TWM653489U - Feed structure of reaction chamber of plasma processing equipment - Google Patents
Feed structure of reaction chamber of plasma processing equipment Download PDFInfo
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- TWM653489U TWM653489U TW112211501U TW112211501U TWM653489U TW M653489 U TWM653489 U TW M653489U TW 112211501 U TW112211501 U TW 112211501U TW 112211501 U TW112211501 U TW 112211501U TW M653489 U TWM653489 U TW M653489U
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 62
- 230000005540 biological transmission Effects 0.000 claims abstract description 27
- 238000009832 plasma treatment Methods 0.000 claims abstract description 11
- 239000010453 quartz Substances 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
本創作公開一種電漿處理設備反應腔的饋電結構,所述反應腔包括腔體和設置於腔體頂部的頂蓋;所述腔體側壁的頂部至少部分為內緣低於外緣的階梯型,所述饋電結構包括:傳輸部,貫穿頂蓋並將電能饋入反應腔內,所述傳輸部包括導線、輸入端和輸出端,所述導線連接所述輸入端和所述輸出端,所述輸入端與反應腔外的電源電連接,所述輸出端與反應腔內用電部的接電端子電連接;以及絕緣部,使所述接電端子與所述腔體、所述頂蓋絕緣;其中,所述接電端子設置於所述內緣正上方並與所述內緣絕緣。本創作可以方便地向腔室內饋入電能,並且使饋電結構及用電部與反應腔徹底絕緣,能夠有效地防止電源通過饋電結構向用電部饋電時發生能量洩露或流失。The present invention discloses a power feeding structure for a reaction chamber of a plasma treatment equipment, wherein the reaction chamber comprises a chamber body and a top cover arranged at the top of the chamber body; the top of the side wall of the chamber body is at least partially stepped with an inner edge lower than an outer edge; the power feeding structure comprises: a transmission part, which penetrates the top cover and feeds electric energy into the reaction chamber; the transmission part comprises a wire, an input end and an output end, the wire connects the input end and the output end, the input end is electrically connected to a power source outside the reaction chamber, and the output end is electrically connected to a power terminal of an electric part in the reaction chamber; and an insulating part, which insulates the power terminal from the chamber body and the top cover; wherein the power terminal is arranged directly above the inner edge and insulated from the inner edge. The invention can conveniently feed electric energy into the chamber, and completely insulate the power feeding structure and the power-consuming part from the reaction chamber, which can effectively prevent energy leakage or loss when the power is fed to the power-consuming part through the power feeding structure.
Description
本創作涉及半導體設備技術領域,尤其涉及一種電漿處理設備反應腔的饋電結構。This invention relates to the field of semiconductor equipment technology, and in particular to a feeding structure of a reaction chamber of a plasma processing device.
電容耦合電漿蝕刻設備利用射頻能量在上下電極之間產生電漿,以對晶圓進行蝕刻。由於射頻能量的耦合性質與設備結構的複雜性,會在蝕刻設備反應腔內產生諧波,導致晶圓表面上的能量分佈不均,影響晶圓表面蝕刻的均勻性。Capacitively coupled plasma etching equipment uses radio frequency energy to generate plasma between upper and lower electrodes to etch wafers. Due to the coupling nature of radio frequency energy and the complexity of the equipment structure, harmonics will be generated in the reaction chamber of the etching equipment, resulting in uneven energy distribution on the wafer surface, affecting the uniformity of etching on the wafer surface.
為了改善蝕刻的均勻性,需要在電漿處理設備的反應腔內設置一些用電部件,而向這些用電部件饋電的結構存在一些問題,如擠佔設備空間、不能適應用電部件的經常更換等。因此,有必要對饋電的結構進行設計。In order to improve the uniformity of etching, some electrical components need to be set in the reaction chamber of the plasma processing equipment. However, there are some problems with the structure of feeding these electrical components, such as occupying the equipment space and not being able to adapt to the frequent replacement of electrical components. Therefore, it is necessary to design the structure of feeding.
本創作的目的在於提供一種電漿處理設備反應腔的饋電結構,通過貫穿頂蓋的傳輸部可以將電能饋入反應腔內用電部,通過絕緣部可以使用電部與反應腔絕緣,從而優化反應腔的設計,減小占地面積,同時避免射頻能量洩露至反應腔體外。The purpose of this invention is to provide a feeding structure for a reaction chamber of a plasma treatment equipment, which can feed electric energy into the power-consuming part in the reaction chamber through a transmission part penetrating the top cover, and can insulate the power-consuming part from the reaction chamber through an insulating part, thereby optimizing the design of the reaction chamber, reducing the floor space occupied, and preventing radio frequency energy from leaking out of the reaction chamber.
為了達到上述目的,本創作通過以下技術方案實現:In order to achieve the above objectives, this work is realized through the following technical solutions:
一種電漿處理設備反應腔的饋電結構,所述反應腔包括腔體和設置於所述腔體頂部的頂蓋;所述腔體側壁的頂部至少部分為內緣低於外緣的階梯型,所述饋電結構包括: 傳輸部,貫穿所述頂蓋並將電能饋入所述反應腔內,所述傳輸部包括導線、輸入端和輸出端,所述導線連接所述輸入端和所述輸出端,所述輸入端與所述反應腔外的電源電連接,所述輸出端與所述反應腔內用電部的接電端子電連接;以及 絕緣部,使所述接電端子與所述腔體、所述頂蓋絕緣; 其中,所述接電端子設置於所述內緣正上方並與所述內緣絕緣。 A power feeding structure for a plasma treatment equipment reaction chamber, the reaction chamber comprising a chamber and a top cover arranged at the top of the chamber; the top of the side wall of the chamber is at least partially stepped with the inner edge lower than the outer edge, the power feeding structure comprising: a transmission part, which penetrates the top cover and feeds electric energy into the reaction chamber, the transmission part comprising a wire, an input end and an output end, the wire connecting the input end and the output end, the input end being electrically connected to a power source outside the reaction chamber, and the output end being electrically connected to a power terminal of an electric part in the reaction chamber; and an insulating part, which insulates the power terminal from the chamber and the top cover; Wherein, the power terminal is arranged directly above the inner edge and is insulated from the inner edge.
可選的,所述傳輸部還包括絕緣套筒;所述絕緣套筒貫穿所述頂蓋,所述輸出端設置於所述絕緣套筒下端,所述導線穿設於所述絕緣套筒內並與所述輸出端和所述輸入端電連接。Optionally, the transmission part further includes an insulating sleeve; the insulating sleeve passes through the top cover, the output end is arranged at the lower end of the insulating sleeve, and the wire passes through the insulating sleeve and is electrically connected to the output end and the input end.
可選的,所述輸出端為可伸縮元件;所述可伸縮元件與所述接電端子抵接使所述用電部和所述電源電連通。Optionally, the output end is a retractable element; the retractable element abuts against the power terminal to make the power-consuming part and the power source electrically connected.
可選的,所述輸出端為凸起元件,所述接電端子為與所述凸起元件匹配的饋電孔;所述凸起元件插入所述饋電孔內使所述用電部和所述電源電連通。Optionally, the output end is a protruding element, and the power terminal is a feeding hole matching the protruding element; the protruding element is inserted into the feeding hole to electrically connect the power-consuming part and the power source.
可選的,所述饋電孔內設有金屬彈性元件,以使所述凸起元件與所述饋電孔彈性接觸。Optionally, a metal elastic element is provided in the feeding hole so that the protruding element is in elastic contact with the feeding hole.
可選的,所述絕緣部包括絕緣墊圈;所述絕緣墊圈設置於所述輸出端和所述頂蓋之間,用於使所述接電端子與所述頂蓋絕緣。Optionally, the insulating portion includes an insulating gasket; the insulating gasket is disposed between the output end and the top cover to insulate the power terminal from the top cover.
可選的,所述絕緣墊圈和所述頂蓋之間設有密封圈。Optionally, a sealing ring is provided between the insulating gasket and the top cover.
可選的,所述絕緣部包括絕緣座;所述絕緣座設置於所述內緣上,用於承載所述接電端子並使所述接電端子與所述腔體絕緣。Optionally, the insulating portion includes an insulating seat; the insulating seat is arranged on the inner edge, and is used to carry the power terminal and insulate the power terminal from the cavity.
可選的,所述腔體側壁頂部全部的內緣低於外緣,所述絕緣座為由內環和外環組成的內凹型階梯環,所述內環的上表面低於所述外環的上表面。Optionally, the entire inner edge of the top of the cavity side wall is lower than the outer edge, the insulating seat is an inwardly concave step ring composed of an inner ring and an outer ring, and the upper surface of the inner ring is lower than the upper surface of the outer ring.
可選的,所述傳輸部的輸入端通過濾波器與所述電源電連接,所述濾波器位於所述反應腔外並固定於所述頂蓋上;所述濾波器與所述頂蓋接觸且兩者接觸部分的材料皆為金屬。Optionally, the input end of the transmission part is electrically connected to the power source through a filter, and the filter is located outside the reaction chamber and fixed on the top cover; the filter is in contact with the top cover and the material of the contacting parts of the two is metal.
可選的,所述用電部包括電氣元件和圓筒型石英部件,所述電氣元件設置於所述圓筒型石英部件中,所述圓筒型石英部件包括沿其頂部的徑向向外延伸的凸出部,所述接電端子設置於所述凸出部。Optionally, the electrical component includes an electrical component and a cylindrical quartz component, the electrical component is arranged in the cylindrical quartz component, the cylindrical quartz component includes a protrusion extending radially outward along the top of the cylindrical quartz component, and the power terminal is arranged on the protrusion.
可選的,所述凸出部為環形。Optionally, the protrusion is ring-shaped.
可選的,所述電氣元件為線圈。Optionally, the electrical component is a coil.
可選的,所述電源為直流電源或射頻源。Optionally, the power source is a direct current power source or a radio frequency source.
本創作與現有技術相比至少具有以下優點之一:Compared with the existing technology, this invention has at least one of the following advantages:
本創作提供的一種電漿處理設備反應腔的饋電結構,貫穿頂蓋的傳輸部的輸入端與反應腔外的電源電連接,輸出端與反應腔內用電部的接電端子電連接,導線則連接輸入端和輸出端,以將電能饋入反應腔內用電部,絕緣部則使接電端子與反應腔的腔體和頂蓋絕緣,本創作可以減少反應腔的占地面積,便於腔室的佈局佈線。The invention provides a power feeding structure for a reaction chamber of a plasma treatment equipment, wherein the input end of a transmission part penetrating a top cover is electrically connected to a power source outside the reaction chamber, the output end is electrically connected to a power terminal of a power-consuming part in the reaction chamber, a wire connects the input end and the output end to feed electric energy to the power-consuming part in the reaction chamber, and the insulating part insulates the power terminal from the cavity body and the top cover of the reaction chamber. The invention can reduce the floor space occupied by the reaction chamber and facilitate the layout and wiring of the chamber.
本創作中用電部的圓筒型石英部件沿其頂部的徑向向外延伸有凸出部,且接電端子設置於凸出部上,以增強接電端子與電氣元件的連接強度,使得電氣元件依次通過接電端子、傳輸部的輸出端、導線及輸入端與電源穩定連接,增加饋電結構的強度。In this invention, a cylindrical quartz component of the electrical part has a protrusion extending outward along the radial direction of its top, and a power terminal is arranged on the protrusion to enhance the connection strength between the power terminal and the electrical component, so that the electrical component is stably connected to the power source through the power terminal, the output end of the transmission part, the wire and the input end in sequence, thereby increasing the strength of the power feeding structure.
本創作中濾波器固定於頂蓋上並與傳輸部的輸入端和電源電連接,不僅可以濾除導線中的射頻能量,避免射頻能量對電源造成破壞,還可以減少反應腔的占地面積;同時,濾波器與頂蓋接觸且兩者接觸部分的材料皆為金屬,能夠對傳輸部的輸入端進行封閉,從而防止射頻能量洩露至反應腔外。In this invention, the filter is fixed on the top cover and electrically connected to the input end of the transmission part and the power supply. It can not only filter the RF energy in the wire to prevent the RF energy from damaging the power supply, but also reduce the floor space occupied by the reaction cavity. At the same time, the filter is in contact with the top cover and the materials of the contacting parts of the two are both metal, which can seal the input end of the transmission part and prevent the RF energy from leaking out of the reaction cavity.
以下結合圖式和具體實施方式對本創作提出的一種電漿處理設備反應腔的饋電結構作進一步詳細說明。根據下面說明,本創作的優點和特徵將更清楚。需要說明的是,圖式採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本創作實施方式的目的。為了使本創作的目的、特徵和優點能夠更加明顯易懂,請參閱圖式。須知,本說明書所附圖式所繪示的結構、比例、大小等,均僅用以配合說明書所揭示的內容,以供熟悉此技術的人士瞭解與閱讀,並非用以限定本創作實施的限定條件,故不具技術上的實質意義,任何結構的修飾、比例關係的改變或大小的調整,在不影響本創作所能產生的功效及所能達成的目的下,均應仍落在本創作所揭示的技術內容能涵蓋的範圍內。The following is a further detailed description of the feeding structure of the plasma treatment equipment reaction chamber proposed by the present invention in combination with the diagram and the specific implementation method. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the diagram adopts a very simplified form and uses non-precise proportions, which is only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the diagram. It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this manual are only used to match the contents disclosed in the manual for people familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of this creation. Therefore, they have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical content disclosed by this creation without affecting the effects and purposes that can be achieved by this creation.
需要說明的是,在本文中,諸如第一和第二等之類的關係術語僅僅用來將一個實體或者操作與另一個實體或操作區分開來,而不一定要求或者暗示這些實體或操作之間存在任何這種實際的關係或者順序。而且,術語「包括」、「包含」或者其任何其他變體意在涵蓋非排他性的包含,從而使得包括一系列要素的過程、方法、物品或者設備不僅包括那些要素,而且還包括沒有明確列出的其他要素,或者是還包括為這種過程、方法、物品或者設備所固有的要素。在沒有更多限制的情況下,由語句「包括一個……」限定的要素,並不排除在包括所述要素的過程、方法、物品或者設備中還存在另外的相同要素。It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus. In the absence of further restrictions, an element defined by the phrase "includes a ..." does not exclude the presence of other identical elements in the process, method, article or apparatus including the element.
結合圖1至圖3所示,本實施例提供一種電漿處理設備反應腔的饋電結構,所述反應腔100包括腔體102和設置於所述腔體102頂部的頂蓋101;所述腔體102側壁的頂部至少部分為內緣低於外緣的階梯型,所述饋電結構包括:傳輸部,貫穿所述頂蓋101並將電能饋入所述反應腔100內,所述傳輸部包括導線141、輸入端和輸出端142,所述導線141連接所述輸入端和所述輸出端142,且所述輸入端與所述反應腔100外的電源130電連接,所述輸出端142與所述反應腔100內用電部110的接電端子112電連接;以及絕緣部,使所述接電端子112與所述腔體102、所述頂蓋101絕緣;其中,所述接電端子112設置於所述內緣正上方並與所述內緣絕緣,所述正上方指的是所述接電端子112在豎直方向上至少部分位於所述內緣寬度範圍內。In combination with FIG. 1 to FIG. 3, this embodiment provides a feeding structure of a plasma treatment equipment reaction chamber, wherein the
具體的,在本實施例中,所述腔體102的內部底部設有下電極104,所述頂蓋101靠近所述腔體102的一端即所述頂蓋101的底端設有與所述下電極104相對的上電極106,且射頻能量通過導入桿105施加到所述下電極104上,以在所述上電極106和所述下電極104之間產生射頻電場,從而將通入所述反應腔100內的工藝氣體電離為電漿,對晶圓103進行蝕刻工藝處理。更具體的,所述頂蓋101的底端還設有石英限制環120,所述石英限制環120位於所述上電極106的徑向外側,使得電漿被限制於所述石英限制環120內;所述用電部110設置於所述石英限制環120週邊,防止所述用電部110與電漿接觸,即能避免產生金屬顆粒污染物,又可延長所述用電部110的使用壽命,但本創作不以此為限。Specifically, in this embodiment, a
具體的,在本實施例中,所述用電部110包括電氣元件113和圓筒型石英部件114,所述電氣元件113設置於所述圓筒型石英部件114中,則通過所述圓筒型石英部件114可以避免所述電氣元件113被電漿腐蝕,從而延長所述用電部110的使用壽命。更具體的,所述圓筒型石英部件114包括沿其頂部的徑向向外延伸的凸出部111,所述凸出部111設置於所述內緣正上方並與所述內緣絕緣,且所述接電端子112設置於所述凸出部111並位於所述腔體102側壁的頂部,使得所述接電端子112通過所述凸出部111與所述腔體102絕緣;同時,所述凸出部111還可以增強所述接電端子112與所述電氣元件113的連接強度,使得所述電氣元件113依次通過所述接電端子112、所述傳輸部的所述輸出端142、所述導線141及所述輸入端與所述電源130穩定連接,從而能夠在所述腔體102內產生需要的磁場。Specifically, in this embodiment, the power-
優選地,所述電氣元件113為線圈。可選地,所述電源130可以為直流電源或射頻源。所述電源130為直流電源時,所述電氣元件113可以在所述腔體102內產生垂直於晶圓103表面的第一磁場,以調整晶圓103上方電漿的分佈密度並使電漿分佈均勻,從而提高晶圓103表面蝕刻的均勻性;所述電源130為射頻源時,所述電氣元件113可以產生第二磁場,以清洗反應腔室。優選地,在一些實施例中,所述凸出部111為環形,且所述凸出部111與所述圓筒型石英部件114一體設置。在一些實施例中,所述用電部110也可以僅包括電氣元件113,但本創作不以此為限。Preferably, the
請同時參考圖1至圖3,所述絕緣部包括絕緣座152;所述絕緣座152設置於所述內緣上,用於承載所述接電端子112並使所述接電端子112與所述腔體102絕緣。Please refer to FIG. 1 to FIG. 3 at the same time. The insulating portion includes an
具體的,在本實施例中,所述凸出部111可以設置於所述絕緣座152上,使得所述凸出部111通過所述絕緣座152安裝於所述腔體102的側壁上,以增強所述凸出部111與所述腔體102連接的穩固性,從而保證所述凸出部111上所述接電端子112的穩定性;同時所述接電端子112通過所述凸出部111及所述絕緣座152這兩個部件與所述腔體102絕緣,可以提高所述接電端子112與所述腔體102之間絕緣的可靠性,從而降低所述接電端子112漏電的風險。優選地,所述腔體102側壁頂部全部的內緣低於外緣,所述絕緣座152為由內環和外環組成的內凹型階梯環,所述內環的上表面低於所述外環的上表面,且所述凸出部111固定於所述內環的上表面,但本創作不以此為限。Specifically, in this embodiment, the
請同時參考圖1至圖3,所述傳輸部還包括絕緣套筒143;所述絕緣套筒143貫穿所述頂蓋101,所述輸出端142設置於所述絕緣套筒143下端,所述導線141穿設於所述絕緣套筒143內並與所述輸出端142和所述輸入端電連接。Please refer to Figures 1 to 3 at the same time. The transmission part also includes an
可以理解的是,所述絕緣部還包括絕緣墊圈151;所述絕緣墊圈151設置於所述輸出端142和所述頂蓋101之間,用於使所述接電端子112與所述頂蓋101絕緣。It can be understood that the insulating portion further includes an
具體的,在本實施例中,所述絕緣套筒143可以避免所述導線141與所述頂蓋101接觸,從而使所述導線141與所述頂蓋101絕緣,進而降低所述導線141漏電的風險。所述絕緣墊圈151可以避免所述傳輸部的輸出端142及所述接電端子112與所述頂蓋101接觸,從而使所述輸出端142及所述接電端子112與所述頂蓋101絕緣,進而避免所述輸出端142及所述接電端子112出現漏電。由此可見,所述絕緣套筒143、所述絕緣墊圈151和所述絕緣座152三者可以使所述饋電結構及所述用電部110與所述反應腔100徹底絕緣,能夠有效地防止所述電源130通過所述饋電結構向所述用電部110饋電時發生漏電,但本創作不以此為限。Specifically, in this embodiment, the
更具體的,所述絕緣墊圈151可以通過緊固件153將固定於所述頂蓋101靠近所述腔體102的端面上;且所述絕緣墊圈151和所述頂蓋101之間、所述絕緣墊圈151與所述絕緣座152之間皆設有密封圈171,以保證所述反應腔100的密封性,從而保證所述反應腔100內部的高真空。此外,所述頂蓋101和所述腔體102之間還設有金屬墊圈172,以使所述頂蓋101和所述腔體102可以形成工藝所需的射頻回路,防止射頻能量洩露出腔室。優選地,所述緊固件153為螺絲,但本創作不以此為限。More specifically, the
請繼續參考圖2和圖3,所述輸出端142為凸起元件,所述接電端子112為與所述凸起元件匹配的饋電孔;所述凸起元件插入所述饋電孔內使所述用電部110和所述電源130電連通。Please continue to refer to FIG. 2 and FIG. 3 , the
具體的,在本實施例中,所述饋電孔內設有金屬彈性元件,以使所述凸起元件與所述饋電孔彈性接觸,在增加電連接穩定性的同時,避免所述凸起元件插入所述饋電孔時帶來的衝擊力對所述饋電孔造成破壞,進而延長所述饋電孔的使用壽命。優選地,所述金屬彈性元件可以為金屬材質的壓縮彈簧、碟形彈簧或彈性墊圈等,但本創作不以此為限。Specifically, in this embodiment, a metal elastic element is provided in the feed hole so that the protruding element is in elastic contact with the feed hole, which increases the stability of the electrical connection and prevents the impact force caused by the protruding element when inserted into the feed hole from damaging the feed hole, thereby extending the service life of the feed hole. Preferably, the metal elastic element can be a compression spring, a disc spring or an elastic gasket made of metal material, but the invention is not limited thereto.
在一些實施例中,所述輸出端142為可伸縮元件;所述可伸縮元件與所述接電端子112抵接使所述用電部110和所述電源130電連通,優選地,此時所述接電端子112可以為導電平板,但本創作不以此為限。In some embodiments, the
請同時參考圖1至圖3,所述傳輸部的輸入端通過濾波器160與所述電源130電連接,所述濾波器160位於所述反應腔外並固定於所述頂蓋101上;所述濾波器160與所述頂蓋101接觸且兩者接觸部分的材料皆為金屬。Please refer to Figures 1 to 3 at the same time. The input end of the transmission part is electrically connected to the
具體的,在本實施例中,通過所述導入桿105導入至所述反應腔100內的射頻能量還會通過所述電氣元件113及所述導線141匯出並損壞所述電源130;而所述濾波器160的設置則可以濾除所述導線141中的射頻能量,避免射頻能量對所述電源130造成破壞。更具體的,考慮到所述頂蓋101上方空間可調整性較大,還可以將所述濾波器160固定於所述頂蓋101上,所述濾波器160的下端面即所述濾波器160靠近所述腔體102的端面與所述頂蓋101的上端面即所述頂蓋101遠離所述腔體102的端面接觸,能夠對所述傳輸部的輸入端進行封閉,從而防止射頻能量洩露至反應腔外,但本創作不以此為限。Specifically, in this embodiment, the RF energy introduced into the
綜上所述,本實施例提供本一種電漿處理設備反應腔的饋電結構,反應腔包括腔體和設置於腔體頂部的頂蓋;腔體側壁的頂部至少部分為內緣低於外緣的階梯型,饋電結構包括貫穿頂蓋的傳輸部和絕緣部,傳輸部的輸入端與反應腔外的電源電連接,輸出端與反應腔內用電部的接電端子電連接,導線則連接輸入端和輸出端,以將電能饋入反應腔內用電部,絕緣部則使接電端子與反應腔的腔體和頂蓋絕緣,本實施例可以減少反應腔的占地面積,便於腔室的佈局佈線。此外,本實施例中,用電部的圓筒型石英部件沿其頂部的徑向向外延伸有凸出部,且接電端子設置於凸出部上,以增強接電端子與電氣元件的連接強度,使得電氣元件依次通過接電端子、傳輸部的輸出端、導線及輸入端與電源穩定連接,增加饋電結構的強度;濾波器固定於頂蓋上並與傳輸部的輸入端和電源電連接,不僅可以濾除導線中的射頻能量,避免射頻能量對電源造成破壞,還可以減少反應腔的占地面積;同時,濾波器與頂蓋接觸且兩者接觸部分的材料皆為金屬,能夠對傳輸部的輸入端進行封閉,從而防止射頻能量洩露至反應腔外。In summary, the present embodiment provides a power feeding structure for a reaction chamber of a plasma treatment device, wherein the reaction chamber comprises a chamber body and a top cover arranged at the top of the chamber body; the top of the side wall of the chamber body is at least partially stepped with the inner edge being lower than the outer edge; the power feeding structure comprises a transmission part and an insulating part penetrating the top cover; the input end of the transmission part is electrically connected to a power source outside the reaction chamber, the output end is electrically connected to a power terminal of a power-consuming part in the reaction chamber, a wire connects the input end and the output end to feed electric energy to the power-consuming part in the reaction chamber, and the insulating part insulates the power terminal from the chamber body and the top cover of the reaction chamber. The present embodiment can reduce the floor space occupied by the reaction chamber and facilitate the layout and wiring of the chamber. In addition, in this embodiment, the cylindrical quartz component of the power-consuming part has a protrusion extending outward along the radial direction of its top, and the power terminal is arranged on the protrusion to enhance the connection strength between the power terminal and the electrical component, so that the electrical component is stably connected to the power supply through the power terminal, the output end of the transmission part, the wire and the input end in sequence, thereby increasing the strength of the power feeding structure; the filter is fixed The filter is placed on the top cover and is electrically connected to the input end of the transmission part and the power supply. It can not only filter the RF energy in the wire to prevent the RF energy from damaging the power supply, but also reduce the floor space occupied by the reaction cavity. At the same time, the filter is in contact with the top cover and the materials of the contacting parts of the two are both metal, which can seal the input end of the transmission part, thereby preventing the RF energy from leaking out of the reaction cavity.
儘管本創作的內容已經通過上述優選實施例作了詳細介紹,但應當認識到上述的描述不應被認為是對本創作的限制。在本領域技術人員閱讀了上述內容後,對於本創作的多種修改和替代都將是顯而易見的。因此,本創作的保護範圍應由所附的申請專利範圍來限定。Although the content of this creation has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of this creation. After reading the above content, various modifications and substitutions of this creation will be obvious to those skilled in the art. Therefore, the scope of protection of this creation should be limited by the scope of the attached patent application.
100:反應腔 101:頂蓋 102:腔體 103:晶圓 104:下電極 105:導入桿 106:上電極 110:用電部 111:凸出部 112:接電端子 113:電氣元件 114:圓筒型石英部件 120:石英限制環 130:電源 141:導線 142:輸出端 143:絕緣套筒 151:絕緣墊圈 152:絕緣座 153:緊固件 160:濾波器 171:密封圈 172:金屬墊圈100: reaction chamber 101: top cover 102: chamber 103: wafer 104: lower electrode 105: introduction rod 106: upper electrode 110: power supply 111: protrusion 112: power terminal 113: electrical component 114: cylindrical quartz component 120: quartz limiting ring 130: power supply 141: wire 142: output terminal 143: insulation sleeve 151: insulation gasket 152: insulation seat 153: fastener 160: filter 171: sealing ring 172: metal gasket
圖1是本創作一實施例提供的一種電漿處理設備的結構示意圖; 圖2是本創作一實施例提供的一種電漿處理設備反應腔的饋電結構的示意圖; 圖3是本創作一實施例提供的一種電漿處理設備反應腔的饋電結構的放大示意圖。 Figure 1 is a schematic diagram of the structure of a plasma treatment device provided in an embodiment of the present invention; Figure 2 is a schematic diagram of the feeding structure of a reaction chamber of a plasma treatment device provided in an embodiment of the present invention; Figure 3 is an enlarged schematic diagram of the feeding structure of a reaction chamber of a plasma treatment device provided in an embodiment of the present invention.
100:反應腔 100: reaction chamber
101:頂蓋 101: Top cover
102:腔體 102: Cavity
103:晶圓 103: Wafer
104:下電極 104: Lower electrode
105:導入桿 105:Introduction rod
106:上電極 106: Upper electrode
110:用電部 110: Electricity Department
111:凸出部 111: protrusion
112:接電端子 112: Power terminal
113:電氣元件 113:Electrical components
114:圓筒型石英部件 114: Cylindrical quartz parts
120:石英限制環 120: Quartz limiting ring
130:電源 130: Power supply
141:導線 141: Conductor
142:輸出端 142: Output terminal
143:絕緣套筒 143: Insulation sleeve
151:絕緣墊圈 151: Insulation gasket
152:絕緣座 152: Absolute Seat
160:濾波器 160:Filter
Claims (14)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2022231007721 | 2022-11-22 |
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