US1992244A - Process of making bullets - Google Patents

Process of making bullets Download PDF

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Publication number
US1992244A
US1992244A US209195A US20919527A US1992244A US 1992244 A US1992244 A US 1992244A US 209195 A US209195 A US 209195A US 20919527 A US20919527 A US 20919527A US 1992244 A US1992244 A US 1992244A
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US
United States
Prior art keywords
plating
lead
slug
copper
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US209195A
Inventor
Alfons G Schuricht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Western Cartridge Co
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Western Cartridge Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Western Cartridge Co filed Critical Western Cartridge Co
Priority to US209195A priority Critical patent/US1992244A/en
Application granted granted Critical
Publication of US1992244A publication Critical patent/US1992244A/en
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Expired - Lifetime legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42AMMUNITION; BLASTING
    • F42BEXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B12/00Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material
    • F42B12/72Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material
    • F42B12/76Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material of the casing
    • F42B12/78Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material of the casing of jackets for smallarm bullets ; Jacketed bullets or projectiles
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22Electroplating combined with mechanical treatment during the deposition
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/623Porosity of the layers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42AMMUNITION; BLASTING
    • F42BEXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B12/00Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material
    • F42B12/72Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material
    • F42B12/76Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material of the casing
    • F42B12/80Coatings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12701Pb-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12903Cu-base component

Definitions

  • One or the objects oi this is to provide a copper plated lead or lead alloy Ml bullet and process of making the same, whereby the copper plating will not only closely and firmly cohere to the lead sing or core, but in which this plating will be dense, hard and homogeneous.
  • Another object is to provide a process which is 85 readily controllable and in which the plating may be carried out in a'simple, expeditious and economical manner.
  • FIG. 2 is a similar view, showing the platin lead alloy bullets, greatly improved invention, therefore,
  • Figure '4 is a section, somewhat enlarged, or a lead or leadalloy slug formed-to provide a shot 50 shell shot;
  • Figure 5 shows the slug Figure 4 plated.
  • the copper plating is deposited on the lead or lead alloy slug in an 55 alkaline electrolyte, such as alkaline cuprous cy- PATENT OFFICE 1,992,244 rnocsss or'maxmc BULLETS Alton, 111., assignor to East Alton, n1.,
  • the solution or electrolyte is maintained hot and agitated to secure a uniform plating, the concentration is maintained and the plating is mechanically condensed and burnished while the deposit proceeds. While a satisfactory deposit is'obtainabie by an alkaline electrolyte, the latter is not susceptible of the ease of control, nor simplicity, as is' the case where an acid electrolyte is used.
  • Another feature of this invention therefore, resides in the fact that the copper deposit is started in an alkalineelectrolyte and finished in an acid electrolyte, such as copper sulphate.
  • a copper film is deposited or flashed on the lead or lead alloy slug or core in an alkaline electrolyte and the plating is then built up to the desired thickness in the acid electrolyte.
  • the plating is condensed and conformed at the driving band so as to cause the plated band to accurately lit the rifling.
  • this condensation and conformation can be accomplished in any suitable manner, as by rolling or swaging the driving band to size.
  • the slug is formed to the desired shape as described in the Patent No. 1,732,211.
  • the lead or lead alloy is suitably formed by a swaging die or in any other suitable manner, so as to provide a formation whose shape is that of. the finished bullet, but whose volume is slightly below that of the finished bullet, in order to allow for the plating which is to be deposited.
  • the slug is designed to form the core.
  • the lead alloy can be formed in any suitable manner, as in a shot tower; in such a case, however, it is desirable that graphiting and grease be avoided as much as possible.
  • the slug is to form the core of a ball, such as the single ball used in a shot shell, the formation thereot can be secured in any suitable manner.
  • the surfaces thereof are cleaned so as to permit a coherlng plating to be deposited thereon; this may be secured by tumbling the slugs in a hot solution of soda ash until they are perfectly clean.
  • the plating is to be finished in an alkaline solution, it is proceeded with until the desired thickness has been attained, care being used the concentration. .In practical film is deposited or flashed the form of the bullet.
  • FIG. 1 a formed slug designed to provide a rifle bullet is shown at l and, as shown, it is provided with a shot or ball, thereto as shownin Figure 5.
  • the process comprising, depositing a plating of copper ona lead slug in an alkaline electrolyte while the plating is being mechanically condensed or burnished.
  • the process comprising, depositing a plating of copper on a. lead slug in an alkaline electrolyte and condensing and conforming the plated slug at the driving band so as to iii; the riiiing.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

Feb. 26, 1935.
ALrmvs 6. Scwweva-ur,
. 10 secured by w s t. a, 1935 Alfons G. Schuflcht,
Western CartridgcCompany, I a corporation of Delaware Application 2 Claims- Tms invention relates to bullets or projectiles such as rifle bullets, shot gun shot, balls, etc., and
more particularly to abullet embodying a slug oi! lead or a lead alloy plated with copper. This in- 5 vention is a further development or that or Paten N0. 1,732,211, October 15, 1929.
In the manufacture or lead or the characteristics thereof are by plating the same with copper, especially if electrodeposition. However, a closely cohering plating cannot be secured where the electrodeposition is in an acid solution or electrolyte, such as copper sulphate; nor is the plating dense or hard, but rather sp n y. This is be- 15 lieved to be due to a number of causes, among which may be mentioned the following: the acid ally with the lead, coating the same with a film of lead sulphate, which not only prevents the copper from cohering 20 tothe lead, but also prevents a dense and homogeneous plating from being built up; furthermore, since lead is above copper in the electrochemical series, deposition of copper on the lead cccursoy immersion,'which results in the deposit 28 being spongy. A non-cohesive spongy plating does not, however, give such a coating for a bullet as is desirable.
One or the objects oi this is to provide a copper plated lead or lead alloy Ml bullet and process of making the same, whereby the copper plating will not only closely and firmly cohere to the lead sing or core, but in which this plating will be dense, hard and homogeneous.
Another object is to provide a process which is 85 readily controllable and in which the plating may be carried out in a'simple, expeditious and economical manner.
Further objects will appear from the detail description, taken in connection with the accompanying drawing, in which- Figure 1 is a section, considerably enlarged, of a lead or lead alloy slug iormed to provide a small calibre rifle bullet;
Figure 2 is a similar view, showing the platin lead alloy bullets, greatly improved invention, therefore,
Figur 3 is a view showing the bullet mounted and secured in its cartridge shell;
Figure '4 is a section, somewhat enlarged, or a lead or leadalloy slug formed-to provide a shot 50 shell shot; and
Figure 5 shows the slug Figure 4 plated. One of the ieatures of this invention, generally stated, resides in the fact that the copper plating is deposited on the lead or lead alloy slug in an 55 alkaline electrolyte, such as alkaline cuprous cy- PATENT OFFICE 1,992,244 rnocsss or'maxmc BULLETS Alton, 111., assignor to East Alton, n1.,
July 29, 927, Serial No. 209,195
anide. In accordance with a practical embodiment of this invention, the solution or electrolyte is maintained hot and agitated to secure a uniform plating, the concentration is maintained and the plating is mechanically condensed and burnished while the deposit proceeds. While a satisfactory deposit is'obtainabie by an alkaline electrolyte, the latter is not susceptible of the ease of control, nor simplicity, as is' the case where an acid electrolyte is used. Another feature of this invention, therefore, resides in the fact that the copper deposit is started in an alkalineelectrolyte and finished in an acid electrolyte, such as copper sulphate. In accordance with a practical embodiment of this invention, a copper film is deposited or flashed on the lead or lead alloy slug or core in an alkaline electrolyte and the plating is then built up to the desired thickness in the acid electrolyte.
Where accuracy of formation is desired, as in the case of small calibre rifle bullets, the plating is condensed and conformed at the driving band so as to cause the plated band to accurately lit the rifling. In-a practical embodiment of this invention, this condensation and conformation can be accomplished in any suitable manner, as by rolling or swaging the driving band to size.
Further features will appear from the detail description, in which will be described and illustrated practical embodiments of this invention; it will be understood, however, that this invention is susceptiblemf various other embodiments. As a practical embodiment of this invention, the slug is formed to the desired shape as described in the Patent No. 1,732,211. Where the slug is to form a small calibre rifle bullet, such as for a .22 calibre rifle, the lead or lead alloy is suitably formed by a swaging die or in any other suitable manner, so as to provide a formation whose shape is that of. the finished bullet, but whose volume is slightly below that of the finished bullet, in order to allow for the plating which is to be deposited. In a case where the slugis designed to form the core. of a shot shell shot, the lead alloy can be formed in any suitable manner, as in a shot tower; in such a case, however, it is desirable that graphiting and grease be avoided as much as possible. Where the slug is to form the core of a ball, such as the single ball used in a shot shell, the formation thereot can be secured in any suitable manner.
In whatever manner the slug is formed, the surfaces thereof are cleaned so as to permit a coherlng plating to be deposited thereon; this may be secured by tumbling the slugs in a hot solution of soda ash until they are perfectly clean.
from an arm so that it is immersed in the electrolyte. Where an alkaline cyanide electrolyte is used, brass and aluminum should be avoided, and all metal parts should be since it is not attacked by the electrolyte.
In the plating of leadbullets designed for small calibre rifles and in which must be accurately maintained; it is necessary to have provisions preventing de-formation of the bullet during the tumbling action. Such deformation is oi non-conducting material, lain, quartz, etc., may be used.
Where the plating is to be finished in an alkaline solution, it is proceeded with until the desired thickness has been attained, care being used the concentration. .In practical film is deposited or flashed the form of the bullet.
on the lead or lead alloy slug until the latter is entirely covered with copper. The slugs are then centrat'ion of the solution is maintained by solution 01' the anode, and since higher current'and densities may be .employed, the plating is carried out expeditiously, conveniently and economically.
oiT. The plated able manner, as by air, centrifuge, bling with saw dust, either with or application of heat.
The drawing illustrates embodiments of this invention. In Figure 1 a formed slug designed to provide a rifle bullet is shown at l and, as shown, it is provided with a shot or ball, thereto as shownin Figure 5.
It will, therefore, be seen that the invention accomplishes its objects. A closely coherlng,
dense and homogeneous plating is formed on the plating ofsumcient stability to prevent deformation of the shot under the conditions encountered.
be understood that certain features, operations and sub-combinations are of utility and may be employed without reference to other features, op erations and sub-combinations; that is contem-f' plated by and is within the scope of the appended claims. It is furthermore obvious that various changes may be made in details and operations, within the scope of the appended claims, without departing from the spirit of this invention. It is, therefore, to be understood that this invention is not limited to the specific details and operations shown and/or described. I
Having thus described the invention what is claimed is:
1. In the art of making bullets, the process comprising, depositing a plating of copper ona lead slug in an alkaline electrolyte while the plating is being mechanically condensed or burnished.
2. In the art of making small calibre rifle bullets, the process comprising, depositing a plating of copper on a. lead slug in an alkaline electrolyte and condensing and conforming the plated slug at the driving band so as to iii; the riiiing.
ALFONS G. CHT.
US209195A 1927-07-29 1927-07-29 Process of making bullets Expired - Lifetime US1992244A (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2420291A (en) * 1940-07-22 1947-05-13 Nat Standard Co Electrodepositing copper upon steel wire
US5357866A (en) * 1993-08-20 1994-10-25 Remington Arms Company, Inc. Jacketed hollow point bullet and method of making same
US5528988A (en) * 1992-10-07 1996-06-25 Boliden Mineral Ab Shot pellets for wild game hunting and a method for its manufacture
US5597975A (en) * 1995-10-04 1997-01-28 Mcgean-Rohco, Inc. Mechanical plating of small arms projectiles
WO2000037878A1 (en) * 1998-12-23 2000-06-29 Beal Harold F Small bore frangible ammunition projectile
US6317946B1 (en) 1997-01-30 2001-11-20 Harold F. Beal Method for the manufacture of a multi-part projectile for gun ammunition and product produced thereby
US6551376B1 (en) 1997-03-14 2003-04-22 Doris Nebel Beal Inter Vivos Patent Trust Method for developing and sustaining uniform distribution of a plurality of metal powders of different densities in a mixture of such metal powders
US6607692B2 (en) 1997-01-30 2003-08-19 Doris Nebel Beal Intervivos Patent Trust Method of manufacture of a powder-based firearm ammunition projectile employing electrostatic charge
US20030213396A1 (en) * 2002-03-04 2003-11-20 Dippold Jack D. Bullet
US20060042456A1 (en) * 2002-08-16 2006-03-02 Bismuth Cartridge Company Method of making a frangible non-toxic projectile

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2420291A (en) * 1940-07-22 1947-05-13 Nat Standard Co Electrodepositing copper upon steel wire
US5528988A (en) * 1992-10-07 1996-06-25 Boliden Mineral Ab Shot pellets for wild game hunting and a method for its manufacture
US5357866A (en) * 1993-08-20 1994-10-25 Remington Arms Company, Inc. Jacketed hollow point bullet and method of making same
US5597975A (en) * 1995-10-04 1997-01-28 Mcgean-Rohco, Inc. Mechanical plating of small arms projectiles
US6607692B2 (en) 1997-01-30 2003-08-19 Doris Nebel Beal Intervivos Patent Trust Method of manufacture of a powder-based firearm ammunition projectile employing electrostatic charge
US6626114B2 (en) 1997-01-30 2003-09-30 Doris Nebel Beal Intervivos Patent Trust Projectile having a disc and multiple cores
US6317946B1 (en) 1997-01-30 2001-11-20 Harold F. Beal Method for the manufacture of a multi-part projectile for gun ammunition and product produced thereby
US6551376B1 (en) 1997-03-14 2003-04-22 Doris Nebel Beal Inter Vivos Patent Trust Method for developing and sustaining uniform distribution of a plurality of metal powders of different densities in a mixture of such metal powders
WO2000037878A1 (en) * 1998-12-23 2000-06-29 Beal Harold F Small bore frangible ammunition projectile
US20030213396A1 (en) * 2002-03-04 2003-11-20 Dippold Jack D. Bullet
US6935243B2 (en) * 2002-03-04 2005-08-30 Olin Corporation Bullet
US20060090665A1 (en) * 2002-03-04 2006-05-04 Olin Corporation Bullet
US7162942B2 (en) 2002-03-04 2007-01-16 Olin Corporation Bullet
US20060042456A1 (en) * 2002-08-16 2006-03-02 Bismuth Cartridge Company Method of making a frangible non-toxic projectile

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