than or equal to 50 μm.

In this embodiment, the thickness of the first tin-preventing layer 113 is controlled between 1 μm and 50 μm by physical or chemical vapor deposition, so that the first tin-preventing layer 113 is a coating structure on the tin-separating portion 112: on the one hand, the first tin-preventing layer 113 can be combined with the tin-separating part 112 with reliable binding force, so that the problem that the first tin-preventing layer 113 is cracked or peeled off to lose efficacy due to overlarge thermal stress between the first tin-preventing layer 113 and the separating part in the furnace passing process of the tin-drawing piece 11 can be effectively prevented, and the service life of the tin-drawing piece 11 is prolonged; on the other hand, the thickness of the first tin pick-up preventing layer 113 is thinner, the material cost of the first tin pick-up preventing layer 113 is lower, which is favorable for compressing the manufacturing cost of the tin drawing member 11 and improving the comprehensive cost-effective ratio of the tin drawing member 11.

In an embodiment of the utility model, as shown in fig. 2, fig. 3A, and fig. 3B, the tin pick-up portion 111 is provided with a first through hole 111a, and the first through hole 111a is used for implementing installation and fixation of the tin pick-up portion 111; the tin isolation part 112 is provided with a second through hole 112a corresponding to the first through hole 111a, and the tin pick-up part 111 and the tin isolation part 112 are riveted or screwed on the tin receiving surface of the furnace jig 1 through the first through hole 111a and the second through hole 112 a.

In the present embodiment, the tin pick-up portion 111 is detachably connected with the tin isolation portion 112, and the first through hole 111a on the tin pick-up portion 111 and the second through hole 112a on the tin isolation portion 112 can be assembled and fixed with the furnace jig applied by the tin dragging member 11 by riveting or screwing; for example, a screw passes through the first through hole 111a on the tin dipping portion 111 and the second through hole 112a on the tin isolation portion 112 at the same time and then is screwed with a screw hole on the furnace passing jig, and the installation and the disassembly of the tin dipping portion 111 and the tin isolation portion 112 on the furnace passing jig are realized by screwing the screw, so that the assembly, the use and the replacement of the tin dragging piece 11 can be facilitated.

The embodiment of the utility model also provides a furnace passing jig, which is shown in fig. 3A and 3B, and comprises a carrier 12 and the tin dragging piece 11, wherein the carrier 12 is provided with a tin receiving surface 121, and the carrier 12 is provided with a first welding hole 12a penetrating through the tin receiving surface 121; the tin separating part 112 of the tin dragging member 11 is arranged on the tin receiving surface 121 and is positioned at the periphery of the first welding hole 12a; the tin pick-up portion 111 of the tin dragging member 11 is located at a side of the tin isolation portion 112 facing away from the tin receiving surface 121.

In this embodiment, the carrier 12 is used for carrying the circuit board 2 to be soldered, the bonding pad on the circuit board 2, the pin of the plug-in unit, etc. are exposed through the first soldering hole 12a on the carrier 12, in the process of passing through the furnace, the tin liquid contacts with the soldering point 21 on the circuit board 2 through the first soldering hole 12a, so as to realize the tin plating and soldering of the soldering point 21, at this time, because the tin dragging member 11 is located at the periphery of the first soldering hole 12a, the tin liquid contacting with the tin dipping portion 111 of the tin dragging member 11 is adhered by the tin dipping portion 111, the tin liquid contacting with the tin isolation portion 112 is difficult to adhere and adhere with the tin isolation portion 112, so that the problem of shorting between the soldering points 21 due to the adhesion of the tin dipping portion 111 and the adhesion of the soldering point 21 on the circuit board 2 can be solved, the reliable tin plating of the soldering point 21 on the circuit board 2 can be ensured, and the soldering quality of the soldering point 21 on the circuit board 2 can be improved.

The first tin-plating resist layer 113 in the tin-drawing member 11 is disposed on the tin-separating portion 112 and covers the outer sidewall of the tin-separating portion 112 and the surface of the tin-separating portion 112 facing and/or facing away from the tin-plating portion 111, for example, the first tin-plating resist layer 113 is disposed to completely cover and cover the outer peripheral wall of the tin-separating portion 112 as shown in fig. 3A, or the first tin-plating resist layer 113 is disposed to cover the outer sidewall of the tin-separating portion 112 and the side of the tin-separating portion 112 facing the carrier 12 as shown in fig. 3B.

The specific structure of the tin drawing member 11 in this embodiment refers to the foregoing embodiments, and since the furnace passing jig in this embodiment adopts all the technical solutions of all the foregoing embodiments, at least the beneficial effects brought by the technical solutions of the foregoing embodiments are provided, and will not be described in detail herein.

In an embodiment of the present utility model, as shown in fig. 3A and 3B, the distance between the tin isolation part 112 and the first soldering hole 12a is greater than or equal to 1 mm and less than or equal to 1.5 mm.

In this embodiment, a certain interval is formed between the edge of the tin isolation portion 112 near the first soldering hole 12a and the opening of the first soldering hole 12a, and the minimum width of the interval is greater than or equal to 1 mm and less than or equal to 1.5 mm, so that when the sticky solder of the tin dipping portion 111 is too much, the solder on the tin dipping portion 111 is too close to the first soldering hole 12a to climb the tin isolation portion 112 and adhere to the redundant solder on the soldering spot 21 of the circuit board 2, thereby avoiding the problem that the solder dragging member 11 and the circuit board 2 are simultaneously adhered to the solder and cannot be separated.

In an embodiment of the present utility model, as shown in fig. 4, fig. 5A, and fig. 5B, the overload tool 12 is further provided with a second soldering hole 12B penetrating through the tin-receiving surface 121, and the furnace-passing tool further includes a heat-conducting patch 13; the heat conduction patch 13 is arranged on the tin receiving surface 121 of the furnace passing jig and covers the second welding hole 12b; the heat conduction patch 13 is provided with a first avoidance hole 13a corresponding to the second welding hole 12b, the orthographic projection of the first avoidance hole 13a on the tin receiving surface 121 shields the second welding hole 12b, and the first avoidance hole 13a is communicated with the second welding hole 12b for solder to enter the second welding hole 12b.

In this embodiment, the second solder holes 12b are used for exposing solder joints 21 such as pads on the circuit board 2, pins of the interposer, and the like. The heat conducting patch 13 is arranged around the second welding hole 12b, and is provided with a first avoidance hole 13a for exposing the second welding hole 12b, the first avoidance hole 13a can be opposite to the second welding hole 12b, and the open area of the first avoidance hole 13a can be larger than or equal to that of the second welding hole 12b. The carrier 12 is made of synthetic stone and the like, the heat conduction patch 13 is made of metal, and the heat conduction coefficient of the heat conduction patch 13 is larger than that of the carrier 12, so that the heat conduction patch 13 can efficiently conduct heat to the welding spots 21 on the circuit board 2 when being contacted with high-temperature soldering tin, the filling rate of the residual soldering tin on the welding spots 21 after soldering tin wave peaks is improved, and the welding quality of the welding spots 21 on the circuit board 2 is improved.

In an embodiment of the present utility model, as shown in fig. 4, fig. 5A, and fig. 5B, the thermal conductive patch 13 includes a thermal conductive substrate 131 and a second tin pick-proof layer 132; the heat conducting substrate 131 is arranged on the tin receiving surface 121 of the carrier 12, the heat conducting substrate 131 is provided with a first avoidance hole 13a, the second tin pick-proof layer 132 is arranged on the heat conducting substrate 131, and the second tin pick-proof layer 132 is provided with a second avoidance hole corresponding to the first avoidance hole 13 a.

In this embodiment, the heat conducting substrate 131 is used for conducting heat from high temperature solder to the solder joint 21 on the circuit board 2, and the second anti-wetting layer 132 is not wet with the solder, and is used for preventing the solder from adhering to the solder joint 21 and the heat conducting substrate 131 on the circuit board 2 at the same time, so as to reduce the risk that the solder joint 21 on the circuit board 2 adheres to the heat conducting patch 13 and thus the circuit board 2 cannot be removed from the carrier 12. The first avoidance holes 13a on the heat conducting substrate 131 and the second avoidance holes on the tin pick-proof layer are correspondingly arranged and are matched to expose the second welding holes 12b, so that the soldering tin can contact the welding spots 21 on the circuit board 2 through the second avoidance holes, the first avoidance holes 13a and the second welding holes 12b, and the soldering tin filling on the welding spots 21 is realized.

The second tin pick-up preventing layer 132 in the heat conducting patch 13 is disposed on the heat conducting substrate 131 and covers the outer side wall of the heat conducting substrate 131 and the surface of the heat conducting substrate 131 facing and/or facing away from the carrier 12, for example, as shown in fig. 5A, the second tin pick-up preventing layer 132 covers the outer side wall of the heat conducting substrate 131 and the side of the tin isolation part 112 facing the carrier 12; alternatively, according to the arrangement in which the second tin pick-up preventing layer 132 is entirely wrapped around and covers the outer circumferential wall of the heat conductive substrate 131 as shown in fig. 5B,

in an embodiment of the utility model, as shown in fig. 4, fig. 5A, and fig. 5B, the thermal conductivity of the thermal conductive substrate 131 is greater than or equal to 15W/(m.k); and/or, the melting point of the heat conductive substrate 131 is 500 ℃ or more; and/or, the heat conducting substrate 131 is made of metal; and/or, the material of the second tin pick-proof layer 132 is metal nitride; and/or, the thickness of the second tin pick-proof layer 132 is greater than or equal to 1 μm and less than or equal to 50 μm.

In this embodiment, when the thermal conductivity of the thermally conductive substrate 131 is greater than or equal to 15W/(m.k), the thermally conductive performance of the thermally conductive substrate 131 is better than that of the carrier 12 made of synthetic stone, so that the thermally conductive patch 13 can efficiently conduct heat to the solder joint 21 on the circuit board 2 when contacting with high-temperature solder, improve the filling rate of the solder remaining on the solder joint 21 after passing through the solder peak on the solder joint 21, and improve the soldering quality of the solder joint 21 on the circuit board 2.

When the melting point of the heat conducting matrix 131 is more than or equal to 500 ℃, the heat conducting matrix 131 cannot be melted and corroded by the high Wen Xiye when contacting high-temperature soldering tin, and the service life of the heat conducting patch 13 can be prolonged.

When the material of the heat conducting matrix 131 is metal, the heat conducting matrix 131 has the characteristics of heat conduction and easy processing and forming, the heat conducting matrix 131 is conveniently manufactured into various shapes and various sizes, and the heat conducting matrix 131 can be adapted to welding holes and welding spots 21 in different shapes, so that the heat conducting matrix 131 can be matched with the second tin dipping prevention layer 132 to achieve a more reliable tin isolation effect, the phenomenon that soldering tin is simultaneously adhered to the tin dipping part 111 and the welding spots 21 on the circuit board 2 is avoided, and the purpose of improving the welding quality and reliability of the welding spots 21 of the circuit board 2 is achieved. Specifically, the heat conducting substrate 131 may be made of stainless steel, copper, etc.

When the material of the second TiN pick-up preventing layer 132 is CrN, tiCN, al TiN, crNAl, tiSiN, and other metal nitrides, the second TiN pick-up preventing layer 132 has high thermal conductivity while being resistant to high temperature solder corrosion and not wetting with solder, so that the second TiN pick-up preventing layer 132 meets the requirements of TiN isolation and heat transfer, and the welding quality of the wave soldering device adopting the heat conduction patch 13 is improved. In addition, when the second anti-tin-dipping layer 132 is a metal nitride layer, the metal nitride layer can be deposited on the metal heat-conducting substrate 131 through a physical or chemical vapor deposition process, and the bonding force between the first anti-tin-dipping layer made of the metal nitride material and the metal heat-conducting substrate 131 is better, so that the whole of the heat-conducting substrate 131 and the second anti-tin-dipping layer 132 has high wear resistance, the service life of the heat-conducting patch 13 can be prolonged, and experimental test data are used. In addition, the vapor deposition is adopted to manufacture the second tin pick-proof layer 132 of the metal nitride coating layer, so that compared with the direct adoption of a titanium alloy or other solder-repellent material to realize solder anti-sticking, the manufacturing cost of the heat conduction patch 13 can be greatly reduced.

When the thickness of the second tin-plating resist layer 132 is controlled to be between 1 μm and 50 μm by physical or chemical vapor deposition, the second tin-plating resist layer 132 becomes a coating structure on the heat conductive substrate 131: on the one hand, the second tin-plating preventing layer 132 can be combined with the heat conducting substrate 131 with reliable bonding force, so that the problem that the second tin-plating preventing layer 132 cracks or peels off to lose efficacy due to overlarge thermal stress between the second tin-plating preventing layer 132 and the isolation part of the heat conducting patch 13 passing through the furnace Cheng Xuzhong can be effectively prevented, and the service life of the heat conducting patch 13 is prolonged; on the other hand, the thickness of the second tin pick-up preventing layer 132 is thinner, the material cost of the second tin pick-up preventing layer 132 is lower, the manufacturing cost of the compression heat conduction patch 13 is facilitated, and the comprehensive cost-effective ratio of the heat conduction patch 13 is improved.

The embodiment of the utility model also provides wave soldering equipment which comprises the furnace passing jig in each embodiment.

In this embodiment, the wave soldering apparatus may further include a soldering furnace, in which, in the passing procedure, the circuit board 2 is carried by the passing jig, and the wave crest of the high-temperature tin liquid is soldered to the soldering point 21 of the circuit board 2 by contacting the first avoidance hole 13a on the tin dragging member 11 and the first soldering hole 12a on the carrier 12, and the second avoidance hole on the heat conducting patch 13 and the second soldering hole 12b on the carrier 12 with the soldering point 21 on the circuit board 2.

The specific structure of the furnace passing jig in this embodiment refers to the foregoing embodiments, and since the wave soldering apparatus adopts all the technical solutions of all the foregoing embodiments, at least the technical solutions of the foregoing embodiments have all the beneficial effects, which are not described in detail herein.

The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. The utility model provides a drag tin spare, is applied to and crosses stove tool, it has the face that receives tin to cross stove tool, its characterized in that, drag tin spare includes:

a tin dipping part;

the tin isolation part is arranged in a lamination way with the tin dipping part and is connected with the tin receiving surface of the furnace passing jig; and

the first tin-dipping prevention layer is arranged on the tin separation part to prevent the tin separation part from being adhered with soldering tin.

2. The tin drawing member as claimed in claim 1, wherein the tin dipping portion is made of tin plate;

and/or the material of the tin isolation part is metal;

and/or the material of the first tin-dipping prevention layer is metal nitride.

3. The tin drawing member as in claim 1, wherein the first tin pick-up preventing layer has a thickness of 1 μm or more and 50 μm or less.

4. A tin drawing member as claimed in any one of claims 1 to 3, wherein the tin pick-up portion is provided with a first through hole, the tin separation portion is provided with a second through hole corresponding to the first through hole, and the tin pick-up portion and the tin separation portion are riveted or screwed to the tin receiving surface of the furnace jig through the first through hole and the second through hole.

5. The utility model provides a cross stove tool which characterized in that, cross stove tool includes:

the carrier is provided with a tin receiving surface, and is provided with a first welding hole penetrating through the tin receiving surface; and

the tin drawing member according to any one of claims 1 to 4, wherein the tin separating portion of the tin drawing member is provided on the tin receiving surface and located at a periphery of the first soldering hole; the tin dipping part of the tin dragging piece is positioned at one side of the tin isolation part, which is away from the tin receiving surface.

6. The furnace jig according to claim 5, wherein a distance between the tin isolation portion and the first solder hole is 1 mm or more and 1.5 mm or less.

7. The furnace jig of claim 5, wherein the carrier is further provided with a second solder hole penetrating the tin-receiving surface, the furnace jig further comprising a heat-conducting patch;

the heat conduction patch is arranged on the tin receiving surface of the furnace passing jig, the heat conduction patch is provided with a first avoidance hole corresponding to the second welding hole, the orthographic projection of the first avoidance hole on the tin receiving surface shields the second welding hole, and the first avoidance hole is communicated with the second welding hole so that soldering tin can enter the second welding hole.

8. The furnace jig of claim 7, wherein the thermally conductive patch comprises a thermally conductive substrate and a second tin pick-up prevention layer;

the heat conducting substrate is arranged on the tin receiving surface of the carrier, the heat conducting substrate is provided with the first avoidance holes, the second tin dipping prevention layer is arranged on the heat conducting substrate, and the second tin dipping prevention layer is provided with the second avoidance holes corresponding to the first avoidance holes.

9. The furnace jig of claim 8, wherein the thermal conductivity of the thermally conductive substrate is 15W/(m.k) or more;

and/or the melting point of the heat conducting matrix is greater than or equal to 500 ℃;

and/or the heat conducting matrix is made of metal;

and/or the material of the second tin-dipping prevention layer is metal nitride;

and/or the thickness of the second tin-dipping prevention layer is more than or equal to 1 mu m and less than or equal to 50 mu m.

10. A wave soldering apparatus comprising a furnace jig as claimed in any one of claims 5 to 9.