US20020019068A1 - Method and device for passive alignment - Google Patents

Method and device for passive alignment Download PDF

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Publication number
US20020019068A1
US20020019068A1 US09/862,461 US86246101A US2002019068A1 US 20020019068 A1 US20020019068 A1 US 20020019068A1 US 86246101 A US86246101 A US 86246101A US 2002019068 A1 US2002019068 A1 US 2002019068A1
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US
United States
Prior art keywords
alignment
carrier
laser
structures
passive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/862,461
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English (en)
Inventor
Thomas Ericson
Paul Eriksen
Mats Granberg
Krister Frojd
Goran Palmskog
Pontus Lundstrom
Lennart Backlin
Christian Vjeider
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Telefonaktiebolaget LM Ericsson AB
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Individual
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Filing date
Publication date
Priority claimed from SE0001954A external-priority patent/SE0001954D0/sv
Application filed by Individual filed Critical Individual
Assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) reassignment TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BACKLIN, LENNART, GRANBERG, MATS, LUNDSTROM, PONTUS, PALMSKOG, GORAN, ERICSON, THOMAS, VJEIDER, CHRISTIAN, FROJD, KRISTER, ERIKSEN, PAUL
Publication of US20020019068A1 publication Critical patent/US20020019068A1/en
Priority to US11/177,493 priority Critical patent/US7317746B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Definitions

  • the present invention is related to a method and a device for precision and passive alignment such as a precision and passive alignment technology for low cost array fibre access components.
  • BCB benzocyclobutene
  • Silicon micromachining indiumphosfide (InP) laser diode array technology, benzocyclobutene (BCB) waveguides, passive alignments of laserdiode arrays to waveguides by self-aligning solder bumps, passive alignment of waveguide to an optical MT interface—micro replication technology and plastic encapsulation.
  • InP indiumphosfide
  • BCB benzocyclobutene
  • a laser carrier is passive aligned to an MT-interface using alignments structures on a low cost replicated carrier.
  • the laser carrier is based on a self-aligned semiconductor laser, flip-chip mounted on a silicon substrate with planar polymeric waveguides.
  • the concept for alignment according to the invention is shown in FIG. 1 with a front view of a laser carrier mounted on a polymeric carrier.
  • FIG. 1 is a front view of a laser carrier mounted on a polymeric carrier with the concept of an alignment according to the invention.
  • FIG. 2 is a top view of a laser carrier with alignment trenches adapted for the carrier structure according to the invention.
  • FIG. 3 is a front view of the polymer carrier according to the invention showing alignment structures in a mould insert and the formed polymeric carrier.
  • a laser carrier 1 comprises an edge-emitting SM laser array 2 passive aligned to the waveguides 3 on the carrier using AuSn, soldering bumps, se FIG. 2. This method of alignment has earlier been shown to give single mode precision; see reference /1/ and /2/. The alignment is achieved by the surface tension that is created of the bumps in the melted phase.
  • the planar waveguides 3 of for example BCB, see reference /3/, on the silicon substrate conduct the light from the laser array 2 to the edge of the carrier 1 , enabling a laser component without pigtail connection and with future waveguide functionality to be integrated.
  • trenches 4 are etched, see FIG. 2, into the outer parts of the carrier 1 preferably made by silicon.
  • the laser carrier 1 is then placed upside down on a polymeric carrier 5 and passively positioned to an MT-interface by fitting the alignment trenches 4 on the laser carrier to vertical alignment structures 6 and the waveguides 3 to horizontal alignment structures 7 on the polymeric carrier, see FIG. 1.
  • Polymeric carriers are preferably made by using replication technique, based on transfer moulding with micro structured silicon as a mould insert 8 , see FIG. 3 and reference /4/.
  • the mould insert comprises v-grooves of different sizes for the MT-interface, the vertical alignment and the horizontal alignment for later creating the vertical alignment structures 6 and the horizontal alignment structures 7 in the polymeric carrier.
  • a cavity can be formed behind the alignment structures in the polymeric carrier.
  • MT guiding holes 9 in the replicated carriers are made by placing the MT-guiding pins 10 on the mould insert during the replication step.
  • a lead frame may then be mounted on the backside of the laser carier and connected to the electrodes by wire bonding. This is done before the laser carrier is fixed to the polymer carrier by gluing. Finally, this package is encapsulated using transfer moulding and polished to achieve optical finish at the waveguide edge.
  • the laser array can have four laser channels, where signal electrodes can apear on the epitaxial side and be connected to the carrier when the laser array is flip-chip mounted.
  • the common ground electrode is wire bonded to the laser carrier.
  • the laser carrier was manufacturated using standard micro structuring technique with litography and dry etching on silicon. Electrodes were made by e-beam evaporation of Ti/Pt/Ni/Au and a lift-off technique. Gold and tin can then be electroplated through a photoresist mask as soldering bumps.
  • the planar BCB waveguide was built up by under- and overcladding layers, and in between a waveguiding core, se reference /3/. All these layers were deposited on the silsicon substrate by spinning deposition and the pattern of the waveguiding core was made in a lithography step. The end surface of the waveguide was also dry etched, thus creating a sharp edge of the waveguide. This was done in order to get good coupling efficiency from the laser into the waveguide core. Finally, alignment trenches were etched into the substrate using DRIE (Deep Reactive Ion Etching) with oxide as masking material.
  • DRIE Deep Reactive Ion Etching
  • Silicon wafers of (100) orientation was anisotropically etched in KOH (30 vol. %), for manufacturing the mould insert. Since the v-grooves for the MT-guiding pins consists of two levels, two separate litography steps were used with Si oxide and Si nitride as masking material. First the wider MT-structures were etched with nitride as masking material. After removing the nitride, the rest of the structures were etched with an underlying oxide mask. In order to create the building block, another silcon wafer was fusion bonded on top of this wafer, The building block structures were then etched out from this bonded wafer. All structures in the mould insert were compensated for a dimensional shrinkage of 0,629% of the polymeric material, see reference /4/.
  • the optical properties of the laser module can be tested with an integrating sphere and the IP-curve can be recorded for each individual channel.
  • the total shrinkage of the replicated structures after the transfer moulding was found to be about 0,69% when measuring the structures on both mold insert and replicated carrier with a profilometer.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
  • Manipulator (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
US09/862,461 2000-05-23 2001-05-23 Method and device for passive alignment Abandoned US20020019068A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/177,493 US7317746B2 (en) 2000-05-23 2005-07-11 Method and device for passive alignment

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
SE0001954A SE0001954D0 (sv) 2000-05-23 2000-05-23 Anordning för passiv upplinjering
SE0001954-7 2000-05-23
SE0100367-2 2001-02-06
SE0100367A SE519713C2 (sv) 2000-05-23 2001-02-06 Förfarande och anordning för passiv upplinjering

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/177,493 Continuation US7317746B2 (en) 2000-05-23 2005-07-11 Method and device for passive alignment

Publications (1)

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US20020019068A1 true US20020019068A1 (en) 2002-02-14

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US09/862,461 Abandoned US20020019068A1 (en) 2000-05-23 2001-05-23 Method and device for passive alignment
US11/177,493 Expired - Fee Related US7317746B2 (en) 2000-05-23 2005-07-11 Method and device for passive alignment

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US11/177,493 Expired - Fee Related US7317746B2 (en) 2000-05-23 2005-07-11 Method and device for passive alignment

Country Status (11)

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US (2) US20020019068A1 (sv)
EP (1) EP1290481B1 (sv)
JP (1) JP4808900B2 (sv)
KR (1) KR100902433B1 (sv)
CN (1) CN1380987A (sv)
AT (1) ATE478356T1 (sv)
AU (1) AU6094201A (sv)
CA (1) CA2380240C (sv)
DE (1) DE60142832D1 (sv)
SE (1) SE519713C2 (sv)
WO (1) WO2001090794A1 (sv)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030072338A1 (en) * 2001-10-12 2003-04-17 Masayuki Momiuchi Laser oscillation apparatus
US20070252289A1 (en) * 2003-07-25 2007-11-01 Hrl Laboratories, Llc Oriented self-location of microstructures with alignment structures
US10048450B2 (en) * 2016-03-28 2018-08-14 Cisco Technology, Inc. Alignment of optical components using nanomagnets
US11562984B1 (en) 2020-10-14 2023-01-24 Hrl Laboratories, Llc Integrated mechanical aids for high accuracy alignable-electrical contacts
US12057429B1 (en) 2021-06-23 2024-08-06 Hrl Laboratories, Llc Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699262B2 (ja) * 2006-03-31 2011-06-08 京セラ株式会社 光導波路コネクタ及びそれを用いた光接続構造、並びに光導波路コネクタの製造方法
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
US8265436B2 (en) 2010-05-12 2012-09-11 Industrial Technology Research Institute Bonding system for optical alignment
JP6052815B2 (ja) 2014-09-30 2016-12-27 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 導波路用のコネクタおよびアライメント方法
US10852492B1 (en) * 2014-10-29 2020-12-01 Acacia Communications, Inc. Techniques to combine two integrated photonic substrates
US20230296853A9 (en) 2015-10-08 2023-09-21 Teramount Ltd. Optical Coupling
US11585991B2 (en) 2019-02-28 2023-02-21 Teramount Ltd. Fiberless co-packaged optics
US12124087B2 (en) 2015-10-08 2024-10-22 Teramount Ltd. Wideband surface coupling
US9804334B2 (en) 2015-10-08 2017-10-31 Teramount Ltd. Fiber to chip optical coupler
US10564374B2 (en) 2015-10-08 2020-02-18 Teramount Ltd. Electro-optical interconnect platform
US10048455B2 (en) * 2016-01-18 2018-08-14 Cisco Technology, Inc. Passive fiber array connector alignment to photonic chip
US10031299B2 (en) 2016-05-27 2018-07-24 Corning Optical Communications LLC Silicon-based optical ports providing passive alignment connectivity
US10656339B2 (en) 2018-03-14 2020-05-19 Cisco Technology, Inc. Fiber to chip alignment using passive vgroove structures
CN115362402A (zh) * 2020-02-03 2022-11-18 扇港元器件股份有限公司 弹性平均耦合装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5535296A (en) * 1994-09-28 1996-07-09 Optobahn Corporation Integrated optoelectronic coupling and connector
US5559918A (en) * 1992-12-04 1996-09-24 Kabushiki Kaisha Toshiba Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer
US5574811A (en) * 1994-09-07 1996-11-12 Northern Telecom Limited Method and apparatus for providing optical coupling between optical components
US6219470B1 (en) * 1999-09-23 2001-04-17 Xiang Zheng Tu Wavelength division multiplexing transmitter and receiver module
US6236788B1 (en) * 1998-10-01 2001-05-22 Daimlerchrysler Ag Arrangement for aligning optical components
US6238100B1 (en) * 1998-10-21 2001-05-29 Nec Corporation Optical module and a method for fabricating a same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0339706A (ja) * 1989-07-06 1991-02-20 Fujitsu Ltd 光モジュール
JP3090335B2 (ja) * 1990-12-03 2000-09-18 株式会社東芝 光半導体モジュール
JPH06130254A (ja) * 1992-10-15 1994-05-13 Toshiba Corp 光部品結合装置
DE4240950C1 (de) * 1992-12-07 1994-03-31 Bosch Gmbh Robert Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung und Deckel für eine integriert optische Schaltung
JPH0777634A (ja) * 1993-09-09 1995-03-20 Fujitsu Ltd 光端末装置
TW298627B (en) * 1995-08-31 1997-02-21 At & T Corp Article comprising a fiber-to-planar waveguide coupling and method of making the article
SE510049C2 (sv) * 1996-03-25 1999-04-12 Ericsson Telefon Ab L M Anordning för att ansluta minst en vågledare till en optisk sändare eller mottagare
JPH1039176A (ja) * 1996-07-24 1998-02-13 Furukawa Electric Co Ltd:The 光素子の基板実装方法
KR100248407B1 (ko) * 1997-08-06 2000-03-15 이계철 광섬유와 광소자의 수동정렬 방법
JP2000171669A (ja) * 1998-12-03 2000-06-23 Hitachi Ltd 光素子アレイモジュールおよびその製造方法ならびに多芯光コネクタと光素子搭載基板
JP2001324631A (ja) * 2000-05-12 2001-11-22 Nec Corp 基板、光ファイバ接続端部材、光素子ハウジング部材、光モジュール及び基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559918A (en) * 1992-12-04 1996-09-24 Kabushiki Kaisha Toshiba Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer
US5574811A (en) * 1994-09-07 1996-11-12 Northern Telecom Limited Method and apparatus for providing optical coupling between optical components
US5535296A (en) * 1994-09-28 1996-07-09 Optobahn Corporation Integrated optoelectronic coupling and connector
US6236788B1 (en) * 1998-10-01 2001-05-22 Daimlerchrysler Ag Arrangement for aligning optical components
US6238100B1 (en) * 1998-10-21 2001-05-29 Nec Corporation Optical module and a method for fabricating a same
US6219470B1 (en) * 1999-09-23 2001-04-17 Xiang Zheng Tu Wavelength division multiplexing transmitter and receiver module

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030072338A1 (en) * 2001-10-12 2003-04-17 Masayuki Momiuchi Laser oscillation apparatus
US6687273B2 (en) * 2001-10-12 2004-02-03 Kabushiki Kaisha Topcon Laser oscillation apparatus
US20070252289A1 (en) * 2003-07-25 2007-11-01 Hrl Laboratories, Llc Oriented self-location of microstructures with alignment structures
US7622813B2 (en) * 2003-07-25 2009-11-24 Hrl Laboratories, Llc Oriented self-location of microstructures with alignment structures
US10048450B2 (en) * 2016-03-28 2018-08-14 Cisco Technology, Inc. Alignment of optical components using nanomagnets
US11562984B1 (en) 2020-10-14 2023-01-24 Hrl Laboratories, Llc Integrated mechanical aids for high accuracy alignable-electrical contacts
US12057429B1 (en) 2021-06-23 2024-08-06 Hrl Laboratories, Llc Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Also Published As

Publication number Publication date
KR100902433B1 (ko) 2009-06-11
EP1290481B1 (en) 2010-08-18
CA2380240C (en) 2011-05-03
DE60142832D1 (de) 2010-09-30
ATE478356T1 (de) 2010-09-15
EP1290481A1 (en) 2003-03-12
AU6094201A (en) 2001-12-03
US20060007972A1 (en) 2006-01-12
SE0100367L (sv) 2001-11-26
CA2380240A1 (en) 2001-11-29
CN1380987A (zh) 2002-11-20
US7317746B2 (en) 2008-01-08
JP4808900B2 (ja) 2011-11-02
WO2001090794A1 (en) 2001-11-29
JP2003534568A (ja) 2003-11-18
SE0100367D0 (sv) 2001-02-06
SE519713C2 (sv) 2003-04-01
KR20020021161A (ko) 2002-03-18

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Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ERICSON, THOMAS;ERIKSEN, PAUL;GRANBERG, MATS;AND OTHERS;REEL/FRAME:012244/0289;SIGNING DATES FROM 20010807 TO 20010921

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