TWM646905U - Vacuum baking structure with buffer processing - Google Patents

Abstract

This application is a vacuum baking mechanism with buffer processing, which includes: a substrate transfer station, a first buffer cavity and a vacuum baking cavity. The substrate transfer station includes a transfer transmission module for picking up and placing the substrates; the first buffer cavity includes a first buffer gate, a plurality of first transmission modules and a first baking inlet and outlet for each Respectively receive or output each substrate into and out of the first buffer gate or the first baking inlet and outlet; the vacuum baking cavity includes a first baking gate connected to the first baking inlet and outlet, and a baking module to The substrates are vacuum baked. This improves the baking efficiency of the vacuum baking cavity and the process yield of the substrate.

Description

Buffered vacuum baking mechanism

This application relates to a vacuum baking mechanism, in particular to a vacuum baking mechanism with buffering.

In today's semiconductor process equipment, the semiconductor equipment will transport the substrate between different cavities to perform different processing on the substrate such as etching, coating, cleaning, cooling, etc. However, before the substrate waits to enter the cavity, the substrate may be in contact with the air in the atmospheric environment, causing moisture in the air to be adsorbed on the surface of the substrate, thereby affecting the yield of the substrate in subsequent processes.

In order to solve the problem of moisture or residue forming on the substrate that would affect the subsequent process yield, a vacuum oven is generally used to vacuum bake the substrate before transporting it to the subsequent process machine. The method of vacuum baking is to place multiple substrates into the vacuum oven, close the gate and remove the air from the vacuum oven, and then perform heating and baking to remove moisture or residue on the substrates. After the baking is completed, the gate is opened and the substrate is taken out and transported to the subsequent processing machine for processing operations. However, there are several problems with this approach:

1. The pumping time required to reach the vacuum state of the vacuum oven is long, and the vacuum must be broken when taking out the substrates. The cycle will be repeated for each batch of substrates, which is very time-consuming and will significantly reduce the vacuum. Oven usage efficiency.

2. Each batch of substrates will require repeated heating and cooling procedures. The heating and cooling procedures will also take a considerable amount of time and affect the efficiency of the vacuum oven.

3. Since the subsequent processes will require processing of the substrates one by one, the plurality of substrates after vacuum baking may have water vapor re-attached to the substrates while waiting for the subsequent processes, which will impair the effect of vacuum baking.

From the above description, it can be seen that the conventional vacuum oven method is not ideal in terms of efficiency and baking effect. Therefore, how to solve the aforementioned problems has become a major issue for the industry.

The main purpose of this application is to improve the low baking efficiency of past vacuum ovens and the inability to solve the problem of moisture re-adhesion.

The aforementioned purposes do not prevent the existence of other purposes. If a person with ordinary knowledge in the technical field can derive the purpose from the description, patent scope, drawings, etc., it is also included in the purpose of this application. Therefore, the purpose of this application is not limited to the foregoing enumerated purposes.

In order to achieve the above purpose, the present application provides a vacuum baking mechanism with buffer processing, which is connected to a process mechanism to bake multiple substrates. The vacuum baking mechanism includes: a substrate transfer station, a first Buffer cavity and a vacuum baking cavity. The substrate transfer station is adjacent to the process mechanism. The substrate transfer station includes a transfer transmission module, which is used to pick up and place the substrates; the first buffer cavity is adjacent to the substrate transfer station, and the first buffer cavity The cavity includes a first buffer gate, a plurality of first transmission modules stacked at intervals in the vertical direction, and a first baking inlet and outlet. The first buffer gate is adjacent to the substrate transfer station, and the substrates pass through the first A buffer gate enters and exits the first buffer cavity, and the first transmission modules are disposed between the first buffer gate and the first baking inlet and outlet to respectively receive or output each substrate into and out of the first buffer gate or There is a first baking inlet and outlet, and the first vacuum module performs vacuuming when the first buffer gate is closed; the vacuum baking cavity is connected to the first buffer cavity, and the vacuum baking cavity includes a first baking inlet and a first baking inlet. The first baking gate and a baking module are connected to the outlet. The first baking gate controls the communication between the vacuum baking cavity and the first buffer cavity. The baking module performs vacuum baking on the substrates. .

In another embodiment of the present application, the present application provides a vacuum baking method with buffer processing for baking multiple substrates. The vacuum baking method includes the following steps: step S1, step S2, and step S3. In step S1: the first buffer gate is opened, and the input substrates are put into the first buffer cavity using the transfer transmission module to place the substrates on the first transmission modules respectively. , when the first buffer gate is closed, the first vacuum module evacuates the first buffer cavity; in step S2: the first baking gate is opened, and the first transfer modules are used to place the substrates into the baking module, and the first baking gate is closed to vacuum bake the substrates; in step S3: the first baking gate is opened again, and the first transmission modules are used to vacuum bake the base materials. The substrates that have been baked are taken out of the baking cavity and placed in the first buffer cavity.

Based on the above technical characteristics, this application contains the following features:

1. By using the first buffer cavity as a buffer for the vacuum baking cavity, it is avoided that the vacuum baking cavity needs to be in direct contact with the atmospheric environment, so that the vacuum baking cavity can be heated again before baking the next batch of substrates. The problem of needing to re-vacuum can be greatly reduced, and the preparation time required for vacuum baking in the vacuum baking cavity can be greatly reduced and the baking efficiency can be improved.

2. The first buffer cavity can be used as a waiting area for cooling after the substrates are baked, to prevent the vacuum baking cavity from being significantly cooled and requiring the heating operation to be restarted when the next batch of substrates is baked. This reduces the preparation time required for heating and cooling of the vacuum baking cavity.

3. Through the arrangement of the first buffer cavity, it is avoided that after the substrates are taken out from the vacuum baking cavity, the substrates need to be directly exposed to the atmospheric environment to wait for subsequent processes. In this way, the waiting time for the substrates to be exposed to the atmospheric environment can be reduced, thereby reducing the re-adsorption of water vapor on the substrates, thereby improving the yield and quality of the process.

In order to facilitate the explanation of the central idea expressed in the above novel content column of the present application, specific embodiments are hereby expressed. Various objects in the embodiments are drawn according to proportions, sizes, deformations or displacements suitable for illustration, rather than according to the proportions of actual components, and are explained first.

Exemplary embodiments of the present application are described in detail below with reference to the accompanying drawings. It is not intended to limit the technical principles of the present application to the specific disclosed embodiments, but the scope of the present application is limited only by the patent scope of the application, covering substitutions, modifications and equivalent.

Please refer to Figures 1 to 2. In this embodiment, the application provides a vacuum baking mechanism 100A with buffer processing, which is connected to a process mechanism 1 to bake a plurality of substrates 2. The vacuum baking mechanism The baking mechanism 100A includes: a substrate transfer station 10 , a first buffer cavity 20 and a vacuum baking cavity 30 . The aforementioned process mechanism 1 is used for coating, etching, and cleaning, and is composed of a plurality of connected mechanisms, cavities, or stations. In this embodiment, the process mechanism 1 is a continuous process equipment, which may include a loading station 3, a plurality of process chambers 4 combined in series, and a loading station 6. The substrates 2 can be processed by the aforementioned stations or The cavity completes the processes of coating, etching, and cleaning, but this application is not necessarily limited to connecting to continuous process equipment. In the embodiment of the present application, the substrate 2 can be a wafer, a chip, a circuit carrier board (eg, PCB), or other objects.

In the embodiment of the vacuum baking mechanism 100A, the substrate transfer station 10 is adjacent to the process mechanism 1. The so-called adjacent here means that compared to other modules of this application, the substrate transfer station 10 is relatively close. In fact, the pick-and-place operation with the process mechanism 1 does not refer to a relatively close relationship in terms of physical location. The substrate transfer station 10 includes a transfer and transmission module 11 and a vertical lifting module 12 . The transfer and transmission module 11 is connected to the vertical lifting module 12. The transfer and transmission module 11 is located between the process mechanism 1 and the first buffer cavity 20 to take out or put the substrates 2. The vertical lifting module 12 controls the transfer. The transfer module 11 moves vertically in the substrate transfer station 10 to distribute the substrates 2 into the first buffer cavity 20 .

In one embodiment of the present application, the transfer and transport module 11 includes a plurality of transport rollers that transport the substrates 2 on both sides to transport the substrates 2 . In an embodiment of the present application, the power source of the vertical lifting module 12 may be a servo motor, a stepper motor, a pneumatic cylinder, a hydraulic cylinder, etc., but the present application is not limited thereto. In another embodiment of the present application, the transfer and transmission module 11 can also be a robotic arm (such as a six-axis robotic arm), which takes out or puts the substrates 2 between the process mechanism 1 and the first buffer cavity 20 .

The first buffer cavity 20 is adjacent to the substrate transfer station 10 , that is, the substrate transfer station 10 is located between the process mechanism 1 and the first buffer cavity 20 . The first buffer cavity 20 can receive data from the substrate transfer station 10 of these substrates 2. The first buffer cavity 20 includes a first buffer gate 21, a plurality of vertically spaced and stacked first transmission modules 22, a first baking inlet and outlet 23, and a first vacuum module 24.

Continuing to explain, the first buffer gate 21 is adjacent to the substrate transfer station 10. The first buffer gate 21 controls the communication between the substrate transfer station 10 and the first buffer cavity 20. The substrates 2 can be Access to the first buffer cavity 20 is via the first buffer gate 21 . In the embodiment of the present application, the first buffer gate 21 is opened and closed by pivoting to allow the substrates 2 to enter and exit the first buffer cavity 20 . In addition, the first buffer gate 21 can also be opened by sliding to both sides and displacing up and down, so that the substrates 2 can pass through the first buffer gate 21. Therefore, this case does not only open and close the first buffer gate 21 by pivoting. A buffer gate is limited to 21.

The first baking inlet and outlet 23 is adjacent to the vacuum baking cavity 30. The first transmission modules 22 are disposed between the first buffer gate 21 and the first baking inlet and outlet 23 for respectively receiving or Each substrate 2 is output into and out of the first buffer gate 21 or the first baking inlet and outlet 23 . That is to say, the substrates 2 can move between the substrate transfer station 10 , the first buffer cavity 20 and the vacuum baking cavity 30 . In one embodiment of the present application, the first transport modules 22 include a plurality of transport rollers to transport the substrates 2 , but the present application is not limited thereto. When the substrates 2 are in the first buffer cavity 20, the first buffer gate 21 is closed and the first vacuum module 24 is used to evacuate, so that the first buffer cavity 20 is in a vacuum state to prevent the substrates from being Material 2 is exposed to air. In a preferred embodiment of the present application, the pressure value in the first buffer chamber 20 may be between 1x10 ^-1 Torr and 1x10 ^-3 Torr.

In an embodiment of the present application, there may be a plurality of first buffer gates 21 , and the first buffer gates 21 are respectively set corresponding to the positions of the first transmission modules 22 to input and output the substrates 2 respectively. The advantage of this is that the first buffer cavity 20 can independently open and close the first buffer gates 21 to access one of the substrates 2 , and when one of the first buffer gates 21 is opened, it will not allow Excessive air enters the first buffer cavity 20, making it easier for the first buffer cavity 20 to maintain an isolated state, thereby reducing the contact between the substrates 2 and external air.

The vacuum baking cavity 30 is connected to the first buffer cavity 20 to receive the substrates 2 from the first buffer cavity 20 or to output the substrates 2 to the first buffer cavity 20 . The vacuum baking cavity 30 includes a first baking gate 31 connected to the first baking inlet and outlet 23 , a baking module 32 and a second vacuum module 33 . The first baking gate 31 controls the communication between the vacuum baking cavity 30 and the first buffer cavity 20 for the first transmission modules 22 to transport the substrates 2 to the vacuum baking cavity 30 for drying. The baking module 32 can bake the substrates 2. In one embodiment of the present application, there are a plurality of baking modules 32, and they are respectively arranged in stacked positions corresponding to the first transmission modules 22. A single substrate 2 can be baked independently. Furthermore, the substrates 2 can be baked using thermal radiation.

In one embodiment of the present application, the vacuum baking cavity 30 further includes a second vacuum module 33. The second vacuum module 33 is used to evacuate the inside of the vacuum baking cavity 30 to achieve vacuum baking. The cavity 30 is in a vacuum state and vacuum bakes the substrates 2 . In a preferred embodiment of the present application, the pressure value in the vacuum baking cavity 30 can be between 1x10 ^-2 Torr and 1x10 ^-8 Torr, where the vacuum degree of the vacuum baking cavity 30 must be greater than The first buffer cavity 20.

To illustrate an actual working situation, the substrate transfer station 10 sequentially inputs the substrates 2 into the first buffer chamber 20, then closes the first buffer gate 21, and the first vacuum module 24 performs the first buffering process. Low-level vacuuming of the chamber 20. Then, the first baking gate 31 is opened, and the first transfer module 22 inputs all the substrates 2 into the vacuum baking cavity 30 at one time, and then the first baking gate 31 is closed, and the second vacuuming step is performed. The module 33 performs vacuuming and the baking module 32 performs baking, thereby achieving the purpose of vacuum baking the substrates 2 . It should be noted that since the vacuum baking cavity 30 itself is already in a vacuum state, opening the first baking gate 31 will cause the vacuum baking cavity 30 to communicate with the first buffer cavity 20, thereby reducing the vacuum baking time. The vacuum degree of the cavity 30. However, after all the substrates 2 are input into the vacuum baking cavity 30 and the first baking gate 31 is closed, it is only necessary to perform an intensive vacuuming operation through the second vacuuming module 33 to complete the vacuum baking process. The vacuum degree of the baking cavity 30 is increased to a higher vacuum degree state. After all the substrates 2 are vacuum baked, the first baking gate 31 can be opened, and the first transmission module 22 can receive all the substrates 2 in the vacuum baking cavity 30 at once, that is, the first baking gate 31 can be opened. A buffer cavity 20 completes the reception of the substrate 2 . Finally, the substrates 2 are placed one by one from the first buffer chamber 20 to the substrate transfer station 10 for the substrate transfer station 10 to perform subsequent operations of outputting the substrates 2 .

In an embodiment of the present application, the first buffer cavity 20 may further include a first cooling module 25. The first cooling module 25 is disposed on one side of the first transmission module 22 adjacent to the base material 2, so as to The substrates 2 that have been baked are cooled, thereby shortening the cooling buffer time of the substrates 2 . In the embodiment of the present application, the first cooling module 25 can adopt contact cooling or non-contact cooling, such as air cooling, air cooling, water cooling, cooling plate and other cooling methods.

In an embodiment of the present application, the first buffer cavity 20 may include a first nitrogen module 26, and the first nitrogen module 26 may be disposed between the first buffer gate 21 and the first baking inlet and outlet 23. These substrates 2 are air-jetted. For example, when the substrates 2 are to be output from the first buffer gate 21 , the first nitrogen module 26 can be used to blow the substrates 2 with low-temperature nitrogen to form a protective film on the surface of the substrates 2 to delay or reduce the time or probability for the substrate 2 to be reattached by moisture in the atmosphere after the substrate 2 leaves the first buffer cavity 20 . In addition, the first nitrogen module 26 can also cool the substrates 2 that have been baked, so as to shorten the cooling time of the substrates 2 .

Please refer to FIGS. 3 to 5 . In the embodiment of the vacuum baking mechanism 100B, the difference from the embodiment of the vacuum baking mechanism 100A is that the vacuum baking mechanism 100B further includes a second buffer cavity 40 . The vacuum baking mechanism 100B can be connected to a conveying mechanism 5. In this embodiment, the conveying mechanism 5 is adjacent to the loading stations 3 of the two process mechanisms 1 and is located between the two loading stations 3. The conveying mechanism 5 The substrate 2 is transported between the two loading stations 3 and the vacuum baking mechanism 100B. In this embodiment, the substrate transfer station 10, the first buffer cavity 20, the second buffer cavity 40 and the vacuum baking cavity 30 are square, and the first buffer cavity 20 and the second buffer cavity 40 are respectively provided with on two adjacent sides of the substrate transfer station 10, and the first buffer cavity 20 and the second buffer cavity 40 are also respectively connected to two adjacent sides of the vacuum baking cavity 30, so that the substrate transfer station 10. The first buffer cavity 20, the second buffer cavity 40 and the vacuum baking cavity 30 are combined in a field shape. Thereby, when the first buffer cavity 20 or the second buffer cavity 40 picks up and places the substrates 2, the other buffer cavity can cool, buffer or bake the substrates 2. Or one buffer cavity is waiting to take out the substrates 2 being baked, and another buffer cavity can input the substrates 2 from the substrate transfer station 10 . Two buffer cavities are used to input and output the substrates 2 at different time points to reduce the idle time of the vacuum baking cavity 30 and improve the overall operating efficiency.

In one embodiment of the present application, please refer to Figures 4 and 5. Figures 4 and 5 are respectively schematic cross-sectional views of the right and rear sides of the second buffer cavity 40. The second buffer cavity 40 is adjacent to the base material. Transfer station 10 (as shown in Figure 4), and the second buffer cavity 40 is connected to the vacuum baking cavity 30 (as shown in Figure 5), and the second buffer cavity 40 can receive the material from the substrate transfer station 10. Some substrates 2. The second buffer cavity 40 includes a second buffer gate 41, a plurality of vertically spaced and stacked second transmission modules 42, a second baking inlet and outlet 43, and a third vacuum module 44.

The second buffer gate 41 is adjacent to the substrate transfer station 10. The second buffer gate 41 controls the communication between the substrate transfer station 10 and the second buffer cavity 40. The substrates 2 pass through the second buffer The gate 41 enters and exits the second buffer cavity 40 . The second transmission modules 42 are arranged corresponding to the entrance and exit positions of the substrates 2 , and are used to respectively receive or output each substrate 2 into and out of the second buffer gate 41 or the second baking inlet and outlet 43 . In one embodiment of the present application, the second transport modules 42 include a plurality of transport rollers to transport the substrates 2 , but the present application is not limited thereto. The second buffer gate 41, the second transmission module 42, the second baking inlet and outlet 43, the third vacuum module 44 and the first buffer gate 21, the first transmission module 22, the first baking inlet and outlet 23 , the functions of the first vacuum module 24 are the same.

In one embodiment of the present application, the vacuum baking cavity 30 further includes a second baking gate 34 connected to the second baking inlet and outlet 43. The second baking gate 34 controls the vacuum baking cavity 30 and the second baking gate 34. The communication between the buffer cavities 40 allows the second transmission modules 42 to transport the substrates 2 to the vacuum baking cavity 30 so that the baking modules 32 can vacuum bake the substrates 2 .

In one embodiment of the present application, the second buffer cavity 40 further includes a second cooling module 45. The second cooling module 45 is disposed on one side of the second transmission module 42 adjacent to the base material 2 to complete the process. The baked substrates 2 are cooled. In the embodiment of the present application, the second cooling module 45 can adopt contact cooling or non-contact cooling, such as air cooling, air cooling, water cooling, cooling plate and other cooling methods.

In one embodiment of the present application, there are a plurality of second buffer gates 41 , and the second buffer gates 41 are set corresponding to the positions of the second transmission modules 42 to input and output the substrates 2 respectively or entirely. The implementation and effect of the second buffer gate 41 are the same as those of the first buffer gate 21 and will not be described again here.

In one embodiment of the present application, the second buffer cavity 40 includes a second nitrogen module 46. The second nitrogen module 46 is disposed between the second buffer gate 41 and the second baking inlet and outlet 43 for These base materials 2 are air-jetted. The implementation and effects of the second nitrogen module 46 are the same as those of the first nitrogen module 26 and will not be described again.

Please refer to FIG. 6 . In another embodiment of the present application, the present application provides a vacuum baking method 200 with buffer processing for baking a plurality of substrates 2 . The vacuum baking method 200 includes the following steps:

In step S1: the first buffer gate 21 is opened, and the input substrates 2 are put into the first buffer cavity 20 using the transfer and transmission module 11, so as to place the substrates 2 into the first buffer cavity 20 respectively. On the first transmission module 22, when the first buffer gate 21 is closed, the first vacuum module 24 evacuates the first buffer cavity 20. In step S2: the first baking gate 31 is opened, the first transmission modules 22 are used to put the substrates 2 into the baking module 32, and the first baking gate 31 is closed to process the substrates 2. Substrate 2 is vacuum baked. In step S3: the first baking gate 31 is opened again, and the substrates 2 are taken out from the vacuum baking cavity 30 through the first transmission modules 22 and placed in the first buffer cavity 20.

In an embodiment of the present application, step S4 is further included after step S3. In step S4, the first buffer gate 21 is opened to output one or all of the substrates 2, and the drying is completed through a first nitrogen module 26 disposed in the first buffer cavity 20. The baked base materials 2 are sprayed. After step S4, the first buffer cavity 20 continues to perform the operations of steps S1, S2, S3, and S4 in a cycle. The advantage of this embodiment is that the first nitrogen module 26 can form a protective film on the surface of the substrates 2 to delay or reduce the time or probability of the substrates 2 being re-adhered by moisture in the atmosphere.

Please refer to FIG. 7 , which is a schematic diagram of the relationship between the vacuum baking method 200 and time. In another embodiment of the present application, step P1 is further included after step S1. In step P1, the second buffer gate 41 is opened, and the transfer and transmission module 11 is used to continue to input another batch of the substrates 2 into the second buffer cavity 40, so as to put the substrates 2 into the second buffer cavity 40 respectively. On the second transmission modules 42, when the second buffer gate 41 is closed, the third vacuum module 44 evacuates the second buffer cavity 40. This application does not limit the sequence relationship between steps P1, step S2, and step S3 as shown in Figure 7, that is, step P1 can be before or after step S2 and step S3; step P1 can also be Between step S2 and step S3, etc. To give an actual working situation, after the substrate 2 is put into the first buffer chamber 20 and the vacuum operation is performed in the first buffer chamber 20, another batch of substrates 2 can be transferred from the substrate transfer station 10 The second buffer cavity 40 is placed to improve the overall operating efficiency.

In an embodiment of the present application, step P2 is further included after step S3. In step P2, the second baking gate 34 is opened, the substrates 2 are put into the baking module 32 through the second transmission modules 42, and the second baking gate 34 is closed to process the substrates 2. Some substrates 2 are vacuum baked.

In an embodiment of the present application, step P3 is further included after step P2. In step P3, the first buffer gate 21 is opened, and the transfer and transmission module 11 is used to continue to input another batch of the substrates 2 onto the first transmission modules 22, and the second baking gate 34 is opened again. , the substrates 2 that have been baked are taken out from the vacuum baking cavity 30 through the second transmission modules 42 and placed in the second buffer cavity 40 . The present application is not limited to the sequence relationship between step P2, step P3 and step S4 as shown in Figure 7, that is, step S4 can be before or after step P2 and step P3; step S4 is also It can be between step P2 and step P3, etc. To give an actual working situation, if the baked substrates 2 are placed in the first buffer cavity 20, and the first buffer cavity 20 places the substrates 2 one by one in the substrate transfer station 10, then The substrates 2 in the second buffer cavity 40 can be placed into the baking module 32 in an idle state. Through the first buffer cavity 20 and the second buffer cavity 40, different batches of substrates 2 are processed at different time points, so as to improve the overall operation efficiency.

In an embodiment of the present application, step P4 is further included after step P3. In step P4, the second buffer gate 41 is opened to output one or all of the substrates 2, and a second nitrogen module 46 is used to spray the baked substrates 2. This application does not limit the sequence relationship between step S1, step P2, step P3, and step P4 as shown in Figure 7, and may be adjusted according to actual working conditions. It should also be noted that, as shown in Figure 7, the time relationship between steps S1 to S4 and steps P1 to P4 is only represented by the time axis. It is not necessary to execute step P1 before step S2 can be executed, or The situation in which step S4 can be performed only after step P2 is performed.

To sum up, this application contains the following technical features:

1. The first buffer cavity 20 is used as a buffer for the vacuum baking cavity 30 to avoid direct contact between the vacuum baking cavity 30 and the atmospheric environment. Before baking the next batch of substrates 2 in the vacuum baking cavity 30, the time for re-evacuating the vacuum baking cavity 30 can be reduced to improve baking efficiency.

2. The first buffer cavity 20 can be used as a cooling waiting area for the substrates 2 after baking to prevent the vacuum baking cavity 30 from being significantly cooled. When the next batch of substrates 2 needs to be baked, vacuum baking The cavity 30 is heated again to reduce the preparation time required for the heating and cooling operation of the vacuum baking cavity 30 .

3. By arranging a plurality of first buffer gates 21, the first buffer cavity 20 can open and close the first buffer gates 21 respectively, so that too much air will not enter the first buffer when the first buffer gate 21 is opened. The cavity 20 makes it easier for the first buffer cavity 20 to maintain an isolated state. Thereby, the chance of the substrates 2 being exposed to air is reduced, and the process yield of the substrates 2 is further improved.

4. Through the arrangement of the second buffer cavity 40, with the cooperation of the first buffer cavity 20 and the second buffer cavity 40, the first buffer cavity 20 and the second buffer cavity 40 can input at different time points. The substrates 2 are vacuum baked to improve overall operating efficiency.

The aforementioned effects do not prevent the existence of other effects. If a person with ordinary knowledge in the technical field can deduce the effect from the description, patent scope or drawings, etc., it is also included in the effect of this application. Therefore, the effects of this application are not limited to the effects listed above.

The above embodiments are only used to illustrate the present application and are not intended to limit the scope of the present application. All modifications or changes that do not violate the spirit of this application fall within the scope of this application.

100A, 100B: Vacuum baking mechanism 1: Processing mechanism 2:Substrate 3:Loading station 4: Process chamber 5: Conveying mechanism 6: Load out of station 10:Substrate transfer station 11:Transportation module 12:Vertical lifting module 20:First buffer cavity 21:First buffer gate 22:First transmission module 23:First Baking Import and Export 24:The first vacuum module 25:First cooling module 26:The first nitrogen module 30: Vacuum baking cavity 31: First baking gate 32: Baking module 33: Second vacuum module 34: Second baking gate 40: Second buffer cavity 41:Second buffer gate 42: Second transmission module 43: Second baking import and export 44: The third vacuum module 45: Second cooling module 46:Second Nitrogen Module 200: Vacuum baking method S1: Steps S2: Step S3: Steps S4: Steps P1: Steps P2: Step P3: Steps P4: Steps

Figure 1 is a schematic top view of the first embodiment of the present application. Figure 2 is a schematic cross-sectional view on the right side of the first embodiment of the present application. Figure 3 is a schematic top view of the second embodiment of the present application. Figure 4 is a schematic cross-sectional view of the right side of the substrate transfer station and the second buffer cavity according to the second embodiment of the present application. Figure 5 is a schematic cross-sectional view of the rear side of the second buffer cavity and the vacuum baking cavity according to the second embodiment of the present application. Figure 6 is a schematic diagram of the steps of a vacuum baking method according to an embodiment of the present application. Figure 7 is a schematic diagram of the steps of a vacuum baking method according to another embodiment of the present application.

100A: Vacuum baking mechanism

2:Substrate

10:Substrate transfer station

11:Transportation module

12:Vertical lifting module

20:First buffer cavity

21:First buffer gate

22:First transmission module

23:First Baking Import and Export

24:The first vacuum module

25:First cooling module

26:The first nitrogen module

30: Vacuum baking cavity

31: First baking gate

32: Baking module

33: Second vacuum module

Claims (11)

A vacuum baking mechanism with buffer processing, which is connected to a process mechanism to bake multiple substrates. The vacuum baking mechanism includes: A substrate transfer station adjacent to the process mechanism, which includes a transfer and transmission module for picking up and placing the substrates; A first buffer cavity adjacent to the substrate transfer station, which includes a first buffer gate, a plurality of first transmission modules stacked at intervals in the vertical direction, a first baking inlet and outlet, and a first vacuum Module, the first buffer gate is adjacent to the substrate transfer station, the substrates enter and exit the first buffer cavity through the first buffer gate, and the first transmission modules are arranged at the first Between the buffer gate and the first baking inlet and outlet, it is used to respectively receive or output the substrates into and out of the first buffer gate or the first baking inlet and outlet, and the first vacuum module is in the Perform vacuuming when a buffer gate is closed; and A vacuum baking cavity connected to the first buffer cavity includes a first baking gate connected to the first baking inlet and outlet and a baking module. The first baking gate controls the vacuum baking The baking cavity is connected to the first buffer cavity, and the baking module performs vacuum baking on the substrates. The vacuum baking mechanism with buffer processing as described in claim 1, wherein the base material transfer station further includes a vertical lifting module connected to the transfer and transmission module, and the vertical lifting module controls the transfer and transmission module. The group moves in the vertical direction at the substrate transfer station. The vacuum baking mechanism with buffer processing as described in claim 1, wherein there are a plurality of first buffer gates, and the first buffer gates are respectively set corresponding to the positions of the first transmission modules. The vacuum baking mechanism with buffer processing as described in claim 1, wherein the first buffer cavity further includes a first cooling module for cooling the substrates. The vacuum baking mechanism with buffer processing according to claim 1, wherein the first buffer cavity includes a first nitrogen module, and the first nitrogen module is disposed between the first buffer gate and the first drying Between the baking inlet and outlet, these substrates are sprayed. The vacuum baking mechanism with buffer processing as described in claim 1, further includes a second buffer cavity adjacent to the substrate transfer station and connected to the vacuum baking cavity, the second buffer cavity includes There is a second buffer gate, a plurality of second transmission modules stacked at intervals in the vertical direction, a second baking inlet and outlet and a third vacuum module, the second buffer gate is adjacent to the substrate transfer station, The substrates enter and exit the second buffer cavity through the second buffer gate, and the second transmission modules are configured corresponding to the entry and exit positions of the substrates to receive or output the substrates respectively. Two buffer gates or the second baking inlet and outlet, and the third vacuum module performs vacuuming when the second buffer gate is closed. The vacuum baking mechanism with buffer processing as described in claim 6, wherein the substrate transfer station, the first buffer cavity, the second buffer cavity and the vacuum baking cavity are square, and the first The buffer cavity and the second buffer cavity are respectively provided on two adjacent sides of the substrate transfer station, and the first buffer cavity and the second buffer cavity are also respectively connected to the vacuum baking cavity. The two adjacent side surfaces are arranged so that the base material transfer station, the first buffer cavity, the second buffer cavity and the vacuum baking cavity are combined in a field shape. The vacuum baking mechanism with buffer processing as described in claim 6, wherein the vacuum baking cavity further includes a second baking gate connected to the second baking inlet and outlet, and the second baking gate controls There is communication between the vacuum baking cavity and the second buffer cavity. The vacuum baking mechanism with buffer processing as described in claim 6, wherein the second buffer cavity further includes a second cooling module for cooling the substrates. The vacuum baking mechanism with buffer processing as described in claim 6, wherein there are a plurality of second buffer gates, and the second buffer gates are arranged corresponding to the positions of the second transmission modules. The vacuum baking mechanism with buffer processing as described in claim 6, wherein the second buffer cavity includes a second nitrogen module, and the second nitrogen module is disposed between the second buffer gate and the second baking Between the baking inlet and outlet, these substrates are sprayed.