US1552591A - Metal-plating device - Google Patents

Metal-plating device Download PDF

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Publication number
US1552591A
US1552591A US638877A US63887723A US1552591A US 1552591 A US1552591 A US 1552591A US 638877 A US638877 A US 638877A US 63887723 A US63887723 A US 63887723A US 1552591 A US1552591 A US 1552591A
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United States
Prior art keywords
metal
plating
receptacle
plated
plating device
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Expired - Lifetime
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US638877A
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Peter J F Batenburg
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Individual
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Priority to US638877A priority Critical patent/US1552591A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/14Electrodes, e.g. composition, counter electrode for pad-plating

Definitions

  • the invention relates to a device for plating metal.
  • the primary object of the invention is to provide an easily handled and inexpensive device for plating metal and more particularly designed for retouching or restoring worn or defective plating.
  • a further object of the invention is to provide a metal plating device which may be efficiently used on surfaces of varying contour and which burnishes the plated surface during the process of plating.
  • the invention further consists in the several features hereinafter set forth and more particularly defined by claim at the conclusion hereof.
  • the drawing shows a vertical sectional view through a plating device embodying the invention.
  • the numeral 2 designates an electrode or anode of suitable metal, and should be the metal or contain the metal which is to be deposited, to which an end of a current-supply-wire 3 is firmly connected, said Wire preferably having an insulated covering 4.
  • the anode 2 is disposed within a receptacle 5 whose surface for contact with the object to be plated should be porous.
  • This receptacle is conveniently formed of flexible porone material of any suitable kind.
  • the receptacle may be formed in any suitable manner and is here shown as a fiat piece of fabri whose edges have been drawn up around the electrode and secured by a cord 6 bind- Ii)ng them aboutthe wire 3 and forming a is noted in the drawing, the receptacle 5 is filled with a moisture absorbent material and salts of the metal to be plated. Sawdust or absorbent cotton, forming a loose filler, or other suitable material may be used as the absorbent material. As the covering forming the receptacle is easily opened new salts and filler may be readily supplied.
  • the filler of material within the receptacle is loose or adapted to conform to the shape of the re- .ceptacle and the part of the receptacle for contact with the surface being plated is-flexible, there is no difficulty in plating surfaces of irregular contour.
  • WOI'II'OI defective plating of previously plated surfaces may be restored or'touched up.
  • the device may be used for.
  • a metal plating device In a metal plating device. the combination of an anode, a yieldable displaceable absorbent filler. salts of the metal to be deposited associated with the filler. and a piece of porous polishing material enclosing said anode and filler, a current conductor secured to the anode, andmeans for binding said polishing material about said conductor.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

Sept. 8, 1925. 1,552,591
P. J. F. BATENBURG METAL PLATING DEVICE Filed May 14, 1923 I N A/To Patented Sept. 8, 1925.
UNITED STATES PETER J. r. narnunuae, or'nacmn, wrscousm.
METAL-PLATING DEVICE.
Application filed May 14, 1923. Serial No. 638,877.
To all whom it may concern:
Be it known that I, PETER J. F. BATEN- BURG, a subject of the Queen of Holland, and resident of Racine, in the county of Racine and State of Wisconsin, have invented new and useful Improvements in Metal- Plating Devices, of which the following is a description, reference being hadto the accompanying drawings, which are a part of this specification.
The invention relates to a device for plating metal.
The primary object of the invention is to provide an easily handled and inexpensive device for plating metal and more particularly designed for retouching or restoring worn or defective plating.
A further object of the invention is to provide a metal plating device which may be efficiently used on surfaces of varying contour and which burnishes the plated surface during the process of plating.
The invention further consists in the several features hereinafter set forth and more particularly defined by claim at the conclusion hereof.
"The drawing shows a vertical sectional view through a plating device embodying the invention.
In the drawings the numeral 2 designates an electrode or anode of suitable metal, and should be the metal or contain the metal which is to be deposited, to which an end of a current-supply-wire 3 is firmly connected, said Wire preferably having an insulated covering 4. i
The anode 2 is disposed within a receptacle 5 whose surface for contact with the object to be plated should be porous. This receptacle is conveniently formed of flexible porone material of any suitable kind. The receptacle may be formed in any suitable manner and is here shown as a fiat piece of fabri whose edges have been drawn up around the electrode and secured by a cord 6 bind- Ii)ng them aboutthe wire 3 and forming a is noted in the drawing, the receptacle 5 is filled with a moisture absorbent material and salts of the metal to be plated. Sawdust or absorbent cotton, forming a loose filler, or other suitable material may be used as the absorbent material. As the covering forming the receptacle is easily opened new salts and filler may be readily supplied.
lVith the above construction, when the receptacle is dipped into water to moisten the absorbent material, and the wire 3 connected with one terminal of a battery 7 and the other terminal of the battery connected, as by a'wire 9, to the part 8 to be plated, a circuit. is established which causes an electroplating of the metal, from the metal salts within the receptacle, upon the surface of the part 8 in contact with the porous receptacle, and while the current is on as the receptacle is slowly rubbed over the surface being, replated. The movement of the receptacle over the surface efliciently distributes the plating metal and at the same time polishes or burnishes it. .As the filler of material within the receptacle is loose or adapted to conform to the shape of the re- .ceptacle and the part of the receptacle for contact with the surface being plated is-flexible, there is no difficulty in plating surfaces of irregular contour. Thus, by establishing the flow of electric current and the hand rubbing of the receptacle 5 over the surface to be plated, WOI'II'OI defective plating of previously plated surfaces may be restored or'touched up. The device may be used for.
plating nickel, copper, silver, gold, orany other plating metal by using the proper salt or salts of the metal to be plated and a suitable elect-rode.
I desire it to be understood that this invention is not to be limited to any specific form or arrangement of parts except in so far as such limitations are specified in the claim.
What I claim as my invention is:- I
In a metal plating device. the combination of an anode, a yieldable displaceable absorbent filler. salts of the metal to be deposited associated with the filler. and a piece of porous polishing material enclosing said anode and filler, a current conductor secured to the anode, andmeans for binding said polishing material about said conductor.
In testimony whereof I afiix my signature.
PETER J. F. BATENBURG.
US638877A 1923-05-14 1923-05-14 Metal-plating device Expired - Lifetime US1552591A (en)

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Application Number Priority Date Filing Date Title
US638877A US1552591A (en) 1923-05-14 1923-05-14 Metal-plating device

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2463483A (en) * 1939-01-31 1949-03-01 Frasch Jean Protection of metallic objects by galvanic action
US2540602A (en) * 1946-07-03 1951-02-06 Lockheed Aircraft Corp Method and apparatus for the surface treatment of metals
US3520792A (en) * 1965-07-12 1970-07-14 Johann Kerschgens Apparatus for the production of metal coatings
US3619384A (en) * 1968-04-03 1971-11-09 Norton Co Electrodeposition
US3619389A (en) * 1969-10-03 1971-11-09 Norton Co Electrodeposition system
US3619401A (en) * 1968-04-03 1971-11-09 Norton Co Apparatus for electrodeposition
US3755089A (en) * 1971-11-18 1973-08-28 Rapid Electroplating Process I Method of gold plating

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2463483A (en) * 1939-01-31 1949-03-01 Frasch Jean Protection of metallic objects by galvanic action
US2540602A (en) * 1946-07-03 1951-02-06 Lockheed Aircraft Corp Method and apparatus for the surface treatment of metals
US3520792A (en) * 1965-07-12 1970-07-14 Johann Kerschgens Apparatus for the production of metal coatings
US3619384A (en) * 1968-04-03 1971-11-09 Norton Co Electrodeposition
US3619401A (en) * 1968-04-03 1971-11-09 Norton Co Apparatus for electrodeposition
US3619389A (en) * 1969-10-03 1971-11-09 Norton Co Electrodeposition system
US3755089A (en) * 1971-11-18 1973-08-28 Rapid Electroplating Process I Method of gold plating

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