US10289944B2 - Metal smart card with dual interface capability - Google Patents

Metal smart card with dual interface capability Download PDF

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Publication number
US10289944B2
US10289944B2 US15/742,813 US201515742813A US10289944B2 US 10289944 B2 US10289944 B2 US 10289944B2 US 201515742813 A US201515742813 A US 201515742813A US 10289944 B2 US10289944 B2 US 10289944B2
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Prior art keywords
metal layer
card
module
plug
layer
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Active
Application number
US15/742,813
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US20180204105A1 (en
Inventor
John Herslow
Adam Lowe
Luis daSilva
Brian Nester
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Composecure LLC
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Composecure LLC
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Assigned to COMPOSECURE, LLC reassignment COMPOSECURE, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DASILVA, LUIS, HERSLOW, JOHN, LOWE, ADAM, NESTER, BRIAN
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Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COMPOSECURE, L.L.C.
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details

Definitions

  • the present invention relates generally to “smart” cards and, more particularly, relates to smart cards which have at least one metal layer and are capable of radio frequency transmission (RF) and physical electrical interfacing.
  • the invention relates to dual interface (i.e., capable of contactless and/or contact operation) smart cards having a metal layer and a rich and aesthetically pleasant appearance.
  • Smart cards are highly desirable and are in wide use, including: in payment and ticketing applications, such as mass transit and motorway tolls; in personal identification and entitlement schemes on regional, national, and international levels; in citizen cards; in drivers' licenses; in patient card schemes; and in biometric passports to enhance security for international travel.
  • payment and ticketing applications such as mass transit and motorway tolls
  • personal identification and entitlement schemes on regional, national, and international levels
  • citizen cards in drivers' licenses
  • patient card schemes in biometric passports to enhance security for international travel.
  • a smart card is a card that includes embedded electronic circuitry such as an integrated circuit (IC) chip that can be either: (a) a secure microcontroller, also referred to as a microprocessor, or equivalent intelligence device with internal memory; or (b) a memory chip alone.
  • IC integrated circuit
  • a smart card connects or couples to a card reader with direct physical contact and/or with a remote contactless radio frequency interface.
  • a “contact” smart card includes an IC chip connected to a conductive contact plate on which are mounted a number of physical contact pads (typically gold plated) located generally on the top surface of the card.
  • a contact smart card must be inserted into a contact type smart card reader and transmission of commands, data, and card status takes place over the physical contact pads
  • a “contactless” smartcard contains an IC chip and a card antenna by means of which RF signals are coupled between the smart card's chip and the antenna of a card reader. This permits wireless (e.g., RF) communication between the card and a card reader with no direct electrical contact between the card and the card reader.
  • a contactless smart card requires only close proximity to a reader. Both the reader and the smart card have antennae, and the two communicate using radio frequencies (RF) over a contactless link. Most contactless cards also derive power for the internal chip from electromagnetic signals emitted by the card reader. The range of operation may vary from less than an inch to several inches.
  • RF radio frequencies
  • a “dual-interface” smart card has, typically, a single IC chip (but could have two) and includes both contact and contactless interfaces. With dual-interface cards, it is possible to access the IC chip(s) using a contact and/or a contactless interface.
  • a metal layer provides a desirable weight and a decorative pattern and/or reflective surface enhancing the card's appearance and aesthetic value. This is especially desirable for use by high-end customers. It is therefore desirable to make dual interface (contacts and contactless) smart cards having a metal layer.
  • a dual interface smart card embodying the invention includes a top metal layer with a non-metallic plug formed within the metal layer to enable the placement of an IC module about the plug so the card can function as contact and/or contactless card. At the same time the card is made to have a relatively smooth and beautiful external surface.
  • a hole (opening or cut-out) is formed in the plug for locating an IC chip module about the center area of the plug so the IC module is isolated and insulated from the metal layer.
  • the plug functions to provide a physical separation and a degree of electrical insulation between the chip module and the metal layer in the horizontal and vertical directions.
  • the hole in the plug provides a pathway for RF transmission.
  • the chip module includes contacts which extend along the same horizontal surface as the metal layer to enable contact capability with a contact card reader and the chip module extends within the plug's hole to enable contactless (RF) operating capability.
  • the metal layer is a relatively thick layer having a top surface which defines the top surface of the card.
  • a plug is formed in the metal layer below the top surface so the plug is not seen from the top and does not affect the appearance of the card.
  • the lateral dimensions of the plug are greater than the lateral dimensions of the chip module to provide insulation and isolation.
  • a hole is formed vertically down through the plug and an underlying ferrite layer to form a passageway for RF signals to pass between a card booster antenna and an IC module chip antenna.
  • the lateral dimensions of the hole plug are smaller than the lateral dimensions of the IC chip module.
  • a dual interface smart metal card embodying the invention includes a metal layer in which is disposed an integrated circuit (IC) module to provide contactless (RF) and contact capability.
  • the metal layer has a top surface and a bottom surface extending generally parallel to each other. At least two different sized cut outs are formed in the metal layer, one above the other, both cut outs extending in the horizontal plane, symmetrically about the same centerline. One cut out is formed to position and nestle the IC module within the top surface of the metal layer and to enable the IC module, which has contacts to make to a card reader.
  • the IC module and its corresponding one cut out have a depth of approximately D 1 , a length L 1 and a width W 1 .
  • the other cut (also called a “pocket”), underlying the one cut out, extends from the bottom surface of the metal layer until a distance D 1 from the top surface.
  • the pocket is made to have a length L 2 greater than L 1 and a width W 2 greater than W 1 to enable RF transmission between the IC module and a card reader.
  • a non-metallic plug designed to fit snugly within the pocket fills the pocket and is attached to the walls of the pocket.
  • the plug has a centrally located opening having a length L 3 which is smaller than L 1 and a width W 3 which is less than W 1 .
  • FIG. 1 is a simplified, isometric diagram of a smart card 10 with a metal layer 30 , embodying the invention
  • FIG. 1A is a highly simplified, idealized isometric diagram of an integrated circuit (IC) module capable of contactless and contact operation intended for use in making smart cards embodying the invention
  • FIG. 1B is a simplified idealized cross sectional diagram of the IC module of FIG. 1A used in the card shown in FIG. 1 ;
  • FIG. 2 includes cross sectional diagrams of various processing steps ( 1 through 7 ) to form a card embodying the invention
  • FIG. 3A is a simplified cross sectional diagram of a card being made as shown in step 5 of FIG. 2 ;
  • FIG. 3B a top view of a card being formed as shown in FIG. 3A with a plug ( 34 ) and the opening ( 36 ) formed in the plug;
  • FIG. 3C is a top view of the top layer of a card embodying the invention formed in accordance with the process shown in FIG. 2 ;
  • FIG. 4 includes cross sectional diagrams of various processing steps ( 1 through 5 ) to form a card according to another aspect of the invention
  • FIG. 5A is a cross sectional diagram corresponding to step 4 of FIG. 4 showing a plug and openings formed in the plug prior to insertion of an IC module;
  • FIG. 5B is a top view of a card having the cross section shown in FIG. 5A showing the plug and openings formed in the plug prior to insertion of an IC module formed in accordance with FIG. 4 ;
  • FIG. 5C is a top view of a card formed according to the process steps shown in FIG. 4 and as shown in FIGS. 5A and 5B with an IC module inserted in the opening for the module;
  • FIG. 6 is a cross-sectional diagram showing a masking layer formed on a card such as the one shown in FIG. 5C .
  • An integrated circuit (IC) module 7 having multiple contacts as shown in FIG. 1A is to be mounted in, and on, a card 10 as shown in FIG. 1 with the top surface of the IC module and its contacts generally flush with the top surface of the card.
  • the length, width and depth of the card may respectively be approximately 3.37 inches by 2.125 inches by 0.03 inches.
  • the IC module has a depth D 1 , a length L 1 and a width W 1 .
  • Modules such as IC module 7 are commercially available, for example, from Infineon or NXP.
  • the lateral dimensions of some of these modules were approximately 0.052 inches by 0.47 inches with a depth ranging from 0.005 inches to more than 0.025 inches. These dimensions are purely illustrative and IC modules used to practice the invention may be greater or smaller in size.
  • IC module 7 contains an internal microprocessor chip 7 a , a chip antenna 7 b and a contact pad 7 c .
  • Pad 7 c may be a conventional multi-contact pad used in contact-type smart cards and is positioned to engage contacts in a contact card reader (not shown) when the smart card is inserted therein.
  • An epoxy blob 7 d encapsulates the bottom side of the IC module. The epoxy blob allows the IC module to be easily attached (e.g., by gluing) to an underlying surface.
  • the invention is directed to the manufacture of a smart metal card having dual interface capability and also having a top surface which is free of any bumps or depressions, except for: (a) the IC module and its contacts, and/or (b) any design or texture intentionally formed on the top surface.
  • a card can be made to have a highly aesthetic, smooth and visually pleasing appearance even though the card must include dual interface capability (i.e., contact and contactless capability). That is, smart cards having a metal layer as a top surface, for aesthetic reasons, must include an IC module and its associated contacts. For the card to be used in a contact mode, the contacts of the IC module have to be located along an exterior surface of the card.
  • the contacts are located along the top surface of the card although the contacts could conceivably be located along the bottom surface of the card.
  • RF wireless
  • a challenge is to produce these cut outs (openings) in the metal layer without affecting the smooth, aesthetic, exterior (e.g., top) appearance of the card.
  • a method of forming a card in accordance with the invention includes the structure and processing steps illustrated in FIG. 2 .
  • booster antenna 47 is designed to capture radio frequency energy generated by an associated card reader (not shown) and to communicate with the card reader.
  • module antenna 7 b is sufficiently close to couple inductively with antenna 47 , thereby providing signals from antenna 47 to chip 7 a , while keeping the chip electrically isolated from antenna 47 .
  • ferrite layer 44 shields metal layer 30 , to make it possible for radio frequency radiation to enter and be emitted from card 10 .
  • ferrite layer 44 shields metal layer 30 , to make it possible for radio frequency radiation to enter and be emitted from card 10 .
  • Booster antenna 47 is designed to capture radio frequency energy generated by an associated card reader (not shown) and to communicate with the card reader.
  • module antenna 7 b is sufficiently close to couple inductively with antenna 47 , thereby providing signals from antenna 47 to chip 7 a , while keeping the chip electrically isolated from antenna 47 .
  • the dimensional tolerances of the various holes/openings and of the components need to be close enough so that on a platen lamination all parts fuse together with no airspace or sinks in the outward appearance of the card.
  • metal layer 30 has a cut out 36 formed in its top surface.
  • the thickness/depth D 1 of cut out 36 is made substantially equal to the depth of the IC module 7 .
  • the hole/opening 36 is machined through metal layer 30 dimensioned to receive module 7 , which is secured therein, as by bonding.
  • Module 7 contains a microprocessor chip 7 a (internally), a chip antenna 7 b and a contact pad 7 c .
  • Pad 7 c is a conventional contact pad used in contact-type smart cards and is positioned to engage contacts in a card reader when the smartcard is inserted therein.
  • plug 34 is substantially wider than module 7 .
  • plug 34 extends at least 0.04 laterally beyond either side of module 7 . This prevents the metal in substrate 30 from interfering with communication between the card and chip.
  • the plug does not have to be wider than module 7 (i.e., its lateral dimensions need not be greater than those of the module).
  • Module 7 is positioned vertically within metal layer 30 so as to provide a contact pad 7 c along the top metal surface to realize the contact functions of the dual interface. Moreover, positioning module 7 on plug 34 which is made larger (though not necessarily so) in area than the module 7 makes it possible to decrease interference in the radio communication between module antenna 7 b and the booster antenna 47 .
  • cards embodying the invention may be formed as shown in FIGS. 4, 4A, 5A, 5B, 5C and 6 . These cards differ from those discussed above in that a plug is formed whose thickness is equal to the thickness of the metal layer. That is, there is no recessed pocket.
  • a card formed in accordance with this aspect of the invention may include the following processing steps and structure:
  • FIG. 5A is an enlarged cross sectional diagram corresponding to step 4 of FIG. 4 .
  • FIG. 5B is a top view of a card showing the holes formed in the metal and the plug.
  • FIG. 5C is a top view of a card showing the module 7 mounted and inserted in the top of the card.
  • the smart metal card 10 can function as a wireless (contactless) card or as a contact card. Note that as shown in FIGS. 5A, 5B and 5C the hole portion 436 a has an inner edge 410 . The plug has an outer edge 442 . As is evident from FIGS. 5B and 5C , the IC module 7 will cover openings 436 a and 436 b .
  • space/area 450 between edges 440 and 442 extending around the outer periphery of the IC module between the module 7 and the metal layer 30 .
  • the space/area 450 may be objected to on aesthetic grounds as it detracts from the continuous metal layer (except for the necessary module contact pad). However, it should be appreciated that the space area 450 may enhance RF transmission.
  • the presence of space/area 450 and an depression or bump related to space 450 may be masked by the addition of a masking layer 470 , as shown in FIG. 6 . This may be acceptable in many instances. However, in instances where such a solution is still not acceptable or feasible, the solution is to revert to making cards as per the process steps shown in FIG. 2 .
  • a problem with the smart cards formed in accordance with the process shown in FIG. 4 is that a portion of a plug may be seen.
  • the portion of the plug may mar the continuous appearance of the card and/or as a bump on the surface or as a depression. This may be so, even if a masking (concealing) layer 470 is formed over layer 30 .
  • the spacing and any discontinuity in the metal surface are avoided by forming a recess pocket 32 in substrate 30 and filling the recess with a plug 34 which is not seen from the top of the card.
  • the plug 34 does not appear as a bump on the surface or as a depression. It is not visible when the card is viewed from the outside.
  • the process of FIG. 2 thus differs from the process of FIG. 4 where a through hole 420 is formed in the metal layer 30 and a plug 434 is formed which fills the hole 420 .
  • a plug is used to separate an IC module from a surrounding metal layer to promote RF transmission capability and the plug is also used to position and secure the IC module within the card. Openings for the plug and its positioning within the card are designed to maintain the exterior of the card flat and visually pleasant.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Electromagnetism (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
US15/742,813 2015-07-08 2015-07-08 Metal smart card with dual interface capability Active US10289944B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/039535 WO2017007468A1 (en) 2015-07-08 2015-07-08 Metal smart card with dual interface capability

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2015/039535 A-371-Of-International WO2017007468A1 (en) 2015-07-08 2015-07-08 Metal smart card with dual interface capability
US16/739,211 Continuation-In-Part US10748049B2 (en) 2015-07-08 2020-01-10 Metal smart card with dual interface capability

Related Child Applications (3)

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US15/976,612 Continuation-In-Part US10318859B2 (en) 2015-07-08 2018-05-10 Dual interface metal smart card with booster antenna
US15/976,612 Continuation US10318859B2 (en) 2015-07-08 2018-05-10 Dual interface metal smart card with booster antenna
US16/367,595 Continuation US10534990B2 (en) 2015-07-08 2019-03-28 Metal smart card with dual interface capability

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US20180204105A1 US20180204105A1 (en) 2018-07-19
US10289944B2 true US10289944B2 (en) 2019-05-14

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US15/742,813 Active US10289944B2 (en) 2015-07-08 2015-07-08 Metal smart card with dual interface capability
US16/367,595 Active US10534990B2 (en) 2015-07-08 2019-03-28 Metal smart card with dual interface capability
US16/739,211 Active US10748049B2 (en) 2015-07-08 2020-01-10 Metal smart card with dual interface capability

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US16/367,595 Active US10534990B2 (en) 2015-07-08 2019-03-28 Metal smart card with dual interface capability
US16/739,211 Active US10748049B2 (en) 2015-07-08 2020-01-10 Metal smart card with dual interface capability

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US (3) US10289944B2 (hu)
EP (2) EP3779795B1 (hu)
JP (1) JP6200106B2 (hu)
CN (2) CN106575373B (hu)
AU (1) AU2015390919B2 (hu)
CY (1) CY1123448T1 (hu)
DK (1) DK3138049T3 (hu)
ES (1) ES2827026T3 (hu)
HK (1) HK1232323A1 (hu)
HU (1) HUE051867T2 (hu)
NZ (1) NZ725249A (hu)
PL (1) PL3138049T3 (hu)
PT (1) PT3138049T (hu)
SG (1) SG11201608594YA (hu)
WO (1) WO2017007468A1 (hu)

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US11113593B2 (en) 2019-08-15 2021-09-07 Federal Card Services; LLC Contactless metal cards with fingerprint sensor and display
US11301744B2 (en) 2015-07-08 2022-04-12 Composecure, Llc Metal smart card with dual interface capability
US11341385B2 (en) 2019-11-16 2022-05-24 Federal Card Services, LLC RFID enabled metal transaction card with shaped opening and shaped slit
US11347993B2 (en) 2019-08-12 2022-05-31 Federal Card Services, LLC Dual interface metal cards and methods of manufacturing
US11416728B2 (en) 2019-08-15 2022-08-16 Federal Card Services, LLC Durable dual interface metal transaction cards
US11455507B2 (en) 2019-10-13 2022-09-27 Federal Card Services, LLC Metal transaction cards containing ceramic having selected coloring and texture
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US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
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US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10892646B2 (en) 2016-12-09 2021-01-12 Nucurrent, Inc. Method of fabricating an antenna having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
TWI656816B (zh) * 2017-07-25 2019-04-11 宏通數碼科技股份有限公司 電子卡及其製作方法
EP3673415B1 (en) * 2017-08-25 2022-05-25 CPI Card Group -Colorado, Inc. Weighted transaction card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
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