TWM654203U - Air-cooled and liquid-cooled composite heat sink - Google Patents

Abstract

This invention is about an air-cooled liquid-cooled composite heat dissipation device, which includes: a liquid cooling device, including a heat dissipation base and a liquid cooling head, one side of the heat dissipation base is provided with a groove, the groove is used to correspond to a liquid cooling tube, the liquid cooling tube is used to accommodate the flowing liquid cooling liquid, the liquid cooling head is provided with two liquid tube joints, the two liquid tube joints are connected to the two ends of the liquid cooling tube; a heat pipe device, including a plurality of heat pipes, each of which has a heat pipe contact section, the heat pipe contact section is in close contact with the liquid cooling tube and the heat dissipation base; in this way, it can actively improve the overall heat dissipation efficiency through the proper combination design of air cooling and liquid cooling heat dissipation technology, so that it can be used in conjunction with the heat dissipation of electronic components with increasingly powerful functions.

Description

Air-cooled and liquid-cooled composite heat dissipation device

This invention relates to a heat sink structure, in particular to an air-cooled and liquid-cooled composite heat sink with air-cooled and liquid-cooled heat dissipation options or combined operation.

The electronic components in today's electronic products are becoming more functional, which means that more heat will be generated when the electronic components are in operation. If this heat cannot be removed in time, it will lead to the problem of unstable performance and shortened life of the electronic products. Therefore, in order to keep the operating temperature of electronic components within an appropriate range, effective heat dissipation technology is crucial. Therefore, using heat dissipation devices to effectively dissipate heat from electronic components has become a common concern in the industry.

The commonly used heat dissipation technology is an air-cooled heat dissipation, which mainly installs a fan on the heat dissipation fin assembly, and the heat dissipation fin assembly is penetrated by a heat pipe, and a heat dissipation seat is provided under the heat dissipation fin assembly, and the heat dissipation seat is used to attach a heat source, such as a processor or a chip and other heat generating components. The heat energy of the heat source is transferred to the heat dissipation fin assembly through the heat dissipation seat, and the heat energy of the heat dissipation fin assembly is discharged through the absorption and transfer of the heat pipe and the blowing airflow of the fan, so as to achieve the function of heat dissipation and cooling.

It is known that there is another type of heat dissipation technology, liquid cooling, which is mainly composed of a liquid cooling head, a liquid pipe, a water pump, a cooling liquid pipe/row and a liquid cooling liquid (water). The liquid cooling head takes out the heat energy of the heat source through the liquid cooling liquid in the cooling liquid pipe/row, so that the liquid cooling heat dissipation cycle can be carried out. However, both air cooling and liquid cooling are selected to operate separately, and when the heat dissipation efficiency cannot meet the thermal design power consumption (TDP, unit is W) of the equipment, the temperature of the equipment will continue to rise, thereby affecting its normal function. For example, the development and use of high-end monitors are often accompanied by the generation of a large amount of heat energy, making the existing heat dissipation technologies gradually inadequate. Therefore, it is particularly important to develop better heat dissipation technology solutions to meet the corresponding requirements of the thermal design power consumption (TDP) of the equipment.

Therefore, the creator of this case, in view of the fact that the shortcomings of the known heat dissipation technology and its imperfect structural design have gradually emerged, has begun to develop a solution, hoping to develop a more efficient heat dissipation method that can be selected or combined for use, and can be used to dissipate heat for electronic components with increasingly powerful functions, in order to serve the general public and promote the development of this industry. After a long period of thinking, this creation was born.

The purpose of this invention is to provide an air-cooled and liquid-cooled composite heat dissipation device, which can actively improve the overall heat dissipation efficiency through the proper combination of air cooling and liquid cooling technology, so that it can cooperate with the heat dissipation users of increasingly powerful electronic components.

Another purpose of this invention is to provide an air-cooled and liquid-cooled composite heat dissipation device, which enables air cooling and liquid cooling technologies to be selected and used according to needs, and also enables the combination of air cooling and liquid cooling heat dissipation technologies to be used together, thereby expanding its heat dissipation application range and improving its applicability.

The technical means adopted by this invention to achieve the above-mentioned purpose include: a liquid cooling device, including a heat dissipation base and a liquid cooling head, one side surface of the heat dissipation base is provided with a groove, the groove is used to correspond to a liquid cooling tube, the liquid cooling tube is used to accommodate the flowing liquid cooling liquid, the liquid cooling head is provided with two liquid tube joints, the two liquid tube joints are connected to the two ends of the liquid cooling tube; a heat pipe device, including a plurality of heat pipes, each of which has a heat pipe contact section, the heat pipe contact section is in close contact with the liquid cooling tube and the heat dissipation base.

In this embodiment, the liquid cooling tube is a U-shaped tube.

In this embodiment, one end surface of the heat sink base is provided with a plurality of positioning holes, and the liquid cooling head is provided with two liquid cooling head channels and a plurality of positioning slots, and the plurality of positioning slots correspond to the plurality of positioning holes.

In this embodiment, a water stop washer is provided at the end of the liquid cooling head channel, and a positioning plate is provided. The positioning plate is provided with two liquid cooling head slots and a plurality of positioning holes. The positioning plate is provided on the liquid cooling head, and the two liquid cooling head slots correspond to the two liquid cooling head channels respectively, so that the liquid cooling pipe is inserted into the two liquid cooling head slots and enters the liquid cooling head channel, and the liquid cooling head and the heat dissipation base are fixed.

In this embodiment, the liquid cooling tube has at least one planar side, and the heat conducting tube contact section has at least one planar side.

In this embodiment, it further includes a heat sink fin assembly, which includes a plurality of heat sink fins, and the bottom of the heat sink fin assembly is provided with at least one positioning frame.

In this embodiment, the bottom of the heat sink fin assembly is formed with a recessed portion for accommodating the plurality of heat pipe contact sections, and the heat sink fin assembly is provided with a plurality of heat sink connection slots on both sides of the recessed portion.

In this embodiment, the recessed portion is within the range of the positioning frame.

In this embodiment, the heat sink base is fixed to the heat sink fin assembly, the plurality of heat pipe contact sections are vertically and closely contacted to the liquid cooling tube, and a fan is installed above the heat sink fin assembly.

In this embodiment, the liquid pipe joint is connected to a water tank via a pipe, and the water tank is connected to a water pump.

In this embodiment, the heat sink fin assembly and the heat sink base are fixed to a circuit board, a heat sink is provided on the circuit board, and the heat sink base is in close contact with the heat sink.

In order to enable the review committee to have a deeper understanding and knowledge of the technical features and effects achieved by this creation, we would like to provide better implementation diagrams and detailed explanations as follows:

1: Heat dissipation device

10: Liquid cooling device

11: Heat dissipation base

14: Liquid cooling head

111: Positioning hole

12: Grooves

13: Liquid cooling tube

132: Flat side

131: Pipeline

14: Liquid cooling head

15: Liquid cooling head channel

151: Positioning slot

16: Liquid pipe joint

161: Liquid channel

18: Water stop gasket

17: Positioning plate

171: Liquid cooling head slot

172: Positioning hole

19: Screws

20: Heat sink fin assembly

21: Heat sink fins

22: Positioning frame

23: Concave part

211: Heat dissipation pipe slot

212: Heat dissipation pipe slot

30: Heat pipe device

31: Heat pipe

311: Thermal conductor contact section

40: Circuit board

41: Heating element

50: Fan

60: Water tank

Figure 1 is a schematic diagram of the three-dimensional combination of this creation.

Figure 2 is a partial decomposition diagram of this work.

Figure 3 is a schematic diagram of the decomposition of the liquid cooling device of this invention.

Figure 4 is a schematic diagram of the assembly of the liquid cooling device of this invention.

Figure 5 is a partial cross-sectional diagram of the liquid cooling device of this invention.

Figure 6 is a three-dimensional schematic diagram of the application of this creative combination.

Figure 7 is a cross-sectional diagram of the application of this creative combination.

Please refer to Figures 1, 2, 3, 4 and 5 for illustrating an embodiment of the air-cooled liquid-cooled composite heat sink of the present invention. The heat sink 1 disclosed in the present invention includes a liquid cooling device 10, a heat sink fin assembly 20, and a heat pipe device 30. The components are described in detail below.

The liquid cooling device 10 includes a heat sink 11 and a liquid cooling head 14. One end surface of the heat sink 11 is provided with a plurality of positioning holes 111. One side surface of the heat sink 11 is provided with a groove 12. The groove 12 is used to correspond to a liquid cooling tube 13. The liquid cooling tube 13 is slightly U-shaped (but not limited to). The liquid cooling tube 13 preferably has at least one flat side 132 (as shown in FIG. 7). The liquid cooling tube 13 has a pipe 131 therein for accommodating a flowing liquid cooling liquid (such as water). The liquid cooling head 14 is provided with two liquid cooling head channels 15 and a plurality of positioning grooves 151. One side surface of the liquid cooling head 14 is provided with two liquid pipe joints 16. The liquid pipe joint 16 has a liquid channel 161. A water stop washer 18 is provided at the end of the liquid cooling head channel 15; another positioning plate 17 is provided with two liquid cooling head slots 171 and a plurality of positioning holes 172, the positioning plate 17 is provided on the liquid cooling head 14, and the two liquid cooling head slots 171 correspond to the two liquid cooling head channels 15 respectively; the liquid cooling pipe 13 is inserted into the two liquid cooling head slots 171 and enters the liquid cooling head channel 15, and is fixed to the positioning hole 111 of the heat sink 11 by a screw 19 through the positioning slot 151 and the positioning hole 172, so as to fix the liquid cooling head 14 and the heat sink 11, and to fix the liquid cooling pipe 13 in the two liquid cooling head channels 15, and to connect the two ends of the liquid cooling pipe 13 with the pipe 131 connected to the liquid channel 161 of the liquid pipe joint 16.

The heat sink fin assembly 20 includes a plurality of heat sink fins 21, which are arranged in a gap arrangement so that a heat sink channel is formed between adjacent heat sink fins 21. The bottom of the heat sink fin assembly 20 is provided with at least one positioning frame 22, and a recessed portion 23 is formed at the bottom of the heat sink fin assembly 20 within the range of the positioning frame 22, and the heat sink fin assembly 20 is provided with a plurality of heat sink pipe grooves 211, 212 on both sides of the recessed portion 23.

The heat pipe device 30 is disposed in the recessed portion 23 of the heat sink fin assembly 20. The heat pipe device 30 includes a plurality of heat pipes 31. Each heat pipe 31 has a heat pipe contact section 311. Both sides of each heat pipe contact section 311 are respectively inserted into the heat sink pipe grooves 211 and 212. The heat pipe contact section 311 preferably has at least one flat side.

Please refer to Figures 6 and 7 together. When the present invention combines the air-cooled and liquid-cooled composite heat sink, the heat sink base 11 is fixed to the heat sink fin assembly 20, and the liquid cooling tube 13 is in contact with the multiple heat-conducting tube contact sections 311 fixed to the heat-conducting tube device 30, that is, the multiple heat-conducting tube contact sections 311 are vertically and closely contacted with the plane side 132 of the liquid cooling tube 13, and the contact surface is in close contact with the two plane sides. At the same time, the multiple heat-conducting tube contact sections 311 are also in close contact with the heat sink base 11.

Please refer to Figure 6. The liquid pipe joint 16 is connected to a water tank 60 via a pipe (not shown). The water tank 60 is connected to a water pump (not shown), so that the liquid cooling liquid (such as water) in the liquid cooling pipe 13 can circulate.

Please refer to FIG. 7 , the heat sink fin assembly 20 and the liquid cooling device 10 (heat sink base 11) are fixed to a circuit board 40, on which a heat generating element 41 (such as a processor or a chip, etc.) is disposed, and the other side of the heat sink base 11 opposite to the groove 12 and the liquid cooling tube 13 is in close contact with the heat generating element 41, so that the high heat generated by the heat generating element 41 is respectively dissipated through the heat sink base 11, the liquid cooling tube 13 and/or the plurality of heat conducting pipes 31. A fan 50 is installed above the heat dissipation fin assembly 20, and the fan 50 blows cold air toward the heat dissipation fin assembly 20 to the heat dissipation channel and the heat dissipation base 11. At this time, the heat source can be operated by the multiple heat pipes 31 to produce an air-cooled heat dissipation effect; and the heat source can also be operated by the liquid cooling pipe 13 to produce a liquid-cooled heat dissipation effect.

Since the liquid cooling tube 13 or the plurality of heat pipes 31 can be used for heat dissipation respectively, both can be operated separately to produce liquid cooling or air cooling heat dissipation effects; for example, when the heat dissipation demand is not the highest, only the air cooling heat dissipation operation of the heat pipe device 30 can be used; and when the heat dissipation demand is higher, the two heat dissipation operations can be combined at the same time to have better heat dissipation effects of both liquid cooling and air cooling.

This invention is an air-cooled liquid-cooled composite heat dissipation device. Through the above structure, it can actively improve the overall heat dissipation efficiency through the proper combination of air cooling and liquid cooling technology, so that it can be used in conjunction with the heat dissipation of increasingly powerful electronic components; and in heat dissipation applications, it can combine air cooling and liquid cooling technology according to needs, and can also use air cooling heat dissipation technology alone, thereby expanding its heat dissipation application range and improving its applicability.

This invention has been described in more detail through the above-mentioned preferred specific embodiments, but this invention is not limited to the above-mentioned embodiments. Any changes and modifications to these structures within the scope of the technical ideas disclosed in this invention are still within the scope of this invention.

10: Liquid cooling device

11: Heat dissipation base

14: Liquid cooling head

16: Liquid pipe joint

161: Liquid channel

20: Heat sink fin assembly

21: Heat sink fins

22: Positioning frame

211: Heat dissipation pipe slot

30: Heat pipe device

31: Heat pipe

Claims (10)

An air-cooled and liquid-cooled composite heat dissipation device, comprising: A liquid cooling device includes a heat dissipation base and a liquid cooling head. A groove is provided on one side of the heat dissipation base. The groove is used to correspond to a liquid cooling tube. The liquid cooling tube is used to accommodate the flowing liquid cooling liquid. The liquid cooling head is provided with a liquid tube joint. The liquid tube joint is connected to the two ends of the liquid cooling tube. A heat pipe device includes a plurality of heat pipes, each of which has a heat pipe contact section, and the heat pipe contact section is in close contact with the liquid cooling pipe and the heat dissipation base. According to the air-cooled and liquid-cooled composite heat dissipation device described in Item 1 of the patent application, the liquid cooling tube is a U-shaped tube. According to the air-cooled liquid-cooled composite heat dissipation device described in Item 1 of the patent application scope, one end surface of the heat dissipation base is provided with a plurality of positioning holes, the liquid cooling head is provided with two liquid cooling head channels and a plurality of positioning slots, and the plurality of positioning slots correspond to the plurality of positioning holes. According to the air-cooled and liquid-cooled composite heat dissipation device described in item 3 of the patent application, a water stop washer is provided at the end of the liquid cooling head channel, and a positioning plate is provided. The positioning plate is provided with two liquid cooling head slots and a plurality of positioning holes. The positioning plate is provided on the liquid cooling head, and the two liquid cooling head slots correspond to the two liquid cooling head channels respectively, so that the liquid cooling pipe is inserted into the two liquid cooling head slots and enters the liquid cooling head channel, and the liquid cooling head and the heat dissipation base are fixed. According to the air-cooled liquid-cooled composite heat dissipation device described in Item 1 of the patent application, the liquid cooling pipe has at least one flat side, and the heat conducting pipe contact section has at least one flat side. According to the air-cooled and liquid-cooled composite heat dissipation device described in Item 1 of the patent application, it further includes a heat dissipation fin assembly, the heat dissipation fin assembly includes a plurality of heat dissipation fins, and the bottom of the heat dissipation fin assembly is provided with at least one positioning frame. According to the air-cooled and liquid-cooled composite heat dissipation device described in Item 6 of the patent application, the bottom of the heat dissipation fin assembly is formed with a recessed portion for accommodating the plurality of heat conducting pipe contact sections, and the heat dissipation fin assembly is provided with a plurality of heat dissipation pipe slots on both sides of the recessed portion. According to the air-cooled and liquid-cooled composite heat dissipation device described in Item 7 of the patent application, the recessed portion is within the range of the positioning frame. According to the air-cooled liquid-cooled composite heat dissipation device described in Item 8 of the patent application, the heat dissipation base is fixed to the heat dissipation fin assembly, the plurality of heat pipe contact sections are vertically and closely contacted to the liquid cooling pipe, and a fan is installed above the heat dissipation fin assembly. According to the air-cooled liquid-cooled composite heat dissipation device described in Item 1 of the patent application, the liquid pipe joint is connected to a water tank by a pipe, and the water tank is connected to a water pump.

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