US20020023664A1 - Process for the chemical treatment of semiconductor wafers - Google Patents

Process for the chemical treatment of semiconductor wafers Download PDF

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Publication number
US20020023664A1
US20020023664A1 US09/882,207 US88220701A US2002023664A1 US 20020023664 A1 US20020023664 A1 US 20020023664A1 US 88220701 A US88220701 A US 88220701A US 2002023664 A1 US2002023664 A1 US 2002023664A1
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Prior art keywords
aqueous
semiconductor wafers
solution
medium containing
ozone
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US09/882,207
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US6451124B1 (en
Inventor
Roland Brunner
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Siltronic AG
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Wacker Siltronic AG
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Assigned to WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG reassignment WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BRUNNER, ROLAND
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H01L21/02049—Dry cleaning only with gaseous HF
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Definitions

  • the present invention relates to a process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers.
  • the present invention relates to a process for the chemical treatment of semiconductor wafers, in which the semiconductor wafers are treated with a medium containing HF and then with a medium containing ozone, wherein the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF.
  • the medium containing HF which is used in the process according to the invention may be either pure hydrogen fluoride or an aqueous solution of hydrogen fluoride, i.e. hydrofluoric acid. In both cases the medium containing HF may be in the gas phase or in the liquid phase.
  • the medium containing HF which is used according to the present invention is preferably an aqueous HF solution, particularly preferably one that contains HF in a concentration of from 0.001% to 10% by weight.
  • the aqueous HF solution which is used according to the invention may also contain HCl in a concentration of from 0.001% to 10% by weight, preferably from 0.2% to 2.0% by weight.
  • the medium containing HF which is used according to the present invention preferably does not contain any other substances, for example surfactants.
  • the percent by weight for the HF is based upon the total weight of the aqueous solution.
  • the percent by weight for the HCl is based upon the total weight of the aqueous solution.
  • the medium containing ozone which is used in the process according to the invention may be either O 3 gas or an aqueous O 3 solution.
  • the medium containing ozone which is used according to the invention is preferably an aqueous O 3 solution, particularly preferably solutions that contain O 3 in a concentration of from 1 to 50 ppm.
  • aqueous HF solutions and/or aqueous ozone solutions are used in the process according to the present invention, it is preferable to employ solutions that have been prepared using deionized water.
  • the treatment with the medium containing ozone directly follows the treatment with the medium containing HF, without any additional step of washing with water.
  • the omission of washing with water between the treatments with the chemically active agents offers immediate economic advantages and substantially improves the cleaning action on the Si surface.
  • the oxidizing action of ozone on the Si surface is also improved by the process according to the present invention.
  • the semiconductor wafers used in the process according to the invention which have been treated with a medium containing HF and are free of aqueous HF, can be obtained as a result of either carrying out the treatment with the medium containing HF
  • the semiconductor wafers are exposed to an HF gas stream in a sealed device, and the residual HF gas is pumped out at the end of the treatment stage.
  • the semiconductor wafers obtained in this way can then be processed using ozone gas in a second step.
  • the residual ozone gas is pumped out after the ozone-gas treatment stage.
  • the semiconductor wafer treated with HF can be separated from the aqueous HF bath according to the process variant b) by
  • the aqueous HF solution is preferably discharged from the process bath into a temporary container at a rate which lowers the level of the liquid by preferably from 0.01 to 15 mm per second.
  • the HF solution is preferably discharged through a valve that has a controllable cross section.
  • the semiconductor wafers that are free of HF solution are immersed in the next medium containing ozone.
  • the HF solution is cleaned in the temporary container, preferably by using 0.05 ⁇ m recycling filtration, and fed back into the process bath.
  • the filtered HF solution is again ready to clean semiconductor wafers.
  • the treated semiconductor wafers are drawn at a speed of preferably from 0.01 to 15 mm per second through the surface of the aqueous HF solution, advantageously by using an automated handling device.
  • the semiconductor wafers obtained in this way, which are free of HF solution, are subsequently immersed in the next medium containing ozone, and uniformly rendered hydrophilic.
  • the process according to the present invention is carried out at a temperature of preferably from 10 to 65° C., particularly preferably from 20 to 30° C., and at a pressure of preferably from 900 to 1100 hPa.
  • the treatment sequences according to the present invention may—if desired—be preceded or followed by other standard operations for the chemical treatment of semiconductor wafers, for example treatment to dry the semiconductor wafers after the ozone treatment has been carried out.
  • the present invention provides a process with which semiconductor wafers can be conditioned particularly effectively for the defect-free growth of thermal oxides.
  • the process according to the present invention has the advantage that the native oxide grows very uniformly over the entire Si surface during the ozone hydrophilization.
  • the oxide advantageously contains no defect sites in the native oxide, which cause nonuniform thermal oxidation in the nm range.
  • very thin or thick oxide layers are applied to the semiconductor wafer. The thermally produced oxide layers grow uniformly and without defect regions.
  • the process according to the present invention also has the advantage that the Si surface of the semiconductor wafer is free of regions with different microroughness (haze) due to residual aqueous HF solution in combination with aqueous ozone solution.
  • Example 1 The procedure described in Example 1 was repeated, with the difference that the rate at which the semiconductor wafers were drawn from the HF bath was 50 mm/s instead of 0.5 mm/s.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

A process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers, is such that the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers. [0002]
  • 2. The Prior Art [0003]
  • Processes for the wet chemical treatment of semiconductor wafers are already known. Regarding these processes, reference may, for example, be made to DE-A 19853486 and U.S. Pat. No. 5,662,743. The disclosure of these references relate to removing metallic contamination and particles from semiconductor wafers. This contamination generally interferes with the surface structure pattern. [0004]
    • SUMMARY OF THE INVENTION
  • The present invention relates to a process for the chemical treatment of semiconductor wafers, in which the semiconductor wafers are treated with a medium containing HF and then with a medium containing ozone, wherein the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF. [0005]
  • The medium containing HF which is used in the process according to the invention may be either pure hydrogen fluoride or an aqueous solution of hydrogen fluoride, i.e. hydrofluoric acid. In both cases the medium containing HF may be in the gas phase or in the liquid phase. The medium containing HF which is used according to the present invention is preferably an aqueous HF solution, particularly preferably one that contains HF in a concentration of from 0.001% to 10% by weight. The aqueous HF solution which is used according to the invention may also contain HCl in a concentration of from 0.001% to 10% by weight, preferably from 0.2% to 2.0% by weight. Apart from HF, optionally water and optionally HCl, the medium containing HF which is used according to the present invention preferably does not contain any other substances, for example surfactants. [0006]
  • Regarding the above mentioned HF concentration or HCl concentration, the percent by weight for the HF is based upon the total weight of the aqueous solution. The percent by weight for the HCl is based upon the total weight of the aqueous solution. [0007]
  • The medium containing ozone which is used in the process according to the invention may be either O[0008] 3 gas or an aqueous O3 solution. The medium containing ozone which is used according to the invention is preferably an aqueous O3 solution, particularly preferably solutions that contain O3 in a concentration of from 1 to 50 ppm.
  • If aqueous HF solutions and/or aqueous ozone solutions are used in the process according to the present invention, it is preferable to employ solutions that have been prepared using deionized water. [0009]
  • In the process according to the present invention, the treatment with the medium containing ozone directly follows the treatment with the medium containing HF, without any additional step of washing with water. The omission of washing with water between the treatments with the chemically active agents offers immediate economic advantages and substantially improves the cleaning action on the Si surface. The oxidizing action of ozone on the Si surface is also improved by the process according to the present invention. [0010]
  • The semiconductor wafers used in the process according to the invention, which have been treated with a medium containing HF and are free of aqueous HF, can be obtained as a result of either carrying out the treatment with the medium containing HF [0011]
  • a) by using HF gas or [0012]
  • b) after the treatment in the aqueous HF bath has been carried out, separating the semiconductor wafer from the latter in such a way that there is no longer any aqueous HF on the surface of the semiconductor wafer. [0013]
  • In the process variant a) the semiconductor wafers are exposed to an HF gas stream in a sealed device, and the residual HF gas is pumped out at the end of the treatment stage. The semiconductor wafers obtained in this way can then be processed using ozone gas in a second step. The residual ozone gas is pumped out after the ozone-gas treatment stage. [0014]
  • In the process according to the invention, the semiconductor wafer treated with HF can be separated from the aqueous HF bath according to the process variant b) by [0015]
  • b1) extracting the aqueous HF solution from the treatment bath or [0016]
  • b2) extracting the treated semiconductor wafers from the aqueous HF bath. [0017]
  • In the process according to the present invention, in the variant b1) the aqueous HF solution is preferably discharged from the process bath into a temporary container at a rate which lowers the level of the liquid by preferably from 0.01 to 15 mm per second. In this case, the HF solution is preferably discharged through a valve that has a controllable cross section. After the HF solution has been fully drained from the bath, the semiconductor wafers that are free of HF solution are immersed in the next medium containing ozone. The HF solution is cleaned in the temporary container, preferably by using 0.05 μm recycling filtration, and fed back into the process bath. The filtered HF solution is again ready to clean semiconductor wafers. [0018]
  • In the process according to the present invention, in the variant b2) the treated semiconductor wafers are drawn at a speed of preferably from 0.01 to 15 mm per second through the surface of the aqueous HF solution, advantageously by using an automated handling device. The semiconductor wafers obtained in this way, which are free of HF solution, are subsequently immersed in the next medium containing ozone, and uniformly rendered hydrophilic. [0019]
  • The process according to the present invention is carried out at a temperature of preferably from 10 to 65° C., particularly preferably from 20 to 30° C., and at a pressure of preferably from 900 to 1100 hPa. [0020]
  • The treatment sequences according to the present invention may—if desired—be preceded or followed by other standard operations for the chemical treatment of semiconductor wafers, for example treatment to dry the semiconductor wafers after the ozone treatment has been carried out. [0021]
  • The present invention provides a process with which semiconductor wafers can be conditioned particularly effectively for the defect-free growth of thermal oxides. [0022]
  • The process according to the present invention has the advantage that the native oxide grows very uniformly over the entire Si surface during the ozone hydrophilization. The oxide advantageously contains no defect sites in the native oxide, which cause nonuniform thermal oxidation in the nm range. According to the requirement of the subsequent processing in the IC industry, very thin or thick oxide layers are applied to the semiconductor wafer. The thermally produced oxide layers grow uniformly and without defect regions. [0023]
  • The process according to the present invention also has the advantage that the Si surface of the semiconductor wafer is free of regions with different microroughness (haze) due to residual aqueous HF solution in combination with aqueous ozone solution. [0024]
    • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • Other objects and features of the present invention will become apparent from the following detailed description considered in connection with the accompanying Examples which disclose several embodiments of the present invention. It should be understood, however, that the Examples are designed for the purpose of illustration only and not as a definition of the limits of the invention. [0025]
    • EXAMPLE 1
  • 50 silicon semiconductor wafers, with a diameter of 200 mm, each were immersed in 50 l of aqueous HF solution with an HF concentration of 0.2% by weight and, after a period of 5 minutes, were drawn from the HF solution at a pulling rate of 0.5 mm/s. The semiconductor wafers obtained in this way were then immersed for a period of 5 minutes in 50 l of aqueous ozone solution with an ozone concentration of 6 ppm. [0026]
  • The semiconductor wafers treated in this way were then subjected to thermal poly/LTO oxidation which is known per se. The quality of the oxide uniformity was assessed by visual inspection under haze light. The number of semiconductor wafers having nonuniform oxide faces was approximately 0. [0027]
    • COMPARATIVE EXAMPLE 1
  • The procedure described in Example 1 was repeated, with the difference that the rate at which the semiconductor wafers were drawn from the HF bath was 50 mm/s instead of 0.5 mm/s. [0028]
  • The number of semiconductor wafers having nonuniform oxide faces, primarily at the positions where the HF solution adhered to the semiconductor wafers before immersion in the ozone solution, was in the 80% range. [0029]
  • Accordingly, while a few embodiments of the present invention have been shown and described, it is to be understood that many changes and modifications may be made thereunto without departing from the spirit and scope of the invention as defined in the appended claims. [0030]

Claims (9)

What is claimed is:
1. A process for the chemical treatment of semiconductor wafers comprising,
treating the semiconductor wafers with a medium containing HF and then freeing said wafers of aqueous HF;
treating said wafers with a medium containing ozone, wherein the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF.
2. The process as claimed in claim 1,
wherein the medium containing HF is an aqueous solution of hydrogen fluoride.
3. The process as claimed in claim 2,
wherein the medium containing HF is an aqueous HF solution that contains HF in a concentration of from 0.001% to 10% by weight based upon the total weight of the aqueous solution.
4. The process as claimed in claim 1,
wherein an aqueous O3 solution is employed as the medium containing ozone.
5. The process as claimed in claim 4,
wherein an aqueous O3 solution that contains O3 in a concentration of from 1 to 50 ppm is employed.
6. The process as claimed in claim 1,
wherein the treating with the medium containing HF is carried out using HF gas.
7. The process as claimed in claim 2,
wherein the semiconductor wafer, after the treating in an aqueous HF treatment bath has been carried out, is separated from the treatment bath in such a way that there is no longer any aqueous HF on the surface of the semiconductor wafer.
8. The process as claimed in claim 7,
wherein the semiconductor wafer treated with HF is separated from the aqueous HF treatment bath by extracting the aqueous HF solution from the treatment bath.
9. The process as claimed in claim 7,
wherein the semiconductor wafer treated with HF is separated from the aqueous HF bath by extracting the treated semiconductor wafers from the aqueous HF bath.
US09/882,207 2000-07-27 2001-06-15 Process for the chemical treatment of semiconductor wafers Expired - Fee Related US6451124B1 (en)

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DE10036691A DE10036691A1 (en) 2000-07-27 2000-07-27 Process for the chemical treatment of semiconductor wafers
DE10036691.0 2000-07-27
DE10036691 2000-07-27

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EP (1) EP1176632B1 (en)
JP (1) JP2002118088A (en)
KR (1) KR100442744B1 (en)
DE (2) DE10036691A1 (en)
TW (1) TW546729B (en)

Cited By (3)

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US6451124B1 (en) * 2000-07-27 2002-09-17 Wacker Siltronic Gesellschaft Fur Halbleiterma Terialien Ag Process for the chemical treatment of semiconductor wafers
US20030226577A1 (en) * 2002-04-16 2003-12-11 Takehiko Orll Liquid processing apparatus and liquid processing method
US20090071507A1 (en) * 2007-09-19 2009-03-19 Siltronic Ag Process for cleaning a semiconductor wafer

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JP6718714B2 (en) * 2016-03-25 2020-07-08 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus

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US6451124B1 (en) * 2000-07-27 2002-09-17 Wacker Siltronic Gesellschaft Fur Halbleiterma Terialien Ag Process for the chemical treatment of semiconductor wafers
US20030226577A1 (en) * 2002-04-16 2003-12-11 Takehiko Orll Liquid processing apparatus and liquid processing method
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Also Published As

Publication number Publication date
EP1176632A1 (en) 2002-01-30
KR20020010529A (en) 2002-02-04
EP1176632B1 (en) 2005-04-13
DE10036691A1 (en) 2002-02-14
US6451124B1 (en) 2002-09-17
KR100442744B1 (en) 2004-08-02
JP2002118088A (en) 2002-04-19
DE50105889D1 (en) 2005-05-19
TW546729B (en) 2003-08-11

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