CN220627753U - Wafer cleaning equipment - Google Patents

Abstract

A wafer cleaning apparatus for cleaning a plurality of dies spaced apart from each other after dicing and an object to be cleaned between the plurality of dies. The wafer cleaning apparatus may include a driving device, a turntable, an adsorption device, and a cleaning device. The turntable can be connected with the driving device and driven to rotate by the driving device. The adsorption means may be arranged in the turntable. The cleaning device may be arranged towards the turntable. The plurality of dies may be fixed to the wafer frame, the suction device suctions at least one of the wafer frame or the plurality of dies in a direction opposite to gravity, and the cleaning device sprays at least one cleaning liquid toward the plurality of dies.

Description

Wafer cleaning equipment

Technical Field

The present disclosure relates to a wafer cleaning apparatus, and more particularly, to a wafer cleaning apparatus for cleaning a plurality of dies spaced apart from each other after dicing.

Background

In semiconductor manufacturing, a cleaning process of a wafer is an important process, because contamination caused by a process such as dicing or etching will seriously affect a subsequent process if not cleaned, and finally, a product abnormality will be caused, so that a yield is reduced.

To ensure that each wafer (wafer) is cleaned, a single wafer cleaning apparatus may be used to clean each wafer. However, as shown in fig. 1, in the conventional art, the wafer is cleaned by using a conventional cleaning apparatus 50 to clean the object 60 to be cleaned between the grooves 72 of the dies 71, with the surface to be cleaned of the dies 71 of the wafer facing upwards.

However, the above-mentioned cleaning method cannot completely clean the current wafer products (such as those manufactured by 14 nm or later), or requires a very long time to clean the wafer products. The reason is that with the progress of the semiconductor process, the structure of the chip is getting more complex, the circuit is getting finer, the surface structure is getting more three-dimensional, and the aspect ratio is greatly improved. Therefore, the gap generated by the surface structure or the width of the cutting groove on the wafer surface is very tiny.

In this case, if the wafer is cleaned only in a conventional manner or with equipment, the contaminants in the recess will not be easily removed. Furthermore, cleaning fluids, such as deionized water, falling from above tend to splash and cross-contaminate the wafer surface due to uneven surfaces. Therefore, a wafer cleaning apparatus is needed to solve the above-mentioned conventional problems.

Disclosure of Invention

In view of the above, the present disclosure provides a wafer cleaning apparatus for cleaning a plurality of dies spaced apart from each other after dicing and an object to be cleaned between the plurality of dies. The wafer cleaning apparatus may include a driving device, a turntable, an adsorption device, and a cleaning device. The turntable can be connected with the driving device and driven to rotate by the driving device. The adsorption means may be arranged in the turntable. The cleaning device may be arranged towards the turntable. The plurality of dies may be fixed to the wafer frame, the suction device suctions at least one of the wafer frame or the plurality of dies in a direction opposite to gravity, and the cleaning device sprays at least one cleaning liquid toward the plurality of dies.

Preferably, the wafer cleaning apparatus of the present disclosure further comprises a plurality of fixing devices disposed on the turntable for fixing the wafer frame at a fixed position or releasing the wafer frame at a released position.

Preferably, each of the plurality of fixing devices comprises a pushing unit, a pushing part, a rotating shaft and a fixing part, wherein the pushing part is connected with the pushing unit, the rotating shaft is arranged at the edge of the turntable, and the rotating shaft is positioned between the pushing part and the fixing part.

Preferably, the pushing unit is an elastic member, and the pushing unit applies a force to the pushing portion in a first direction, and the fixing portions of the fixing devices are at the fixing positions.

Preferably, the wafer cleaning apparatus of the present disclosure further includes at least one release mechanism, wherein the release mechanism applies a force to the pushing portion toward the second direction, and the first direction is opposite to the second direction, and the fixing portion is at the release position.

Preferably, the release mechanism is a ring mechanism.

Preferably, the pushing unit comprises one or more of a pneumatic cylinder, an oil hydraulic lever, a motor and a screw rod, and the pushing unit pushes or pulls the pushing part to enable the fixing part to be at the fixing position or the releasing position.

Preferably, each of the plurality of fixing devices includes a first end, a rotating shaft and a second end, the first end, the rotating shaft and the second end form a lever mechanism, the rotating shaft is located between the first end and the second end, the first end is closer to the center of the turntable than the second end, and the weight of the first end is greater than that of the second end.

Preferably, the cleaning device comprises a nozzle cantilever and at least one nozzle, the nozzle is arranged on the nozzle cantilever, and the nozzle is driven by the nozzle cantilever to move in a cleaning range.

Preferably, the adsorption device comprises a plurality of adsorption units, and the plurality of adsorption units are arranged corresponding to the positions of the plurality of crystal grains and the wafer frame.

The present disclosure provides a wafer cleaning apparatus. In the present disclosure, the individual wafers are disposed in a Wafer Frame to form a Frame Wafer (Frame Wafer) for facilitating subsequent processing to avoid Wafer damage. Further, the single frame wafer is sucked by a turntable (Spin Chuck) so that the cleaned surface of the frame wafer faces downward, and the frame wafer is rotated and cleaned in such a manner that the turntable faces the ground direction (Spin Chuck Face Down). In addition, since the frame wafer is fixed under the turntable, the frame wafer can be further fixed on the turntable by the fixing device, preventing the frame wafer from sliding. The cleaning nozzle is positioned at the bottom of the apparatus and applies a cleaning liquid, such as deionized water or other liquid chemicals, to the upper frame wafer. Therefore, during cleaning, the contaminants can flow down from the grooves between the grains in the frame wafer by gravity. This prevents the conventional technique of cleaning the wafer by rotating the turntable upward, which could cause the liquid medicine in the groove to splash and cause cross contamination. Therefore, the present disclosure can overcome the problem of difficult cleaning at the wafer groove of the frame.

Drawings

Non-limiting examples of the embodiments disclosed herein are described below with reference to the drawings listed later in this paragraph. The specification drawings and description are intended to illustrate and clarify the embodiments disclosed herein and should not be taken as limiting in any way.

FIG. 1 is a schematic diagram of a conventional process for cleaning a single wafer.

FIG. 2 is a first schematic illustration of wafer dicing according to an embodiment of the present disclosure.

FIG. 3 is a second schematic view of wafer dicing according to an embodiment of the present disclosure.

FIG. 4A is a first schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 4B is a second schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 4C is a schematic diagram of a transfer device according to an embodiment of the present disclosure.

FIG. 5A is a first schematic diagram of an adsorption unit according to an embodiment of the present disclosure.

FIG. 5B is a second schematic diagram of an adsorption unit according to an embodiment of the present disclosure.

FIG. 6A is a third schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 6B is a fourth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 7 is a bottom view of a fixture according to an embodiment of the present disclosure.

FIG. 8A is a fifth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 8B is a sixth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 9A is a seventh schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 9B is an eighth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 10A is a ninth schematic view of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 10B is a tenth schematic view of a wafer cleaning apparatus according to an embodiment of the present disclosure.

FIG. 11 is a schematic view of a fixture according to an embodiment of the present disclosure.

Detailed Description

In order to facilitate the understanding of the technical features, contents and advantages of the present disclosure and the effects achieved thereby, the present disclosure will be described in detail below in conjunction with the accompanying drawings and expressed in terms of embodiments, and the gist of the drawings used herein is merely for illustration and auxiliary description, and not necessarily for actual proportion and precise arrangement of the present disclosure after implementation, so that the proportion and arrangement relation of the accompanying drawings should not be interpreted to limit the scope of the present disclosure in practical implementation, and the description is given earlier.

Embodiments in accordance with the present disclosure will be described with reference to the drawings, wherein like elements are designated with like numerals throughout the embodiments for ease of understanding.

There are multiple cleaning processes in the semiconductor process to avoid wafer contamination, so that the subsequent photolithography, etching, packaging processes can be performed smoothly. In these processes, the diced wafer product 20 is very difficult to clean.

As shown in fig. 2, in the present semiconductor manufacturing process, the wafer product 20 is diced by the dicing apparatus 106 for a plurality of times to form a plurality of dies 201, grooves 203 are formed between the plurality of dies 201 spaced apart from each other, and contaminants after polishing are formed in the grooves 203 in addition to the plurality of dies 201.

As shown in fig. 2 and 3, in other processes, the dicing apparatus 106 of fig. 2 may be used to perform a first dicing process on the wafer product 20, then turn over the wafer product 20, remove the back of the wafer product 20 by the polishing apparatus 107, and finally form a plurality of dies 201 spaced apart.

No matter what process is used to form the die, contaminants are generated, and therefore a wafer cleaning apparatus is required to clean the contaminants. The present disclosure provides a wafer cleaning apparatus for cleaning a plurality of dies 201 spaced apart from each other after dicing and an object to be cleaned between the plurality of dies 201.

In one embodiment, the wafer cleaning apparatus may include a driving device 101, a turntable 102, an adsorption device 103, a cleaning device 104, and a transfer device 108. As shown in fig. 4A and 4B, since the turntable 102 rotates and washes the die 201 in a direction (Spin Chuck Face Down) toward the ground, the contaminants such as particles and chemicals from the object 40 to be cleaned can flow downward by gravity, thereby increasing the washing efficiency.

Further, in an embodiment, the driving device 101 may include a motor 1013, and the motor 1013 may be controlled to output a rotation power to rotate the turntable 102. The turntable 102 may be connected to the driving device 101 and driven to rotate by the driving device 101. In a preferred embodiment, the turntable 102 is connectable to a drive shaft 1011 of the drive apparatus 101, the drive shaft 1011 transmitting power from the motor 1013.

As shown in fig. 4A to 5B, the adsorption device 103 is provided in the turntable 102, and may include a plurality of adsorption units 1031. In an embodiment, the adsorbing unit 1031 may be one or more of a magnetic adsorbing element, a negative pressure adsorbing element, and a vacuum adsorbing element to adsorb at least one of the wafer frame 30 or the plurality of dies 201. In a preferred embodiment, the adsorption unit 1031 may be a vacuum adsorption element, and the surface of the turntable 102 facing the ground is provided with an air suction port of the adsorption unit 1031.

Further to the description, in the present disclosure, the cleaning device 104 is disposed toward the turntable 102, the plurality of dies 201 may be fixed on the wafer frame 30, and the adsorbing device 103 adsorbs at least one of the wafer frame 30 or the plurality of dies 201 in a direction opposite to the gravity, and the cleaning device 104 may spray at least one cleaning liquid, such as one or more of deionized water, cleaning agent, and the like, toward the plurality of dies 201. After the cleaning device 104 cleans the die 201, the wafer frame 30 can be transferred to the shipment area of the wafer cleaning apparatus by the transfer device 108.

Further, the cleaning device 104 may include a nozzle cantilever 1041 and a nozzle 1042, the nozzle 1042 may be disposed on the nozzle cantilever 1041, and the nozzle 1042 is driven by the nozzle cantilever 1041 to move within the cleaning range. However, for example, in one embodiment, in order to avoid the cross contamination caused by different cleaning fluids being sprayed from the same nozzle 1042, the cleaning device 104 may also include a plurality of nozzle cantilevers 1041 and a plurality of nozzles 1042, or may also include a nozzle cantilever 1041 and a plurality of nozzles 1042, so that different cleaning fluids, such as deionized water, etching solution, and isopropyl alcohol solution, are sprayed from different nozzles 1042.

In addition, in other embodiments, the nozzle 1042 can provide cleaning liquid in one or more of fan shape, cone shape, needle shape when spraying, and the cleaning liquid sprayed by the nozzle 1042 can be high temperature and high pressure cleaning liquid to facilitate cleaning of the die and the object to be cleaned.

Further illustrated, the transfer device 108 may be a robotic arm and may include a telescoping arm 1081 and a load section 1082. The load unit 1082 is provided on the telescopic arm 1081, and the telescopic arm 1081 is controlled to move the load unit 1082. The carrier 1082 has components, such as suction cups, suction holes, etc., that attract the wafer frame 30 to attract the surface of the wafer frame 30. Thus, in one embodiment, the transfer device 108 may take the wafer frame 30 in a horizontal position for cleaning.

And in a preferred embodiment, the transfer device 108 may comprise two robots, or may be a Dual-jaw robot as shown in fig. 4C. In other words, the transfer device 108 may include two telescopic arms 1081 and two carrying portions 1082. Therefore, the different telescopic arms 1081 and the different carrying portions 1082 can prevent cross contamination of the wafer frame 30 and the die 201 before and after cleaning.

As shown in fig. 5A and 5B, the die 201 and the wafer frame 30 are adhered to the protective film 202, and the adsorbing device 103 adsorbs the protective film 202, so that the adsorbing device 103 can adsorb at least one of the wafer frame 30 or the plurality of dies 201 adhered to the protective film 202. In a preferred embodiment, the protective film 202 may be an Ultraviolet curable Tape (Ultraviolet Tape), which is a pressure sensitive Tape. The protective film 202 can be firmly bonded to the die 201 and the wafer frame 30 by the adhesive on the protective film 202.

The protective film 202 includes a substrate and an adhesive, and the substrate may be a plastic film, and may include one or more of polyolefin, polyvinyl chloride, polyethylene terephthalate, and the like. The adhesive is a pressure sensitive adhesive which is curable upon irradiation with ultraviolet light. The adhesive has high adhesive force, but after ultraviolet irradiation, the polymer chains in the adhesive form a three-dimensional net structure to harden, so that the adhesive force is rapidly reduced, and the adhesive can be conveniently and cleanly stripped, thereby facilitating the subsequent process.

In the present disclosure, the position of the adsorption unit 1031 may be set as needed. For example, as shown in fig. 5B, the adsorption unit 1031 may be disposed corresponding to the positions of the die 201 and the wafer frame 30, or may be disposed corresponding to only the position of the wafer frame 30 as shown in fig. 5A. In addition, other arrangements may be performed as required, for example, the adsorption unit 1031 is disposed only corresponding to the position of the die 201. In a preferred embodiment, when the adsorption unit 1031 is disposed corresponding to the positions of the die 201 and the wafer frame 30 as shown in fig. 5B, a preferred adsorption effect of the die 201 and the wafer frame 30 can be provided.

Further to this, to further ensure that the wafer frame 30 and the die 201 are firmly secured, the wafer cleaning apparatus of the present disclosure may further include a plurality of securing devices 105. A plurality of holding devices 105 may be disposed on the turntable 102 and cooperate with the suction devices 103 to hold the wafer frame 30 in a fixed position or release the wafer frame 30 in a released position.

In one embodiment, as shown in fig. 6A and 6B, each of the plurality of fixing devices 105 includes a pushing unit 1051, a pushing portion 1052, a rotating shaft 1053, a fixing portion 1054, and at least one release mechanism 1055. The pushing portion 1052 is connected to the pushing unit 1051, the rotating shaft 1053 is disposed at the edge of the turntable 102, and the rotating shaft 1053 is located between the pushing portion 1052 and the fixing portion 1054. In a preferred embodiment, the pushing portion 1052 and the fixing portion 1054 may form an L-shaped rod, so that when the pushing portion 1052 is pushed, the fixing portion 1054 will have a movement direction opposite to that of the pushing portion 1052 due to the rotation of the rotating shaft 1053.

In a preferred embodiment, the pushing unit 1051 may be a resilient member, such as a spring. Therefore, the pushing unit 1051 can apply a force to the pushing portion 1052 toward the first direction, for example, the pushing unit 1051 can push the pushing portion 1052 toward the edge of the turntable 102, so that the fixing portion 1054 of each of the plurality of fixing devices 105 can be located at the fixing position.

Therefore, in one embodiment, when the turntable 102 rotates, at least one of the wafer frame 30 or the die 201 can be adsorbed by the adsorption device 103, and the wafer frame 30 can be further fixed by the fixing device 105, so that the wafer frame 30 or the die 201 can be prevented from sliding or falling off when the turntable 102 rotates.

In another embodiment, when the turntable 102 is not rotating (e.g., the wafer frame 30 and the die 201 are required to be sent to the wafer cleaning apparatus for cleaning, or the die 201 in the wafer frame 30 is cleaned), the release mechanism 1055 can apply a force to the pushing portion 1052 in a second direction opposite to the first direction (e.g., toward the center of the turntable 102), and the fixing portion 1054 is at the release position for preparing for the subsequent process.

Further, in the above embodiment, when the wafer frame 30 and the die 201 are sent to the wafer cleaning apparatus for cleaning, the wafer frame 30 may be picked up and turned by a robot arm, a turning device, etc., and at least one of the wafer frame 30 and the die 201 is first adsorbed on the turntable 102 by the adsorbing device 103, and then the fixing portion 1054 of the fixing device 105 is moved to the fixing position, so that the fixing portion 1054 fixes the wafer frame 30. At this time, when the turntable 102 rotates, the wafer frame 30 or the die 201 can be prevented from sliding or falling off the turntable 102.

When the wafer frame 30 and the die 201 are cleaned by the wafer cleaning apparatus, the release mechanism 1055 may move the fixing portion 1054 of the fixing device 105 to the release position, so that the fixing portion 1054 is separated from the wafer frame 30, and the adsorption device 103 releases the adsorption force when the wafer frame 30 is ready to be taken (for example, when the transfer device 108 is ready to transfer the wafer frame 30), so as to facilitate the subsequent process.

In one embodiment, the release mechanism 1055 may rotate synchronously with the turntable 102 or may be a mechanism that is independent of the turntable 102 and does not rotate with the turntable 102. In a preferred embodiment, the release mechanism 1055 may be a ring mechanism and the pushing unit 1051 may comprise a resilient member, such as a spring, as shown in fig. 8A-8B. Therefore, as shown in fig. 8A, when the release mechanism 1055 is lifted, the pushing unit 1051 pushes the pushing portion 1052, and the fixing portion 1054 can be fixed to the wafer frame 30 at the fixing position. As shown in fig. 8B, when the release mechanism 1055 is lowered, the annular release mechanism 1055 pushes the pushing portion 1052 toward the center of the turntable 102, and the fixing portion 1054 is at the release position, so as to prepare for releasing the wafer frame 30.

In addition, in one embodiment, as shown in fig. 7, in order to avoid interference between the fixture 105 and other mechanisms (e.g., the transfer device 108 for picking up wafers), the fixture 105 may be disposed on opposite sides of the turntable 102.

In other embodiments, the pushing unit 1051 may also include one or more of a pneumatic cylinder, a hydraulic lever, a motor, and a screw. As shown in fig. 9A to 9B, when the pushing unit 1051 itself is controlled to push or pull the pushing portion 1052, the fixing portion 1054 can be located at the fixing position or the releasing position without using the releasing mechanism 1055 described above.

In one embodiment, as shown in fig. 10A-11, other forms of securing devices 105 may also be provided. The fixture 105 may include a first end 1056, a shaft 1053, and a second end 1057. The first end 1056, the shaft 1053, and the second end 1057 form a leverage mechanism. The shaft 1053 is disposed between the first end 1056 and the second end 1057, the first end 1056 is closer to the center of the turntable 102 than the second end 1057, and the weight of the first end 1056 is greater than the weight of the second end 1057. In a preferred embodiment, the fixture 105 may further comprise a housing 1058, the housing 1058 may be disposed on the turntable 102, and the first end 1056, the shaft 1053, and the second end 1057 may be disposed within the housing 1058.

Thus, when the turntable 102 rotates, the first end 1056 will move toward the edge of the turntable 102 due to centrifugal force, and the second end 1057 will be in a fixed position. When the turntable 102 stops rotating, the first end 1056 will return to the original position due to the gravity effect because the weight of the first end 1056 is greater than the weight of the second end 1057, and at this time, the second end 1057 will be in the release position in preparation for releasing the wafer frame 30. In this case, it is unnecessary to provide the other power mechanism control fixture 105 additionally.

In summary, in the present disclosure, the diced die 201 is disposed in the wafer frame 30, and the wafer frame 30 can be absorbed by the absorbing device 103 in the turntable 102, so that the cleaned surface of the die 201 faces downward, and the die 201 is rotated and cleaned by the turntable 102 facing the ground direction. In addition, since the die 201 is fixed under the turntable, the wafer frame 30 can be further fixed on the turntable 102 by the fixing device 105, preventing the wafer frame 30 from sliding. The nozzle 1042 is located at the bottom of the apparatus and applies a cleaning liquid, such as deionized water or other liquid medicine, to the die 201 above. Thus, during cleaning, contaminants can flow down out of the grooves 203 between the dies 201 by gravity. This prevents the conventional technique of cleaning the wafer by rotating the turntable upward, which could cause the liquid medicine in the groove to splash and cause cross contamination. Therefore, the present disclosure can overcome the problem of difficult cleaning at the wafer groove of the frame.

The foregoing is by way of example only and is not intended as limiting. Any equivalent modifications or variations to the present disclosure without departing from the spirit and scope thereof are intended to be included in the following claims.

Claims (10)

1. A wafer cleaning apparatus for cleaning a plurality of dies spaced apart from each other after dicing and an object to be cleaned between the plurality of dies, characterized by comprising:

a driving device;

the turntable is connected with the driving device and is driven to rotate by the driving device;

the adsorption device is arranged in the turntable; and

a cleaning device arranged towards the rotary disk,

wherein the plurality of dies are fixed on the wafer frame, the adsorption device adsorbs at least one of the wafer frame or the plurality of dies in a direction opposite to gravity, and the cleaning device sprays at least one cleaning liquid toward the plurality of dies.

2. The wafer cleaning apparatus of claim 1, further comprising a plurality of securing devices disposed on the turntable for securing the wafer frame in a secured position or releasing the wafer frame in a released position.

3. The wafer cleaning apparatus according to claim 2, wherein each of the plurality of fixing devices includes a pushing unit, a pushing portion, a rotating shaft, and a fixing portion, the pushing portion is connected to the pushing unit, the rotating shaft is disposed at an edge of the turntable, and the rotating shaft is located between the pushing portion and the fixing portion.

4. The wafer cleaning apparatus according to claim 3, wherein the pushing unit is an elastic member, and the pushing unit applies a force to the pushing portion toward the first direction, the fixing portion of each of the plurality of fixing devices being at the fixing position.

5. The wafer cleaning apparatus of claim 4, further comprising at least one release mechanism that applies a force to the pushing portion in a second direction, the first direction being opposite the second direction, the securing location being in the release position.

6. The wafer cleaning apparatus of claim 5, wherein the release mechanism is a ring mechanism.

7. The wafer cleaning apparatus according to claim 3, wherein the pushing unit includes one or more of a pneumatic cylinder, a hydraulic lever, a motor, and a screw, and the pushing unit pushes or pulls the pushing portion so that the fixing portion is at the fixing position or the release position.

8. The wafer cleaning apparatus of claim 2, wherein each of the plurality of fixtures includes a first end, a spindle, and a second end, the first end, the spindle, and the second end forming a lever mechanism, the spindle being located between the first end and the second end, the first end being closer to a center of the turntable than the second end, and a weight of the first end being greater than a weight of the second end.

9. The wafer cleaning apparatus of claim 1, wherein the cleaning device comprises a nozzle cantilever and at least one nozzle, the nozzle is disposed on the nozzle cantilever, and the nozzle is moved within a cleaning range by the nozzle cantilever.

10. The wafer cleaning apparatus of claim 1, wherein the suction device further comprises a plurality of suction units disposed corresponding to the positions of the plurality of dies and the wafer frame.