TWM651594U - Photo coupler package structure - Google Patents

Abstract

An optocoupler packaging structure includes a first substrate, a second substrate, a trench, an insulating material, a first optocoupler integrated circuit, an integrated circuit and a first light receiving element. The trench is disposed between the first substrate and the second substrate, the insulating material is disposed in the trench and between the first substrate and the second substrate, the first optocoupler integrated circuit system The integrated circuit is arranged in the first substrate, the integrated circuit is arranged in the second substrate, the first light receiving element is arranged in the first substrate and is electrically connected to the first optocoupler integrated circuit.

Description

Optocoupler packaging structure

This invention relates to a packaging structure, especially an optical coupler packaging structure.

Currently, a related art optical coupler packaging structure includes a plurality of independent packaging structures; for example, a related art half-bridge gate drive optical coupler packaging structure includes two independent packaging structures; therefore, the related art The packaging structure of the optical coupler (for example, the packaging structure of the half-bridge gate drive optical coupler in the related art) is complex and increases the manufacturing cost.

In order to solve the above problems, the purpose of this invention is to provide an optical coupler packaging structure.

In order to achieve the above purpose of this invention, the optical coupler packaging structure of this invention includes: a first substrate; a second substrate; a trench, the trench is provided between the first substrate and the second substrate; An insulating material, the insulating material is disposed in the trench and between the first substrate and the second substrate; a first optocoupler integrated circuit, the first optocoupler integrated circuit is disposed in In the first substrate; an integrated circuit, the integrated circuit is arranged in the second substrate; and a first light receiving element, the first light receiving element is arranged in the first substrate and electrically connected to the first optocoupler integrated circuit.

Furthermore, in a specific embodiment of the optical coupler package structure of the present invention as mentioned above, the optical coupler package structure further includes: a second light receiving element, the second light receiving element is disposed on the first within two substrates and electrically connected to the integrated circuit; and a light-transmitting insulating layer, which is disposed on the first substrate, the second substrate, the trench, the insulating material, and the first light on the receiving element and the second light receiving element, wherein the integrated circuit is a second optocoupler integrated circuit.

Furthermore, in a specific embodiment of the optical coupler packaging structure of the invention as mentioned above, the optical coupler packaging structure further includes: a light emitting element, the light emitting element is disposed on the light-transmitting insulating layer .

Furthermore, in a specific embodiment of the optical coupler packaging structure of the invention as mentioned above, the optical coupler packaging structure further includes: an adhesive insulation layer, the adhesive insulation layer is attached to the first substrate, on the second substrate, the trench and the insulating material.

Furthermore, in an embodiment of the optical coupler package structure of the present invention as described above, a depth of the trench is within three times of a width of the trench.

Furthermore, in a specific embodiment of the optical coupler packaging structure of the invention as mentioned above, the insulating material is ester, plastic, polymer, metal oxide, polycarbonate, epoxy resin, glass or its mixture.

Furthermore, in a specific embodiment of the optical coupler packaging structure of the present invention as mentioned above, the light-transmitting insulating layer is made of polyethylene terephthalate, polymethyl methacrylate, polyimide , polycarbonate, epoxy resin or glass.

Furthermore, in a specific embodiment of the optical coupler package structure of the present invention as mentioned above, the first light receiving element is a photodiode.

Furthermore, in a specific embodiment of the optical coupler package structure of the present invention as mentioned above, the second light-receiving element is a photodiode.

Furthermore, in a specific embodiment of the optical coupler package structure of the present invention as mentioned above, the light emitting element is a light emitting diode.

The effect of this invention is to reduce the manufacturing cost of the optical coupler packaging structure.

In order to further understand the technology, means and effects used by this creation to achieve the intended purpose, please refer to the following detailed description and drawings of this creation. I believe that the purpose, features and characteristics of this creation can be understood in depth and concretely. However, the attached drawings are only for reference and illustration and are not intended to limit this creation.

In this disclosure, many specific details are provided in order to provide a thorough understanding of specific embodiments of the present invention; however, one skilled in the art will understand that without one or more of these specific details, still to be able to practice the invention; in other cases, well-known details are not shown or described to avoid obscuring the main technical features of the invention. The technical content and detailed description of this creation, together with the diagrams, are as follows:

Please refer to FIG. 1 , which is a schematic side cross-sectional view of the optical coupler packaging structure 10 of the present invention; and please also refer to FIG. 2 , which is a top view of the optical coupler packaging structure 10 of the present invention. An optocoupler packaging structure 10 of the present invention includes a first substrate 102, a second substrate 104, a trench 106, an insulating material 108, a first optocoupler integrated circuit 110, an integrated circuit 112, an A first light-receiving element 114, a second light-receiving element 116, a light-transmitting insulating layer 118, a light-emitting element 120 and an adhesive insulating layer 122. The optocoupler package structure 10 can be, for example but not limited to, a half-bridge gate drive optocoupler package structure, and the integrated circuit 112 can be, for example but not limited to, a second optocoupler integrated circuit. circuit.

The first optocoupler integrated circuit 110 and the integrated circuit 112 can be respectively connected to the control terminal (eg, gate terminal) of the switching element (not shown in FIGS. 1 and 2 ) to drive the switching element, or the first optical coupling The coupling integrated circuit 110 and the integrated circuit 112 can be other digital optocouplers or analog optocouplers, such as isolation amplifiers; wherein the switching element can be, for example, a metal oxide semiconductor field effect transistor (metal oxide semiconductor field effect transistor, often referred to as MOSFET) or insulated gate bipolar transistor (often referred to as IGBT).

The first optocoupler integrated circuit 110 and the integrated circuit 112 need to be isolated by the trench 106 and the insulating material 108 (that is, the high voltage terminal is isolated). In a specific embodiment of the invention but not limiting the invention, one of the first optocoupler integrated circuit 110 and the integrated circuit 112 is used to receive an external control signal and can be connected to the control end of the switching element. to drive the switching element, and the other one of the first optocoupler integrated circuit 110 and the integrated circuit 112 receives the signal sent from the above-mentioned first light receiving element 114 or the second light receiving element 116 and Can be connected to the control terminal of the switching element to drive the switching element.

The trench 106 is disposed between the first substrate 102 and the second substrate 104; the insulating material 108 is disposed in the trench 106 and between the first substrate 102 and the second substrate 104. ; The first optocoupler integrated circuit 110 is provided in the first substrate 102 ; the integrated circuit 112 is provided in the second substrate 104 ; the first light receiving element 114 is provided in the first substrate 102 and is electrically connected to the first optocoupler integrated circuit 110; the second light-receiving element 116 is disposed in the second substrate 104 and electrically connected to the integrated circuit 112; the light-transmitting insulating layer 118 is Disposed on the first substrate 102, the second substrate 104, the trench 106, the insulating material 108, the first light receiving element 114 and the second light receiving element 116; the light emitting element 120 is disposed on the on the light-transmitting insulating layer 118; the adhesive insulating layer 122 is attached to the first substrate 102, the second substrate 104, the trench 106 and the insulating material 108.

A depth D of the trench 106 is within three times a width W of the trench 106 . The insulating material 108 is ester, plastic, polymer, metal oxide, polycarbonate (usually referred to as PC), epoxy resin (epoxy), glass or a mixture thereof; the light-transmitting insulating layer 118 is made of Polyethylene terephthalate (commonly referred to as PET), polymethylmethacrylate (commonly referred to as PMMA), polyimide (commonly referred to as PI), polycarbonate, Made of epoxy resin or glass; the first light-receiving element 114 is a photodiode; the second light-receiving element 116 is a photodiode; the light-emitting element 120 is a Light emitting diode (light emitting diode, often referred to as LED), and although Figures 1 and 2 show one light emitting element 120, the invention can also include two light emitting elements 120 to correspond to the respective A light receiving element 114 and the second light receiving element 116.

The following content will describe how to manufacture the optocoupler package structure 10 of the present invention, and the following content omits conventional details or process steps to avoid obscuring the main technical features of the present invention:

Please refer to FIG. 3 , which is a top view of the wafer 20 of the present invention; the present invention uses cutting technology or etching technology to generate the first substrates 102 and the second substrates 104 of the wafer 20 . Groove 106; next, please refer to Figure 1, the present invention fills the insulating material 108 in the groove 106 (at this time, the adhesive insulating layer 122 has not been attached, and the bottom of the first substrate 102 and the second The bottoms of the substrate 104 have not yet been ground and can be connected together to form the bottom of the trench 106 (that is, the cross-sections of the first substrate 102, the second substrate 104, and the trench 106 will be similar to a concave shape), so as to (so that the bottom of the trench 106 is not exposed); then, the present invention grinds the bottoms of the first substrate 102 and the second substrate 104 until the filled insulating material 108 is exposed; then, the adhesive insulating layer 122 is attached On the first substrate 102, the second substrate 104, the trench 106 and the insulating material 108; then, please refer to FIG. 3, the present invention cuts the wafer 20 into independent ones along the plurality of cutting lines 22. Some optocoupler package structures 10.

Among them, the step of arranging the light-transmitting insulating layer 118 on the first substrate 102, the second substrate 104, the trench 106, the insulating material 108, the first light-receiving element 114 and the second light-receiving element 116 It can also be completed together with the above-mentioned step of filling the insulating material 108 into the trench 106, and the present invention can use white glue (not shown in Figures 1, 2 and 3) for the final processing of the optical coupler packaging structure 10. of packaging.

The effect of this invention is to reduce the steps of the packaging process to reduce the manufacturing cost of the optical coupler packaging structure.

However, the above are only examples of this invention and should not limit the scope of implementation of this invention. That is, all equivalent changes and modifications made in accordance with the claims of this invention should still be within the scope of the patent coverage of this invention and are intended to be protected. category. The invention can also have various other embodiments. Without departing from the spirit and essence of the invention, those skilled in the art can make various corresponding changes and deformations based on the invention. However, these corresponding changes and deformations are It should fall within the scope of protection of the claims attached to this creation. To sum up, the structure of this invention has never been seen in similar products and has been used publicly, and it has industrial applicability, novelty and advancement.

10: Optocoupler packaging structure 20:wafer 22: Cutting line 102: First substrate 104: Second substrate 106:Trench 108:Insulating material 110: The first optocoupler integrated circuit 112:Integrated Circuit 114: First light receiving element 116: Second light receiving element 118: Translucent insulation layer 120:Light emitting element 122: Paste the insulation layer D: Depth W: Width

Figure 1 is a schematic side cross-sectional view of the optical coupler packaging structure of this invention.

Figure 2 is a top view of the optical coupler packaging structure of this invention.

Figure 3 is a top view of the wafer of this creation.

10: Optocoupler packaging structure

102: First substrate

104: Second substrate

106:Trench

108:Insulating material

110: The first optocoupler integrated circuit

112:Integrated Circuit

114: First light receiving element

116: Second light receiving element

118: Translucent insulation layer

120:Light emitting element

122: Paste the insulation layer

D: Depth

W: Width

Claims (10)

An optocoupler packaging structure, including: a first substrate; a second substrate; A trench, the trench is provided between the first substrate and the second substrate; An insulating material, the insulating material is disposed in the trench and between the first substrate and the second substrate; a first optocoupler integrated circuit, the first optocoupler integrated circuit is disposed in the first substrate; an integrated circuit disposed within the second substrate; and A first light-receiving element is disposed in the first substrate and electrically connected to the first optocoupler integrated circuit. The optocoupler packaging structure as described in claim 1 further includes: a second light-receiving element, the second light-receiving element is disposed in the second substrate and electrically connected to the integrated circuit; and A light-transmitting insulating layer, the light-transmitting insulating layer is provided on the first substrate, the second substrate, the trench, the insulating material, the first light-receiving element and the second light-receiving element, Wherein, the integrated circuit is a second optocoupler integrated circuit. The optocoupler packaging structure as described in claim 2 further includes: A light emitting element is provided on the light-transmitting insulating layer. The optocoupler packaging structure as described in request item 3 further includes: An adhesive insulation layer is attached to the first substrate, the second substrate, the trench and the insulating material. The optical coupler packaging structure of claim 4, wherein a depth of the trench is within three times a width of the trench. The optical coupler packaging structure of claim 5, wherein the insulating material is ester, plastic, polymer, metal oxide, polycarbonate, epoxy resin, glass or a mixture thereof. The optical coupler packaging structure according to claim 5, wherein the light-transmitting insulating layer is made of polyethylene terephthalate, polymethylmethacrylate, polyimide, polycarbonate, epoxy resin or made of glass. The optical coupler package structure of claim 5, wherein the first light receiving element is a photodiode. The optical coupler package structure of claim 5, wherein the second light receiving element is a photodiode. The optical coupler packaging structure of claim 5, wherein the light emitting element is a light emitting diode.

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