US10635072B2 - Imprint apparatus, method of calibrating correction mechanism, and method of manufacturing article - Google Patents

Imprint apparatus, method of calibrating correction mechanism, and method of manufacturing article Download PDF

Info

Publication number
US10635072B2
US10635072B2 US14/943,079 US201514943079A US10635072B2 US 10635072 B2 US10635072 B2 US 10635072B2 US 201514943079 A US201514943079 A US 201514943079A US 10635072 B2 US10635072 B2 US 10635072B2
Authority
US
United States
Prior art keywords
mold
shape
force
substrate
parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US14/943,079
Other languages
English (en)
Other versions
US20160144553A1 (en
Inventor
Kenichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Assigned to CANON KABUSHIKI KAISHA reassignment CANON KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, KENICHI
Publication of US20160144553A1 publication Critical patent/US20160144553A1/en
Application granted granted Critical
Publication of US10635072B2 publication Critical patent/US10635072B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3835—Designing moulds, e.g. using CAD-CAM
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/35—Nc in input of data, input till input file format
    • G05B2219/35044—Tool, design of tool, mold, die tooling
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45244—Injection molding

Definitions

  • the present invention relates to an imprint apparatus, a method of calibrating a correction mechanism, and a method of manufacturing an article.
  • microfabrication technology for forming a pattern on a substrate according to an imprint process of molding an imprint material on the substrate according to a mold.
  • This technology is also referred to as imprint technology and enables a pattern (structure) on the order of several nanometers to be formed on the substrate.
  • imprint technology is a photocuring method.
  • a photocurable resin is supplied as an imprint material to a shot region on the substrate.
  • the resin on the substrate is molded using the mold.
  • the resin is cured by radiating light and released to form a pattern of the resin on the substrate.
  • a pattern shape error such as magnification, skew, or a trapezoid occurring in a semiconductor process
  • a base layer (base pattern) formed on the substrate in advance and a concave-convex pattern (pattern region) formed in a mold are superimposed, relative positions of a mark formed in the mold and a mark formed on the substrate are first measured using a detector. Next, the relative positions are corrected by deforming the mold based on a relative position difference.
  • a shape correction apparatus for deforming the mold at a precision of several nanometers or less is required to perform the superimposition of the pattern at high precision.
  • Japanese Patent Laid-Open No. 2009-141328 discloses a shape correction apparatus in which an actuator for applying a compressive force to a side surface of a mold is disposed between the side surface of the mold and a support structure, the compressive force is measured using a force sensor installed between the actuator and the support structure, and feedback is controlled.
  • the publication of Japanese Patent No. 4573873 discloses a method of obtaining a deformation parameter predicted to occur in a mold to minimize a dimension change between a record pattern on a mold and a reference pattern.
  • the present invention for example, provides an imprint apparatus that is useful for changing a mold to a desired shape at a high precision and a high speed.
  • FIG. 1 is a diagram illustrating a configuration of an imprint apparatus according to an embodiment of the present invention.
  • FIG. 2 is a diagram illustrating a configuration of a shape correction mechanism.
  • FIG. 3 is a diagram illustrating a configuration of a wafer stage.
  • FIG. 4 is a flowchart illustrating a flow of initial calibration of a shape correction mechanism.
  • FIG. 5 is a flowchart illustrating a flow of calibration for changes with time of a shape correction mechanism.
  • FIG. 6 is a flowchart illustrating a flow of calibration of a production mold.
  • FIG. 1 is a schematic diagram illustrating a configuration of the imprint apparatus 100 according to the embodiment of the present invention.
  • the imprint apparatus 100 is used to manufacture a semiconductor device or the like serving as an article, molds an uncured resin (imprint material) coated on a wafer 7 (on a substrate) and a mold 2 by bringing the uncured resin and the mold 2 in contact with each other, and forms a pattern of a resin on the wafer 7 .
  • the imprint apparatus 100 for example, is assumed to adopt a photocuring method.
  • a Z axis is defined as an upward/downward direction (vertical direction) and X and Y axes orthogonal to each other within a plane perpendicular to the Z axis are defined.
  • the imprint apparatus 100 includes an illumination system 1 , a mold holding mechanism 3 , a wafer stage 8 , a coating unit 10 , an alignment measuring unit 11 , and a controller 14 .
  • the illumination system 1 is a resin curing means for adjusting ultraviolet light emitted from a light source (not illustrated) to light suitable for curing the resin and radiating the light to the mold 2 .
  • the light source is not limited to the ultraviolet light and it is only necessary that it emit light of a wavelength which is transmitted through the mold 2 and at which the resin is cured.
  • a heating means for curing a thermosetting resin is installed in the vicinity of the wafer stage 8 as a resin curing means in place of the illumination system 1 .
  • the mold 2 is a mold in which a plane shape is a rectangle and which has a concave-convex pattern (pattern region) 21 such as a circuit pattern three-dimensionally formed in the center of a surface opposed to the wafer 7 .
  • the material of the mold 2 is a material such as quartz capable of transmitting ultraviolet light.
  • the surface of the concave-convex pattern 21 is processed at a high degree of flatness.
  • the mold 2 has a plurality of alignment marks 22 in a perimeter region of the concave-convex pattern 21 (see FIG. 2 ). Plane coordinates of each of the plurality of alignment marks 22 are measured in advance and saved as coordinate data including a drawing error when a mark is formed, for example, in a storage apparatus included in the controller 14 , within the imprint apparatus 100 .
  • the mold holding mechanism (mold holding unit) 3 has a mold chuck 4 for holding the mold 2 , a mold driving mechanism (not illustrated) for supporting and moving the mold chuck 4 , and a shape correction mechanism 5 capable of deforming the concave-convex pattern 21 (mold 2 ).
  • the mold chuck (mold base) 4 holds the mold 2 by attracting an outer circumferential region of an irradiation surface of the ultraviolet light in the mold 2 according to a vacuum suction force or electrostatic force.
  • the mold chuck 4 and the mold driving mechanism have an opening region in a center (inner side) so that the ultraviolet light radiated from the illumination system 1 is transmitted through the mold 2 and directed to the wafer 7 .
  • the mold driving mechanism moves the mold 2 in a Z-axis direction to selectively bring the mold 2 and the resin on the wafer 7 in contact with each other or separate them from each other.
  • the contact or separation operation at the time of an imprint process may be implemented by moving the mold 2 in the Z-axis direction.
  • the contact or separation operation may be implemented by driving the wafer stage 8 and moving the wafer 7 in the Z-axis direction or both the mold 2 and the wafer 7 may be relatively moved.
  • the shape correction mechanism (correction mechanism) 5 corrects the shape of the concave-convex pattern 21 to a desired shape by applying a force (external force or compressive force) to the mold 2 held in the mold chuck 4 and changing the shape of the mold 2 .
  • FIG. 2 is a schematic plan view illustrating a configuration of the shape correction mechanism 5 when viewed from a negative side of the Z-axis direction (the side of the wafer stage 8 ).
  • the shape correction mechanism 5 has a plurality of driving units 30 opposed to any of side surfaces (surfaces (XZ surfaces or YZ surfaces) perpendicular to the XY surface in which the concave-convex pattern 21 is formed) of four directions of the mold 2 and disposed to surround the entire side surface corresponding to an outer circumferential portion of the mold 2 .
  • four driving units 30 are assumed to be disposed for each side surface (one side) of one direction of the mold 2 .
  • Each driving unit 30 is supported by the mold chuck 4 and includes an actuator for generating a compressive force to the side surface of the mold 2 and a sensor (detector) 6 for measuring the compressive force applied to the side surface of the mold 2 .
  • the actuator a piezoelectric actuator having a small heating value and excellent responsiveness can be adopted.
  • the driving unit 30 has a driving stroke necessary to generate a desired compressive force and a driving stroke including a predetermined idle running distance in which a non-contact state is provided for the mold 2 .
  • the sensor 6 is a force sensor such as a load cell or a strain gauge individually continuously provided in each of a plurality of driving units 30 .
  • a non-contact displacement sensor supported by the mold chuck 4 may be designated as another compressive force measuring means and detect a relative position of the side surface of the mold 2 may be provided.
  • the wafer 7 is a processed substrate including single crystal silicon. Also, when the substrate is used to manufacture an article other than a semiconductor device, for example, optical glass such as quartz can be adopted as the material of the substrate if an optical element is manufactured and GaN, SiC, or the like can be adopted as the material of the substrate if a light-emitting element is manufactured.
  • optical glass such as quartz can be adopted as the material of the substrate if an optical element is manufactured and GaN, SiC, or the like can be adopted as the material of the substrate if a light-emitting element is manufactured.
  • the wafer stage (substrate holding unit) 8 is capable of moving within the XY plane while holding the wafer 7 and performs position alignment of the mold 2 and the wafer 7 when in contact with the mold 2 and the resin on the wafer 7 .
  • the wafer stage 8 has a reference mark 9 for aligning the mold 2 and the wafer stage 8 .
  • FIG. 3 is a schematic plan view illustrating shapes and installation positions of the wafer stage 8 and the reference mark 9 when viewed from a positive side of the Z-axis direction (the side of the mold holding mechanism 3 ).
  • a plurality of reference marks 9 are provided to be symmetrical with respect to a plurality of alignment marks 22 (see FIG. 2 ) installed (formed) in the mold 2 .
  • plane coordinates of each of the plurality of reference marks 9 are measured in advance and saved as coordinate data including a drawing error at the mark formation time, for example, in a storage apparatus included in the controller 14 , within the imprint apparatus 100 .
  • the coating unit (dispenser) 10 coats an uncured resin in a desired coating pattern on a shot region (pattern formation region) preset on the wafer 7 .
  • the resin serving as the imprint material has mobility when filled between the mold 2 and the wafer 7 and a solid for maintaining a shape after molding is required.
  • the resin is an ultraviolet curable resin (photocurable resin) having a property of being cured by receiving ultraviolet light, but a thermosetting resin, a thermoplastic resin, or the like can be used in place of the photocurable resin according to various types of conditions such as article manufacturing processes.
  • the alignment measuring unit 11 includes a measurement light source 12 for use in a wavelength band in which no resin is cured such as a He—Ne laser, a detector 13 such as a charge coupled device (CCD) camera, and an optical element (not illustrated).
  • the alignment measuring unit 11 radiates measurement light in a state in which the alignment mark 22 and the alignment mark on the wafer 7 overlap when the concave-convex pattern 21 and the base layer (base pattern) formed in advance on the wafer 7 are superimposed and the detector 13 detects an interference fringe. Thereby, the alignment measuring unit 11 can measure relative positions of the alignment mark 22 of the mold 2 and the alignment mark of the wafer 7 .
  • the alignment measuring unit 11 can detect the alignment mark 22 of the mold 2 and the reference mark 9 installed on the wafer stage 8 . Further, based on a detection result, it is possible to measure relative positions of the alignment mark 22 (mold 2 ) and the reference mark 9 (wafer stage 8 ).
  • the controller 14 for example, includes a computer or the like, is connected to each component of the imprint apparatus 100 via a line, and can control an operation, adjustment, or the like of each component according to a program or the like.
  • the controller 14 can perform control related to calibration of the shape correction mechanism 5 as follows.
  • the controller 14 may be configured to be integrated with another part of the imprint apparatus 100 (within a common housing) or configured to be separated from another part of the imprint apparatus 100 (within a separate housing).
  • the controller 14 superimposes the alignment mark of the base layer formed in advance on the wafer 7 and the alignment mark 22 of the mold 2 and causes the alignment measuring unit 11 to measure mutually relative positions of the marks.
  • a relation between alignment precision and a measurement time becomes the trade-off according to the number of alignment marks 22 to be measured. Therefore, the controller 14 selects the alignment mark 22 to be measured from among a plurality of alignment marks 22 according to use conditions of the imprint apparatus 100 .
  • the controller 14 calculates a shape error of the concave-convex pattern 21 from information related to the relative positions obtained by the alignment measurement and obtains a shape correction amount decomposed into a shape component such as magnification, skew, a trapezoid, a bow shape, or a spool shape. In this manner, it is possible to obtain a shape difference between a pattern region of the mold 2 and an imprint region formed in the wafer 7 from a result of detecting the alignment mark.
  • the controller 14 derives a compressive force input to each driving unit 30 by applying the obtained shape correction amount to Formula (1) and performs shape correction by adding the derived compressive force to a target value (compressive force or displacement) of a control system of each driving unit 30 .
  • a matrix [r] is a deformation amount (shape correction amount) including elements of n shape components.
  • a matrix [f] is a target value (compressive force) for a feedback control system of each driving unit 30 including m elements corresponding to the number of axes of the driving unit 30 .
  • a matrix [A] is a matrix which includes m ⁇ n elements and determines a target value [f] from a deformation amount [r].
  • the matrix [A] is a parameter determined according to the shape of the mold 2 , Young's modulus and Poisson's ratio of the material, a friction force at the time of suction holding of the mold 2 , etc., and is obtained through simulation in advance.
  • the controller 14 obtains the deformation amount [r] of the concave-convex pattern 21 when the compressive force corresponding to the target value [f] is applied to the side surface of the mold 2 using a known technique such as finite element analysis (FEA).
  • FEA finite element analysis
  • the controller 14 iterates this process while sequentially changing a plurality of types of compressive forces (target values [f]) assumed in advance.
  • the controller 14 calculates the matrix [A] using a least squares method or the like from elements ⁇ [r] ⁇ of a matrix of a deformation amount obtained through the simulation and elements ⁇ [f] ⁇ of a matrix of a plurality of types of target values assumed in advance.
  • Formula (1) corresponds to simultaneous linear equations, but the order may be increased by further developing Formula (1) to precisely perform shape correction.
  • the controller 14 can finally perform desired superimposition by iteratively performing alignment measurement and shape correction until a shape error converges in an allowed range.
  • initial calibration will be described as a method of calibrating the shape correction mechanism 5 .
  • the matrix [A] in the above-described Formula (1) is obtained through the simulation, and thus there is a possibility of occurrence of an error if the matrix [A] is directly applied to the shape correction mechanism 5 .
  • This error results from a dimension error of the mold 2 , a processing/assembly error of the shape correction mechanism 5 , a measurement error of the sensor 6 , or the like. Therefore, in this embodiment, initial calibration of the shape correction mechanism 5 is performed as described below to implement more precise shape correction.
  • FIG. 4 is a flowchart illustrating a flow of an initial calibration process of the shape correction mechanism 5 .
  • a mold calibration mold
  • production mold production mold
  • step S 101 setting process: step S 101 . It is desirable that the calibration mold be constantly provided within the imprint apparatus 100 and the calibration mold be appropriately automatically conveyed with the mold holding mechanism 3 based on a conveyance command from the controller 14 .
  • the controller 14 calibrates an offset error of the sensor 6 (step S 102 ).
  • Each driving unit 30 included in the shape correction mechanism 5 is movable by a given stroke in a non-contact state with the mold 2 . Therefore, here, the controller 14 first drives the driving unit 30 until all the driving units 30 are in the non-contact state. In this non-contact state, the mold 2 is held in only an absorption force by the mold chuck 4 and the compressive force for the side surface of the mold 2 is not generated. Accordingly, at this time, it is desirable that the measured value of each sensor 6 be zero or match a predetermined reference value.
  • the controller 14 designates the measured value of each sensor 6 or a difference from the reference value as an offset error and processes a result obtained by adding the offset error to an actually measured value (output value) as a measured value. Also, the information related to the offset error is saved, for example, in the storage apparatus included in the controller 14 , within the imprint apparatus 100 .
  • the controller 14 moves the wafer stage 8 to the measurement position for performing alignment measurement in the following step S 105 by superimposing the alignment mark 22 of the mold 2 and the reference mark 9 installed on the wafer stage 8 (step S 103 ).
  • the controller 14 lowers the mold chuck 4 so that the alignment mark 22 and the reference mark 9 are close to the mold driving mechanism.
  • a resin or a fluid other than a resin may be coated on the reference mark 9 in advance.
  • the controller 14 inputs elements ⁇ [f] ⁇ of a matrix of a predetermined desired target value (driving command) to each driving unit 30 and deforms the concave-convex pattern 21 of the mold 2 (step S 104 ).
  • the controller 14 causes the alignment measuring unit 11 to perform alignment measurement and calculates the shape of the concave-convex pattern 21 of the mold 2 , that is, elements ⁇ [r] ⁇ of a matrix of an actual deformation amount of the concave-convex pattern 21 , based on a measurement result (deformation amount derivation process: step S 105 ).
  • the controller 14 determines whether the elements ⁇ [r] ⁇ of the matrix of the actual deformation amount are obtained for the elements ⁇ [f] ⁇ of the matrix of all the target values (step S 106 ).
  • the controller 14 iterates the process of steps S 104 and S 105 .
  • the controller 14 proceeds to the following step S 107 when the elements ⁇ [r] ⁇ are obtained (Yes).
  • the controller 14 calculates a matrix [A′] for associating the elements ⁇ [r] ⁇ of the matrix of the actual deformation amount and the elements ⁇ [f] ⁇ of the matrix of the target values (calculation process: step S 107 ).
  • the matrix [A′] is calculated using a least squares method as in the case in which the matrix [A] in Formula (1) is obtained.
  • the matrix [A′] which is a parameter obtained using the calibration mold is used. Therefore, because it is only necessary to use a parameter obtained in advance while installing the calibration mold at the time of subsequent calibration, it is possible to perform calibration at a high speed without having to obtain a parameter for calibration again.
  • the parameter for use in the calibration is not obtained by simulation, but is obtained by actual measurement. Accordingly, for example, it is possible to perform highly precise calibration because a parameter reflecting the measurement error is used even when a measurement error occurs in the sensor 6 .
  • the imprint apparatus according to the second embodiment of the present invention will be described.
  • the imprint apparatus according to this embodiment is characterized in that the imprint apparatus can be applied to calibration for changes with time, that is, the case in which the calibration is performed at a desired time interval in relation to a calibration method of the shape correction mechanism 5 .
  • the same reference signs are assigned to the same components and description thereof will be omitted.
  • a main factor of the changes with time of the shape correction mechanism 5 includes a measurement error of the sensor 6 .
  • the measurement error of the sensor 6 is classified into a linearity error and an offset error.
  • a function of the linearity error is generated, a high-order approximation function may be used.
  • a linear gain error will be mentioned.
  • a matrix [f′ ] which is an actual compression amount for a matrix [f] of a target value of each driving unit calculated using the above-described Formula (1) is expressed by Formula (3).
  • a matrix [gain] is a gain error of each sensor 6 including m elements.
  • a matrix [ofs] is an offset error of each sensor 6 including m elements.
  • FIG. 5 is a flowchart illustrating a flow of a calibration process for changes with time of the shape correction mechanism 5 . Also, because the process of steps S 201 to S 206 after the calibration process for the changes with time in FIG. 5 starts is the same as the process of steps S 101 to S 106 in FIG. 4 illustrating an initial calibration process described in the first embodiment, description thereof will be omitted.
  • step S 207 the controller 14 obtains a gain correction coefficient as a second parameter.
  • the controller 14 obtains the elements ⁇ [f′] ⁇ of a matrix of a target value of each driving unit 30 by substituting the elements ⁇ [r′] ⁇ of a matrix of an actual deformation amount obtained in alignment measurement in step S 205 into the above-described Formula (2).
  • the matrix [A′] serving as the parameter in Formula (2) becomes an invariable parameter by using the alignment mark 22 of the same mold 2 and the reference mark 9 of the wafer stage 8 .
  • a coefficient for which a ratio between the element ⁇ [f′] ⁇ and the element ⁇ [f] ⁇ is 1 becomes a gain correction coefficient of the sensor 6 .
  • the gain correction coefficient is calculated as a value including a difference of the matrix [A′].
  • the gain correction coefficient obtained here is strictly a coefficient including an error factor of a transfer mechanism or the like present in the driving unit 30
  • the gain correction coefficient is also referred to as a gain correction coefficient in the entire driving unit 30 .
  • the number of elements of the shape (shape pattern) ⁇ [r] ⁇ of the concave-convex pattern 21 is sufficient when there are several elements.
  • it is only necessary to calculate each coefficient using a least squares method or the like by increasing the number of elements of the shape ⁇ [r] ⁇ of the concave-convex pattern 21 and applying a relation between the element ⁇ [f′ ] ⁇ and the element ⁇ [f] ⁇ of the matrix of the target value to a high-order approximation function.
  • the controller 14 can calibrate the measured value of the sensor 6 if the gain correction coefficient obtained in step S 207 is multiplied by the measured value of the sensor 6 .
  • the calibration mold is assumed to be prepared separately from a production mold.
  • the calibration mold is not limited to a dedicated mold for calibration as described above.
  • a specific production mold may be reused by regarding the specific production mold as a calibration mold at a subsequent calibration time. In this case, because an installation process of the calibration mold in step S 201 is unnecessary, a calibration time can be shortened.
  • calibration may be performed, for example, after predicting a time at which precision is degraded from an actual value of calibration, as a time at which calibration for changes with time can be performed, the calibration may be performed at the beginning of a production lot, or the calibration may be performed at the timing at which the mold 2 is replaced. Further, one shape of the concave-convex pattern 21 in which a measurement error of the sensor 6 is predicted to be significantly shown may be measured by only an alignment mark of several points, production may continue when the error is within an allowed range of values, and calibration may be configured to be performed when the error exceeds the allowed range of values.
  • the calibration time is shortened, it is possible to minimize the degradation of throughput even when a process of checking whether a gain error is within an allowed range of values every time wafer processing is performed is added to the calibration process.
  • the calibration time is short for calibration of the offset error, the calibration of the offset error may be frequently performed separately from the calibration of the gain error.
  • the calibration may be performed in parallel with wafer replacement or performed in parallel with coating (supplying) of a resin by the coating unit 10 between shot regions.
  • the imprint apparatus according to this embodiment is characterized in that the mold 2 serving as the production mold is calibrated using the shape correction mechanism 5 . Also, because each component of the imprint apparatus according to this embodiment is the same as each component of the imprint apparatus 100 according to the first embodiment, the same reference signs are assigned to the same components and description thereof will be omitted.
  • FIG. 6 is a flowchart illustrating a flow of a calibration process of a production mold.
  • the controller 14 installs the calibration mold as the mold 2 in the mold holding mechanism 3 (step S 301 ).
  • the controller 14 performs calibration of the shape correction mechanism 5 along the flow of the flowchart of FIG. 5 described in the second embodiment using the calibration mold (step S 302 ).
  • the controller 14 transports the calibration mold from the mold holding mechanism 3 and continuously installs the production mold as the mold 2 (step S 303 ).
  • the controller 14 can perform the calibration of the production mold by obtaining the matrix [A′] along the flow of the flowchart of FIG. 4 described in the first embodiment using the production mold and updating Formula (2) (step S 304 ).
  • the gain correction coefficient and the offset correction value of the shape correction mechanism 5 are managed separately from the matrix [A′] of the correction parameter due to the mold, so that the matrix [A′] becomes an invariable parameter and it is not necessary to perform calibration thereafter.
  • the shape correction mechanism 5 even when the shape correction mechanism 5 is replaced, it is possible to maintain calibration precision without depending upon the mold 2 only by performing the calibration described in the second embodiment.
  • a method for manufacturing a device may include a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate, or the like) using the imprint apparatus described above. Furthermore, the manufacturing method may include a step of etching the substrate on which a pattern has been formed. When other articles such as a patterned medium (storage medium), an optical element, or the like are manufactured, the manufacturing method may include another step of processing the substrate on which a pattern has been formed instead of the etching step.
  • the device manufacturing method of the present embodiment has an advantage, as compared with a conventional method, in at least one of performance, quality, productivity and production cost of an article.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
US14/943,079 2014-11-20 2015-11-17 Imprint apparatus, method of calibrating correction mechanism, and method of manufacturing article Expired - Fee Related US10635072B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-235282 2014-11-20
JP2014235282A JP6552185B2 (ja) 2014-11-20 2014-11-20 インプリント装置、補正機構の校正方法、および物品の製造方法

Publications (2)

Publication Number Publication Date
US20160144553A1 US20160144553A1 (en) 2016-05-26
US10635072B2 true US10635072B2 (en) 2020-04-28

Family

ID=56009324

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/943,079 Expired - Fee Related US10635072B2 (en) 2014-11-20 2015-11-17 Imprint apparatus, method of calibrating correction mechanism, and method of manufacturing article

Country Status (2)

Country Link
US (1) US10635072B2 (ja)
JP (1) JP6552185B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11244838B2 (en) * 2016-09-13 2022-02-08 Tokyo Electron Limited Substrate processing apparatus and substrate processing method of controlling discharge angle and discharge position of processing liquid supplied to peripheral portion of substrate
US11815811B2 (en) 2021-03-23 2023-11-14 Canon Kabushiki Kaisha Magnification ramp scheme to mitigate template slippage

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6827755B2 (ja) * 2016-09-30 2021-02-10 キヤノン株式会社 インプリント装置及び物品の製造方法
JP7034621B2 (ja) * 2017-07-25 2022-03-14 浜松ホトニクス株式会社 レーザ加工装置
JP7317575B2 (ja) * 2019-05-28 2023-07-31 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US20230127984A1 (en) * 2021-10-25 2023-04-27 Canon Kabushiki Kaisha Apparatus and method for optimizing actuator forces

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050006343A1 (en) * 2003-07-09 2005-01-13 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
US20050271955A1 (en) * 2004-06-03 2005-12-08 Board Of Regents, The University Of Texas System System and method for improvement of alignment and overlay for microlithography
US20090108484A1 (en) * 2007-10-11 2009-04-30 Asml Netherlands B.V. Imprint lithography
US20130134630A1 (en) * 2011-11-28 2013-05-30 Canon Kabushiki Kaisha Imprint apparatus, manufacturing method for article using the same, and imprint method
WO2013118547A1 (en) * 2012-02-07 2013-08-15 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20130300031A1 (en) * 2012-05-08 2013-11-14 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20160041058A1 (en) * 2014-08-11 2016-02-11 Goodrich Corporation System and method to adjust a force zero reference
US20160070179A1 (en) * 2013-05-20 2016-03-10 Asml Netherlands B.V. Method of controlling a radiation source and lithographic apparatus comprising the radiation source

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6847433B2 (en) * 2001-06-01 2005-01-25 Agere Systems, Inc. Holder, system, and process for improving overlay in lithography
JP4217551B2 (ja) * 2003-07-02 2009-02-04 キヤノン株式会社 微細加工方法及び微細加工装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050006343A1 (en) * 2003-07-09 2005-01-13 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
US20050271955A1 (en) * 2004-06-03 2005-12-08 Board Of Regents, The University Of Texas System System and method for improvement of alignment and overlay for microlithography
US7535549B2 (en) 2004-06-03 2009-05-19 Board Of Regents, University Of Texas System System and method for improvement of alignment and overlay for microlithography
JP4573873B2 (ja) 2004-06-03 2010-11-04 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム マイクロリソグラフィにおけるアラインメントとオーバーレイを改善するシステムおよび方法
US20090108484A1 (en) * 2007-10-11 2009-04-30 Asml Netherlands B.V. Imprint lithography
JP2009141328A (ja) 2007-10-11 2009-06-25 Asml Netherlands Bv インプリントリソグラフィ
US8579625B2 (en) 2007-10-11 2013-11-12 Asml Netherlands B.V. Imprint lithography
US20130134630A1 (en) * 2011-11-28 2013-05-30 Canon Kabushiki Kaisha Imprint apparatus, manufacturing method for article using the same, and imprint method
WO2013118547A1 (en) * 2012-02-07 2013-08-15 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20130300031A1 (en) * 2012-05-08 2013-11-14 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20160070179A1 (en) * 2013-05-20 2016-03-10 Asml Netherlands B.V. Method of controlling a radiation source and lithographic apparatus comprising the radiation source
US20160041058A1 (en) * 2014-08-11 2016-02-11 Goodrich Corporation System and method to adjust a force zero reference

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11244838B2 (en) * 2016-09-13 2022-02-08 Tokyo Electron Limited Substrate processing apparatus and substrate processing method of controlling discharge angle and discharge position of processing liquid supplied to peripheral portion of substrate
US11640911B2 (en) 2016-09-13 2023-05-02 Tokyo Electron Limited Substrate processing method of controlling discharge angle and discharge position of processing liquid supplied to peripheral portion of substrate
US11815811B2 (en) 2021-03-23 2023-11-14 Canon Kabushiki Kaisha Magnification ramp scheme to mitigate template slippage

Also Published As

Publication number Publication date
JP2016100428A (ja) 2016-05-30
US20160144553A1 (en) 2016-05-26
JP6552185B2 (ja) 2019-07-31

Similar Documents

Publication Publication Date Title
US10635072B2 (en) Imprint apparatus, method of calibrating correction mechanism, and method of manufacturing article
JP7087056B2 (ja) インプリント装置、インプリント方法および物品の製造方法
US20220121112A1 (en) Imprint apparatus for forming a pattern of an imprint material on a substrate-side pattern region of a substrate by using a mold, and related device manufacturing methods
US9892949B2 (en) Imprint method, imprint apparatus, and article manufacturing method
KR101980415B1 (ko) 임프린트 장치 및 물품 제조 방법
US10739674B2 (en) Imprint apparatus and method for producing article
US9823562B2 (en) Imprint apparatus, imprint method, and method of manufacturing article
US9958773B2 (en) Imprint apparatus and method of manufacturing article
JP6120677B2 (ja) インプリント装置、インプリント方法および物品の製造方法
US10241424B2 (en) Imprint apparatus, imprint method, and article manufacturing method
JP6306830B2 (ja) インプリント装置、および物品の製造方法
US20170008219A1 (en) Imprinting apparatus, imprinting method, and method of manufacturing object
CN105301893B (zh) 压印装置、压印方法及物品的制造方法
KR20160140485A (ko) 몰드, 임프린트 방법 및 임프린트 장치, 및 물품의 제조 방법
JP2016072508A (ja) パターン形成方法、および物品の製造方法
US11209731B2 (en) Imprint device and method for manufacturing article
US11835871B2 (en) Imprint apparatus, imprint method, and article manufacturing method
JP2017147414A (ja) インプリント装置および物品製造方法
JP2015079887A (ja) インプリント装置、および物品の製造方法
JP6866106B2 (ja) インプリント装置、インプリント方法、および物品の製造方法
JP2016021442A (ja) インプリント装置及び物品の製造方法
JP2018046156A (ja) インプリント装置、インプリント方法および物品製造方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: CANON KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KOBAYASHI, KENICHI;REEL/FRAME:037637/0657

Effective date: 20151027

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20240428