US1785493A - Method of making plated shot - Google Patents

Method of making plated shot Download PDF

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Publication number
US1785493A
US1785493A US331395A US33139529A US1785493A US 1785493 A US1785493 A US 1785493A US 331395 A US331395 A US 331395A US 33139529 A US33139529 A US 33139529A US 1785493 A US1785493 A US 1785493A
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US
United States
Prior art keywords
shot
lead
copper
globules
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US331395A
Inventor
Pugsley Edwin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Winchester Repeating Arms Co
Original Assignee
Winchester Repeating Arms Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Winchester Repeating Arms Co filed Critical Winchester Repeating Arms Co
Priority to US331395A priority Critical patent/US1785493A/en
Application granted granted Critical
Publication of US1785493A publication Critical patent/US1785493A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal

Definitions

  • This invention relates to methods of making shot for shot shellsand more particularly to a method of making plated shot.
  • the strength of the copper sulphate solu- 5 tion may vary within wide limits.
  • the quantity of iron added to the solution may also vary as it is merely necessary thatsome metallic iron be in contact with the shot at all 1 times to replace the copper and the iron may '50 be added periodically to the tank contain- COMPANY, A CORPORATION OF DELA- Miirnon or Max ne PLATED snocr ⁇ Application filed January 9, 1929. Serial No. 331,895.
  • My invention is applicable to shot made either of lead or an alloy of lead and throughout the claims the Word lead is used to include the .various alloys of lead employed in the manufacture of shot.
  • I claim: 1 v 1. The process of making plated lead shot which comprises dropping globules of mol ten'lead' into a solution of a metallic salt containing a metal adapted to replace the metal of the salt when lead is dipped in the solution whereby the globules are formed into shot andplated with-the metal of the salt.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

Patented Dec. 16, 1930 UNITED STATES PATENT OFFICE EDWIN PUGSLEY, OF NEW HAVEN, CONNECTICUT, ASSIGNOR, BY MESNE ASSIGN- MEN'I'S, TO WINCHESTER REPEATING ARMS WARE No Drawing.
This invention relates to methods of making shot for shot shellsand more particularly to a method of making plated shot.
In the manufacture of shot at the present time globules of molten lead, or an alloy of lead, are dropped into a bath ofwater. When the globules of moltenlead'fall into the tank of water the metal is chilled formingthe shot. In some instances the shot is plated with various metals, such as copper, and heretofore this plating operation has been performed by'the usual electroplating process using electric current supplied to a plating bath in which the unplated shot is placed. Articles made 'of lead may also be plated with copper by dipping them in a copper sulphate solution containing a quantity of metallic iron, but such process has not been utilized for plating shot as it is more expensive than the ordinary electroplating process.
In the present invention I provide a method of making plated shot wherein the two-step process of forming the shot and I then electroplating it is materially simplified, and the same, or better, results obtained by means of a one-step process. Instead of using a water bath for chilling the molten lead, I drop the globules of lead into a solution that will form the'shot, and at-the same time, provide a plating of the desired metal on the shot. Thus when a copper plating is desired, a solution of copper sulphate containing a quantity of metallic iron may be used. I preferably employ iron in the form.
of degreased chips or other clean scrap. The globules of molten lead, or lead alloy, are dropped into. this solution whence they are 0 chilled and form shot. In contact with lead, themetallic iron replaces the copper of the copper sulphate and the released metallic copper plates the formed shot.
The strength of the copper sulphate solu- 5 tion may vary within wide limits. The quantity of iron added to the solution may also vary as it is merely necessary thatsome metallic iron be in contact with the shot at all 1 times to replace the copper and the iron may '50 be added periodically to the tank contain- COMPANY, A CORPORATION OF DELA- Miirnon or Max ne PLATED snocr \Application filed January 9, 1929. Serial No. 331,895.
ing the copper sulphate solution into which the lead globules are dropped.
An important commercial consideration in connection with my invention is thatin every ammunition manufacturing plant where lead shot is made, a solution of copper sulphate and z nc-sulphate is alwaysravailable as a Waste product from various operations in the tanks at thebase of the shot tower. The lead,
or alloy of lead, is formed into molten globules 1n the same manner as heretofore employed in the manufacture of shot and then dropped into this solution. When the plated shot is removed from the tanks at the base of the tower, it may in' the customary manner.
My invention is applicable to shot made either of lead or an alloy of lead and throughout the claims the Word lead is used to include the .various alloys of lead employed in the manufacture of shot.
I claim: 1 v 1. The process of making plated lead shot which comprises dropping globules of mol ten'lead' into a solution of a metallic salt containing a metal adapted to replace the metal of the salt when lead is dipped in the solution whereby the globules are formed into shot andplated with-the metal of the salt.
2. The process of making plated lead shot which comprises dropping globules of molten lead into a solution of a soluble copper salt containing metallic iron whereby the copper of the salt is replaced by the iron, the globules formed into shot and the shot plated with copper.
3. The process of making plated lead shot be tumbled and inspected which comprises dropping globules of molten lead into a solution of copper sulphate containing metallic iron whereb iron sulphate and metallic copper are ormed, the
5 lead globules formed into the shot and the shot plated with copper.
In testimony whereof I affix my signature.
EDWIN PUGSLEY.
US331395A 1929-01-09 1929-01-09 Method of making plated shot Expired - Lifetime US1785493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US331395A US1785493A (en) 1929-01-09 1929-01-09 Method of making plated shot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US331395A US1785493A (en) 1929-01-09 1929-01-09 Method of making plated shot

Publications (1)

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