TWM645605U - Wide format transfer-printing molding equipment - Google Patents

Abstract

The invention discloses a wide-width transfer molding equipment, which includes a roller fixing device, a soft baking device arranged at intervals on the roller fixing device, a photolithography device arranged at intervals on the soft baking device, and a photolithography device arranged at intervals on the soft baking device. A deboarding device of a photolithography device. The roller fixing device is used to fix a metal roller covered with a base plate, and the length of the metal roller is between 1.6 meters and 1.8 meters. The lithography apparatus includes a plurality of lithography light sources, and the lithography apparatus can be used to irradiate a lithography light to the substrate. The plate removal device can be used to separate the substrate and metal rollers.

Description

Wide format transfer molding equipment

The invention relates to a molding device, in particular to a wide-width transfer molding device.

Existing flat-panel molding equipment can usually only process smaller-sized substrates to obtain templates. If large-sized templates need to be produced, they need to be obtained by combining multiple templates. However, the above method is not only time-consuming and labor-intensive, but also, although the process parameters of each batch of templates are the same, there may still be slight differences, resulting in the failure to achieve the expected results when multiple templates are combined.

Therefore, how to overcome the above-mentioned defects through structural design improvements has become one of the important issues to be solved in this project.

The embodiment of this invention provides a wide-width transfer molding device to address the shortcomings of the existing technology, which can effectively improve the possible defects of the existing transfer device.

This creative embodiment discloses a wide-width transfer molding equipment, which includes: a roller fixing device used to fix a metal roller covered with a substrate; wherein the length of the metal roller is between 1.6 meters and 1.8 meters. time, and the metal roller is a chromium metal roller; a soft baking device is arranged at intervals on the roller fixing device; a photolithography device is arranged on the soft baking device at intervals, and the photolithography device includes A plurality of photolithography light sources, and the photolithography device can be used to irradiate a photolithography light to the substrate; and a plate removal device is spaced apart from the photolithography device, and the plate removal device can be used to Separate the substrate and the metal roller.

One of the beneficial effects of this invention is that the wide-width transfer molding equipment provided by this invention can be used to fix the metal roller covered with the substrate through "the roller fixing device; wherein, The technical solution of "the length of the metal roller is between 1.6 meters and 1.8 meters" enables the wide-width transfer molding equipment to be used to produce large-sized templates.

In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and diagrams about this creation. However, the diagrams provided are only for reference and illustration and are not used to limit this creation.

The following is a specific embodiment to illustrate the implementation of the "wide-width transfer molding equipment" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this description can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. In addition, the accompanying drawings of this creation are only simple illustrations and are not depictions based on actual size, as stated in advance. In addition, if it is pointed out below that please refer to a specific diagram or as shown in a specific diagram, it is only used to emphasize the subsequent description. Most of the relevant content mentioned appears in the specific diagram, but does not Reference in this subsequent description is limited to the specific drawings described. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

Please refer to Figures 1 to 11, which are embodiments of the present invention. It should be noted that the drawings corresponding to this embodiment and the related quantities and shapes mentioned in this embodiment are only used for specific explanation. The implementation method of this creation is to facilitate understanding of the content of this creation, but is not used to limit the scope of protection of this creation.

Referring to FIGS. 1 to 11 , embodiments of the present invention provide a wide-width transfer molding device 100 for forming a chromium imprint layer 700 at intervals on a substrate 300 , and the substrate 300 is coated with a metal Roller 200. In this embodiment, the substrate 300 is mainly made of polyethylene terephthalate (PET), and the length of the substrate 300 is between 1.6 meters and 1.8 meters, and the substrate 300 The width is between 1 meter and 1.2 meters, but this creation is not limited to this. For example, in other embodiments of the present invention, the substrate 300 can also be made of any resin with transparent characteristics.

It should be noted that in this embodiment, the length of the metal roller 200 is between 1.6 meters and 1.8 meters, and the metal roller 200 is preferably a chromium metal roller made of chromium.

The wide-width transfer molding equipment 100 includes a roller fixing device 01, a photoresist spraying device 02, a soft baking device 03, a photolithography device 04, a developing device 05, a silver spraying device 06, and an infiltration device 07. A panel removal device 08, a moving device 09, a lifting device 10, a washing device 11, and a dust-free chamber 12, but the invention is not limited to this. For example, in other embodiments not shown in the present invention, the wide-width transfer molding equipment 100 may not include the flushing device 11 and the dust-free chamber 12 .

In the following, for convenience of explanation and understanding, each component of the wide-width transfer molding apparatus 100 will be described one by one, and the mutual position and operating relationship between the above components will be explained in a timely manner. As shown in Figure 3, the roller fixing device 01 is used to fix the metal roller 200 covered with the base plate 300, and the roller fixing device 01 includes a rotating mechanism 011 and a rotating mechanism 011 installed on the rotating mechanism 011. A clamping mechanism 012. The rotating mechanism 011 can be installed on the metal roller 200 , and the clamping mechanism 012 can clamp the metal roller 200 . Furthermore, when the rotating mechanism 011 operates, the rotating mechanism 011 will rotate the clamping mechanism 012 so that the metal roller 200 is rotated by the clamping mechanism 012 .

Furthermore, the clamping mechanism 012 includes a circular elastic collet (not shown), and the clamping mechanism 012 is driven by hydraulic pressure, so that the circular elastic collet can clamp all The metal roller 200 is described, but the invention is not limited thereto. For example, the circular elastic collet can also be a lathe chuck or other clamps, and the clamping mechanism 012 can also be driven by air pressure or manually, so that the circular elastic collet can clamp all objects. The metal roller 200 is described.

It should be noted that the rotating mechanism 011 further includes a speed controller (not shown), which can be used to make the metal roller 200 rotate at a speed between 2900 rpm and 4500 rpm. The spin-drying speed rotates, but this creation is not limited to this. For example, in other embodiments not shown in the present invention, the speed controller can also be used to make the metal roller 200 operate at a wetting speed ranging from 1 revolution per minute (RPM) to 25 revolutions per minute. Turn.

As shown in Figure 4, the photoresist spraying device 02 is disposed at intervals on the roller fixing device 01, and the photoresist spraying device 02 can be used to spray a photoresist liquid (not labeled) on the substrate 300. A photoresist layer 400 is formed accordingly. In this embodiment, the photoresist liquid is formed of a positive photoresist, and the photoresist liquid is mainly made of phenol-formaldehyde resin, but the invention is not limited thereto. For example, the photoresist liquid can also be made of positive photoresist materials such as epoxy resin.

Specifically, the photoresist spraying device 02 includes a photoresist groove 022 and a first nozzle 021 that are spaced apart from the roller fixing device 01 , and the first nozzle 021 is connected to the photoresist groove 022 , and the first nozzle 021 can be used to spray the photoresist liquid. Wherein, the photoresist liquid is stored in the photoresist groove 022, and the first nozzle 021 can extract the photoresist liquid from the photoresist groove 022, and spray the photoresist liquid on the coating. on the metal roller 200 of the base plate 300 .

It should be noted that in this embodiment, the first nozzle 021 is a piezoelectric nozzle, but the invention is not limited thereto. For example, in other embodiments, the nozzle 11 may also be a continuous nozzle. In more detail, compared with the existing coating nozzle, when the first nozzle 021 is a piezoelectric nozzle, the shape of the photoresist liquid when forming droplets is more regular, and the photoresist liquid is It can be more accurately positioned on the substrate 300 during spraying.

In addition, when the first nozzle 021 is a piezoelectric nozzle, the photoresist liquid does not need to be heated, so the photoresist liquid is not prone to chemical changes, and because the temperature of the photoresist liquid continues to maintain a stable state, even after the photoresist liquid is printed continuously for a long time, the viscosity and surface tension of the photoresist liquid remain relatively stable, so that the photoresist liquid can be coated on the substrate 300 Improved uniformity.

When the first nozzle 021 is a continuous nozzle, the speed at which the photoresist liquid forms droplets increases, thereby increasing the spraying speed of the first nozzle 021 . It should be noted that when the first nozzle 021 is a piezoelectric nozzle or a continuous nozzle, the first nozzle 021 is also a solvent-type nozzle. Otherwise, the first nozzle 021 will be easily corroded and its use will be reduced. lifespan.

Specifically, when the photoresist spraying device 02 sprays the photoresist liquid on the substrate 300 covered with the metal roller 200, the metal roller 200 is clamped by the roller fixing device 01 and Rotate so that the substrate 300 is evenly sprayed with the photoresist liquid, and then the photoresist layer 400 disposed on the substrate 300 is formed.

As shown in Figure 5, the soft baking device 03 is arranged at intervals on the roller fixing device 01. The soft baking device 03 includes a plurality of soft baking lamps 031, and each of the soft baking lamps 031 is an infrared lamp. , a near-infrared lamp, or a xenon lamp, and each of the soft baking lamps 031 of the soft baking device 03 is preferably a near-infrared lamp in this embodiment. The soft baking device 03 can be used to bake the photoresist layer 400 and reduce the solvent content of the photoresist layer 400 . In more detail, the soft baking device 03 can be used to volatilize the solvent and excess moisture of the photoresist layer 400 from the photoresist layer 400 , and make the solvent evaporate in the photoresist layer 400 The content in it should be reduced to at least about 5%.

As shown in FIG. 6 , the photolithography device 04 is spaced apart from the soft bake device 03 , and the photolithography device 04 includes a plurality of photolithography light sources 041 and a plurality of the photolithography light sources 041 spaced apart from each other. A photomask (not shown), and the photolithography device 04 can be used to irradiate part of the photoresist layer 400 on the substrate 300 to form a patterned photoresist layer 500 accordingly. Among them, the plurality of photolithography light sources 041 include a plurality of light-emitting diodes (not shown), which are used to emit ultraviolet light with a wavelength of 248 nanometers to 365 nanometers.

Furthermore, the ultraviolet light emitted by the plurality of photolithography light sources 041 of the photolithography device 04 can pass through the photomask and correspondingly form a patterned light, and the patterned light irradiates part of the photoresist. When layer 400 is formed, the metal roller 200 is clamped and rotated by the roller fixing device 01, so that part of the photoresist layer 400 is uniformly illuminated by the patterned light source, and then the photoresist layer 400 is formed correspondingly. The patterned photoresist layer 500.

It should be noted that the photomask is connected to the mobile device 09, but the invention is not limited thereto. For example, in other embodiments not shown in this invention, the photomask can also be replaced by an interference element, and the interference element is also connected to the mobile device 09 .

As shown in FIG. 7 , the developing device 05 is disposed at intervals on the roller fixing device 01 , and the developing device 05 can be used to spray a developer solution on the substrate 300 (not shown). Specifically, the developing device 05 includes a developing tank 051 and a second nozzle 052 that are spaced apart from the roller fixing device 01, and the second nozzle 052 is connected to the developing tank 051 and can be used to Spray the developer; wherein, the developer tank 051 stores the developer.

It should be noted that the types and proportions of constituent materials of the developer solution correspond to the types and proportions of constituent materials of the photoresist layer 400 . In other words, the types and proportions of the constituent materials contained in the developer will vary with the types and proportions of the constituent materials of the photoresist layer 400 . In this embodiment, the developer includes an alkali aqueous solution in which tetramethylammonium hydroxide (TMAH) is dissolved, but the invention is not limited thereto. For example, in other embodiments, the alkali aqueous solution in which tetramethylammonium hydroxide (TMAH) is dissolved can also be replaced by a solution in which tetraethylammonium hydroxide (TEAH) or tetrapropylammonium hydroxide is dissolved. (TPAH), or alkali aqueous solution of tetrabutylammonium hydroxide (TBAH).

As shown in Figure 8, the silver spraying device 06 is arranged at intervals on the roller fixing device 01, and the position of the silver spraying device 06 corresponds to the photoresist spraying device 02, and the silver spraying device 06 can be used The substrate 300 is sprayed with a nanosilver solution (not labeled in the figure). Specifically, the silver spraying device 06 includes a silver solution tank 062 and a third nozzle 061 that are spaced apart from the roller fixing device 01, and the third nozzle 061 is connected to the silver solution tank 062 and Can be used to spray the nanosilver solution. Wherein, the silver solution tank 062 stores the nanosilver solution, and the third nozzle 061 can extract the nanosilver solution in the silver solution tank 062, and then spray the nanosilver solution A silver metal layer 600 is formed correspondingly to the patterned photoresist layer 500 .

For convenience of explanation and understanding, the infiltration device 07 and the lifting device 10 will be described together below. As shown in Figure 9, the soaking device 07 is spaced apart from the roller fixing device 01, and the soaking device 07 can be used to accommodate a chromium metal solution 7S; the lifting device 10 carries the soaking device 07, And the lifting device 10 is used to move the roller fixing device 01 and the infiltration device 07 relatively, so that the infiltration device 07 can be used to infiltrate the chromium metal solution 7S contained in it into the local area. the substrate 300.

Specifically, the infiltration device 07 includes a infiltration tank 071 and a plurality of plate covers 072, and the plurality of plate covers 072 are disposed on a side of the infiltration tank 071 relatively adjacent to the metal roller 200, and the The wetting tank 071 and the plurality of plate covers 072 are spaced apart from the roller fixing device 01; the lifting device 10 includes two symmetrical lifting rails 101 and two symmetrical lifting rails 101 respectively installed on the two lifting rails 101. There are two lifting platforms 102, and the two lifting rails 101 are respectively disposed adjacent to the two ends of the infiltration device 07 in its length direction. One end of each lifting track 101 is adjacent to the roller fixing device 01 , and the other end is adjacent to the soaking device 07 .

The two lifting platforms 102 of the lifting device 10 can be used to cooperate with the two lifting rails 101 to bring the wetting tank 071 close to the metal roller 200, thereby making the metal roller 200 covered with Parts of the substrate 300 and the silver metal layer 600 are soaked in the chromium metal solution 7S, and the chromium imprint layer 700 is formed accordingly. When the metal roller 200 is immersed in the infiltration tank 071 , a plurality of plate covers 072 will be opened to allow the metal roller 200 to enter the infiltration tank 071 .

As shown in Figure 11, the plate removal device 08 is arranged at intervals on the photolithography device 04, and the plate removal device 08 is detachably installed on the roller fixing device 01, and the plate removal device 08 can Used to separate the substrate 300 and the metal roller 200 . Furthermore, the plate removal device 08 includes a fixing part 081 and a separating part 082 spaced apart from the fixing part 081. The separating part 082 can be used to connect the chrome reprint layer 700, and the The fixing member 081 can be used to fix the metal roller 200 and the silver metal layer 600 . The separation member 082 and the fixing member 081 can be separated from each other, thereby separating the chromium imprint layer 700 and the silver metal layer 600 from each other.

It should be noted that, for convenience of explanation and understanding, only the metal roller 200 and the plate removal device 08 are shown in FIG. 11 , but in fact, the plate removal device 08 is partially installed on the roller fixing device 01 , hereby explain.

As shown in FIG. 1 , the moving device 09 is arranged at intervals on the roller fixing device 01 , and the moving device 09 is connected and can be used to move the first nozzle 021 and the second nozzle 052 . Among them, the moving device 09 is also connected and can be used to move the soft baking device 03, the photolithography device 04, and the deboarding device 08. For example, when the first nozzle 021 or the second nozzle 052 performs a spraying operation on the substrate 300 covered with the metal roller 200 , the moving device 09 can be used to move the first nozzle 021 or the second nozzle 052 The nozzle 021 or the second nozzle 052 moves relative to the metal roller 200 so that the substrate 300 can be evenly coated.

As shown in FIG. 10 , the rinsing device 11 is disposed at intervals on the roller fixing device 01 , and the rinsing device 11 can be used to rinse the substrate 300 covered with the metal roller 200 . Specifically, the rinsing device 11 includes a water tank 112 and a fourth nozzle 111 connected to the water tank 112. The fourth nozzle 111 can be used to remove the patterned photoresist layer 500 from the wetting device. 07, pump water from the water tank 112 and rinse the developer distributed on the patterned photoresist layer 500 with water.

It should be noted that the roller fixing device 01, the photoresist spraying device 02, the soft baking device 03, the photolithography device 04, the developing device 05, the silver spraying device 06, the infiltration device Device 07, the plate removal device 08, the moving device 09, the lifting device 10, and the washing device 11 are provided in the dust-free chamber 12, and the level of the dust-free chamber is the same as this one. In the embodiment, it is US Federal Standard Classification 1 to US Federal Standard Classification 500. The dust-free chamber 12 is used to prevent the substrate 300 from being adhered to by pollution sources in the environment.

[Beneficial effects of the embodiment]

One of the beneficial effects of this invention is that the wide-width transfer molding equipment 100 provided by this invention can be used to fix the metal roller covered with the substrate 300 through the "roller fixing device 01" 200; wherein the length of the metal roller 200 is between 1.6 meters and 1.8 meters." The technical solution enables the wide-width transfer molding equipment 100 to be used to produce large-sized templates.

The contents disclosed above are only preferred and feasible embodiments of this invention, and do not limit the scope of the patent application for this invention. Therefore, all equivalent technical changes made by using the description and drawings of this invention are included in the application for this invention. within the scope of the patent.

100: Wide-width transfer molding equipment

01:Roller fixing device

011:Rotating mechanism

012: Clamping mechanism

02: Photoresist spraying device

021:First nozzle

022: Photoresist groove

03:Soft baking device

031:Soft baking lamp

04: Lithography device

041: Lithography light source

05:Developing device

051:Developing tank

052:Second nozzle

06:Silver spray device

061:Third nozzle

062:Silver solution tank

07:Infiltration device

071: Wetting tank

072:Plate cover

7S:Chromium metal solution

08: Board removal device

081:Fixed parts

082: Separate parts

09:Mobile device

10: Lifting device

101: Lift track

102: Lifting platform

11: Flushing device

111:The fourth nozzle

112:Sink

12: Dust-free chamber

200:Metal roller

300:Substrate

400: Photoresist layer

500: Patterned photoresist layer

600:Silver metal layer

700:Chrome reprint layer

Figure 1 is a schematic diagram of a metal roller and a substrate according to an embodiment of this invention.

Figure 2 is a schematic diagram of the action of coating the substrate on the metal roller according to this embodiment of the present invention.

Figure 3 is a schematic three-dimensional view of the wide-width transfer molding equipment according to this embodiment of the present invention.

Figure 4 is a schematic diagram of the operation of the photoresist spraying device according to this embodiment of the present invention.

Figure 5 is a schematic diagram of the operation of the soft baking device according to the embodiment of this invention.

Figure 6 is a schematic diagram of the operation of the photolithography apparatus according to this embodiment of the present invention.

FIG. 7 is a schematic diagram of the operation of the developing device according to this creative embodiment.

Figure 8 is a schematic diagram of the operation of the silver spraying device according to this embodiment of the invention.

Figure 9 is a schematic diagram of the operation of the infiltration device and the lifting device according to the embodiment of this invention.

Figure 10 is a schematic diagram of the operation of the flushing device according to the embodiment of this invention.

Figure 11 is a schematic diagram of the operation of the panel removal device according to the embodiment of this invention.

100: Wide-width transfer molding equipment

01:Roller fixing device

011:Rotating mechanism

012: Clamping mechanism

02: Photoresist spraying device

03:Soft baking device

04: Lithography device

05:Developing device

06:Silver spray device

07:Infiltration device

09:Mobile device

10: Lifting device

101: Lift track

102: Lifting platform

11: Flushing device

12: Dust-free chamber

200:Metal roller

300:Substrate

Claims (10)

A wide-width transfer molding equipment, which includes: a roller fixing device used to fix a metal roller covered with a substrate; wherein the length of the metal roller is between 1.6 meters and 1.8 meters, and the The metal roller is a chromium metal roller; a soft baking device is spaced on the roller fixing device; a photolithography device is spaced on the soft baking device, and the photolithography device includes a plurality of photolithography light sources , and the photolithography device can be used to irradiate a photolithography light to the substrate. The wide-width transfer molding equipment according to claim 1, wherein the wide-width transfer molding equipment further includes a plate removal device and a dust-free cavity, and the roller fixing device, the soft baking device The device, the photolithography device, and the board-removing device are arranged in the dust-free chamber, and the board-removing device can be used to separate the substrate and the metal roller. The wide-width transfer molding equipment as claimed in claim 1, wherein the wide-width transfer molding equipment further includes a plate removal device and a moving device, the moving device is connected and can be used to move the soft The baking device, the photolithography device, and the board-removing device can be used to separate the substrate and the metal roller. The wide-width transfer molding equipment of claim 3, wherein the photolithography device includes a photomask spaced apart from a plurality of the photolithography light sources, and the photomask is connected to the mobile device . The wide-width transfer molding apparatus according to claim 3, wherein the photolithography device includes an interference member that is spaced apart from a plurality of the photolithography light sources, and the interference member is connected to the moving device . The wide-width transfer molding equipment according to claim 1, wherein the soft baking device includes a plurality of soft baking lamps, and each of the soft baking lamps is an infrared lamp, a near Infrared lamp, or a xenon lamp. The wide-width transfer molding equipment of claim 1, wherein the plurality of photolithography light sources include a plurality of light-emitting diodes, which are used to emit ultraviolet light with a wavelength of 248 nanometers to 365 nanometers. The wide-width transfer molding equipment of claim 1, wherein the roller fixing device further includes a rotating mechanism, the rotating mechanism can be used to be installed on the metal roller, and the rotating mechanism includes a speed A controller can be used to rotate the metal roller at a drying speed ranging from 2900 rpm to 4500 rpm. The wide-width transfer molding equipment of claim 1, wherein the roller fixing device further includes a rotating mechanism, the rotating mechanism can be used to be installed on the metal roller, and the rotating mechanism includes a speed A controller can be used to rotate the metal roller at a wetting speed ranging from 1 revolution per minute (RPM) to 25 revolutions per minute. The wide-width transfer molding equipment according to claim 8, wherein the roller fixing device includes a clamping mechanism, the clamping mechanism is installed on the rotating mechanism, and the clamping mechanism is used to clamp The metal roller; wherein, when the rotating mechanism operates, the rotating mechanism will rotate the clamping mechanism, so that the metal roller is rotated by the clamping mechanism.

Images