US1552591A - Metal-plating device - Google Patents
Metal-plating device Download PDFInfo
- Publication number
- US1552591A US1552591A US638877A US63887723A US1552591A US 1552591 A US1552591 A US 1552591A US 638877 A US638877 A US 638877A US 63887723 A US63887723 A US 63887723A US 1552591 A US1552591 A US 1552591A
- Authority
- US
- United States
- Prior art keywords
- metal
- plating
- receptacle
- plated
- plating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
Definitions
- the invention relates to a device for plating metal.
- the primary object of the invention is to provide an easily handled and inexpensive device for plating metal and more particularly designed for retouching or restoring worn or defective plating.
- a further object of the invention is to provide a metal plating device which may be efficiently used on surfaces of varying contour and which burnishes the plated surface during the process of plating.
- the invention further consists in the several features hereinafter set forth and more particularly defined by claim at the conclusion hereof.
- the drawing shows a vertical sectional view through a plating device embodying the invention.
- the numeral 2 designates an electrode or anode of suitable metal, and should be the metal or contain the metal which is to be deposited, to which an end of a current-supply-wire 3 is firmly connected, said Wire preferably having an insulated covering 4.
- the anode 2 is disposed within a receptacle 5 whose surface for contact with the object to be plated should be porous.
- This receptacle is conveniently formed of flexible porone material of any suitable kind.
- the receptacle may be formed in any suitable manner and is here shown as a fiat piece of fabri whose edges have been drawn up around the electrode and secured by a cord 6 bind- Ii)ng them aboutthe wire 3 and forming a is noted in the drawing, the receptacle 5 is filled with a moisture absorbent material and salts of the metal to be plated. Sawdust or absorbent cotton, forming a loose filler, or other suitable material may be used as the absorbent material. As the covering forming the receptacle is easily opened new salts and filler may be readily supplied.
- the filler of material within the receptacle is loose or adapted to conform to the shape of the re- .ceptacle and the part of the receptacle for contact with the surface being plated is-flexible, there is no difficulty in plating surfaces of irregular contour.
- WOI'II'OI defective plating of previously plated surfaces may be restored or'touched up.
- the device may be used for.
- a metal plating device In a metal plating device. the combination of an anode, a yieldable displaceable absorbent filler. salts of the metal to be deposited associated with the filler. and a piece of porous polishing material enclosing said anode and filler, a current conductor secured to the anode, andmeans for binding said polishing material about said conductor.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Description
Sept. 8, 1925. 1,552,591
P. J. F. BATENBURG METAL PLATING DEVICE Filed May 14, 1923 I N A/To Patented Sept. 8, 1925.
UNITED STATES PETER J. r. narnunuae, or'nacmn, wrscousm.
METAL-PLATING DEVICE.
Application filed May 14, 1923. Serial No. 638,877.
To all whom it may concern:
Be it known that I, PETER J. F. BATEN- BURG, a subject of the Queen of Holland, and resident of Racine, in the county of Racine and State of Wisconsin, have invented new and useful Improvements in Metal- Plating Devices, of which the following is a description, reference being hadto the accompanying drawings, which are a part of this specification.
The invention relates to a device for plating metal.
The primary object of the invention is to provide an easily handled and inexpensive device for plating metal and more particularly designed for retouching or restoring worn or defective plating.
A further object of the invention is to provide a metal plating device which may be efficiently used on surfaces of varying contour and which burnishes the plated surface during the process of plating.
The invention further consists in the several features hereinafter set forth and more particularly defined by claim at the conclusion hereof.
"The drawing shows a vertical sectional view through a plating device embodying the invention.
In the drawings the numeral 2 designates an electrode or anode of suitable metal, and should be the metal or contain the metal which is to be deposited, to which an end of a current-supply-wire 3 is firmly connected, said Wire preferably having an insulated covering 4. i
The anode 2 is disposed within a receptacle 5 whose surface for contact with the object to be plated should be porous. This receptacle is conveniently formed of flexible porone material of any suitable kind. The receptacle may be formed in any suitable manner and is here shown as a fiat piece of fabri whose edges have been drawn up around the electrode and secured by a cord 6 bind- Ii)ng them aboutthe wire 3 and forming a is noted in the drawing, the receptacle 5 is filled with a moisture absorbent material and salts of the metal to be plated. Sawdust or absorbent cotton, forming a loose filler, or other suitable material may be used as the absorbent material. As the covering forming the receptacle is easily opened new salts and filler may be readily supplied.
lVith the above construction, when the receptacle is dipped into water to moisten the absorbent material, and the wire 3 connected with one terminal of a battery 7 and the other terminal of the battery connected, as by a'wire 9, to the part 8 to be plated, a circuit. is established which causes an electroplating of the metal, from the metal salts within the receptacle, upon the surface of the part 8 in contact with the porous receptacle, and while the current is on as the receptacle is slowly rubbed over the surface being, replated. The movement of the receptacle over the surface efliciently distributes the plating metal and at the same time polishes or burnishes it. .As the filler of material within the receptacle is loose or adapted to conform to the shape of the re- .ceptacle and the part of the receptacle for contact with the surface being plated is-flexible, there is no difficulty in plating surfaces of irregular contour. Thus, by establishing the flow of electric current and the hand rubbing of the receptacle 5 over the surface to be plated, WOI'II'OI defective plating of previously plated surfaces may be restored or'touched up. The device may be used for.
plating nickel, copper, silver, gold, orany other plating metal by using the proper salt or salts of the metal to be plated and a suitable elect-rode.
I desire it to be understood that this invention is not to be limited to any specific form or arrangement of parts except in so far as such limitations are specified in the claim.
What I claim as my invention is:- I
In a metal plating device. the combination of an anode, a yieldable displaceable absorbent filler. salts of the metal to be deposited associated with the filler. and a piece of porous polishing material enclosing said anode and filler, a current conductor secured to the anode, andmeans for binding said polishing material about said conductor.
In testimony whereof I afiix my signature.
PETER J. F. BATENBURG.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US638877A US1552591A (en) | 1923-05-14 | 1923-05-14 | Metal-plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US638877A US1552591A (en) | 1923-05-14 | 1923-05-14 | Metal-plating device |
Publications (1)
Publication Number | Publication Date |
---|---|
US1552591A true US1552591A (en) | 1925-09-08 |
Family
ID=24561817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US638877A Expired - Lifetime US1552591A (en) | 1923-05-14 | 1923-05-14 | Metal-plating device |
Country Status (1)
Country | Link |
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US (1) | US1552591A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2463483A (en) * | 1939-01-31 | 1949-03-01 | Frasch Jean | Protection of metallic objects by galvanic action |
US2540602A (en) * | 1946-07-03 | 1951-02-06 | Lockheed Aircraft Corp | Method and apparatus for the surface treatment of metals |
US3520792A (en) * | 1965-07-12 | 1970-07-14 | Johann Kerschgens | Apparatus for the production of metal coatings |
US3619384A (en) * | 1968-04-03 | 1971-11-09 | Norton Co | Electrodeposition |
US3619389A (en) * | 1969-10-03 | 1971-11-09 | Norton Co | Electrodeposition system |
US3619401A (en) * | 1968-04-03 | 1971-11-09 | Norton Co | Apparatus for electrodeposition |
US3755089A (en) * | 1971-11-18 | 1973-08-28 | Rapid Electroplating Process I | Method of gold plating |
-
1923
- 1923-05-14 US US638877A patent/US1552591A/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2463483A (en) * | 1939-01-31 | 1949-03-01 | Frasch Jean | Protection of metallic objects by galvanic action |
US2540602A (en) * | 1946-07-03 | 1951-02-06 | Lockheed Aircraft Corp | Method and apparatus for the surface treatment of metals |
US3520792A (en) * | 1965-07-12 | 1970-07-14 | Johann Kerschgens | Apparatus for the production of metal coatings |
US3619384A (en) * | 1968-04-03 | 1971-11-09 | Norton Co | Electrodeposition |
US3619401A (en) * | 1968-04-03 | 1971-11-09 | Norton Co | Apparatus for electrodeposition |
US3619389A (en) * | 1969-10-03 | 1971-11-09 | Norton Co | Electrodeposition system |
US3755089A (en) * | 1971-11-18 | 1973-08-28 | Rapid Electroplating Process I | Method of gold plating |
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