TWM647670U - Wafer cleaning equipment - Google Patents

Abstract

A wafer cleaning equipment, configured to clean a plurality of dice spaced apart from each other after dicing, and configured to clean to-be-cleaned matters between the plurality of dies. The wafer cleaning equipment includes a driving device, a spin chuck, an adsorption device, and a cleaning device. The spin chuck is connected with to driving device and is driven to rotate by the driving device. The adsorption device can be disposed in the spin chuck. The cleaning device can is disposed towards the spin chuck. The plurality of dice can be fixed in a wafer frame. The adsorption device adsorbs at least one of the wafer frame or the plurality of dice in a direction opposite to gravity. The cleaning device sprays at least one cleaning liquid towards the plurality of dies.

Description

Wafer cleaning equipment

The present invention relates to a wafer cleaning equipment, in particular to a wafer cleaning equipment used to clean a plurality of wafers that are spaced apart from each other after cutting.

In semiconductor manufacturing, the wafer cleaning process is an important process. The reason is that if the contamination caused by cutting or etching processes is not cleaned, it will seriously affect the subsequent processes and eventually lead to product abnormalities. , causing the yield to decrease.

In order to ensure that each wafer can be cleaned, single wafer cleaning equipment can be used to clean each wafer. However, as shown in FIG. 1 , in the conventional technology, the cleaning of a single wafer is usually done by placing the surface of the die 71 of the wafer to be cleaned upward, and using the conventional cleaning equipment 50 to clean the grooves 72 of each die 71 . 60 items to be cleaned.

However, the above-mentioned cleaning methods cannot completely clean today's wafer products (such as wafer products manufactured with processes after 14 nanometers), or it takes a very long time to complete the cleaning of wafer products. The reason is that with the evolution of semiconductor manufacturing processes, the structure of the chip has become increasingly complex, the circuits have become smaller and smaller, the surface structure has become more three-dimensional, and the high aspect ratio has been greatly improved. Therefore, both the width of the cutting groove on the wafer surface and the gaps generated by the surface structure are very small.

Under this situation, if the wafer is cleaned only with conventional methods or equipment, the contaminants inside the groove will not be easily removed. Furthermore, cleaning liquids falling from above, such as deionized water, can easily cause these contaminants to splash due to uneven wafer surfaces, thus causing cross-contamination. Therefore, a wafer cleaning equipment is needed to solve the above-mentioned conventional problems.

Based on the above purpose, this invention provides a wafer cleaning equipment for cleaning a plurality of wafers that are spaced apart from each other after cutting and the objects to be cleaned between the plurality of wafers. Wafer cleaning equipment may include a driving device, a turntable, an adsorption device and a cleaning device. The turntable can be connected to the driving device and driven to rotate by the driving device. The adsorption device can be arranged in the turntable. The cleaning device can be set towards the turntable. The plurality of die can be fixed on the wafer frame, the adsorption device adsorbs at least one of the wafer frame or the plurality of die in a direction opposite to gravity, and the cleaning device sprays at least one cleaning liquid toward the plurality of die.

Preferably, the wafer cleaning equipment of the present invention further includes a plurality of fixing devices, and the plurality of fixing devices are arranged on the turntable for fixing the wafer frame at a fixed position or releasing the wafer frame at a release position.

Preferably, each plurality of fixing devices includes a push unit, a push part, a rotating shaft and a fixed part. The push part is connected to the push unit, the rotating shaft is arranged on the edge of the turntable, and the rotating shaft is located between the pushing part and the fixed part. .

Preferably, the pushing unit is an elastic member, and the pushing unit exerts a force toward the first direction on the pushing part, and the fixing parts of each plurality of fixing devices are in fixed positions.

Preferably, the wafer cleaning equipment of the present invention further includes at least one release mechanism, the release mechanism exerts a force on the pushing portion toward the second direction, and the first direction is opposite to the second direction, and the fixing portion is in the release position.

Preferably, the release mechanism is a ring mechanism.

Preferably, the pushing unit includes one or more of a pneumatic cylinder, a hydraulic cylinder, a motor, and a screw. The pushing unit pushes or pulls the pushing part so that the fixed part is in a fixed position or a release position.

Preferably, each of the plurality of fixing devices includes a first end, a rotating shaft and a second end. The first end, the rotating shaft and the second end form a lever mechanism, and the rotating shaft is located between the first end and the second end. During this time, the first end is closer to a center of the turntable than the second end, and the weight of the first end is greater than the weight of the second end.

Preferably, the cleaning device includes a nozzle cantilever and at least one nozzle, the nozzle is arranged on the nozzle cantilever, and the nozzle is driven by the nozzle cantilever to move within the cleaning range.

Preferably, the adsorption device includes a plurality of adsorption units, and the plurality of adsorption units are arranged corresponding to the positions of a plurality of die and wafer frames.

This creation provides wafer cleaning equipment. In this invention, a single wafer is placed in a wafer frame to form a frame wafer to facilitate subsequent processes and avoid damage to the wafer. To further explain, the single frame wafer is adsorbed by the turntable (Spin Chuck) so that the cleaned surface of the frame wafer faces down, and the frame wafer is rotated with the turntable facing the ground (Spin Chuck Face Down). and cleaning. In addition, since the frame wafer is fixed below the turntable, a fixing device can be further used to fix the frame wafer on the turntable to prevent the frame wafer from sliding. The cleaning nozzle is located at the bottom of the equipment and applies cleaning liquid, such as deionized water or other chemicals, to the upper frame wafer. Therefore, during cleaning, contaminants can flow downward from the grooves between the dies in the frame wafer by gravity. This can prevent the conventional technique of using the turntable to rotate upward to clean a single wafer, which will cause the liquid at the groove to splash and cause cross contamination. Therefore, this invention can overcome the problem of difficulty in cleaning the grooves of the frame wafer.

In order to help the examiner understand the technical characteristics, content and advantages of this invention and the effects it can achieve, this invention is described in detail below with the accompanying drawings in the form of expressions of embodiments, and the diagrams used therein are as follows. The subject matter is only for illustration and auxiliary explanation, and may not represent the true proportions and precise configuration of this creation after its implementation. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted to limit the scope of rights in the actual implementation of this creation. Let’s explain first.

The following will describe embodiments of the present invention with reference to relevant drawings. To facilitate understanding, the same components in the following embodiments are labeled with the same symbols.

There are multiple cleaning processes in the semiconductor manufacturing process to prevent the wafer from being contaminated and to facilitate the smooth progress of subsequent lithography, etching, packaging and other processes. In these processes, the wafer product 20 after cutting is very difficult to clean.

As shown in FIG. 2 , in today's semiconductor manufacturing process, the wafer product 20 will be cut multiple times by the cutting device 106 to form a plurality of die 201 , and grooves 203 will be formed between the plurality of spaced die 201 . , in addition to being formed on the plurality of crystal grains 201 , the polished contaminants will also be formed in the grooves 203 .

As shown in FIGS. 2 and 3 , in other processes, the cutting device 106 in FIG. 2 can also be used to perform the first cutting process on the wafer product 20 , and then the wafer product 20 is turned over, and then the wafer product 20 is turned over with the grinding device. 107. Remove the back of the wafer product 20, and finally form a plurality of spaced apart dies 201.

No matter what process is used to form the crystal grains, contaminants will be produced, so a wafer cleaning equipment is needed to clean these contaminants. This invention provides a wafer cleaning equipment for cleaning a plurality of die 201 spaced apart from each other after cutting and the spaces between the plurality of die 201 to be cleaned.

In one embodiment, the wafer cleaning equipment may include a driving device 101, a turntable 102, an adsorption device 103, a cleaning device 104 and a transfer device 108. As shown in Figures 4A and 4B, since the turntable 102 is facing the ground (Spin Chuck Face Down), after the die 201 is rotated and cleaned, the objects 40 to be cleaned, such as particles, chemicals and other contaminants, can be passed through Gravity flows downward to increase cleaning efficiency.

To further explain, in one embodiment, the driving device 101 may include a motor 1013, and the motor 1013 may be controlled to output rotational power to drive the turntable 102 to rotate. The turntable 102 can be connected to the driving device 101 and driven to rotate by the driving device 101 . In a preferred embodiment, the turntable 102 can be connected to the driving shaft 1011 of the driving device 101, and the driving shaft 1011 transmits the power of the motor 1013.

As shown in FIGS. 4A to 5B , the adsorption device 103 is disposed in the turntable 102 and may include a plurality of adsorption units 1031 . In one embodiment, the adsorption unit 1031 may be one or more of a magnetic attraction element, a negative pressure adsorption element, and a vacuum adsorption element to adsorb at least one of the wafer frame 30 or the plurality of dies 201 . In a preferred embodiment, the adsorption unit 1031 can be a vacuum adsorption component, and the surface of the turntable 102 facing the ground is provided with an air extraction port of the adsorption unit 1031 .

To further explain, in this invention, the cleaning device 104 is disposed facing the turntable 102, a plurality of die 201 can be fixed on the wafer frame 30, and the adsorption device 103 adsorbs the wafer frame 30 or a plurality of die in the direction opposite to gravity. At least one of 201, the cleaning device 104 can spray at least one cleaning liquid, such as deionized water, cleaning chemicals, and the like, toward the plurality of dies 201 or one or more. After the cleaning device 104 completes cleaning the wafer 201, the transfer device 108 can be used to transfer the wafer frame 30 to the shipping area of the wafer cleaning equipment.

To further explain, the cleaning device 104 may include a nozzle cantilever 1041 and a nozzle 1042. The nozzle 1042 may be disposed on the nozzle cantilever 1041, and the nozzle 1042 is driven by the nozzle cantilever 1041 to move within a cleaning range. But it is not limited to this. For example, in one embodiment, in order to avoid cross-contamination of different cleaning liquids sprayed from the same nozzle 1042, the cleaning device 104 may also include a plurality of nozzle cantilevers 1041 and a plurality of nozzles 1042, or It can also include a nozzle cantilever 1041 and a plurality of nozzles 1042, and different cleaning liquids, such as deionized water, etching liquid, isopropyltone solution, etc., are sprayed from different nozzles 1042.

In addition, in other embodiments, the nozzle 1042 can provide one or more cleaning liquids in a fan shape, a cone shape, or a needle shape when spraying, and the cleaning liquid sprayed by the nozzle 1042 can be a high-temperature, high-pressure cleaning liquid. To facilitate the cleaning of crystal grains and objects to be cleaned.

To further explain, the transfer device 108 may be a robotic arm, and may include a telescopic arm 1081 and a loading part 1082. The carrying part 1082 is provided on the telescopic arm 1081, and the telescopic arm 1081 is controlled to move the carrying part 1082. The carrying portion 1082 has elements that can attract the wafer frame 30 , such as suction cups, air extraction holes, etc., so as to attract the surface of the wafer frame 30 . Therefore, in one embodiment, the transfer device 108 can take the wafer frame 30 in a horizontal state to perform cleaning operations.

In a preferred embodiment, the transfer device 108 may include two robotic arms, or may be a dual finger (Dual Finger) robotic arm as shown in FIG. 4C . In other words, the transfer device 108 may include two telescopic arms 1081 and two carrying parts 1082 . Therefore, different telescopic arms 1081 and different loading parts 1082 can be used to avoid cross-contamination of the wafer frame 30 and the die 201 before and after cleaning.

As shown in FIG. 5A and FIG. 5B , the die 201 and the wafer frame 30 are adhered to the protective film 202 , and the adsorption device 103 adsorbs the protective film 202 . Therefore, the adsorption device 103 can adsorb the wafer frame adhered to the protective film 202 At least one of 30 or a plurality of die 201. In a preferred embodiment, the protective film 202 may be ultraviolet tape, which is a pressure-sensitive tape. Through the adhesive on the protective film 202 , the protective film 202 can be firmly bonded to the die 201 and the wafer frame 30 .

The protective film 202 includes a base material and an adhesive. The base material may be a plastic film, and may include one or more materials such as polyolefin, polyvinyl chloride, and polyethylene terephthalate. The adhesive is a pressure-sensitive adhesive that hardens after exposure to ultraviolet rays. The adhesive has high adhesion, but after being irradiated by ultraviolet rays, the polymer chains in it will form a three-dimensional network structure and harden, which will cause the adhesion to drop sharply and can be easily and cleanly peeled off to facilitate subsequent processes.

In the present invention, the position of the adsorption unit 1031 can be set as required. For example, as shown in FIG. 5B , the adsorption unit 1031 may be arranged corresponding to the positions of the die 201 and the wafer frame 30 , or may be arranged only corresponding to the position of the wafer frame 30 as shown in FIG. 5A . In addition, other configurations can also be performed as required. For example, the adsorption unit 1031 is only configured to correspond to the position of the die 201 . In a preferred embodiment, when the adsorption unit 1031 is disposed corresponding to the positions of the die 201 and the wafer frame 30 as shown in FIG. 5B , a better adsorption effect can be provided for the die 201 and the wafer frame 30 .

To further illustrate, in order to further ensure that the wafer frame 30 and the die 201 can be firmly fixed, the wafer cleaning equipment of the present invention may further include a plurality of fixing devices 105 . A plurality of fixing devices 105 can be disposed on the turntable 102 and cooperate with the adsorption device 103 to fix the wafer frame 30 in a fixed position or release the wafer frame 30 in a release position.

In one embodiment, as shown in FIG. 6A and FIG. 6B , each plurality of fixing devices 105 includes a pushing unit 1051 , a pushing part 1052 , a rotating shaft 1053 , a fixing part 1054 and at least one release mechanism 1055 . The pushing part 1052 is connected to the pushing unit 1051. The rotating shaft 1053 is arranged on the edge of the turntable 102. The rotating shaft 1053 is located between the pushing part 1052 and the fixed part 1054. In a preferred embodiment, the pushing part 1052 and the fixing part 1054 can form an L-shaped rod. Therefore, when the pushing part 1052 is pushed, due to the rotation of the rotating shaft 1053, the fixing part 1054 will have an opposite effect to the pushing part 1052. direction of movement.

In a preferred embodiment, the pushing unit 1051 can be an elastic member, such as a spring. Therefore, the pushing unit 1051 can exert a force toward the first direction on the pushing portion 1052. For example, the pushing unit 1051 can push the pushing portion 1052 toward the edge of the turntable 102. Therefore, the fixing portions 1054 of each of the plurality of fixing devices 105 can Located in a fixed location.

Therefore, in one embodiment, when the turntable 102 rotates, at least one of the wafer frame 30 or the die 201 can be adsorbed by the adsorption device 103, and the wafer frame 30 can also be fixed by the fixing device 105, so that the wafer frame can be avoided 30 or the grain 201 slides or falls off when the turntable 102 rotates.

In another embodiment, when the turntable 102 is not rotating (for example, the wafer frame 30 and the die 201 need to be sent to the wafer cleaning equipment for cleaning, or the die 201 in the wafer frame 30 has been cleaned) , the release mechanism 1055 can exert a force toward the second direction on the pushing portion 1052, and the first direction is opposite to the second direction (for example, toward the center of the turntable 102). At this time, the fixing portion 1054 is in the release position to prepare for subsequent operations. process.

To further explain, in the above embodiment, when the wafer frame 30 and the die 201 are sent to the wafer cleaning equipment for cleaning, the wafer frame 30 can be picked up and turned over by a robot arm, a turning device, etc., and the wafer frame 30 can be first used by an adsorption device. 103 adsorbs at least one of the wafer frame 30 or the die 201 on the turntable 102, and then moves the fixing part 1054 of the fixing device 105 to a fixed position so that the fixing part 1054 fixes the wafer frame 30. At this time, when the turntable 102 rotates, the wafer frame 30 or the die 201 can be prevented from sliding or falling off on the turntable 102 .

After the wafer frame 30 and the die 201 are cleaned in the wafer cleaning equipment, the release mechanism 1055 can first move the fixing part 1054 of the fixing device 105 to the release position, so that the fixing part 1054 is separated from the wafer frame 30 and is ready to be picked up. When the wafer frame 30 is taken out (for example, when the transfer device 108 is preparing to transfer the wafer frame 30 ), the adsorption device 103 releases the adsorption force to facilitate subsequent processes.

In one embodiment, the release mechanism 1055 can rotate synchronously with the turntable 102 , or it can be a mechanism that is independent of the turntable 102 and does not rotate with the turntable 102 . In a preferred embodiment, as shown in FIGS. 8A and 8B , the release mechanism 1055 can be a ring-shaped mechanism, and the pushing unit 1051 can include an elastic member, such as a spring. Therefore, as shown in FIG. 8A , when the release mechanism 1055 is raised, the pushing unit 1051 will push the pushing part 1052 , and at this time, the fixing part 1054 can be in a fixed position to fix the wafer frame 30 . As shown in FIG. 8B , when the release mechanism 1055 is lowered, the annular release mechanism 1055 will push the push portion 1052 toward the center of the turntable 102 . At this time, the fixing portion 1054 will be in the release position, ready to release the wafer frame 30 .

In addition, in one embodiment, as shown in FIG. 7 , in order to avoid interference between the fixing device 105 and other mechanisms (such as the transfer device 108 for picking up the wafer), the fixing device 105 can be disposed on opposite sides of the turntable 102 .

In other embodiments, the pushing unit 1051 may also include one or more of a pneumatic cylinder, a hydraulic cylinder, a motor, and a screw. As shown in FIGS. 9A and 9B , when the pushing unit 1051 itself is controlled to push or pull the pushing part 1052 , the above-mentioned release mechanism 1055 may no longer be used, so that the fixing part 1054 can be positioned at a fixed position or released. Location.

In an embodiment, other forms of fixing devices 105 may also be provided as shown in FIGS. 10A to 11 . The fixing device 105 may include a first end 1056, a rotating shaft 1053, and a second end 1057. The first end 1056, the rotating shaft 1053 and the second end 1057 form a lever mechanism. The rotating shaft 1053 is located between the first end 1056 and the second end 1057. The first end 1056 is closer to the center of the turntable 102 than the second end 1057, and the weight of the first end 1056 is greater than the weight of the second end 1057. . In a preferred embodiment, the fixing device 105 may also include a housing 1058, which may be disposed on the turntable 102, and the first end 1056, the rotating shaft 1053, and the second end 1057 may be disposed in the housing 1058.

Therefore, when the turntable 102 rotates, the first end 1056 will move toward the edge of the turntable 102 due to centrifugal force. At this time, the second end 1057 will be at a fixed position. When the turntable 102 stops rotating, since the weight of the first end 1056 is greater than the weight of the second end 1057, the first end 1056 will return to the initial position due to the influence of gravity. At this time, the second end 1057 It will be in the release position, ready to release the wafer frame 30 . In this case, there is no need to additionally provide other power mechanism control fixing devices 105 .

To sum up, in this invention, the cut die 201 is placed in the wafer frame 30. The wafer frame 30 can be adsorbed by the adsorption device 103 in the turntable 102, so that the cleaned surface of the die 201 faces downward. The crystal grains 201 are rotated and cleaned with the turntable 102 facing the ground direction. In addition, since the die 201 is fixed below the turntable, the fixing device 105 can be further used to fix the wafer frame 30 on the turntable 102 to prevent the wafer frame 30 from sliding. The nozzle 1042 is located at the bottom of the device and applies cleaning liquid, such as deionized water or other chemicals, toward the upper die 201 . Therefore, during cleaning, contaminants can flow out of the grooves 203 between the die 201 downwards by gravity. This can prevent the conventional technique of using the turntable to rotate upward to clean a single wafer, which will cause the liquid at the groove to splash and cause cross contamination. Therefore, this invention can overcome the problem of difficulty in cleaning the grooves of the frame wafer.

The above is only illustrative and not restrictive. Any equivalent modifications or changes that do not depart from the spirit and scope of this creation shall be included in the appended patent application scope.

101:Driving device 1011: Drive shaft 1012:Drive unit cantilever 1013:Motor 102:Turntable 103:Adsorption device 1031:Adsorption unit 104: Cleaning device 1041:Nozzle cantilever 1042:Nozzle 105: Fixtures 1051: Push unit 1052:Pushing Department 1053:Shaft 1054: Fixed part 1055: Release mechanism 1056: first end 1057:Second end 1058: Shell 106: Cutting device 107:Grinding device 108:Transfer device 1081:Telescopic arm 1082: Passenger section 20:Wafer products 201:Grain 202:Protective film 203: Groove 30: Wafer frame 40: Things to be cleaned 50:Xinzhi cleaning equipment 60: Things to be cleaned 71:Grain 72: Groove

Figure 1 is a schematic diagram of single wafer cleaning in the conventional technology.

FIG. 2 is a first schematic diagram of wafer cutting according to an embodiment of the present invention.

FIG. 3 is a second schematic diagram of wafer cutting according to an embodiment of the present invention.

FIG. 4A is a first schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

FIG. 4B is a second schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

Figure 4C is a schematic diagram of a transfer device according to an embodiment of the present invention.

Figure 5A is a first schematic diagram of an adsorption unit according to an embodiment of the invention.

Figure 5B is a second schematic diagram of an adsorption unit according to an embodiment of the present invention.

FIG. 6A is a third schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

FIG. 6B is a fourth schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

Figure 7 is a bottom view of a fixing device according to an embodiment of the present invention.

FIG. 8A is a fifth schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

FIG. 8B is a sixth schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

FIG. 9A is a seventh schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

FIG. 9B is an eighth schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

FIG. 10A is a ninth schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

FIG. 10B is a tenth schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

Figure 11 is a schematic diagram of a fixing device according to an embodiment of the invention.

104: Cleaning device

201:Grain

203: Groove

30: Wafer frame

40: Things to be cleaned

Claims (10)

A wafer cleaning equipment used to clean a plurality of wafers that are spaced apart from each other after cutting and the objects to be cleaned between the plurality of wafers. The wafer cleaning equipment includes: a driving device; A turntable connected to the driving device and driven to rotate by the driving device; An adsorption device is provided in the turntable; and a cleaning device, arranged toward the turntable, Wherein, the plurality of die are fixed on a wafer frame, the adsorption device adsorbs at least one of the wafer frame or the plurality of die in a direction opposite to gravity, and the cleaning device sprays at least one of the plurality of die towards the plurality of die. A cleaning liquid. The wafer cleaning equipment as described in claim 1 further includes a plurality of fixing devices arranged on the turntable for fixing the wafer frame at a fixed position or releasing the wafer frame at a release position. Round frame. The wafer cleaning equipment of claim 2, wherein each of the plurality of fixing devices includes a pushing unit, a pushing part, a rotating shaft and a fixed part, the pushing part is connected to the pushing unit, and the The rotating shaft is arranged on one edge of the rotating disk, and the rotating shaft is located between the pushing part and the fixed part. The wafer cleaning equipment of claim 3, wherein the pushing unit is an elastic member, the pushing unit exerts a force toward the pushing part in a first direction, and the fixing parts of each of the plurality of fixing devices are located at The fixed position. The wafer cleaning equipment according to claim 4, further comprising at least one release mechanism that exerts a force on the pushing portion toward a second direction, and the first direction is opposite to the second direction, and the fixed is in this release position. The wafer cleaning equipment of claim 5, wherein the release mechanism is a ring-shaped mechanism. The wafer cleaning equipment of claim 3, wherein the pushing unit includes one or more of a pneumatic cylinder, a hydraulic cylinder, a motor, and a screw, and the pushing unit pushes or pulls the pushing part so that the fixed is in the fixed position or the release position. The wafer cleaning equipment according to claim 2, wherein each of the plurality of fixing devices includes a first end, a rotating shaft and a second end, and the first end, the rotating shaft and the second end form a A lever mechanism, the rotating shaft is located between the first end and the second end, the first end is closer to a center of the turntable than the second end, and the weight of the first end is greater than the third end. The weight of the two ends. The wafer cleaning equipment of claim 1, wherein the cleaning device includes a nozzle cantilever and at least one nozzle, the nozzle is disposed on the nozzle cantilever, and the nozzle is driven by the nozzle cantilever to move within a cleaning range. The wafer cleaning equipment of claim 1, wherein the adsorption device further includes a plurality of adsorption units, and the plurality of adsorption units are arranged corresponding to the positions of the plurality of die and the wafer frame.