US1844925A - Electrolytic reduction of copper oxide surface of rectifiers - Google Patents

Electrolytic reduction of copper oxide surface of rectifiers Download PDF

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Publication number
US1844925A
US1844925A US324501A US32450128A US1844925A US 1844925 A US1844925 A US 1844925A US 324501 A US324501 A US 324501A US 32450128 A US32450128 A US 32450128A US 1844925 A US1844925 A US 1844925A
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US
United States
Prior art keywords
copper
oxidized
rectifier
oxide
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US324501A
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English (en)
Inventor
Kahler Herbert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric and Manufacturing Co filed Critical Westinghouse Electric and Manufacturing Co
Priority to US324501A priority Critical patent/US1844925A/en
Priority to DES95174D priority patent/DE506374C/de
Application granted granted Critical
Publication of US1844925A publication Critical patent/US1844925A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
    • H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
    • H01L21/165—Reduction of the copper oxide, treatment of the oxide layer

Definitions

  • - igure 1 is a perspective view showing an apparatus for electrolytically reducing the surface of anoxidized copper disc suitable for a contact rectifier unit;
  • the method of preparing an oxidized copper rectifier which comprises applying a thin layer of electrolyte to the oxidized surface of the copper rectifier, immediately thereafter passing a current through said electrolyte to the oxidized surface of the copper oxide rectifier and then immediately evaporating the remaining electrolyte before it has time to penetrate to the copper.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Electrolytic Production Of Metals (AREA)
US324501A 1928-12-07 1928-12-07 Electrolytic reduction of copper oxide surface of rectifiers Expired - Lifetime US1844925A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US324501A US1844925A (en) 1928-12-07 1928-12-07 Electrolytic reduction of copper oxide surface of rectifiers
DES95174D DE506374C (de) 1928-12-07 1929-11-26 Vorrichtung zum oberflaechlichen Reduzieren der Oxydschicht von Metall-Oxyd-Gleichrichterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US324501A US1844925A (en) 1928-12-07 1928-12-07 Electrolytic reduction of copper oxide surface of rectifiers

Publications (1)

Publication Number Publication Date
US1844925A true US1844925A (en) 1932-02-09

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ID=23263865

Family Applications (1)

Application Number Title Priority Date Filing Date
US324501A Expired - Lifetime US1844925A (en) 1928-12-07 1928-12-07 Electrolytic reduction of copper oxide surface of rectifiers

Country Status (2)

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US (1) US1844925A (de)
DE (1) DE506374C (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2745798A (en) * 1951-11-06 1956-05-15 Batist R Haueisen Method of coating metal surfaces
US2755236A (en) * 1953-06-15 1956-07-17 Sprague Electric Co Catalyst
US3188240A (en) * 1961-09-11 1965-06-08 Northrop Corp Copper oxide insulation layer for thermoelectric devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2745798A (en) * 1951-11-06 1956-05-15 Batist R Haueisen Method of coating metal surfaces
US2755236A (en) * 1953-06-15 1956-07-17 Sprague Electric Co Catalyst
US3188240A (en) * 1961-09-11 1965-06-08 Northrop Corp Copper oxide insulation layer for thermoelectric devices

Also Published As

Publication number Publication date
DE506374C (de) 1930-09-04

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