CN215376086U - Transfer molding apparatus - Google Patents

Abstract

The utility model discloses a transfer molding apparatus, comprising: a roller fixing device for fixing a metal roller coated with a substrate; wherein the length of the metal roller is between 1.6 and 1.8 meters; the soft baking device is arranged at intervals with the roller fixing device; a lithography device spaced apart from the soft bake device and comprising a plurality of lithography light sources, the lithography device being capable of irradiating a lithography light to the substrate; and a plate detaching device which is arranged at a distance from the photoetching device and can be used for separating the substrate from the metal roller. Thereby, the transfer molding apparatus can be used to make large-sized templates.

Description

Transfer molding apparatus

Technical Field

The present invention relates to a molding apparatus, and more particularly, to a transfer molding apparatus.

Background

The existing flat plate molding equipment can only process a substrate with smaller size to obtain a template, and if a large-size template needs to be manufactured, the template can be obtained by combining a plurality of templates. However, the above method is time consuming and labor consuming, and there may be some differences between the templates in each batch despite the same process parameters, which may result in the combination of multiple templates failing to achieve the desired effect.

Therefore, how to overcome the above-mentioned drawbacks by improving the structural design has become one of the important issues to be solved by the industry.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present invention is to provide a transfer molding apparatus that can effectively improve defects that may be generated by an existing transfer molding apparatus.

One of the embodiments of the present invention discloses a transfer molding apparatus including: a roller fixing device for fixing a metal roller coated with a substrate; wherein the length of the metal roller is between 1.6 and 1.8 meters; the soft baking device is arranged at intervals with the roller fixing device; a lithography device spaced apart from the soft bake device and comprising a plurality of lithography light sources, the lithography device being capable of irradiating a lithography light to the substrate; and a plate detaching device which is arranged at a distance from the photoetching device and can be used for separating the substrate from the metal roller.

Preferably, the transfer molding apparatus further comprises a dust-free chamber, and the roller fixing device, the soft baking device, the lithography device and the plate detaching device are disposed in the dust-free chamber.

Preferably, the transfer molding apparatus further comprises a moving device connected to and capable of moving the soft baking device, the lithography device and the plate detaching device.

Preferably, the lithographic apparatus comprises a reticle spaced apart from the plurality of lithographic light sources and the reticle is connected to the moving device.

Preferably, the lithographic apparatus comprises an interference member spaced apart from the plurality of lithographic light sources, and the interference member is connected to the moving device.

Preferably, the soft-baking device comprises a plurality of soft-baking lamps, and each soft-baking lamp is an infrared lamp, a near-infrared lamp or a xenon lamp.

Preferably, a plurality of said lithographic light sources comprise a plurality of light emitting diodes for emitting ultraviolet light having a wavelength of 248 nm to 365 nm.

Preferably, the roller fixture further comprises a rotation mechanism mountable to the metal roller, and the rotation mechanism comprises a speed controller operable to rotate the metal roller at a spin-drying speed of between 2900 revolutions per minute and 4500 revolutions per minute.

Preferably, the roller fixing device further comprises a rotating mechanism, the rotating mechanism can be mounted on the metal roller, and the rotating mechanism comprises a speed controller, the speed controller can be used for enabling the metal roller to rotate at a wetting speed of between 1 and 25 revolutions per minute.

Preferably, the roller fixing device comprises a clamping mechanism, the clamping mechanism is mounted on the rotating mechanism, and the clamping mechanism is used for clamping the metal roller; when the rotating mechanism operates, the rotating mechanism rotates the clamping mechanism, so that the metal roller is rotated by the clamping mechanism.

One of the benefits of the present invention is that the transfer molding apparatus provided by the present invention can fix the metal roller coated with the substrate by the roller fixing device; the technical scheme that the length of the metal roller is between 1.6 meters and 1.8 meters enables the transfer molding equipment to be used for manufacturing large-size templates.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the utility model and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the utility model in any way.

Drawings

Fig. 1 is a schematic view of a metal roller and a substrate according to an embodiment of the utility model.

Fig. 2 is a schematic diagram illustrating an operation of wrapping a metal roller with a substrate according to an embodiment of the utility model.

FIG. 3 is a schematic perspective view of a transfer molding apparatus of an embodiment of the present invention.

FIG. 4 is a schematic diagram of a photoresist spraying apparatus according to an embodiment of the present invention.

Fig. 5 is a schematic operation diagram of a soft-baking apparatus according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of an apparatus according to an embodiment of the utility model.

FIG. 7 is a schematic diagram of the operation of the developing device according to the embodiment of the present invention.

Fig. 8 is a schematic operation diagram of a silver spraying apparatus according to an embodiment of the present invention.

Fig. 9 is a schematic operation diagram of the wetting device and the lifting device according to the embodiment of the utility model.

Fig. 10 is a schematic operation diagram of a flushing device according to an embodiment of the present invention.

Fig. 11 is a schematic operation diagram of a plate detaching device according to an embodiment of the present invention.

Detailed Description

The following is a description of the embodiments of the present disclosure relating to a "transfer molding apparatus" by specific embodiments, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The utility model is capable of other and different embodiments and its several details are capable of modifications and various changes in detail, all without departing from the spirit and scope of the present invention. It should be noted that the drawings of the present invention are merely schematic illustrations and are not drawn to actual dimensions. Furthermore, as noted below, reference is made to or shown in the accompanying drawings for emphasis instead being placed upon the following description, and the accompanying drawings are presented for the most part, without limitation, in the following description only with reference to the accompanying drawings. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

Fig. 1 to 11 are views illustrating an embodiment of the present invention, and it should be noted that the corresponding figures and the related numbers and shapes are only used to describe the embodiment of the present invention specifically for understanding the content of the present invention, and not to limit the scope of the present invention.

Referring to fig. 1 to 11, an embodiment of the utility model provides a transfer molding apparatus 100, wherein the transfer molding apparatus 100 is used for forming a nickel transfer layer 700 on a substrate 300 at intervals, and the substrate 300 is wrapped on a metal roller 200. In the present embodiment, the substrate 300 is mainly made of Polyethylene terephthalate (PET), the length of the substrate 300 is between 1.6 meters and 1.8 meters, and the width of the substrate 300 is between 1 meter and 1.2 meters, but the utility model is not limited thereto. For example, in other embodiments of the present invention, the substrate 300 may be made of any resin with transparent property.

It should be noted that, in the present embodiment, the length of the metal roller 200 is between 1.6 meters and 1.8 meters, and the metal roller 200 is preferably made of stainless steel, but the utility model is not limited thereto. For example, the metal roller 200 may also be made of tin, lead, zinc, aluminum, copper, brass, iron, nickel, cobalt, tungsten, chromium, or a metal having a hardness greater than chromium.

The transfer molding apparatus 100 includes a roller fixing device 01, a photoresist spraying device 02, a soft baking device 03, a photolithography device 04, a developing device 05, a silver spraying device 06, a wetting device 07, a plate detaching device 08, a moving device 09, a lifting device 10, a flushing device 11, and a dust-free chamber 12, but the utility model is not limited thereto. For example, in other embodiments of the present invention, which are not shown, the transfer molding apparatus 100 may not include the flushing device 11 and the clean room 12.

For convenience of explanation and understanding, the components of the transfer molding apparatus 100 will be described one by one, and the mutual positions and operational relationships among the above components will be described in due course. As shown in fig. 3, the roller fixing device 01 is used for fixing the metal roller 200 coated with the substrate 300, and the roller fixing device 01 includes a rotating mechanism 011 and a clamping mechanism 012 mounted on the rotating mechanism 011. Wherein, the rotating mechanism 011 can be used to be installed on the metal roller 200, and the clamping mechanism 012 is used to clamp the metal roller 200. Further, when the rotating mechanism 011 operates, the rotating mechanism 011 rotates the clamping mechanism 012, so that the metal roller 200 is rotated by the clamping mechanism 012.

Further, the clamping mechanism 012 includes a circular elastic collet (not shown), and the clamping mechanism 012 is hydraulically driven to clamp the metal roller 200, but the utility model is not limited thereto. For example, the circular collet chuck may be a lathe chuck or other fixture, and the clamping mechanism 012 may be driven by air pressure or manually to enable the circular collet chuck to clamp the metal roller 200.

It should be noted that the rotating mechanism 011 further includes a speed controller (not shown) for rotating the metal roller 200 at a spin-drying speed of 2900 Revolutions Per Minute (RPM) to 4500 RPM, but the utility model is not limited thereto. For example, in other embodiments not shown, the speed controller can also be used to rotate the metal roller 200 at a wetting speed between 1 and 25 Revolutions Per Minute (RPM).

As shown in fig. 4, the photoresist sprayer 02 is spaced apart from the roller fixture 01, and the photoresist sprayer 02 can be used to spray a photoresist solution (not shown) onto the substrate 300 to form a photoresist layer 400. In the present embodiment, the photoresist solution is formed by a positive photoresist, and the photoresist solution is mainly made of Phenol-formaldehyde resin (Phenol-formaldehyde resin), but the present invention is not limited thereto. For example, the photoresist liquid may be made of a positive photoresist material such as Epoxy resin (Epoxy resin).

Specifically, the photoresist spraying device 02 includes a photoresist groove 022 spaced apart from the roller fixing device 01 and a first nozzle 021, and the first nozzle 021 is connected to the photoresist groove 022, and the first nozzle 021 can be used to spray the photoresist solution. The photoresist groove 022 stores the photoresist liquid therein, and the first nozzle 021 can extract the photoresist liquid from the photoresist groove 022 and spray-coat the photoresist liquid on the substrate 300 coated on the metal roller 200.

In the present embodiment, the first nozzle 021 is a piezoelectric nozzle, but the utility model is not limited thereto. For example, in other embodiments, the first nozzle may be a continuous nozzle. In more detail, when the first nozzle 021 is a piezoelectric type nozzle, the shape of the photoresist liquid when it is formed into a droplet is more regular than that of the existing coating nozzle, and the photoresist liquid can be more precisely disposed on the substrate 300 when it is sprayed.

In addition, when the first nozzle 021 is a piezoelectric nozzle, the photoresist solution does not need to be heated, so that the photoresist solution is not easy to generate chemical changes, and because the temperature of the photoresist solution is continuously kept in a stable state, even after the photoresist solution is continuously sprayed and printed for a long time, the viscosity and the surface tension of the photoresist solution are kept relatively stable, so that the uniformity of the photoresist solution coated on the substrate 300 can be improved.

When the first nozzle 021 is a continuous nozzle, the speed of forming liquid drops by the photoresist liquid is increased, so that the spraying speed of the first nozzle 021 is increased. It should be noted that, when the first nozzle 021 is a piezo nozzle or a continuous nozzle, the first nozzle 021 is also a solvent-type nozzle, otherwise the first nozzle 021 is easily corroded to reduce the service life.

Specifically, when the photoresist spraying device 02 sprays the photoresist solution on the substrate 300 coated on the metal roller 200, the metal roller 200 is held and rotated by the roller fixing device 01, so that the substrate 300 is uniformly sprayed by the photoresist solution, thereby forming the photoresist layer 400 disposed on the substrate 300.

As shown in fig. 5, the soft-baking device 03 and the roller fixing device 01 are disposed at an interval, the soft-baking device 03 includes a plurality of soft-baking lamps 031, each of the soft-baking lamps 031 is an infrared lamp, a near-infrared lamp, or a xenon lamp, and each of the soft-baking lamps 031 of the soft-baking device 03 is preferably a near-infrared lamp in this embodiment. The soft baking device 03 can be used for baking the photoresist layer 400 and reducing the solvent content of the photoresist layer 400. In more detail, the soft baking apparatus 03 can be used to volatilize the solvent and the excessive moisture of the photoresist layer 400 from the photoresist layer 400, and reduce the content of the solvent in the photoresist layer 400 to at least about 5%.

As shown in fig. 6, the lithography apparatus 04 is spaced apart from the soft baking apparatus 03, and the lithography apparatus 04 includes a plurality of lithography light sources 041 and a mask (not shown) spaced apart from the plurality of lithography light sources 041, and the lithography apparatus 04 can be used to irradiate a portion of the photoresist layer 400 on the substrate 300, so as to correspondingly form a patterned photoresist layer 500. The plurality of lithography light sources 041 includes a plurality of light emitting diodes (not shown) for emitting ultraviolet light with a wavelength of 248 nm to 365 nm.

Further, the ultraviolet light emitted by the plurality of lithography light sources 041 of the lithography apparatus 04 can pass through the mask and correspondingly form a patterned light, when the patterned light irradiates a portion of the photoresist layer 400, the metal roller 200 is clamped by the roller fixture 01 and rotates, so that a portion of the photoresist layer 400 is uniformly irradiated by the patterned light sources, and the patterned photoresist layer 500 is correspondingly formed on the photoresist layer 400.

It should be noted that the mask is connected to the moving device 09, but the utility model is not limited thereto. For example, in other embodiments not shown, the mask can be replaced by an interference member, and the interference member is also connected to the moving device 09.

As shown in fig. 7, the developing device 05 is disposed spaced apart from the roller fixing device 01, and the developing device 05 can be used to spray a developing solution (not shown) on the substrate 300. Specifically, the developing device 05 includes a developing tank 051 disposed to be spaced apart from the roller fixing device 01 and includes a second nozzle 052, and the second nozzle 052 is connected to the developing tank 051 and can be used to spray the developing solution; wherein the developing solution is stored in the developing tank 051.

The types and ratios of the constituent materials of the developing solution correspond to those of the photoresist layer 400. In other words, the developing solution may include a variety of constituent materials and a ratio of constituent materials that vary with the variety and ratio of constituent materials of the photoresist layer 400. The developing solution includes an alkaline aqueous solution in which tetramethylammonium hydroxide (TMAH) is dissolved in the present embodiment, but the present invention is not limited thereto. For example, in other embodiments, an aqueous base solution in which tetramethylammonium hydroxide (TMAH) is dissolved may be replaced with an aqueous base solution in which tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), or tetrabutylammonium hydroxide (TBAH) is dissolved.

As shown in fig. 8, the silver spraying device 06 is spaced apart from the roller fixing device 01, and the silver spraying device 06 is located corresponding to the photoresist spraying device 02, and the silver spraying device 06 can be used to spray a nano silver solution (not shown) on the substrate 300. Specifically, the silver spraying apparatus 06 includes a silver solution tank 062 disposed spaced apart from the roller fixture 01 and includes a third nozzle 061, and the third nozzle 061 is connected to the silver solution tank 062 and can be used to spray the nano-silver solution. Wherein the silver solution tank 062 stores the nano-silver solution, and the third nozzle 061 may pump the nano-silver solution in the silver solution tank 062, and then spray-coat the nano-silver solution on the patterned photoresist layer 500 and correspondingly form a silver metal layer 600.

For the sake of illustration and understanding, the infiltration apparatus 07 and the lifting apparatus 10 will be described together. As shown in fig. 9, the infiltrating device 07 is disposed at a distance from the roller fixing device 01, and the infiltrating device 07 can be used to contain a nickel metal solution 7S; the lifting device 10 carries the wetting device 07, and the lifting device 10 is configured to move the roller fixing device 01 and the wetting device 07 relatively, so that the wetting device 07 can be configured to wet the nickel metal solution 7S contained therein on a part of the substrate 300.

Specifically, the wetting device 07 includes a wetting tank 071 and a plurality of plate covers 072, and the plate covers 072 are disposed on a side of the wetting tank 071 opposite to the metal roller 200, and the wetting tank 071, the plate covers 072 and the roller fixing device 01 are disposed at intervals; the lifting device 10 includes two symmetrical lifting rails 101 and two lifting platforms 102 respectively mounted on the two lifting rails 101, and the two lifting rails 101 are respectively disposed adjacent to two ends of the wetting device 07 in the length direction thereof. One end of each lifting track 101 is adjacent to the roller fixing device 01, and the other end is adjacent to the wetting device 07.

The two lifting platforms 102 of the lifting device 10 can be used to cooperate with the two lifting rails 101 to make the wetting groove 071 approach the metal roller 200, so that a portion of the substrate 300 and the silver layer 600 coated on the metal roller 200 are wetted in the nickel metal solution 7S, and the nickel reprint layer 700 is correspondingly formed. When the metal roller 200 is immersed in the immersion groove 071, the plate covers 072 are opened to allow the metal roller 200 to enter the immersion groove 071.

As shown in fig. 11, the plate removing device 08 is disposed apart from the photolithography device 04, and the plate removing device 08 is detachably mounted to the roller fixing device 01, and the plate removing device 08 can be used to separate the substrate 300 from the metal roller 200. Further, the plate removing device 08 includes a fixing member 081 and a separating member 082 spaced from the fixing member 081, the separating member 082 can be used for connecting the nickel reprint layer 700, and the fixing member 081 can be used for fixing the metal roller 200 and the silver metal layer 600. The separating member 082 and the fixing member 081 can be separated from each other, so that the nickel reprint layer 700 and the silver metal layer 600 are separated from each other.

For convenience of description and understanding, fig. 11 shows only the metal roller 200 and the plate removing device 08, but the plate removing device 08 is partially mounted on the roller fixing device 01, and thus the description is given.

As shown in fig. 10, the moving device 09 is spaced apart from the roller fixing device 01, and the moving device 09 is connected to the first nozzle 021 and the second nozzle 052 and can be used to move the first nozzle 021 and the second nozzle 052. The moving device 09 is also connected to the soft baking device 03, the lithography device 04, and the plate removing device 08, and can be used to move the soft baking device 03, the lithography device 04, and the plate removing device 08. For example, when the first nozzle 021 or the second nozzle 052 performs a spraying operation on the substrate 300 wrapped around the metal roller 200, the moving device 09 can be used to move the first nozzle 021 or the second nozzle 052 relative to the metal roller 200, so that the substrate 300 can be uniformly coated.

As shown in fig. 10, the rinsing device 11 is disposed at a distance from the roller fixing device 01, and the rinsing device 11 can be used to rinse the substrate 300 coated on the metal roller 200. Specifically, the rinsing device 11 comprises a water tank 112 and a fourth nozzle 111 connected to the water tank 112, wherein the fourth nozzle 111 can be used to pump water from the water tank 112 and rinse the developer distributed on the patterned photoresist layer 500 with water when the patterned photoresist layer 500 leaves the developer in the immersion device 07.

It should be noted that the roller fixing device 01, the photoresist spraying device 02, the soft baking device 03, the photolithography device 04, the developing device 05, the silver spraying device 06, the wetting device 07, the plate detaching device 08, the moving device 09, the lifting device 10, and the flushing device 11 are disposed in the dust-free cavity 12, and the grade of the dust-free cavity is, in this embodiment, federal standard grade 1 to federal standard grade 500. Wherein the cleanroom chamber 12 is used to prevent the substrate 300 from being attached by a contamination source in the environment.

[ advantageous effects of the embodiments ]

One of the advantages of the present invention is that the transfer molding apparatus 100 provided by the present invention can fix the metal roller 200 coated with the substrate 300 by "the roller fixing device 01; the length of the metal roller 200 is between 1.6 m and 1.8 m ", so that the transfer molding apparatus 100 can be used to manufacture large-sized templates.

The disclosure is only a preferred embodiment and is not intended to limit the scope of the utility model, so that all equivalent variations made by using the disclosure and drawings are included in the scope of the utility model.

Claims (10)

1. A transfer molding apparatus, characterized by comprising:

a roller fixing device for fixing a metal roller coated with a substrate; wherein the length of the metal roller is between 1.6 and 1.8 meters;

the soft baking device is arranged at intervals with the roller fixing device;

a lithography device spaced apart from the soft bake device and comprising a plurality of lithography light sources, the lithography device being capable of irradiating a lithography light to the substrate; and

and the plate detaching device is arranged at a distance from the photoetching device and can be used for separating the substrate from the metal roller.

2. The transfer molding apparatus of claim 1, further comprising a clean chamber, wherein the roller fixture, the soft bake device, the lithography device, and the plate remover are disposed in the clean chamber.

3. The transfer molding apparatus according to claim 1, further comprising a moving device connected to and operable to move the soft bake device, the lithography device, and the plate detaching device.

4. The transfer molding apparatus of claim 3, wherein the lithography device includes a reticle spaced apart from the plurality of lithography light sources, and the reticle is coupled to the moving device.

5. The transfer molding apparatus of claim 3, wherein the lithography device includes an interference member spaced apart from the plurality of lithography light sources, and the interference member is connected to the moving device.

6. The transfer molding apparatus according to claim 1, wherein the soft-baking device includes a plurality of soft-baking lamps, and each of the soft-baking lamps is an infrared lamp, a near-infrared lamp, or a xenon lamp.

7. The transfer molding apparatus of claim 1, wherein the plurality of lithographic light sources comprises a plurality of light emitting diodes configured to emit ultraviolet light having a wavelength of 248 nm to 365 nm.

8. The transfer molding apparatus of claim 1, wherein the roller fixture further comprises a rotation mechanism mountable to the metal roller, and the rotation mechanism comprises a speed controller operable to rotate the metal roller at a spin speed between 2900 revolutions per minute and 4500 revolutions per minute.

9. The transfer molding apparatus of claim 1, wherein the roller fixture further comprises a rotation mechanism mountable to the metal roller, and the rotation mechanism comprises a speed controller operable to rotate the metal roller at a wetting speed between 1 rpm and 25 rpm.

10. The transfer molding apparatus according to claim 8, wherein said roller fixing device includes a gripping mechanism, said gripping mechanism being mounted to said rotating mechanism, and said gripping mechanism being for gripping said metal roller; when the rotating mechanism operates, the rotating mechanism rotates the clamping mechanism, so that the metal roller is rotated by the clamping mechanism.

Images