TWM652405U - Splitting and cutting equipment of printed circuit board - Google Patents
Splitting and cutting equipment of printed circuit board Download PDFInfo
- Publication number
- TWM652405U TWM652405U TW112213250U TW112213250U TWM652405U TW M652405 U TWM652405 U TW M652405U TW 112213250 U TW112213250 U TW 112213250U TW 112213250 U TW112213250 U TW 112213250U TW M652405 U TWM652405 U TW M652405U
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- circuit board
- cutting
- board
- edge
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 127
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000011889 copper foil Substances 0.000 claims abstract description 60
- 238000009966 trimming Methods 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims description 45
- 230000007246 mechanism Effects 0.000 claims description 38
- 238000007599 discharging Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- -1 material Chemical compound 0.000 description 1
- 208000037975 work-related injury Diseases 0.000 description 1
Images
Landscapes
- Details Of Cutting Devices (AREA)
Abstract
本創作公開一種印刷電路板分板裁切設備,其包括:一機架、一移板裝置、一分板裝置、一邊料裁切裝置、和一收板裝置;其中,分板裝置具有一分板裁切模組,用來將待分割的印刷電路板分割為兩個分割後的印刷電路板;邊料裁切裝置具有一個旋轉模組和設置於旋轉模組兩側邊的切邊模組,分割後的印刷電路板能夠放置於旋轉模組後,透過兩個切邊模組將印刷電路板其中兩側邊的銅箔邊料切除後,再透過旋轉模組帶動印刷電路板旋轉90度,再由兩個切邊模組切除印刷電路板另外兩側邊銅箔邊料;裁切銅箔邊料後的印刷電路板移動至收板裝置。The invention discloses a printed circuit board dividing and cutting equipment, which includes: a frame, a plate moving device, a dividing device, a side cutting device, and a collecting device; wherein, the dividing device has a dividing device The board cutting module is used to divide the printed circuit board to be divided into two divided printed circuit boards; the edge cutting device has a rotating module and edge trimming modules arranged on both sides of the rotating module , the divided printed circuit board can be placed behind the rotating module, and the copper foil edges on both sides of the printed circuit board are cut off through two trimming modules, and then the printed circuit board is driven to rotate 90 degrees through the rotating module , and then two trimming modules cut off the other two sides of the copper foil trimmings of the printed circuit board; the printed circuit board after cutting the copper foil trimmings moves to the board collecting device.
Description
本創作涉及一種印刷電路板分板裁切設備,特別是涉及一種用於多層式印刷電路板製程所使用的印刷電路板分板裁切設備。The invention relates to a printed circuit board dividing and cutting equipment, and in particular to a printed circuit board dividing and cutting equipment used in a multi-layer printed circuit board manufacturing process.
現有的多層式印刷電路板製程中,印刷電路板的基板和銅箔貼合後,通常是以人工作業方式除去基板邊緣多餘的銅箔。而且因壓合後的印刷電路板尚處於高溫,且撕除較厚的銅箔時必須以人工手持刀片切割銅箔,因而容易造成操作者燙傷或被割傷的情形,因而造成了作業上的極大不便,且耗費人力,且容易造成工傷意外。In the existing multi-layer printed circuit board manufacturing process, after the printed circuit board substrate and the copper foil are bonded, the excess copper foil on the edge of the substrate is usually removed manually. Moreover, since the printed circuit board after lamination is still at a high temperature, and when removing the thick copper foil, the copper foil must be cut with a manual hand-held blade, which can easily cause burns or cuts to the operator, resulting in operational inconvenience. It is extremely inconvenient, labor-intensive, and can easily cause work-related injuries.
由於以上原因,造成現有印刷電路板撕銅箔的製程存在相當多不便之處。故,如何通過製程設備的改良,來克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。Due to the above reasons, there are considerable inconveniences in the existing process of removing copper foil from printed circuit boards. Therefore, how to overcome the above-mentioned defects through the improvement of process equipment has become one of the important issues to be solved in this business.
本創作所要解決的技術問題在於,針對現有印刷電路板撕銅箔技術的不足提供一種印刷電路板分板裁切設備。The technical problem to be solved by this invention is to provide a printed circuit board depaneling and cutting equipment in view of the shortcomings of the existing printed circuit board copper foil tearing technology.
為了解決上述的技術問題,本創作所採用的其中一技術方案是提供一種印刷電路板分板裁切設備,用來將待分割的印刷電路板分割為多個分割後的印刷電路板,並裁切分割後的所述印刷電路板的銅箔邊料,其包括:一機架、一移板裝置、一分板裝置、一邊料裁切裝置、和一收板裝置;其中,所述機架能夠定義出一縱軸方向,和垂直於所述縱軸方向的一個橫軸方向;所述機架在縱軸方向上相對兩端能夠定義出一進料端和一出料端,所述分板裝置設置於所述機架靠近所述進料端的一側,所述收板裝置設置於所述機架的所述出料端,所述切邊模組設置於所述分板裝置和所述收板裝置之間;所述移板裝置配置為用來將待分割的所述印刷電路板搬移至所述分板裝置裁切,再將分割後的所述印刷電路板搬移至所述切邊模組裁切銅箔邊料,再將裁切銅箔邊料後的所述印刷電路板搬移至所述收板裝置;所述分板裝置具有前後排列的第一輸送帶和第二輸送帶、和設置於所述第一輸送帶和所述第二輸送帶之間的一分板裁切模組;所述第一輸送帶和所述第二輸送帶配置為能夠移動一個待分割的所述印刷電路板,而使得待分割的所述印刷電路板的所述分割線對準於所述分板裁切模組,再透過所述分板裁切模組將所述印刷電路板分割為兩個分割後的所述印刷電路板;所述邊料裁切裝置具有一個旋轉模組,和設置於所述旋轉模組兩側邊的兩個切邊模組,所述分板裁切裝置分割後的一個所述印刷電路板能夠放置於所述旋轉模組,再由兩所述切邊模組將所述印刷電路板其中兩側邊的所述銅箔邊料切斷後,透過所述旋轉模組將所述印刷電路板旋轉90度以後,兩個所述切邊模組再沿著所述橫軸方向調整位置,而將所述印刷電路板另外兩側邊的所述銅箔邊料切除;所述收板裝置連接於所述邊料裁切裝置之後,用來將切除銅箔邊料後的所述印刷電路板搬移至一收料台。In order to solve the above technical problems, one of the technical solutions adopted in this invention is to provide a printed circuit board dividing and cutting equipment, which is used to divide the printed circuit board to be divided into multiple divided printed circuit boards, and cut The cut copper foil edge material of the printed circuit board includes: a frame, a board moving device, a board dividing device, a edge cutting device, and a board closing device; wherein, the frame A longitudinal axis direction can be defined, and a transverse axis direction perpendicular to the longitudinal axis direction; the opposite ends of the frame in the longitudinal axis direction can define a feed end and a discharge end, and the dividing end can be defined. The plate device is disposed on the side of the frame close to the feed end, the plate collecting device is disposed on the discharge end of the frame, and the trimming module is disposed on the plate dividing device and the between the board collecting devices; the board moving device is configured to move the printed circuit boards to be divided to the dividing device for cutting, and then move the divided printed circuit boards to the cutting device. The edge module cuts the copper foil edge material, and then moves the printed circuit board after cutting the copper foil edge material to the board collecting device; the board dividing device has a first conveyor belt and a second conveyor arranged front and back. belt, and a dividing and cutting module arranged between the first conveyor belt and the second conveyor belt; the first conveyor belt and the second conveyor belt are configured to be able to move a to-be-divided The printed circuit board is so that the dividing line of the printed circuit board to be divided is aligned with the dividing and cutting module, and then the printed circuit board is divided through the dividing and cutting module. The printed circuit boards are two divided printed circuit boards; the edge material cutting device has a rotating module and two edge cutting modules arranged on both sides of the rotating module. One of the printed circuit boards after the device is divided can be placed on the rotating module, and then the two edge-cutting modules cut off the copper foil edges on both sides of the printed circuit board, and pass through the After the rotating module rotates the printed circuit board 90 degrees, the two trimming modules adjust their positions along the horizontal axis, and remove the copper foil on the other two sides of the printed circuit board. Cut off the edge material; the board collecting device is connected to the edge material cutting device and is used to move the printed circuit board after removing the copper foil edge material to a collecting table.
本創作的其中一有益效果在於,本創作所提供的印刷電路板分板裁切設備,其能夠透過所述移板裝置配合所述分板裝置、所述邊料裁切裝置、和所述收板裝置,能夠自動化地將一個待分割的印刷電路板分割為兩個分割後的所述印刷電路板,並將所述印刷電路板的銅箔邊料切除後,再傳送至所述收板裝置,而使得所述印刷電路板在所述收板裝置上逐漸降溫後,再移動至所述收料台上,其操作過程完全自動化,而能夠提高印刷電路板的生產效率。One of the beneficial effects of this invention is that the printed circuit board depaneling and cutting equipment provided by this invention can cooperate with the depaneling device, the edge cutting device, and the collecting device through the plate moving device. The board device can automatically divide a printed circuit board to be divided into two divided printed circuit boards, cut off the copper foil edge of the printed circuit board, and then transfer it to the board collecting device. , so that the printed circuit board gradually cools down on the collecting device and then moves to the collecting table. The operation process is completely automated, which can improve the production efficiency of printed circuit boards.
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and diagrams about this creation. However, the diagrams provided are only for reference and illustration and are not used to limit this creation.
以下是通過特定的具體實施例來說明本創作所公開有關“印刷電路板分板裁切設備”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本創作的構思下進行各種修改與變更。另外,本創作的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is a specific embodiment to illustrate the implementation of the "printed circuit board depaneling and cutting equipment" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this description can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. In addition, the accompanying drawings of this creation are only simple illustrations and are not depictions based on actual size, as stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.
參考圖2所示,本創作的印刷電路板分板裁切設備1是用來對銅箔壓合製程後的待分割的印刷電路板2進行處理,所述待分割的印刷電路板2包含兩個相互並排的電路板本體610,和包覆於兩所述電路板本體610表面的銅箔620,兩個所述電路板本體610外週緣具有延伸於電路板本體610外週緣的銅箔邊料621,並且兩個所述電路板本體610相鄰一側邊的所述銅箔邊料621相互連接,並且在兩個相鄰的電路板本體610相鄰接處的所述銅箔邊料621能夠定義出一分割線C。Referring to Figure 2, the printed circuit board dividing and cutting equipment 1 of the present invention is used to process the printed
所述待分割的印刷電路板2能夠從所述分割線C處切斷,而成為兩個分割後的印刷電路板600。並且每一個所述印刷電路板600還設置有多個對位標記630,多個所述對位標記630能夠包含多個對位靶631、至少一個方向識別靶632、和一個防呆靶633。The printed
參閱圖1至圖9所示,本創作實施例提供一種印刷電路板分板裁切設備1,其包括:一機架100、一移板裝置200、一分板裝置300、一邊料裁切裝置400、和一收板裝置500。Referring to FIGS. 1 to 9 , an embodiment of the present invention provides a printed circuit board depaneling and cutting equipment 1 , which includes: a
其中,所述機架100能夠定義出一縱軸方向D1,和垂直於所述縱軸方向D1的一個橫軸方向D2。所述機架100在縱軸方向D1上相對兩端能夠定義出一進料端和一出料端。所述分板裝置300設置於所述機架100靠近所述進板端的一側,所述收板裝置500設置於所述機架100的出板端,並且所述邊料裁切裝置400設置於所述分板裝置300和所述收板裝置500之間。The
本實施例中,所述移板裝置200包含:設置於所述機架100上方的主滑軌210,和設置於所述主滑軌210上的第一移板機220、第二移板機230、和第三移板機240。其中,所述第一移板機220靠近於所述機架100的進料端,所述第一移板機220包含設置於所述主滑軌210上的第一移動座221,和連接於第一移動座221下方的第一升降機構222,和連接第一升降機構222底端的第一吸板機構223。所述第一移板機220能夠透過所述第一移動座221和第一升降機構222帶動所述第一吸板機構223,而將一個進料台130上的一個待分割的印刷電路板2搬移至所述分板裁切模組330上。In this embodiment, the
所述第二移板機230包含設置於所述主滑軌210上的第二移動座231,和連接於第二移動座231下方的連接座232,和設置於連接座232前端的第二升降機構233和第二吸板機構234,以及設置於連接座232後端的第三升降機構235和第三吸板機構236。當第二移板機230動作時,能夠透過第二移動座231帶動連接座232前後位移,且透過第二升降機構233和第二吸板機構234將所述分板裝置300分割後的一個印刷電路板600搬移至所述邊料裁切裝置400,並透過所述第三升降機構235和第三吸板機構236將裁切完銅箔邊料的一個所述印刷電路板600搬移至所述收板裝置500。所述第三移板機240配置於所述機架100的出料端,用來將所述收板裝置500上的印刷電路板600搬移至一個收料台550。The second moving
接下來介紹所述分板裝置300的構造及動作方式。如圖3及圖4A和圖4B所示,本實施例中,所述分板裝置300包含一個第一輸送帶310、第二輸送帶320、和一個分板裁切模組330。其中,所述第一輸送帶310和所述第二輸送帶320是沿著機架100的縱軸方向D1前後排列。所述分板裁切模組330設置於所述機架100上介於所述第一輸送帶310和所述第二輸送帶320之間的位置。所述移板裝置200的所述第一移板機220能夠將一個待分割的印刷電路板2搬移至所述第一輸送帶310上,再由所述第一輸送帶310和所述第二輸送帶320配合產生動作,而將所述印刷電路板600移動到使得所述分割線C對準於所述分板裁切模組330的位置,再由所述分板裁切模組330將所述待分割的印刷電路板2分割為兩個分割後的印刷電路板600。Next, the structure and operation mode of the
如圖4A和圖4B所示,本實施例中,所述分板裁切模組330具有一個切斷刀架331、一第一讀靶器332、一第一活動桿333、第一驅動機構335、和設置於所述切斷刀架331上並且包含由第一活動切刀334和第一固定切刀336構成的切斷刀組。As shown in Figures 4A and 4B, in this embodiment, the
其中切斷刀架331設置於所述機架100上,所述第一讀靶器332設置於所述切斷刀架331上。所述第一讀靶器332能夠讀取所述印刷電路板600上的所述對位標記630的位置,而且能夠和所述第一輸送帶310和所述第二輸送帶320配合,而調整待分割的所述印刷電路板600的位置,而使得所述分割線C的位置能夠對準於所述第一活動切刀334和第一固定切刀336的切斷位置。The
所述第一活動桿333可上下活動地設置於所述切斷刀架331上,並且所述第一活動桿333的方向平行於所述橫軸方向D2。多個所述第一驅動機構335連接所述第一活動桿333,而能夠帶動所述第一活動桿333上下位移。所述第一活動切刀334設置於所述第一活動桿333上,並且位於所述印刷電路板600的上方。所述第一固定切刀336固定設置於所述切斷刀架331上位於所述印刷電路板600下方的位置。The first
所述分板裁切模組330的所述切斷刀組的所述第一活動切刀334和所述第一固定切刀336的方向平行於所述橫軸方向D2,並且第一活動切刀334和所述第一固定切刀336的切斷位置配置於介於所述第一輸送帶310和所述第二輸送帶320之間的位置,因而當待分割的所述印刷電路板600的所述分割線C移動到對準於所述第一活動切刀334和所述第一固定切刀336的切斷位置時,能夠透過所述第一活動切刀334和所述第一固定切刀336切斷兩個所述印刷電路板600相連接的銅箔邊料621。並且透過所述第一讀靶器332確認所述印刷電路板600的位置,能夠確保所述切斷刀組的切斷位置對準於所述分割線C,而不會傷害到兩個所述電路板本體610。The directions of the first
如圖5至圖7所示,本實施例中,所述邊料裁切裝置400具有一個旋轉模組410,和設置於所述旋轉模組410兩側邊的兩個切邊模組420。所述分板裝置300分割後的一個所述印刷電路板600能夠放置於所述旋轉模組410,再由兩所述切邊模組420將所述印刷電路板600其中兩側邊的銅箔邊料621切斷後,能夠透過所述旋轉模組410將所述印刷電路板600旋轉90度,兩個所述切邊模組420沿著所述橫軸方向D2調整位置,再將所述印刷電路板600另外兩側邊的所述銅箔邊料621切除。As shown in FIGS. 5 to 7 , in this embodiment, the edge
更詳細地說,如圖5和圖6所示,所述旋轉模組410具有一個旋轉台411、一旋轉軸412和一個旋轉驅動裝置413。其中,所述旋轉台411具有一頂面,所述頂面配置為用來放置一個所述印刷電路板600,並且所述旋轉台411的頂面設置有多個吸孔414。當所述第二移板機230將一個分割後的印刷電路板600搬移到所述旋轉台411上時,所述旋轉台411頂面的多個所述吸孔414能夠產生吸力,而將所述印刷電路板600吸附固定在所述旋轉台411上。In more detail, as shown in FIGS. 5 and 6 , the
所述旋轉軸412連接所述旋轉台411的中心並且垂直於所述旋轉台411的頂面。所述旋轉驅動裝置413連接所述旋轉軸412的底端,而能夠帶動所述旋轉台411以所述旋轉軸412為中心旋轉。如圖6和圖7所示,所述旋轉模組410能夠在一個所述切邊模組420將印刷電路板600其中兩側邊的銅箔邊料621切除後,再將所述印刷電路板600旋轉90度,以利於兩所述切邊模組420能夠切除所述印刷電路板600另外兩側邊的銅箔邊料621。The
如圖5所示,本實施例中,所述邊料裁切裝置400具有多個平行於所述橫軸方向D2的橫向滑軌430,兩所述切邊模組420可滑動地設置於多個所述橫向滑軌430上,而使得兩個所述切邊模組420能夠沿著所述橫軸方向D2位移。兩所述切邊模組420分別具有一個切邊刀架421、第二讀靶器422、第二活動桿423、由第二活動切刀424和第二固定切刀426組成的邊料裁切刀組、和第二驅動機構425。所述機架100在所述邊料裁切裝置400下方位置能夠放置一個可移動的收料桶120,用來盛接所述邊料裁切裝置400裁切下來的銅箔邊料621。As shown in Figure 5, in this embodiment, the edge
其中,每一個所述切邊模組420的所述切邊刀架421的底部透過滑座427可滑動地設置於多個所述橫向滑軌430上,而使得所述切邊刀架421能夠沿著所述橫軸方向D2位移。所述第二讀靶器422和所述第二活動桿423設置於所述切邊刀架421上,用來讀取放置於所述旋轉模組410上的所述印刷電路板600的對位標記630,以確定所述印刷電路板600的位置。所述第二活動桿423的方向平行於所述縱軸方向D1,並且所述第二活動桿423可上下滑動地設置於所述切邊刀架421上,並且連接所述第二驅動機構425,而能夠被所述第二驅動機構425驅動而上下位移。Wherein, the bottom of the
所述邊料裁切刀組的所述第二活動切刀424和所述第二固定切刀426的方向平行於所述縱軸方向D1。其中,所述第二活動切刀424是設置在所述第二活動桿423上,並且所述第二活動切刀424的位置高於放置在所述旋轉模組410上的所述印刷電路板600的高度。所述第二固定切刀426固定設置在所述切邊刀架421上,並且所述第二固定切刀426的位置低於所述印刷電路板600的高度。The direction of the second
如圖5和圖6及圖7所示,當所述邊料裁切裝置400對放置於所述旋轉模組410上的所述印刷電路板600裁切銅箔邊料621時,所述印刷電路板600是以其中兩側邊平行於所述縱軸方向D1的方式定位於所述旋轉模組410上,接著透過所述第二讀靶器422讀取所述印刷電路板600上的對位標記630的座標,以確認所述印刷電路板600的位置,並且兩所述切邊模組420依據所述第二讀靶器422讀取的所述對位標記630的座標來確認所述印刷電路板600的所述電路板本體610相對兩側邊緣的位置,並且沿著所述橫軸方向D2調整兩所述切邊模組420的位置,而使得兩所述切邊模組420的所述邊料裁切刀組的切斷位置位於所述電路板本體610的兩側邊的外緣,以避免所述切邊模組420切除銅箔邊料621時傷害到所述電路板本體610。As shown in Figures 5, 6 and 7, when the
如圖7所示,當所述邊料裁切裝置400切除所述印刷電路板600兩側邊的銅箔邊料621後,所述旋轉模組410的旋轉台411能夠以所述旋轉軸412為中心旋轉90度,而使得所述印刷電路板600轉向,而使得所述印刷電路板600尚未切除銅箔邊料621的兩側邊平行於所述縱軸方向D1。此時,兩所述切邊模組420能夠沿著所述橫軸方向D2移動調整位置,而使得兩所述切邊模組420的所述邊料裁切刀組的切斷位置位於所述電路板本體610尚未切除銅箔邊料621的兩側邊的外緣,接著再透過兩所述切邊模組420將所述印刷電路板600上剩餘的兩側邊的所述銅箔邊料621切除,而完成邊料裁切的程序。As shown in FIG. 7 , after the edge
如圖8所示,當所述邊料裁切裝置400將一個所述印刷電路板600的銅箔邊料621切除後,能夠透過所述第二移板機230的所述第三吸板機構236將所述旋轉模組410上已完成銅箔邊料621切除程序的所述印刷電路板600搬移至所述收板裝置500,並且透過所述第二移板機230的所述第二吸板機構234將一個待切除銅箔邊料621的所述印刷電路板600搬移至所述旋轉模組410上進行切除銅箔邊料621的程序。As shown in FIG. 8 , after the edge
如圖1、圖8和圖9所示,本實施例中,所述收板裝置500包含:一進板輸送帶510、多個旋轉翻板裝置520、多個銜接輸送帶530、和一收板輸送帶540。As shown in Figure 1, Figure 8 and Figure 9, in this embodiment, the
其中,所述第二移板機230能夠從所述邊料裁切裝置400將已完成銅箔邊料621切除程序的一個所述印刷電路板600搬移到所述進板輸送帶510,再透過所述進板輸送帶510傳送到多個所述旋轉翻板裝置520。多個所述旋轉翻板裝置520連接於所述進板輸送帶510之後,並且每一個旋轉翻板裝置520之間透過多個所述銜接輸送帶530加以連接。每一個所述旋轉翻板裝置520具有一個旋轉軸心521,和並排設置於所述旋轉軸心521的多組旋轉支架522。每一組所述旋轉支架522分別具有多個沿著放射線方向設置於所述旋轉軸心521上的桿體,所述進板輸送帶510延伸到排列於最前端的所述旋轉翻板裝置520的兩組並排的旋轉支架522的間隙中,因此能夠帶動印刷電路板600插入於所述旋轉支架522的桿體間隙中。當所述印刷電路板600插入到所述旋轉支架522的桿體間隙中以後,所述旋轉支架522以圖式中的順時針方向轉動,而帶動所述印刷電路板600翻面180度以後放置於一個所述銜接輸送帶530上,再透過所述銜接輸送帶530將所述印刷電路板600傳送到下一組的旋轉翻板裝置520上。Among them, the second
而最後一組的所述旋轉翻板裝置520連接所述收板輸送帶540,所述收板輸送帶540用來將最後一組的所述旋轉翻板裝置520所傳送的印刷電路板600傳送到一收板位置。所述第三移板機240配置於所述機架100的出料端,而能夠將一個位於所述收板輸送帶540的所述收板位置上的一個所述印刷電路板600搬移至所述收料台550上。The last group of the
所述收板裝置500透過多組所述旋轉翻板裝置520能夠將裁切完成的印刷電路板600不斷翻面而傳送到所述收板輸送帶540,使得印刷電路板600在傳送的有充分的時間逐漸降溫,而使得印刷電路板600能夠降溫到室溫以後再堆疊於收料台上。The
[實施例的有益效果][Beneficial effects of the embodiment]
本創作的其中一有益效果在於,本創作所提供的印刷電路板分板裁切設備1,其能夠透過所述移板裝置200配合所述分板裝置300、所述邊料裁切裝置400、和所述收板裝置500,能夠自動化地將一個待分割的印刷電路板2分割為兩個分割後的所述印刷電路板600,並將所述印刷電路板600的銅箔邊料621切除後,再傳送至所述收板裝置500,而使得所述印刷電路板600在所述收板裝置500上逐漸降溫後,再移動至所述收料台550上,其操作過程完全自動化,而能夠提高印刷電路板的生產效率。One of the beneficial effects of this invention is that the printed circuit board depaneling and cutting equipment 1 provided by this invention can cooperate with the
進一步來說,本創作的其中一有益效果在於,本創作使用的邊料裁切裝置400具有一個旋轉模組410,和設置於旋轉模組410兩側邊,並能夠沿著所述橫軸方向D2位移的切邊模組420,其能夠在兩所述切邊模組420切除所述印刷電路板600其中兩側邊的銅箔邊料621後,透過所述旋轉模組410帶動所述印刷電路板600旋轉90度以後,兩所述切邊模組420能夠沿著所述橫軸方向D2調整位置,使得兩所述切邊模組420的切斷位置調整到所述印刷電路板600尚未裁切銅箔邊料621的兩側邊的電路板本體610外側的位置,因而能夠在不搬移所述印刷電路板600的情形下完成對所述印刷電路板600裁切銅箔邊料621的程序,並且能夠避免裁切銅箔邊料621時傷害到所述電路板本體610。Furthermore, one of the beneficial effects of this invention is that the edge
以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。The contents disclosed above are only preferred and feasible embodiments of this invention, and do not limit the scope of the patent application for this invention. Therefore, all equivalent technical changes made by using the description and drawings of this invention are included in the application for this invention. within the scope of the patent.
1:印刷電路板分板裁切設備 2:待分割的印刷電路板 100:機架 110:本體 111:腳架 120:收料桶 130:進料台 200:移板裝置 210:主滑軌 220:第一移板機 221:第一移動座 222:第一升降機構 223:第一吸板機構 230:第二移板機 231:第二移動座 232:連接座 233:第二升降機構 234:第二吸板機構 235:第三升降機構 236:第三吸板機構 240:第三移板機 300:分板裝置 310:第一輸送帶 320:第二輸送帶 330:分板裁切模組 331:切斷刀架 332:第一讀靶器 333:第一活動桿 334:第一活動切刀 335:第一驅動機構 336:第一固定切刀 400:邊料裁切裝置 410:旋轉模組 411:旋轉台 412:旋轉軸 413:旋轉驅動裝置 414:吸孔 420:切邊模組 421:切邊刀架 422:第二讀靶器 423:第二活動桿 424:第二活動切刀 425:第二驅動機構 426:第二固定切刀 427:滑座 430:橫向滑軌 500:收板裝置 510:進板輸送帶 520:旋轉翻板裝置 521:旋轉軸心 522:旋轉支架 530:銜接輸送帶 540:收板輸送帶 550:收料台 600:印刷電路板 610:電路板本體 620:銅箔 621:銅箔邊料 630:對位標記 631:對位靶 632:方向識別靶 633:防呆靶 C:分割線 D1:縱軸方向 D2:橫軸方向 1: Printed circuit board depaneling and cutting equipment 2: Printed circuit board to be divided 100:Rack 110:Ontology 111:Tripod 120:Receiving bucket 130: Feeding table 200: Plate shifting device 210: Main slide rail 220:The first plate moving machine 221:The first mobile seat 222:The first lifting mechanism 223: The first suction plate mechanism 230: The second plate moving machine 231: Second mobile base 232: Connector 233: Second lifting mechanism 234: Second suction plate mechanism 235: The third lifting mechanism 236: The third suction plate mechanism 240: The third plate moving machine 300: Depaneling device 310: First conveyor belt 320: Second conveyor belt 330: Panel cutting module 331: Cut off the tool holder 332:First target reader 333:First movable lever 334:The first movable cutter 335:First drive mechanism 336: First fixed cutter 400: Edge material cutting device 410: Rotation module 411: Rotary table 412:Rotation axis 413: Rotary drive device 414:Suction hole 420: Trimming module 421: Trimming knife holder 422: Second target reader 423:Second movable lever 424: Second movable cutter 425: Second drive mechanism 426:Second fixed cutter 427:Sliding seat 430: Horizontal slide rail 500: Plate closing device 510: Plate feeding conveyor belt 520: Rotating flap device 521:Rotation axis 522: Rotating bracket 530:Connecting conveyor belt 540: Plate closing conveyor belt 550: Receiving table 600:Printed circuit board 610:Circuit board body 620:Copper foil 621: Copper foil edge material 630: Counterpoint mark 631:Alignment target 632: Direction identification target 633: Fool-proof target C: dividing line D1: vertical axis direction D2: Horizontal axis direction
圖1為本創作印刷電路板分板裁切設備的示意圖。Figure 1 is a schematic diagram of the printed circuit board depaneling and cutting equipment of this invention.
圖2為本創作一個待分割的印刷電路板的示意圖。Figure 2 is a schematic diagram of a printed circuit board to be divided in this creation.
圖3為本創作使用的分板裝置的示意圖。Figure 3 is a schematic diagram of the depaneling device used in this creation.
圖4A和圖4B為本創作使用分板裝置將待分割的印刷電路板切割的動作示意圖。Figures 4A and 4B are schematic diagrams of the invention using a deboarding device to cut the printed circuit board to be divided.
圖5為本創作使用的邊料裁切裝置從縱軸方向觀察的示意圖。Figure 5 is a schematic diagram of the edge cutting device used in this creation viewed from the longitudinal axis.
圖6和圖7為本創作使用的邊料裁切裝置的旋轉模組帶動印刷電路板,而對印刷電路板多個側邊裁切銅箔邊料的動作示意圖。Figures 6 and 7 are schematic diagrams of the operation of the rotating module of the edge cutting device used in this invention to drive the printed circuit board and cut the copper foil edges on multiple sides of the printed circuit board.
圖8為本創作使用的收板裝置的局部放大示意圖。Figure 8 is a partial enlarged schematic diagram of the plate closing device used in this creation.
圖9為本創作的切邊模組切除銅箔邊料後的印刷電路板的俯視示意圖。Figure 9 is a top view of the printed circuit board after cutting off the copper foil edge material using the edge trimming module of this invention.
1:印刷電路板分板裁切設備 1: Printed circuit board depaneling and cutting equipment
2:待分割的印刷電路板 2: Printed circuit board to be divided
100:機架 100:Rack
110:本體 110:Ontology
111:腳架 111:Tripod
120:收料桶 120:Receiving bucket
130:進料台 130: Feeding table
200:移板裝置 200: Plate shifting device
210:主滑軌 210: Main slide rail
220:第一移板機 220:The first plate moving machine
221:第一移動座 221:The first mobile seat
222:第一升降機構 222:The first lifting mechanism
223:第一吸板機構 223: The first suction plate mechanism
230:第二移板機 230: The second plate moving machine
231:第二移動座 231: Second mobile base
232:連接座 232: Connector
233:第二升降機構 233: Second lifting mechanism
234:第二吸板機構 234: Second suction plate mechanism
235:第三升降機構 235: The third lifting mechanism
236:第三吸板機構 236: The third suction plate mechanism
240:第三移板機 240: The third plate moving machine
300:分板裝置 300: Depaneling device
310:第一輸送帶 310: First conveyor belt
320:第二輸送帶 320: Second conveyor belt
330:分板裁切模組 330: Panel cutting module
400:邊料裁切裝置 400: Edge material cutting device
430:橫向滑軌 430: Horizontal slide rail
500:收板裝置 500: Plate closing device
510:進板輸送帶 510: Plate feeding conveyor belt
520:旋轉翻板裝置 520: Rotating flap device
530:銜接輸送帶 530:Connecting conveyor belt
540:收板輸送帶 540: Plate closing conveyor belt
550:收料台 550: Receiving table
D1:縱軸方向 D1: vertical axis direction
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112213250U TWM652405U (en) | 2023-12-05 | 2023-12-05 | Splitting and cutting equipment of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112213250U TWM652405U (en) | 2023-12-05 | 2023-12-05 | Splitting and cutting equipment of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM652405U true TWM652405U (en) | 2024-03-01 |
Family
ID=91268607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112213250U TWM652405U (en) | 2023-12-05 | 2023-12-05 | Splitting and cutting equipment of printed circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM652405U (en) |
-
2023
- 2023-12-05 TW TW112213250U patent/TWM652405U/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI454432B (en) | Plate glass cutting and breaking device | |
CN113327878B (en) | Wafer loading device and wafer film pasting device | |
CN115302564A (en) | System for automatically separating PCB and PCB process line | |
CN106550551A (en) | Automatic placement machine | |
CN110695538A (en) | Battery piece processing apparatus and battery piece series welding equipment | |
CN202480518U (en) | Automatic film sticking machine for flexible-packaging lithium batteries | |
JP5412670B2 (en) | Booklet transport device | |
TWM652405U (en) | Splitting and cutting equipment of printed circuit board | |
CN215034536U (en) | Battery piece scribing device and series welding machine | |
CN112298952B (en) | High-speed board-splitting assembly front line segment of mobile phone power supply protection board | |
CN211708382U (en) | Battery piece processing apparatus and battery piece series welding equipment | |
TWI855510B (en) | Printed circuit board splitting and trimming equipment | |
CN221202890U (en) | Printed circuit board separating and cutting equipment | |
CN210103762U (en) | Glass lens cutting lobe of a leaf device | |
TW202431909A (en) | Printed circuit board splitting and trimming equipment | |
EP0731029B1 (en) | Method for and apparatus for cutting cardboard boxes | |
JP6326541B1 (en) | Substrate dividing apparatus and substrate dividing method | |
CN213080456U (en) | Battery piece burst device and burst production facility | |
JP2673410B2 (en) | Method and apparatus for cutting printed circuit board | |
JPS61289988A (en) | Table for cutting machine | |
JP3227552U (en) | Board cutting device | |
CN218226964U (en) | Full-automatic laminated board splitting equipment | |
CN118234135A (en) | Printed circuit board separating and edge trimming equipment | |
KR100330756B1 (en) | The scrap remove mothod and equipment of multi layer board | |
CN217620770U (en) | Paper cutter convenient to retrieve based on printing |