US20010001950A1 - Vacuum exhaust system - Google Patents
Vacuum exhaust system Download PDFInfo
- Publication number
- US20010001950A1 US20010001950A1 US09/252,236 US25223699A US2001001950A1 US 20010001950 A1 US20010001950 A1 US 20010001950A1 US 25223699 A US25223699 A US 25223699A US 2001001950 A1 US2001001950 A1 US 2001001950A1
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- auxiliary
- chamber
- pumping section
- exhaust system
- vacuum exhaust
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- 238000005086 pumping Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
Definitions
- the present invention relates to a vacuum exhaust system for use in evacuating a processing chamber for advanced products such as semiconductor devices, for example.
- FIG. 8 A conventional arrangement of a vacuum exhaust system used in semiconductor device manufacturing processes to evacuate a processing chamber for carrying out such process as etching and chemical vapor deposition (CVD) of semiconductor wafers is shown in FIG. 8.
- a main chamber (processing chamber) 10 is connected on both sides to auxiliary chambers (load lock chambers) 12 a , 12 b , for loading and unloading purposes through respective gates 14 .
- Each auxiliary chamber 12 a , 12 b is isolated from or open to the external environment by a gate 15 .
- the main chamber 10 is connected to a vacuum pump 18 through an exhaust path 16 having a valve 20 , and each auxiliary chamber 12 a , 12 b is connected similarly to a vacuum pump 24 through an exhaust path 22 having a valve 26 . It has been customary to use rotary oil pumps for the vacuum pumps 18 , 24 , but lately, dry pumps are used primarily for this type of work.
- a vacuum exhaust system for evacuating a main chamber and at least one associated auxiliary chamber comprising: a first pumping section; a second pumping section disposed downstream of and in series with the first pumping section; a main exhaust passage communicating the main chamber with a suction port of the first pumping section; at least one auxiliary exhaust passage communicating the auxiliary chamber with a suction port of the second pumping section.
- the main chamber can be evacuated with two pumping sections arranged in series, and the auxiliary chambers are evacuated with one of the pumping sections, thereby increasing the operating efficiency of each pumping section while keeping the capacity of each pump as small as practicable.
- the first and second pumping sections may share a common drive motor. Accordingly, one multi-stage vacuum pump can manage the task of evacuating an entire processing system so that the number of vacuum pumps can be reduced compared with a case of providing a vacuum pump for each auxiliary chamber.
- the first pumping section and the second pumping section may be provided with individual drive sections.
- the pumping sections may be controlled so as to obtain a minimum fluctuation in pressure, according to a pressure measured inside the main chamber. Accordingly, pressure changes can be held to a minimum in the main chamber which is an important chamber for processing advanced products such as semiconductor devices.
- Another aspect of the invention is a vacuum exhaust system for evacuating a main chamber and a plurality of associated auxiliary chambers, the plurality of auxiliary chambers having a connecting passage connecting each other which can be opened or closed to equalize pressure in the auxiliary chambers. Accordingly, vacuum environment present inside an auxiliary chambers can be utilized to lower the pressure of another auxiliary chamber which may be at an atmospheric pressure so that evacuation time can be significantly reduced to improve the operating efficiency of the overall evacuation operation.
- FIG. 1 is a schematic diagram of a first embodiment of the vacuum exhaust system of the present invention
- FIG. 2 is a time-chart showing the control steps for the first system shown in FIG. 1;
- FIG. 3 is a schematic diagram of a variation of the first system
- FIG. 4 is a schematic diagram of another embodiment of the vacuum exhaust system of the present invention.
- FIG. 5 is a time-chart showing the control steps for the second system shown in FIG. 4;
- FIG. 6 is a variation of the second system
- FIG. 7 is a schematic diagram of a third embodiment of the vacuum exhaust system of the present invention.
- FIG. 8 is a schematic diagram of a conventional vacuum exhaust system.
- FIGS. 1 and 2 relate to a first embodiment of the vacuum exhaust system of the present invention, which includes, as in the conventional systems, a main chamber 10 for carrying out processes such as etching and CVD of semiconductor wafers.
- An auxiliary chamber 12 a is attached, through a gate 14 a , to the main chamber 10 on the loading-side, and an auxiliary chamber 12 b is attached, through a gate 14 b , to the main chamber 10 on the unloading-side.
- Each of the auxiliary chambers 12 a , 12 b is isolated from and connected to the outside atmosphere through respective gates 15 a , 15 b.
- the two-stage pump 34 has a first pumping section 30 a on the upstream side, and a second pumping section 30 b on the downstream side.
- the pumping sections 30 a , 30 b share a common shaft connected to a variable-speed motor 32 .
- the two-stage pump 34 is provided with a suction port 34 a , and an exhaust port 34 b , and an intermediate port 34 c opening at a location between the pumping section 30 a , 30 b .
- the exhaust passage 16 for the main chamber 10 is connected through a valve 20 to the suction port 34 a , and the exhaust passages 22 a , 22 b , respectively, for auxiliary chambers 12 a , 12 b , are connected though respective valves 26 a , 26 b to the intermediate port 34 c.
- performance of the two-stage pump 34 is designed so as to enable exhaustion of the main chamber 10 at a first rotation speed n 1 , and to enable exhaustion of the main chamber 10 and one of the auxiliary chamber 12 a , 12 b concurrently at a second rotation speed n 2 which is larger than n 1 .
- This exhaustion system is provided with a control section 38 to control the operating parameters such as on/off and rotational speed for the variable speed motor 32 according to output signal from a pressure sensor 36 provided inside the main chamber 10 .
- Speed control can be effected by following a certain pre-selected pattern in sequence or by feedback control to follow signals output from the sensor 36 .
- FIG. 2 showing the time-sequence of a processing workpiece.
- the gate 15 a is opened to load the workpiece into the auxiliary chamber 12 a , and the gate 15 a is closed.
- valves 26 a , 20 are opened and the pump 34 is operated at the higher second speed n 2 , and the rotation speed is gradually reduced back to the first speed n 1 during a time interval (t 1 -t 2 ) so that the auxiliary chamber 12 a and the main chamber 10 are both evacuated.
- workpiece processing operation can be started.
- the auxiliary chamber 12 b While the processing is proceeding in the main chamber 10 , the auxiliary chamber 12 b will also be evacuated.
- the pump 34 is operated at the higher second speed n 2 and the rotation speed is gradually reduced back to the first speed n 1 during a time interval (t 2 -t 3 ).
- the pump 34 is operated at the first speed n 1 to complete the processing in the main chamber 10 during a time interval (t 3 -t 4 ).
- the gate 14 b is opened to unload the processed workpiece from the main chamber 10 to the auxiliary chamber 12 b at time t 4 .
- a new workpiece is placed inside the auxiliary chamber 12 b by opening the gate 15 a , so that the interior pressure is at an atmospheric pressure.
- the steps from time t 1 are repeated.
- the gate 15 b is opened to remove the processed workpiece from inside the auxiliary chamber 12 b.
- the embodied exhaustion system enables to operate the system with one pump by suitably switching the evacuation process among the main chamber and the auxiliary chambers thereby reliably maintaining the required load locking functions. And since the emphasis is placed on exhausting the main chamber by using a multi-stage pump, lowering of gas exhausting capability of the main chamber is avoided.
- valves 26 a , 20 are opened to evacuate the auxiliary chamber 12 a and the main chamber 10 , opening of the valve 26 a causes the pressure in the mid-chamber 35 of the pump 34 to increase, and the pump capacity is lowered so that the interior pressure in the main chamber 10 is also increased.
- the interior pressure can be monitored by a pressure sensor 36 so as to control the rotation-speed of the pump 34 at a speed between the second speed n 2 and the first speed n 1 .
- FIG. 3 shows a variation of the first embodiment, which uses two individual pumps connected in series.
- a first stage booster pump 42 is connected in series with a second stage main pump 46 .
- Each pump is driven by separate variable speed motors 40 , 44 , whose speeds can be controlled separately by a control section 38 .
- the exhaust passage 16 of the main chamber 10 is connected through a valve 20 to a suction port 42 a of the booster pump 42 , and the exhaust port of booster pump 42 and the suction port of main pump 46 are connected through a connecting pipe 50 having an intermediate port 52 .
- the exhaust passages 22 a , 22 b of the auxiliary chambers 12 a , 12 b are connected through the valves 26 a , 26 b to the intermediate port 52 . Operational characteristics of this embodiment system are the same as those in the first case, and their explanations will be omitted.
- the rotation speed of the pump can be feedback controlled using the output signals from a pressure sensor 36 .
- rotation speed of main pump 46 and booster pump 42 can be controlled independently to enable more precise control of the pressure.
- FIG. 4 is a schematic diagram of another embodiment of the vacuum exhaust system.
- This system includes: a connecting passage 60 to connect both auxiliary chambers 12 a , 12 b shown in FIG. 1 to equalize the vacuum pressure; and a valve 62 for opening or closing the connecting passage 60 .
- the valve 62 is controlled by a control section 38 to open in advance when either the auxiliary chamber 12 a or 12 b is exhausted.
- the embodied vacuum exhaust system is used, for example, when exhausting the auxiliary chamber 12 a after it has been loaded with a workpiece so that it is at an atmospheric pressure, in a way that the valve 62 is opened before the valve 26 a is opened to evacuate with the multi-stage pump 34 (at time t 5 ).
- the auxiliary chamber 12 b has a processed workpiece passed from the main chamber so that its interior pressure is maintained at some low pressure. Therefore, by opening the valve 62 , air flows from the auxiliary chamber 12 a to auxiliary chamber 12 b so that both chambers attain a common pressure intermediate between an atmospheric pressure and vacuum.
- valve 62 is closed, and as in FIG. 1, pump 34 is operated at a higher second speed n 2 (at time t 6 ) to exhaust both auxiliary chamber 12 a and main chamber 10 .
- n 2 at time t 6
- the initial pressure in the auxiliary chamber is less than an atmospheric pressure
- the length of time required to exhaust the auxiliary chamber is reduced compared with the system shown in FIG. 1.
- gate 15 b is opened and the processed workpiece is withdrawn.
- This system thus allows to utilize the reduced-pressure environment of the auxiliary chamber 12 b , which is normally discarded to waste, to shorten the evacuation time of the auxiliary chamber 12 a . This feature further contributes to increasing the operating efficiency of the overall vacuum exhaust system.
- valve 62 is first opened temporarily (time t 7 ) to introduce the vacuum environment in the auxiliary chamber 12 a before an unprocessed workpiece has been loaded into the auxiliary chamber 12 b (time t 7 -t 8 ) so that auxiliary chamber 12 b can be reduced in pressure, and then the multi-stage pump 34 is operated at a fast speed.
- the exhaustion time for the auxiliary chamber 12 b can be shortened.
- FIG. 6 shows a variation of the system shown in FIG. 4. This system is based on the variation based on the third embodiment shown in FIG. 3, and includes a connecting path 60 and a valve 62 which is designed to be opened before evacuating either of the auxiliary chamber 12 a or 12 b.
- FIG. 7 shows a third embodiment, and includes auxiliary chambers 12 a , 12 b having dedicated exhaust passages 22 a , 22 b , provided with respective vacuum pump 24 a , 24 b respectively, connected with connecting passage 60 , and within the connecting passage 60 , a valve 62 which is designed to open prior to evacuating either auxiliary chamber 12 a or 12 b .
- This system also enables to utilize waste vacuum, as in the systems shown in FIGS. 3 and 6, to shorten the exhaustion time required to evacuate the auxiliary chambers 12 a , 12 b.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a vacuum exhaust system for use in evacuating a processing chamber for advanced products such as semiconductor devices, for example.
- 2. Description of the Related Art
- A conventional arrangement of a vacuum exhaust system used in semiconductor device manufacturing processes to evacuate a processing chamber for carrying out such process as etching and chemical vapor deposition (CVD) of semiconductor wafers is shown in FIG. 8. A main chamber (processing chamber)10 is connected on both sides to auxiliary chambers (load lock chambers) 12 a, 12 b, for loading and unloading purposes through
respective gates 14. Eachauxiliary chamber gate 15. - The
main chamber 10 is connected to avacuum pump 18 through anexhaust path 16 having avalve 20, and eachauxiliary chamber vacuum pump 24 through anexhaust path 22 having avalve 26. It has been customary to use rotary oil pumps for thevacuum pumps - In this type of apparatus, in order to access the
main chamber 10 while it is under vacuum, loading or unloading of a workpiece into themain chamber 10 requires that anauxiliary chamber 12 be evacuated first, and thegate 14 opened next so as to avoid exposing themain chamber 10 to external atmosphere. This is done to prevent themain chamber 10 and associated piping from contamination as well as to improve productivity by shortening the time for re-starting. - In such conventional systems, a vacuum pump is provided for each chamber to evacuate individual chambers, therefore, working efficiency of each vacuum pumps is low. If the number of
main chambers 10 is increased in an effort to raise productivity, it leads to a problem that the number of vacuum pumps need to be increased, leading ultimately to a large size facility and higher running costs. If an attempt is made to shorten the time for evacuating the auxiliary chambers, a higher capacity for each pump is required, thus aggravating the above problems even further. - It is an object of the present invention to provide a vacuum exhaust system to enable as much sharing of vacuum pumps as possible, to improve the operating efficiency of the vacuum exhaust system while reducing the system cost, or to quickly attain a vacuum in the auxiliary chambers without increasing the size of the vacuum pumps.
- The object has been achieved in a vacuum exhaust system for evacuating a main chamber and at least one associated auxiliary chamber comprising: a first pumping section; a second pumping section disposed downstream of and in series with the first pumping section; a main exhaust passage communicating the main chamber with a suction port of the first pumping section; at least one auxiliary exhaust passage communicating the auxiliary chamber with a suction port of the second pumping section.
- Accordingly, the main chamber can be evacuated with two pumping sections arranged in series, and the auxiliary chambers are evacuated with one of the pumping sections, thereby increasing the operating efficiency of each pumping section while keeping the capacity of each pump as small as practicable.
- The first and second pumping sections may share a common drive motor. Accordingly, one multi-stage vacuum pump can manage the task of evacuating an entire processing system so that the number of vacuum pumps can be reduced compared with a case of providing a vacuum pump for each auxiliary chamber. However, the first pumping section and the second pumping section may be provided with individual drive sections.
- The pumping sections may be controlled so as to obtain a minimum fluctuation in pressure, according to a pressure measured inside the main chamber. Accordingly, pressure changes can be held to a minimum in the main chamber which is an important chamber for processing advanced products such as semiconductor devices.
- Another aspect of the invention is a vacuum exhaust system for evacuating a main chamber and a plurality of associated auxiliary chambers, the plurality of auxiliary chambers having a connecting passage connecting each other which can be opened or closed to equalize pressure in the auxiliary chambers. Accordingly, vacuum environment present inside an auxiliary chambers can be utilized to lower the pressure of another auxiliary chamber which may be at an atmospheric pressure so that evacuation time can be significantly reduced to improve the operating efficiency of the overall evacuation operation.
- FIG. 1 is a schematic diagram of a first embodiment of the vacuum exhaust system of the present invention;
- FIG. 2 is a time-chart showing the control steps for the first system shown in FIG. 1;
- FIG. 3 is a schematic diagram of a variation of the first system;
- FIG. 4 is a schematic diagram of another embodiment of the vacuum exhaust system of the present invention;
- FIG. 5 is a time-chart showing the control steps for the second system shown in FIG. 4;
- FIG. 6 is a variation of the second system;
- FIG. 7 is a schematic diagram of a third embodiment of the vacuum exhaust system of the present invention; and
- FIG. 8 is a schematic diagram of a conventional vacuum exhaust system.
- Preferred embodiments will be presented in the following with reference to the drawings.
- FIGS. 1 and 2 relate to a first embodiment of the vacuum exhaust system of the present invention, which includes, as in the conventional systems, a
main chamber 10 for carrying out processes such as etching and CVD of semiconductor wafers. Anauxiliary chamber 12 a is attached, through agate 14 a, to themain chamber 10 on the loading-side, and anauxiliary chamber 12 b is attached, through agate 14 b, to themain chamber 10 on the unloading-side. Each of theauxiliary chambers respective gates - To exhaust three
chambers stage pump 34 is used. The two-stage pump 34 has afirst pumping section 30 a on the upstream side, and asecond pumping section 30 b on the downstream side. Thepumping sections speed motor 32. The two-stage pump 34 is provided with asuction port 34 a, and anexhaust port 34 b, and an intermediate port 34 c opening at a location between thepumping section exhaust passage 16 for themain chamber 10 is connected through avalve 20 to thesuction port 34 a, and theexhaust passages auxiliary chambers respective valves - As shown in FIG. 2, performance of the two-
stage pump 34 is designed so as to enable exhaustion of themain chamber 10 at a first rotation speed n1, and to enable exhaustion of themain chamber 10 and one of theauxiliary chamber control section 38 to control the operating parameters such as on/off and rotational speed for thevariable speed motor 32 according to output signal from apressure sensor 36 provided inside themain chamber 10. Speed control can be effected by following a certain pre-selected pattern in sequence or by feedback control to follow signals output from thesensor 36. - Operation of the vacuum exhaust system in first embodiment will be explained with reference to FIG. 2 showing the time-sequence of a processing workpiece. First, the
gate 15 a is opened to load the workpiece into theauxiliary chamber 12 a, and thegate 15 a is closed. Next,valves pump 34 is operated at the higher second speed n2, and the rotation speed is gradually reduced back to the first speed n1 during a time interval (t1-t2) so that theauxiliary chamber 12 a and themain chamber 10 are both evacuated. After themain chamber 10 reaches a required pressure, workpiece processing operation can be started. - While the processing is proceeding in the
main chamber 10, theauxiliary chamber 12 b will also be evacuated. Thepump 34 is operated at the higher second speed n2 and the rotation speed is gradually reduced back to the first speed n1 during a time interval (t2-t3). After theauxiliary chamber 12 b is exhausted, thepump 34 is operated at the first speed n1 to complete the processing in themain chamber 10 during a time interval (t3-t4). - Next, the
gate 14 b is opened to unload the processed workpiece from themain chamber 10 to theauxiliary chamber 12 b at time t4. During the processing interval in themain chamber 10, a new workpiece is placed inside theauxiliary chamber 12 b by opening thegate 15 a, so that the interior pressure is at an atmospheric pressure. At this point, the steps from time t1 are repeated. In the meantime, thegate 15 b is opened to remove the processed workpiece from inside theauxiliary chamber 12 b. - By following the steps described above, the embodied exhaustion system enables to operate the system with one pump by suitably switching the evacuation process among the main chamber and the auxiliary chambers thereby reliably maintaining the required load locking functions. And since the emphasis is placed on exhausting the main chamber by using a multi-stage pump, lowering of gas exhausting capability of the main chamber is avoided.
- In the above case, although the rotation speed was controlled sequentially according to a pre-determined pattern, it is permissible to use a feedback control according to signals output from a
pressure sensor 36. Whenvalves auxiliary chamber 12 a and themain chamber 10, opening of thevalve 26 a causes the pressure in themid-chamber 35 of thepump 34 to increase, and the pump capacity is lowered so that the interior pressure in themain chamber 10 is also increased. To avoid such critical pressure fluctuation in themain chamber 10, the interior pressure can be monitored by apressure sensor 36 so as to control the rotation-speed of thepump 34 at a speed between the second speed n2 and the first speed n1. - FIG. 3 shows a variation of the first embodiment, which uses two individual pumps connected in series. A first
stage booster pump 42 is connected in series with a second stagemain pump 46. Each pump is driven by separatevariable speed motors control section 38. - The
exhaust passage 16 of themain chamber 10 is connected through avalve 20 to asuction port 42 a of thebooster pump 42, and the exhaust port ofbooster pump 42 and the suction port ofmain pump 46 are connected through a connectingpipe 50 having anintermediate port 52. Theexhaust passages auxiliary chambers valves intermediate port 52. Operational characteristics of this embodiment system are the same as those in the first case, and their explanations will be omitted. - In this example also, the rotation speed of the pump can be feedback controlled using the output signals from a
pressure sensor 36. In this example, rotation speed ofmain pump 46 andbooster pump 42 can be controlled independently to enable more precise control of the pressure. - FIG. 4 is a schematic diagram of another embodiment of the vacuum exhaust system. This system includes: a connecting
passage 60 to connect bothauxiliary chambers valve 62 for opening or closing the connectingpassage 60. Thevalve 62 is controlled by acontrol section 38 to open in advance when either theauxiliary chamber - The embodied vacuum exhaust system is used, for example, when exhausting the
auxiliary chamber 12 a after it has been loaded with a workpiece so that it is at an atmospheric pressure, in a way that thevalve 62 is opened before thevalve 26 a is opened to evacuate with the multi-stage pump 34 (at time t5). At this time, theauxiliary chamber 12 b has a processed workpiece passed from the main chamber so that its interior pressure is maintained at some low pressure. Therefore, by opening thevalve 62, air flows from theauxiliary chamber 12 a toauxiliary chamber 12 b so that both chambers attain a common pressure intermediate between an atmospheric pressure and vacuum. - After this stage,
valve 62 is closed, and as in FIG. 1, pump 34 is operated at a higher second speed n2 (at time t6) to exhaust bothauxiliary chamber 12 a andmain chamber 10. In this case, because the initial pressure in the auxiliary chamber is less than an atmospheric pressure, the length of time required to exhaust the auxiliary chamber is reduced compared with the system shown in FIG. 1. In theauxiliary chamber 12 b,gate 15 b is opened and the processed workpiece is withdrawn. This system thus allows to utilize the reduced-pressure environment of theauxiliary chamber 12 b, which is normally discarded to waste, to shorten the evacuation time of theauxiliary chamber 12 a. This feature further contributes to increasing the operating efficiency of the overall vacuum exhaust system. - Similarly, when exhausting the
auxiliary chamber 12 b,valve 62 is first opened temporarily (time t7) to introduce the vacuum environment in theauxiliary chamber 12 a before an unprocessed workpiece has been loaded into theauxiliary chamber 12 b (time t7-t8) so thatauxiliary chamber 12 b can be reduced in pressure, and then themulti-stage pump 34 is operated at a fast speed. Thus, the exhaustion time for theauxiliary chamber 12 b can be shortened. - FIG. 6 shows a variation of the system shown in FIG. 4. This system is based on the variation based on the third embodiment shown in FIG. 3, and includes a connecting
path 60 and avalve 62 which is designed to be opened before evacuating either of theauxiliary chamber - FIG. 7 shows a third embodiment, and includes
auxiliary chambers exhaust passages respective vacuum pump 24 a, 24 b respectively, connected with connectingpassage 60, and within the connectingpassage 60, avalve 62 which is designed to open prior to evacuating eitherauxiliary chamber auxiliary chambers
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP10-052984 | 1998-02-18 | ||
JP52984/1998 | 1998-02-18 | ||
JP10052984A JPH11230036A (en) | 1998-02-18 | 1998-02-18 | Evacuating system |
Publications (2)
Publication Number | Publication Date |
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US20010001950A1 true US20010001950A1 (en) | 2001-05-31 |
US6251192B1 US6251192B1 (en) | 2001-06-26 |
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Application Number | Title | Priority Date | Filing Date |
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US09/252,236 Expired - Fee Related US6251192B1 (en) | 1998-02-18 | 1999-02-18 | Vacuum exhaust system |
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US (1) | US6251192B1 (en) |
JP (1) | JPH11230036A (en) |
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US6251192B1 (en) | 2001-06-26 |
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