US20010050164A1 - Cooling apparatus for electronic devices - Google Patents

Cooling apparatus for electronic devices Download PDF

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Publication number
US20010050164A1
US20010050164A1 US09/376,627 US37662799A US2001050164A1 US 20010050164 A1 US20010050164 A1 US 20010050164A1 US 37662799 A US37662799 A US 37662799A US 2001050164 A1 US2001050164 A1 US 2001050164A1
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United States
Prior art keywords
wall portion
cooling device
chamber
heat
cooling
Prior art date
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Abandoned
Application number
US09/376,627
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English (en)
Inventor
Guy R. Wagner
Chandrakant D. Patel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
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Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Priority to US09/376,627 priority Critical patent/US20010050164A1/en
Assigned to AGILENT TECHNOLOGIES reassignment AGILENT TECHNOLOGIES ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PATEL, CHANDRAKANT D., WAGNER, GUY R.
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY MERGER (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Assigned to AGILENT TECHNOLOGIES INC reassignment AGILENT TECHNOLOGIES INC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Priority to JP2000247419A priority patent/JP2001094023A/ja
Publication of US20010050164A1 publication Critical patent/US20010050164A1/en
Priority to US10/208,065 priority patent/US6986384B2/en
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AGILENT TECHNOLOGIES, INC.
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • the present invention relates generally to cooling devices and, more particularly, to cooling devices for removing heat from an electronic devices.
  • heat source is an electronic device.
  • Electronic devices such as integrated circuit devices, are increasingly being used in modern applications.
  • One prevalent example is the computer.
  • the central processing unit or units of most computers, including personal computers, is constructed from an integrated circuit device.
  • One type of cooling device is a heat sink cooling device.
  • a heat sink is formed of a material, such as aluminum, which readily conducts heat.
  • the heat sink is usually placed on top of and in contact with the electronic device. Due to this contact, heat generated by the electronic device is conducted into the heat sink and away from the electronic device.
  • the heat sink may include a plurality of cooling fins in order to increase the surface area of the heat sink and, thus, maximize the transfer of heat from the heat sink into the surrounding air. In this manner, the heat sink draws heat away from the electronic device and transfers the heat into the surrounding air.
  • An example of a heat sink is disclosed in U.S. Pat. No. 5,794,685 of Dean for HEAT SINK DEVICE HAVING RADIAL HEAT AND AIRFLOW PATHS, which is hereby incorporated by reference for all that is disclosed therein.
  • an electrically powered fan is often mounted within or adjacent to the heat sink.
  • the fan causes air to move over and around the fins of the heat sink device, thus cooling the fins by enhancing the transfer of heat from the fins into the ambient air.
  • heat sink devices including fans are disclosed in U.S. Pat. No. 5,785,116 of Wagner for FAN ASSISTED HEAT SINK DEVICE and U.S. Pat. No. 5,740,013 of Roesner et al. for ELECTRONIC DEVICE ENCLOSURE HAVING ELECTROMAGNETIC ENERGY CONTAINMENT AND HEAT REMOVAL CHARACTERISTICS, which are both hereby incorporated by reference for all that is disclosed therein.
  • cooling devices with greater cooling capacities are required.
  • One strategy for increasing cooling capacity is to provide a heat sink having a base portion with a surface area larger than the surface area of the electronic device being cooled. As can be appreciated, this large area base portion provides a larger radiating surface for dissipating heat into the surrounding air, and thus enhances heat removal from the heat sink. If cooling fins are used, as described above, the larger base portion also allows a greater number of cooling fins to be attached to the heat sink than would otherwise be possible.
  • a heat pipe in association with a heat sink device.
  • the heat pipe is generally located between the heat source being cooled and the larger radiating surface described above.
  • Such a heat pipe generally comprises a partially evacuated chamber which includes a small quantity of working fluid, e.g., water.
  • One wall (the heating wall) of the heat pipe is placed in contact with the heat source while another wall (the radiating or condensing wall) of the heat pipe is located adjacent the radiating surface of the heat sink.
  • the heat source raises the temperature of the heat pipe heating wall, causing the working fluid to vaporize. The resulting vapor then spreads rapidly throughout the heat pipe chamber, ultimately condensing on the cooler radiating wall.
  • heat from the heating wall is transferred to the radiating wall via the latent heat of vaporization of the working fluid.
  • a heat pipe arrangement as described above, allows heat to transfer from one surface to another more efficiently than if the heat were merely conducted through a solid material such as aluminum or copper.
  • Examples of cooling devices incorporating heat pipe technology are described in U.S. Pat. No. 5,694,295 of Mochizuki et al. for HEAT PIPE AND PROCESS FOR MANUFACTURING THE SAME, which is hereby incorporated by reference for all that is disclosed therein.
  • a cooling device for cooling heat sources, such as integrated circuits or other electronic devices during operation.
  • the cooling device may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber both integrally formed therewith. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes.
  • a separate cover portion on the heat sink serves to seal the heat pipe chamber.
  • This separate cover portion allows the heat pipe chamber and the remainder of the heat sink to be integrally formed.
  • the separate cover portion may be attached to the remainder of the heat sink after the remainder of the heat sink portion is formed.
  • the cooling device may include extensions of the main heat pipe chamber which project into one or more of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually extended into the vanes to a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.
  • Also disclosed herein is a cooling device in which a separate heat pipe device is mechanically attached to a highly efficient heat sink.
  • FIG. 1 is a top plan view of a cooling device mounted on a heat source, the cooling device including a heat sink and a fan operatively associated therewith.
  • FIG. 2 is a top plan view of the heat sink of the cooling device of FIG. 1.
  • FIG. 3 is a cross-sectional elevation view taken along the line 3 - 3 in FIG. 2.
  • FIG. 4 is a bottom plan view of the heat sink of FIG. 2.
  • FIG. 5 is a cross-sectional elevation view, similar to FIG. 3, of another embodiment of the cooling device of FIG. 1.
  • FIG. 6 is a front elevational view of another embodiment of the cooling device of FIG. 1, mounted on a heat source.
  • FIGS. 1 - 6 in general, illustrate a cooling device 10 for dissipating heat from a heat source 26 .
  • the cooling device 10 may include a chamber 100 enclosed by at least a first wall portion 110 and a second wall portion 130 .
  • the first wall portion 110 may include a first wall portion outer surface 112 adapted to contact the heat source 26 and a first wall portion inner surface 114 oppositely disposed relative to the first wall portion outer surface 112 .
  • the first wall portion inner surface 114 may face the chamber 100 .
  • the second wall portion 130 may include a second wall portion inner surface 134 facing the chamber 100 and a second wall portion outer surface 132 oppositely disposed with respect to the second wall portion inner surface 134 .
  • a plurality of cooling vanes 80 may extend from the second wall portion outer surface 132 .
  • the plurality of cooling vanes 80 may be integrally formed with the second wall portion 130 .
  • FIGS. 1 - 6 further illustrate, in general, a cooling device 10 for dissipating heat from a heat source 26 .
  • the cooling device 10 may include a chamber 100 defined by at least one wall portion 110 , 130 , 150 and a plurality of fins 80 extending from the at least one wall portion 110 , 130 , 150 .
  • the chamber 100 extends into at least one of the plurality of fins 80 .
  • FIGS. 1 - 6 further illustrate, in general, a method of making a cooling device 10 including integrally forming a plurality of cooling vanes 80 into a heat sink portion 30 and integrally forming a chamber 100 within the heat sink portion 30 .
  • Cooling device 10 may be mounted to a heat source 26 , FIG. 3, in a conventional manner for the purpose of removing heat from the heat source 26 during operation thereof.
  • Heat source 26 may, for example, be an integrated circuit device.
  • cooling device 10 may include a fan 20 mounted within a fan chamber 50 of a heat sink 30 .
  • the fan 20 may be rotatable about a fan rotation axis A-A.
  • the fan 20 may be driven by a 12 volt DC brushless motor.
  • Fan 20 may, for example, be of the type commercially available from Matsushita Electric Company of Japan, sold as a “PANAFLO” Model FBA06A12U1A (with its housing removed).
  • Fan 20 may, for example, have a height (measured along the axis A-A) of about 25 mm and a diameter (at the tips of the fan blades) of about 57 mm.
  • the heat sink 30 may include a substantially planar bottom surface 112 , which is adapted to contact the upper surface of a heat source, such as the heat source 26 .
  • Heat sink 30 may include a central axis B-B which may extend in a perpendicular manner relative to the bottom surface 112 .
  • the fan chamber 50 may be generally cylindrical in shape and may be adapted to receive the fan 20 in a manner as shown in FIG. 1.
  • a plurality of slots 60 such as the individual slots 62 , 64 , 66 and 68 , may extend radially outwardly from the fan chamber 30 to the outer periphery 32 of the heat sink 30 .
  • a plurality of cooling vanes 80 such as the individual cooling vanes 82 , 84 , 86 , 88 may also extend radially outwardly from the fan chamber 30 to the outer periphery 32 .
  • one of the cooling vanes 80 will extend between every two of the slots 60 as illustrated, for example, with reference to the cooling vane 82 extending between the slots 62 and 64 and the cooling vane 86 extending between the slots 66 and 68 .
  • each of the cooling vanes 80 will have a radially inner face and a radially outer face.
  • the vane 86 for example, will have a radially inner face 90 and a radially outer face 92 .
  • the radially outer faces of all of the vanes 80 e.g., the radially outer face 92 of the vane 86
  • the radially inner faces of all of the vanes 80 together, form a generally annular “surface” 52 , FIG.
  • each of the vanes 80 may be thicker at the heat sink outer periphery 32 than at the fan chamber outer surface 52 .
  • Each of the slots 60 may, for example, have a width (as measured in a direction normal to the radial direction) of about 1.6 mm.
  • a portion of the slots 60 and vanes 80 may extend beneath the fan chamber 50 such that an upwardly facing edge portion of the vanes 80 (e.g., the upwardly facing edges 83 , 87 of the vanes 82 , 86 , respectively) form a lower “surface” 54 of the fan chamber 50 .
  • a recess 56 may be formed in the fan chamber lower surface 54 , as shown, in order to facilitate retention of the fan 20 , FIG. 1, within the fan chamber 50 in a conventional manner.
  • the outer periphery 32 of the heat sink 30 may include a pair of substantially flat portions 34 , 36 and a pair of arcuate portions 38 , 40 , as shown.
  • the flat portions 34 , 36 may be provided to facilitate fitting the cooling device 10 into a tightly confined area or to facilitate the use of multiple cooling devices in close proximity as described, for example in U.S. Pat. No. 5,740,013, previously referenced.
  • the heat sink outer periphery 32 may be formed having a completely circular profile or having virtually any desired profile as dictated by the particular cooling application.
  • the vanes 80 in the arcuate portions 38 and 40 will be generally thicker than the vanes 80 in the flat portions 34 , 36 due to the fact that the vanes 80 in the arcuate portions 38 and 40 have longer radial lengths than do those in the flat portions 34 , 36 .
  • the vanes 80 generally define a wall portion 42 extending between the fan chamber outer surface 52 and the outer periphery 32 of the heat sink 30 .
  • heat sink 30 may, for example, have a height “a” extending between the heat sink bottom surface 112 and the upper surface 94 of the vanes 80 .
  • a width “b” may extend between the arcuate portions 38 and 40 at the outer periphery 32 .
  • a width “c”, FIG. 1, may extend between the flat portions 34 and 36 at the outer periphery 32 .
  • the height “a” may, for example, be about 50 mm.
  • the widths “b” and “c” may, for example, be about 88 mm and about 64 mm, respectively.
  • heat sink 30 may include a chamber 100 , as shown.
  • Chamber 100 may generally be enclosed by a first wall portion 110 , a second wall portion 130 and a third wall portion 150 .
  • First wall portion 110 may include the outer bottom surface 112 , previously described, and an oppositely disposed inner surface 114 .
  • the outer surface 112 will have a shape substantially identical to the shape of the heat sink outer periphery 32 , FIGS. 1 and 3.
  • First wall portion 110 may include a separate portion 116 which may be attached to the remainder of the first wall portion 110 at a joint line 118 , as best shown in FIG. 4.
  • the separate portion 116 may be attached to the remainder of the first wall portion 110 via any conventional mechanism, such as welding or brazing.
  • the separate portion 116 may also have a circular configuration and, thus, may be threadingly attached to the remainder of the first wall portion 110 such that the separate portion 116 can be attached or removed from the remainder of the lower wall 110 by turning the separate portion 116 (about the axis B-B) relative to the remainder of the heat sink 30 .
  • First wall portion 110 has a thickness extending between the first wall portion outer and inner surfaces 112 , 114 .
  • second wall portion 130 may include an outer surface 132 and an inner surface 134 .
  • Second wall portion 130 may have an arcuate profile such that it extends convexly with respect to the interior of the chamber 100 .
  • Second wall portion outer surface 132 and inner surface 134 may each also have arcuate profiles as shown.
  • Second wall portion 130 has a thickness extending between the second wall portion outer and inner surfaces 132 , 134 , which may, for example, be about 2 mm.
  • second wall inner surface 134 will have a larger surface area than the first wall portion inner surface 114 , described above.
  • Third wall portion 150 may include an outer surface 152 and an inner surface 154 .
  • Third wall portion 150 may be substantially cylindrical, having a radius (about the axis B-B), for example, of about 18 mm. Accordingly, the third wall portion outer and inner surfaces 152 , 154 each have a substantially circular shape.
  • Third wall portion 150 has a thickness extending between the third wall portion outer and inner surfaces 152 , 154 , which may, for example, be about 2 mm.
  • the third wall portion outer surface 152 may form a lower surface of the fan chamber recess 56 previously described.
  • the outer surface 152 may be connected to the fan chamber lower surface 54 via a cylindrical surface portion 58 , as shown.
  • Cylindrical surface portion 58 has a height “e” which may, for example, be about 5 mm.
  • the chamber 100 has an interior height “f” which may, for example, be about 20 mm.
  • a partial vacuum may be provided within the chamber 100 and a fluid 12 , e.g., water, may be provided therewithin such that the chamber 100 functions as a heat pipe device.
  • a fluid 12 e.g., water
  • the level of vacuum applied may be chosen such that the vaporization point of the liquid 12 is lower than the desired maximum operating temperature of the heat source 26 .
  • the cooling device 10 may be located such that the bottom surface 112 is in contact with a heat source, such as the heat source 26 . Heat generated by the heat source will, thus, be transferred to the cooling device bottom surface 112 . This heat will thereafter be transferred through the first wall portion 110 to the first wall portion inner surface 114 . This, in turn, will cause the fluid 12 to vaporize. The resulting vapor will then move upwardly and condense on the inner surface 134 of the second wall portion 130 , which is at a lower temperature than the inner surface 114 of the first wall portion 110 . Heat, thus, is rapidly transferred from the surface 114 to the surface 134 using the latent heat of vaporization of the fluid 12 .
  • a heat source such as the heat source 26 .
  • the chamber 100 thus, allows heat to be rapidly and efficiently transferred from a relatively small area, corresponding to the size of the heat source 26 , to a relatively larger area, corresponding to the size of the second wall portion inner surface 134 .
  • the cooling device 10 described herein is very efficient because there are no joints or interfaces between the heat pipe chamber 100 and the heat dissipation surfaces. This is a result of the fact that, the heat pipe chamber 100 is integrally formed within the heat sink structure 30 .
  • the separate portion 116 facilitates the one-piece integral manufacture of the heat sink 30 , as described above.
  • the heat sink 30 may be manufactured in any conventional manner.
  • Heat sink 30 may, for example, be formed in a typical machining operation.
  • heat sink 30 may be formed in a forging, molding or casting operation.
  • the heat sink 30 may be formed from a material which conducts heat relatively well, such as aluminum or copper.
  • the chamber 100 may be partially evacuated such that a partial vacuum exists therein, in a well-known manner.
  • the provision of the separate portion 116 allows the heat pipe chamber 100 of the heat sink 30 to be integrally formed with the dissipation surfaces as described above.
  • this joint 118 is an interface, this interface does not substantially interfere with heat transfer from the heat source 26 to the dissipation surfaces. This is because heat from the heat source 26 will travel directly through the separate portion 116 to the surface 114 . Thereafter, in a manner as described above, the heat may be directly transferred to the fluid 12 . The heat, thus, does not need to cross the interface caused by the joint 118 in order to reach the dissipation surfaces.
  • the heat pipe chamber 100 may be constructed in a manner as is well known in the art.
  • the amount of fluid 12 , the composition of the fluid 12 and the amount of vacuum in the chamber 100 may all be chosen according to well-known principles, as described, for example, in U.S. Pat. No. 5,694,295, previously referenced.
  • first wall inner portion 114 may be provided with a roughened surface profile in order to facilitate boiling of the fluid 12 .
  • a roughened surface is well known and is discussed, for example, in U.S. Pat. No. 5,694,295, previously referenced.
  • the force of gravity is generally sufficient to cause the liquid condensed on the surface 134 to return to the surface 114 .
  • Such wicking features may also be used in a case where the cooling device 10 is mounted above the heat source in order to enhance the operating efficiency of the heat pipe chamber 100 .
  • Wicking features typically involve structures or surface treatments within the chamber 100 to induce capillary action. Such wicking features are generally well-known in the art; various examples thereof are described, for example, in U.S. Pat. No. 5,694,295, previously referenced.
  • Cooling vane configuration illustrated herein in association with the heat sink 30 is provided for exemplary purposes only. In practice, virtually any cooling vane arrangement and number could alternatively used.
  • Heat sink 30 may, for example, be configured having angled cooling vanes as described in U.S. Pat. No. 5,785,116, previously referenced.
  • the fan 20 has been described herein for exemplary purposes only; the heat sink 30 could, alternatively, be of the type not incorporating a fan.
  • FIG. 5 illustrates an alternative embodiment of the heat sink 30 of the cooling device 10 .
  • a plurality of chambers 160 may be provided within the cooling vanes 80 , as shown.
  • a chamber 162 may be provided within the cooling vane 82 and a chamber 166 withing the cooling vane 86 .
  • Each of the chambers 160 may communicate with the heat pipe chamber 100 via an opening.
  • the chambers 162 and 166 may communicate with the heat pipe chamber 100 via openings 172 and 176 , respectively.
  • Each of the chambers 160 may extend upwardly into the heat sink 30 for a distance “d” which may, for example, be about 30 mm.
  • the cooling vane chambers 160 serve to enhance the operation of the cooling device 10 by allowing the fluid 12 to actually condense within the cooling vanes 80 . This causes heat to be transferred very rapidly and efficiently from the surface 114 to points close to the surface of the cooling vanes 80 where heat may be transferred into the atmosphere. It is noted that the cooling vane chambers 160 may be provided in all of the cooling vanes 80 or only in some of the cooling vanes. The chambers 160 may be formed within the cooling vanes 80 , for example, by any conventional method. The chambers 160 may, for example, be formed by a machining operation. Alternatively, the chambers 160 may be molded or forged directly into the vanes 80 when the heat sink 30 is manufactured.
  • FIG. 6 illustrates a further embodiment in which a cooling device 200 include a heat sink portion 210 which is mechanically attached to a substantially cylindrical heat pipe 220 .
  • Heat sink portion 210 may be attached to the heat pipe 220 at a joint line 224 via any conventional method, such as by welding or adhesive bonding.
  • Heat pipe 220 may be substantially similar to the heat pipe chamber 100 previously described except that the heat pipe 220 may be substantially cylindrically shaped and may be formed separately from the heat sink 210 .
  • Heat sink 210 may, for example, be substantially identical to the heat sink structure disclosed in U.S. Pat. No. 5,785,116, previously referenced.
  • heat from a heat source 230 transfers through the lower wall of the heat pipe 220 .
  • This heat causes the fluid, not shown, within the heat pipe 220 to vaporize.
  • the vapor then travels to the upper interior wall of the heat pipe 220 and thereafter travels through the upper wall of the heat pipe 220 .
  • the heat crosses the joint line 224 and enters the base of the heat sink 210 .
  • the heat then travels through the heat sink 210 and is dissipated into the atmosphere in a manner, for example, as described in U.S. Pat. No. 5,785,116, previously referenced.
  • the heat pipe 220 thus, allows heat to be rapidly transferred from a relatively small area, corresponding to the heat source 230 to a relatively larger area, corresponding to the size of the base of the heat sink 210 .
  • the cooling device 200 thus, combines the advantages of a highly efficient heat sink device 210 with a heat pipe 220 .
  • the cooling device 200 will be somewhat less efficient than the cooling device 10 previously described, due to the fact that the cooling device 200 includes a joint line 224 which must be traversed by the heat when the heat source 230 is being cooled.
  • the cooling device 200 may be more easily manufactured than the cooling device 10 .

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US09/376,627 1999-08-18 1999-08-18 Cooling apparatus for electronic devices Abandoned US20010050164A1 (en)

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US09/376,627 US20010050164A1 (en) 1999-08-18 1999-08-18 Cooling apparatus for electronic devices
JP2000247419A JP2001094023A (ja) 1999-08-18 2000-08-17 電子デバイス用冷却装置
US10/208,065 US6986384B2 (en) 1999-08-18 2002-07-30 Cooling apparatus for dissipating heat from a heat source

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US09/376,627 US20010050164A1 (en) 1999-08-18 1999-08-18 Cooling apparatus for electronic devices

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