US10301211B2 - Mechanically forming crack initiation defects in thin glass substrates using an abrasive surface - Google Patents

Mechanically forming crack initiation defects in thin glass substrates using an abrasive surface Download PDF

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US10301211B2
US10301211B2 US15/524,703 US201515524703A US10301211B2 US 10301211 B2 US10301211 B2 US 10301211B2 US 201515524703 A US201515524703 A US 201515524703A US 10301211 B2 US10301211 B2 US 10301211B2
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glass substrate
abrasive
defect
initiation
glass
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US15/524,703
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US20170334762A1 (en
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Donald Orrin Bigelow
Robertson Dewhurst Booth
James Joseph Watkins
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Corning Inc
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Corning Inc
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Assigned to CORNING INCORPORATED reassignment CORNING INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BIGELOW, DONALD ORRIN, BOOTH, ROBERTSON DEWHURST, WATKINS, James Joseph
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235—Ribbons
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present specification generally relates to laser separation of thin glass substrates and, more specifically, to methods for mechanically forming crack initiation defects for use in separating thin glass substrates using laser separation techniques.
  • Glass substrates such as those utilized in flat panel displays and other electronic devices are generally formed from a large glass substrate which is segmented into a plurality of smaller glass substrates that are incorporated into individual devices.
  • a variety of separation techniques may be used to separate the large glass substrate into a plurality of smaller glass substrates including laser cutting techniques.
  • an initiation defect or vent crack may first be formed in the glass substrate using a single point scribe. To form the initiation defect the scribe is brought into contact with the glass substrate and a force which is normal to the surface of the glass substrate is then applied to the scribe, pressing the scribe into the surface of the glass substrate. The force exerted on the scoring wheel creates an initiation defect that extends partially through the thickness of the glass substrate. Thereafter, the initiation defect is heated and rapidly cooled to propagate a through vent from the initiation defect to separate the glass substrate.
  • a scribe may be used to create an initiation defect
  • single point initiation defects can require careful alignment between the initiation defect and the laser in order to heat locally at the initiation defect. This can require precise control of the glass substrate in the machine cross or lateral direction to avoid initiation defect misalignment.
  • Use of various conveyance systems, such as air bearings can further complicate lateral movement control of the glass substrate between the initiation defect forming location and the laser source.
  • the embodiments described herein relate to methods for forming crack initiation defects in the surface of thin glass substrates without puncturing the thin glass substrates or initiating uncontrolled crack propagation in the thin glass substrates and thereby facilitate separating the thin glass substrates into a plurality of individual substrates.
  • a diamond impregnated pad or sponge may be allowed to make contact on a leading edge of a moving glass substrate to achieve a series of flaws on the surface which then can be propagated by a thermal source in slitting applications that require movement or translation of the glass substrate and/or thermal source.
  • Such processes and apparatuses can be webs undergoing lateral motion and supported on an air conveyance device.
  • a method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate.
  • the field of initiation defects has a width of at least about three millimeters between outermost initiation defects. At least one initiation defect is heated with a laser source.
  • the at least one initiation defect is cooled with a cooling fluid such as an air jet such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating along the glass substrate to separate the glass substrate into the plurality of substrates.
  • a cooling fluid such as an air jet
  • the method of aspect 1 wherein the step of contacting the broad surface of the glass substrate includes contacting the broad surface of the glass substrate with an abrasive pad including the abrasive surface.
  • abrasive surface is at least about three millimeters in width.
  • abrasive surface comprises diamond abrasive particles.
  • the method of aspect 4 wherein the diamond abrasive particles are between about 10 ⁇ m and about 250 ⁇ m in diameter.
  • the step of contacting the broad surface of the glass substrate includes contacting the broad surface of the glass substrate using a defect initiator assembly comprising an actuator that moves an abrasive pad assembly between extended and retracted configurations.
  • a seventh aspect there is provided the method of aspect 6, wherein the actuator moves the abrasive pad assembly between the extended and retracted positions based on a signal from a detector that detects a position of the glass substrate.
  • the abrasive pad assembly comprises an abrasive pad including the abrasive surface and a backing substrate comprising a foam material.
  • any one of aspects 1-8 wherein the glass substrate is no more than about 0.3 mm in thickness.
  • a force exerted by the abrasive surface against the glass substrate is sufficient to form the field of initiation defects.
  • a cutting support member is configured to support the flexible glass substrate along a conveyor path without touching the flexible glass substrate.
  • a glass defect initiator assembly includes an abrasive pad assembly having an abrasive surface. The glass defect initiator assembly includes an actuator that moves the abrasive pad assembly away from the conveyor path in a retracted configuration and toward the conveyor path in an extended configuration to contact a broad surface of the flexible glass substrate with the abrasive surface and provide a field of initiation defects in the broad surface of the flexible glass substrate.
  • the apparatus of aspect 12 wherein the abrasive surface is at least about three millimeters in width.
  • the apparatus of aspect 14 wherein the diamond abrasive particles are between about 10 ⁇ m and about 250 ⁇ m in diameter.
  • the apparatus of any one of aspects 12-15, wherein the actuator is a pneumatic actuator.
  • the apparatus of any one of aspects 12-16 comprising a detector that detects position of the flexible glass substrate and provides a signal that is used to move the abrasive pad assembly between the extended and retracted configurations.
  • the apparatus of aspect 17 further comprising a controller that controls the actuator based on the signal from the detector.
  • the apparatus of any one of aspects 12-18 wherein the abrasive pad assembly comprises an abrasive pad that includes a backing substrate comprising a foam material.
  • the apparatus of any one of aspects 12-19 wherein the glass separating apparatus further comprises a cooling nozzle configured to provide a cooling jet of a cooling fluid to cool an initiation defect with a cooling fluid such that a crack initiates from the initiation defect.
  • FIG. 1 schematically depicts a method for forming a crack initiation defect in a thin glass substrate with an abrasive surface, according to one or more embodiments shown and described herein;
  • FIG. 2 schematically depicts a field of crack initiation defects formed in a surface of a glass substrate utilizing the method depicted in FIG. 1 ;
  • FIG. 3 schematically depicts an enlarged view of the field of crack initiation defects of FIG. 2 ;
  • FIG. 4 schematically illustrates a top view of a portion of a glass processing apparatus according to one or more embodiments shown and described herein;
  • FIG. 5 schematically illustrates a side view of the glass processing apparatus depicted in FIG. 4 ;
  • FIG. 6 schematically illustrates a glass defect initiator assembly for use with the glass processing apparatus of FIG. 5 , according to one or more embodiments shown and described herein;
  • FIG. 7 schematically illustrates an abrasive pad assembly of a glass defect initiator assembly, according to one or more embodiments shown and described herein;
  • FIG. 8 schematically illustrates an abrasive pad for use with the abrasive pad assembly of FIG. 7 , according to one or more embodiments shown and described herein;
  • FIG. 9 schematically depicts a crack initiation defect formed in the surface of a thin glass substrate, according to one or more embodiments shown and described herein;
  • FIGS. 10 and 11 schematically depict a method for laser separating a glass substrate from a crack initiation defect according to one or more embodiments shown and described herein.
  • Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
  • FIG. 1 One embodiment of a method for forming crack initiation defects in the surface of glass substrates is schematically depicted in FIG. 1 .
  • the method generally includes use of an abrasive surface, such as a diamond impregnated surface of a diamond impregnated pad or sponge to generate a field of flaws on a broad surface of the glass substrates.
  • a laser beam may be used to provide a localized thermal source on a flaw that can be used to propagate a crack through the glass substrate in a slitting process.
  • Cover glasses for use in electronic devices may be formed from thin glass substrates with thicknesses of 0.2 mm or less.
  • These thin glass substrates are generally formed as a large sheet or ribbon of glass which is subsequently segmented into a plurality of individual glass substrates by laser separation techniques.
  • glass substrate is meant to include both individual sheets and longer, continuous glass ribbon, for example, that can be rolled and unrolled from a roll.
  • a method of forming multiple crack initiation defects of a field of crack initiation defects in a surface 102 of a thin glass substrate 100 i.e., a glass substrate having a thickness T no greater than about 0.3 mm including but not limited to thicknesses of, for example, about 0.01-0.05 mm, about 0.05-0.1 mm, about 0.1-0.15 mm and about 0.15-0.3 mm
  • the field of crack initiation defects is formed in the surface 102 of the glass substrate 100 with an abrasive material 114 carried by an abrasive impregnated surface 116 of an abrasive sponge or pad 118 .
  • the abrasive impregnated surface 116 with abrasive material 114 may be brought into contact (e.g., manually and/or automatically) with the surface 102 of the glass substrate 100 to abrade an area of the surface 102 thereby creating a field of crack initiation defects.
  • the abrasive material 114 may be a diamond particle graded between about 10 ⁇ m and about 250 ⁇ m, such as between about 20 ⁇ m and about 125 ⁇ m, such as no greater than about 125 ⁇ m, such as about 40 ⁇ m in diameter in order to form crack initiation defects having a size suitable to propagate a crack therefrom.
  • a suitable diamond abrasive surface may be provided by a 400 mesh (40 ⁇ m particles yellow) Diapad® commercially available from 3M Company.
  • these values for the size of the abrasive particles are exemplary and that abrasive materials with larger or smaller sizes may also be utilized to form crack initiation defects in the surface of the glass substrate utilizing this method.
  • the abrasive surface 116 contacts the surface 102 of the glass substrate 100 with a pressure suitable to cause localized formation of a field of crack initiation defects on the surface 102 of the glass substrate 100 without causing excessive damage to the glass substrate (i.e., without creating holes completely through the thickness of the glass substrate 100 ).
  • the abrasive surface 116 may apply only enough force to produce the field of crack initiation defects on the glass substrate 100 that are visible, for example, when the surface 102 is illuminated at a shallow angle. Maintaining this degree of pressure applied to the surface 102 by the abrasive surface 116 helps to mitigate excessive damage of the glass substrate 100 which may lead to the formation of through holes or, alternatively, uncontrolled crack propagation.
  • the abrasive surface 116 of the abrasive pad 118 may contact the glass substrate 100 to provide a contact area 120 (shown in FIGS. 2 and 3 ) with a width W and a length L, within which the field 122 of localized crack initiation defects 124 are formed.
  • the field 122 of localized crack initiation defects 124 may be formed at and intersect a leading edge 126 of the glass substrate 100 .
  • the field of localized crack initiation defects 124 may be formed spaced from the leading edge 126 of the glass substrate 100 and/or continue beyond the leading edge 126 in the longitudinal or conveying direction of the glass substrate 100 .
  • Anticipated lateral movement of the glass substrate 100 may be used to determine the width W of the field 122 of crack initiation defects 124 .
  • the width W of the field 122 of crack initiation defects 124 (i.e., between outermost initiation defects 124 a and 124 b ) may be at least about 3 mm, such as at least about 7 mm, such as at least about 10 mm or greater. Maintaining the width W of the contact area 120 at no less than about 3 mm, such as no less than about 7 mm can increase the predictability of initiation events using, for example, edge induced flaws, as compared to point initiation defects, particularly when some lateral movement of the glass substrate 100 may occur.
  • the length L of the field 122 of crack initiation defects 124 is dependent on the time the abrasive surface 116 is in contact with the surface 102 of the glass substrate 100 and may terminate close to the leading edge 126 (e.g., less than about 5 mm) or be considerably longer (e.g., 25 mm or more, such as 50 mm or more), particularly where a fracture is being initiated away from the leading edge 126 .
  • the glass substrate 100 may be positioned such that the area of the glass substrate opposite the contact area 120 of the abrasive surface 116 is compliantly supported, such as when the glass substrate 100 is supported on an air cushion beneath the abrasive surface 116 or between two supports (e.g., rollers) under tension. Such an arrangement is shown in FIG. 1 where the glass substrate 100 is positioned on a support 130 such that at least a portion of the glass substrate 100 is supported on an air cushion above the support 130 . In this arrangement, the glass substrate 100 may be compliantly supported such that the glass substrate 100 can flex as the abrasive surface 116 contacts the surface 102 of the glass substrate 100 . Accordingly, it should be understood that the phrase “compliantly supported” means that at least a portion of the glass substrate is free to flex or recoil away from the crack initiation mechanism as the crack initiation defects are formed.
  • the glass substrate 100 may be compliantly supported on a compliant surface as the abrasive surface 116 contacts the surface 102 of the glass substrate 100 .
  • the compliant surface may be a foam pad or similar cushion on which the glass substrate 100 is positioned as the abrasive surface 116 contacts the surface 102 of the glass substrate 100 .
  • the compliant surface may be an air bearing, such as a Bernoulli chuck or similar air flotation device, on which the glass substrate 100 is positioned in order to cushion the glass substrate 100 as the abrasive surface 116 contacts the surface 102 of the glass substrate 100 .
  • the compliant surface compliantly supports and cushions the glass substrate 100 and allows the glass substrate 100 to recoil slightly as the abrasive surface 116 contacts the surface 102 of the glass substrate 100 such that the depth of the localized initiation defects caused by the abrasive material can be minimized.
  • Exemplary embodiments of compliant surfaces, specifically air bearings, are schematically depicted in FIGS. 4 and 5 and described in further detail herein.
  • the abrasive surface 116 may be utilized to form the field 122 of crack initiation defects 124 in a localized area on the surface 102 of the glass substrate 100 which corresponds to the position of the contact area 120 of the abrasive surface 116 on the surface 102 . More specifically, the abrasive material carried by the abrasive surface 116 forms the field 122 of the crack initiation defects 124 within the contact area 120 .
  • the surface density of the crack initiation defects 124 (i.e., the number of crack initiation defects per unit width) may be controlled by, for example, the density and positioning of the abrasive particles on the abrasive surface 116 .
  • higher abrasive particle densities on the abrasive surface 116 can yield higher crack initiation defect surface densities.
  • densities of 3 crack initiation defects 124 per millimeter of width or more may be provided.
  • any one of the crack initiation defects 124 located in the contact area 120 may be utilized to initiate a separation vent or crack using laser separation techniques, as will be described in more detail herein.
  • FIG. 4 another flexible glass substrate 150 is illustrated as being conveyed through a glass processing apparatus 152 , only a portion of which is illustrated by FIG. 4 .
  • the flexible glass substrate 150 may be conveyed in a continuous fashion from a glass source through the glass processing apparatus 152 .
  • the flexible glass substrate 150 includes a pair of opposed first and second edges 156 and 158 that extend along a length of the flexible glass substrate 150 and a central portion 160 that spans between the first and second edges 156 and 158 .
  • the first and second edges 156 and 158 may include beads 166 and 168 with a thickness T 1 that is greater than a thickness T 2 within the central portion 160 .
  • the central portion 160 may be “ultra-thin” having a thickness T 2 of about 0.3 mm or less including but not limited to thicknesses of, for example, about 0.01-0.05 mm, about 0.05-0.1 mm, about 0.1-0.15 mm and about 0.15-0.3 mm, 0.3, 0.29, 0.28, 0.27, 0.26, 0.25, 0.24, 0.23, 0.22, 0.21, 0.2, 0.19, 0.18, 0.17, 0.16, 0.15, 0.14, 0.13, 0.12, 0.11, 0.1, 0.09, 0.08, 0.07, 0.06, or 0.05 mm although flexible glass substrates 150 with other thicknesses may be formed in other examples.
  • the apparatus 152 may further include a cutting zone 170 .
  • the apparatus 152 may include a cutting support member 172 configured to bend the flexible glass substrate 150 in the cutting zone 170 to provide a bent target segment 174 with a bent orientation. Bending the target segment 174 within the cutting zone 170 can help stiffen and stabilize the flexible glass substrate 150 for improved positional control during a cutting procedure. Such stabilization can help inhibit buckling or disturbing the flexible glass substrate 150 during the cutting procedure.
  • the cutting support member 172 may not bend the flexible glass substrate 150 , instead providing and supporting the flexible glass substrate 150 in a substantially planar orientation.
  • the cutting support member 172 can be a non-contact support member configured to support the flexible glass substrate 150 without touching the first and second broad surfaces 176 and 178 of the flexible glass substrate 150 .
  • the non-contact cutting support member 172 can include one or more curved air bars configured to provide a cushion of air to space between the flexible glass substrate 150 and the cutting support member 172 to prevent the central portion 160 of the flexible glass substrate 150 from contacting the cutting support member 172 .
  • the space can also facilitate the formation of a local mechanical deformation in the flexible glass substrate 150 during a cutting operation.
  • the glass processing apparatus 152 may include one or more glass defect initiator assemblies 184 and 186 .
  • the glass defect initiator assembly 184 may be located below or opposite surface 178 of the flexible glass substrate 150 and glass initiator assembly 186 may be located above or opposite surface 176 of the flexible glass substrate 150 and upstream from a glass cutting apparatus 190 .
  • each glass defect initiator assembly 184 , 186 may have an extended configuration (illustrated by dashed lines) where an abrasive pad assembly 192 having an abrasive surface 194 is brought into contact with one of the surfaces 176 , 178 of the flexible glass substrate 150 .
  • glass defect initiator assembly 184 may contact surface 178 in the extended configuration, while glass defect initiator assembly 186 may contact surface 176 in the extended position.
  • the glass defect initiator assemblies 184 , 186 may include an actuator 196 that can be used to position the glass defect initiator assemblies 184 , 186 in their extended (and retracted) positions.
  • the actuator 196 may place the abrasive surface 194 in contact with the surface 176 , 178 of the glass substrate 150 with a predetermined force (e.g., as determined using a suitable load detector or other suitable sensor such as a pressure detector in an air cylinder).
  • the actuator 196 may also place the glass defect initiator assemblies 184 , 186 in their retracted positions where the abrasive surface 194 of the abrasive pad assembly 192 is separated from and out of contact with the respective surfaces 176 , 178 .
  • the actuator 196 may be configured to extend the abrasive pad assembly 192 a predetermined distance. Any suitable actuators may be used, such as motor driven eccentric drives, linear actuators, such as pneumatic actuators, etc.
  • the defect initiator assemblies 184 and 186 may be operated automatically and/or manually (e.g., based on a user input). For example, referring back to FIG. 5 , edge detectors 195 may be used to provide a signal indicative of edge location in the glass processing apparatus 152 . The defect initiator assemblies 184 and 186 may be placed in their extended and retracted positions (e.g., sequentially or simultaneously) based on the signals from the edge detectors. Any other suitable detector may be used to provide a signal (e.g., to a controller 197 ) for controlling actuation of the edge initiator assemblies 184 and 186 in order to form or stop forming a field of crack initiation defects as described above.
  • edge detectors 195 may be used to provide a signal indicative of edge location in the glass processing apparatus 152 .
  • the defect initiator assemblies 184 and 186 may be placed in their extended and retracted positions (e.g., sequentially or simultaneously) based on the signals from the edge detectors. Any other suitable detector may be
  • each defect initiator assembly 184 and 186 may represent a pair of edge initiator assemblies located at opposite edges of the flexible glass substrate 150 for removing the opposite edges simultaneously. Further, while both upstream and downstream defect initiators 184 and 186 are illustrated, there may be only one (e.g., one pair) upstream or downstream edge initiator assembly or there may be more than two pairs of defect initiators.
  • FIG. 7 illustrates an exemplary embodiment of another defect initiator assembly 191 including an abrasive pad assembly 192 .
  • the abrasive pad assembly 192 includes a bracket member 201 including a connecting portion 202 (e.g., for connecting to an actuator) and a pad holding portion 204 for holding an abrasive pad 205 .
  • a pair of actuator rods 210 and 212 extends outwardly from the connecting portion 202 to an air cylinder 214 .
  • the air cylinder 214 can be used to extend and retract the abrasive pad assembly 192 between extended and retracted positions as described above through the input and output of air through lines 215 and 217 .
  • an exemplary abrasive pad 218 is illustrated in isolation and includes a fabric 220 with discrete islands 222 of deposited metal having abrasive grains 225 embedded in the top surface of the islands 222 defining the abrasive surface 194 .
  • the abrasive pad 218 may further include a backing substrate 224 that can be formed of any soft, resilient material, such as a foam.
  • the abrasive pad 218 can be resilient and compliant, which can reduce pressure against the glass substrate when the abrasive surface 194 is applied thereto as described above. Further, the pad material can simultaneously collect removed glass particles, while providing the field of initiation defects. Additional details of the exemplary abrasive pad are described in U.S. Pat. No. 6,372,001.
  • the glass substrate 150 is positioned on a compliant surface 230 as the field of crack initiation defects is formed in the glass substrate 150 with the defect initiator assemblies 184 and 186 .
  • the compliant surface 230 may comprise a foam material, as described above, or alternatively, the compliant surface 230 may be an air bearing, as depicted in FIG. 5 .
  • the compliant surface 230 i.e., the air bearing
  • the air cushion 232 can compliantly support the glass substrate 150 as the abrasive surface 194 contacts the surface 176 and/or 178 of the glass substrate 150 , cushioning the glass substrate 150 and absorbing excess force applied to the glass substrate 150 thereby reducing unintended damage to the glass substrate 150 .
  • the glass substrate 150 may be compliantly supported by positioning the glass substrate on a compliant surface or held between a pair of supports, such as rollers.
  • the glass substrate 150 may be compliantly supported such that the glass substrate 150 flexes as the abrasive surface 194 impacts the surface 176 and/or 178 of the glass substrate 150 such that the depth of the initiation defects caused by the abrading fibers is minimized.
  • an exemplary crack initiation defect 250 formed by the abrasive surface 194 which is illustrated as one of a field of a plurality of crack initiation defects, is schematically depicted.
  • the crack initiation defect 250 does not extend through the thickness of the glass substrate 150 .
  • the depth of the crack initiation defect 250 may be dependent on the thickness of the glass substrate.
  • the depth of the initiation defect is 0.1 ⁇ T, where T is the thickness of the glass substrate 150 .
  • the crack initiation defect 250 may have a length of 8 mm or less and may extend from an edge of the glass substrate 150 .
  • the length of the crack initiation defect is greater than or equal to about 2 mm and less than or equal to about 8 mm.
  • the crack initiation defect has a nominal length of about 5 mm.
  • the crack initiation defects formed utilizing the methods described herein may be used to form and propagate a through vent (i.e., a crack) in a glass substrate along a desired separation line to separate the thin glass substrate into a plurality of substrates using laser separation techniques.
  • a laser source 260 may be utilized to heat the crack initiation defect 250 , and the volume of glass surrounding the crack initiation defect 250 , by directing a beam 262 of the laser source 260 onto the surface 176 of the glass substrate 150 .
  • a through vent i.e., a crack
  • the beam 262 of the laser source 260 has a beam spot 264 on the surface 176 of the glass substrate 150 with dimensions large enough to encompass at least a portion of the crack initiation defect 250 .
  • the beam spot 264 is positioned on the crack initiation defect 250 to heat the defect.
  • a cooling jet 266 of cooling fluid such as water, air, or another suitable cooling fluid, is projected onto the crack initiation defect 250 with a cooling nozzle 268 .
  • the cooling jet 266 generally forms a cooling spot 270 on the surface 176 of the glass substrate 150 with dimensions large enough to encompass at least a portion of the crack initiation defect 250 .
  • the rapid cooling of the glass surrounding the crack initiation defect 250 causes a crack to develop from the crack initiation defect and propagate through the thickness of the glass substrate 150 .
  • the glass substrate 150 may be moved relative to the cooling jet 266 and the beam 262 of the laser source 260 in the direction indicated by arrow 274 or, alternatively, the cooling jet 266 and the beam spot 264 may be traversed over the surface 176 of the glass substrate 150 along the line of desired line of separation 271 such that the crack propagates along the desired line of separation 271 , ultimately separating the thin glass substrate 150 into a plurality of smaller glass substrates.
  • the methods and apparatuses described herein may be used to mechanically form a field of crack initiation defects in a thin glass substrate to facilitate laser separation of the glass substrate into a plurality of individual glass substrates.
  • the techniques for forming the crack initiation defect described herein facilitate forming the crack initiation defect with a relatively low amount of normal force applied to the glass substrate and, as such, such techniques prevent uncontrolled cracking or puncturing of the glass substrate, particularly when the glass substrate has a thickness of less than about 0.2 mm.
  • the techniques described herein may also be effectively used to form crack initiation defects in substrates having thicknesses greater than about 0.2 mm.

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US15/524,703 2014-11-07 2015-11-05 Mechanically forming crack initiation defects in thin glass substrates using an abrasive surface Expired - Fee Related US10301211B2 (en)

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PCT/US2015/059176 WO2016073680A1 (fr) 2014-11-07 2015-11-05 Formation mécanique de défauts d'amorce de fissures dans des substrats minces en verre à l'aide d'une surface abrasive

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Cited By (1)

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US11780760B2 (en) 2017-09-15 2023-10-10 Corning Incorporated Systems and methods for processing a glass ribbon

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Publication number Priority date Publication date Assignee Title
KR20200106755A (ko) * 2019-03-05 2020-09-15 코닝 인코포레이티드 유리 라미네이트 기판의 가공 장치, 이를 이용한 가공 방법 및 절단 방법

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JP2017538650A (ja) 2017-12-28
CN107108323A (zh) 2017-08-29
KR20170084109A (ko) 2017-07-19
WO2016073680A1 (fr) 2016-05-12
EP3215470A1 (fr) 2017-09-13
US20170334762A1 (en) 2017-11-23
TW201628985A (zh) 2016-08-16
CN107108323B (zh) 2019-12-31
TWI656103B (zh) 2019-04-11

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