TWM642120U - Integrated wide-format plate-making equipment - Google Patents

Abstract

The invention discloses an integrated wide-format plate-making equipment, which includes an optical table, a photoresist spraying device, a developing device, a silver spraying device, and a chromium electroforming device. The optical table is used to carry a substrate, and the edges of the optical table are arranged on the substrate at intervals. The length of the substrate is between 1.6m and 1.8m, and the width of the substrate is between 1m and 1.2m. The photoresist spraying device is arranged on the optical table at intervals, and the photoresist spraying device can be used to spray a photoresist liquid on the substrate. The developing device is arranged in the photoresist spraying device at intervals, and the substrate can be arranged in the developing device. The silver spraying device is arranged on the developing device at intervals, and the silver spraying device can be used to spray a nanometer silver solution on the substrate. The chromium electroforming device is arranged at intervals on the silver spraying device, and the chromium electroforming device can be used to form a chromium reprint layer on the substrate.

Description

Integrated wide-format plate-making equipment

The creation relates to an integrated wide-width plate-making equipment, in particular to a transfer-printing integrated wide-width plate-making equipment.

Existing flat-panel integrated wide-format plate-making equipment can usually only process smaller-sized substrates to obtain templates. If a large-sized template needs to be produced, it needs to be obtained by combining multiple templates. However, the above method is not only time-consuming and laborious, but each batch of templates may have slight differences even though the process parameters are the same, so that the combination of multiple templates cannot achieve the expected effect.

Therefore, how to overcome the above-mentioned defects by improving the structural design has become one of the important issues to be solved by this project.

The invention embodiment provides an integrated wide-width plate-making equipment for the deficiencies of the prior art, which can effectively improve the possible defects of the existing integrated wide-width plate-making equipment.

The inventive embodiment discloses an integrated wide-format plate-making equipment, which includes: an optical table for carrying a substrate, and the edge of the optical table is arranged on the substrate at intervals; wherein, the length of the substrate is Between 1.6 meters and 1.8 meters, and the width of the substrate is between 1 meter and 1.2 meters; a photoresist spraying device is arranged on the optical table at intervals, and the photoresist spraying device can be used to spray a photoresist liquid on the substrate; a developing device is arranged at intervals in the photoresist spraying device, and the substrate can be arranged in the developing device; a silver spraying device is arranged at intervals in the developing device The developing device, and the silver spraying device can be used to spray a nano-silver solution on the substrate; and a chromium electroforming device, arranged at intervals in the silver spraying device, and the chromium electroforming device can be To form a chromium reprint layer on the substrate.

One of the beneficial effects of this creation is that the integrated wide-format plate-making equipment provided by this creation can be arranged on the substrate at intervals by surrounding the edge of the optical table; wherein, the length of the substrate Between 1.6 meters and 1.8 meters, and the width of the substrate is between 1 meter and 1.2 meters" technical solution, so that the integrated wide-format plate-making equipment can be used to make large-sized templates.

In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings about this creation. However, the provided drawings are only for reference and explanation, and are not used to limit this creation.

The following is a description of the implementation of the "integrated wide-format plate-making equipment" disclosed in this creation through specific specific examples. Those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the idea of this creation. In addition, the drawings of this creation are only for simple illustration, not according to the actual size of the depiction, prior statement. In addition, if it is pointed out below that please refer to the specific drawing or as shown in the specific drawing, it is only used to emphasize the follow-up description. Most of the relevant content mentioned appears in the specific drawing, but not In this ensuing description, reference may be made to only the specific drawings described. The following embodiments will further describe the relevant technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

Please refer to Figures 1 to 9, which are the embodiments of this invention. It should be noted that the drawings corresponding to this embodiment and the relevant quantities and shapes mentioned are only used for specific illustrations. The implementation method of this creation is to facilitate understanding of the content of this creation, not to limit the scope of protection of this creation.

As shown in FIGS. 1 to 9 , the present invention provides an integrated wide-format plate-making equipment 100 (also referred to as a transfer integrated wide-format plate-making equipment 100 ), which is used to form a chromium reprint layer 600 at intervals. on a substrate 200 . The substrate 200 is mainly made of polyethylene terephthalate (PET) in this embodiment, and the length of the substrate 200 is between 1.6 meters and 1.8 meters, and the substrate 200 The width is between 1 meter and 1.2 meters, but this creation is not limited to this. For example, in other embodiments of the present invention, the substrate 200 may also be made of any resin with transparency.

The integrated wide-format plate-making equipment 100 includes an optical table 1 (Optical table), a photoresist spraying device 2, a soft baking device 3, a photolithography device 4, a developing device 5, a silver spraying device 6, a Chromium electroforming device 7, a board removing device 8, a moving device 9, a flushing device 10, and a dust-free chamber (not shown), but the invention is not limited thereto. For example, in other embodiments not shown in this creation, the integrated wide-format plate making equipment 100 may not include the flushing device 10 and the dust-free chamber.

For the convenience of description and understanding, each component of the integrated wide-format plate-making equipment 100 will be described one by one, and the mutual position and action relationship between the above-mentioned components will be described in due course. As shown in FIG. 1 and FIG. 2 , the optical table 1 is used to carry the substrate 200 , and the edge of the optical table 1 is disposed on the substrate 200 at intervals. Wherein, the optical table 1 includes a platform 11 and a plurality of pillars 12 connected to one side of the platform 11, and a plurality of holes 111 are formed on the side of the platform 11 relatively away from the plurality of pillars 12, And a plurality of the pillars 12 are installed with a plurality of shock-absorbing structures 121 .

It should be noted that the platform 11 contains a vacuum device (not shown in the figure), through which the plurality of holes 111 can be used to absorb and fix the substrate 200, and the plurality of shock absorbers The structure 121 is used to avoid shaking the substrate 200 . Wherein, in this embodiment, the plurality of holes 111 are threaded holes.

As shown in FIG. 3 , the photoresist spraying device 2 includes at least one first nozzle 21 arranged at intervals on the optical table 1, and at least one of the first nozzles 21 of the photoresist spraying device 2 can be used To spray a photoresist liquid (not shown) on the substrate 200 , and then form a photoresist layer 300 on the substrate 200 . Wherein, the photoresist solution is formed of positive photoresist, and the photoresist solution is mainly made of phenol-formaldehyde resin, but the invention is not limited thereto. For example, the photoresist liquid may also be made of positive photoresist materials such as epoxy resin (Epoxy resin).

It should be noted that, in this embodiment, at least one of the first nozzles 21 is a piezoelectric nozzle, but the invention is not limited thereto. For example, in other embodiments, at least one of the first nozzles 21 may also be a continuous nozzle. In more detail, when at least one of the first nozzles 21 is a piezoelectric nozzle, the shape of the photoresist liquid droplets is more regular, and the photoresist liquid can be more accurately sprayed. disposed on the substrate 200 .

In addition, when at least one of the first nozzles 21 is a piezoelectric nozzle, the photoresist liquid does not need to be heated, so the photoresist liquid is not easy to change chemically, and since the temperature of the photoresist liquid is kept at In a stable state, even after the photoresist has been sprayed for a long time without interruption, the viscosity and surface tension of the photoresist remain relatively stable, so that the photoresist can be coated on the substrate 200 The uniformity of time is improved.

When at least one of the first nozzles 21 is a continuous nozzle, the speed at which the photoresist liquid forms droplets is increased, thereby increasing the spraying speed of at least one of the first nozzles 21 . It should be noted that when at least one of the first nozzles 21 is a piezoelectric nozzle or a continuous nozzle, at least one of the first nozzles 21 is also a solvent nozzle, otherwise at least one of the first nozzles 21 will be It is easily corroded and reduces the service life.

As shown in Figure 4, the soft roasting device 3 is arranged on the optical table 1 at intervals, and the soft roasting device 3 includes a plurality of soft roasting lamps 31, and each of the soft roasting lamps 31 is an infrared lamp , a near-infrared lamp, or a xenon lamp, and each of the soft-baking lamps 31 of the soft-baking device 3 is preferably a near-infrared lamp in this embodiment. Wherein, the soft baking device 3 can be used to bake the photoresist layer 300 and reduce the solvent content of the photoresist layer 300 .

As shown in Figure 5, the lithography apparatus 4 is arranged at intervals on the soft baking apparatus 3, and the lithography apparatus 4 includes at least one lithography light source 41 and at least one lithography light source 41 is arranged at intervals. A photomask (not drawn in the figure), and at least one of the photolithography light sources 41 includes a plurality of light emitting diodes (not drawn in the figure), which are used to emit ultraviolet light with a wavelength of 248 nm to 365 nm, but this Creation is not limited to this. For example, in other embodiments not shown in the present invention, the lithography device 4 may also include an interference element disposed at least one of the lithography light sources 41 at intervals.

Specifically, the light generated by at least one photolithography light source 41 can pass through the photomask to form a patterned light source (not shown), and the patterned light source can be used to part of the photoresist The layer 300 is irradiated, so that the partially irradiated photoresist layer 300 forms a patterned photoresist layer 400 correspondingly.

As shown in FIGS. 6 and 7 , the developing devices 5 are arranged at intervals in the photoresist spraying device 2 , and the substrate 200 can be arranged in the developing devices 5 . Wherein, the developing device 5 is used to remove a portion of the photoresist layer 300 not irradiated by at least one photolithography light source 41 on the photoresist layer 300 to form the patterned photoresist layer 400 accordingly.

Further, the developing device 5 includes a container 51 arranged on the optical table 1, a first liquid storage tank 52 connected to the container 51, and arranged on the optical table 1 at intervals. A first liquid infusion part 53 and a liquid discharge part 54 connected to the accommodating part 51 . Wherein, the substrate 200 is arranged in the accommodating part 51, the first liquid storage barrel 52 contains a developing solution 5S, and the first liquid infusion part 53 can be used to extract the first liquid storage barrel 52 The developer 5S in the liquid is outputted and disposed in the container 51 and on the substrate 200 , and the liquid discharge member 54 can be used to drain the developer 5S.

Thereby, when the substrate 200 is soaked in the developing solution 5S, the part of the photoresisting layer 300 on the photoresist layer 300 that is not illuminated by at least one photolithography light source 41 will be covered by the developing solution 5S. Dissolving, so that the part of the photoresist layer 300 on the photoresist layer 300 that has been irradiated by at least one photolithographic light source 41 corresponds to form the patterned photoresist layer 400 .

It should be noted that, the types and proportions of the constituent materials of the developer solution 5S correspond to the types and proportions of the constituent materials of the photoresist liquid. In other words, the types and ratios of the constituent materials contained in the developer solution 5S will vary with the types and ratios of the constituent materials of the photoresist liquid. The developer solution 5S in this embodiment includes an aqueous alkali solution dissolved with tetramethylammonium hydroxide (TMAH), but the invention is not limited thereto. For example, in other embodiments, the aqueous alkali solution dissolved with tetramethylammonium hydroxide (TMAH) can also be replaced with dissolved tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), or an aqueous alkali solution of tetrabutylammonium hydroxide (TBAH).

As shown in FIG. 7 , the silver spraying devices 6 are arranged at intervals on the developing device 5 , and the silver spraying devices 6 can be used to spray a nano-silver solution (not shown) on the substrate 200 . Further, the silver spraying device 6 includes at least one second nozzle 61 arranged at intervals on the optical table 1, and at least one second nozzle 61 can be used to spray the nano-silver solution on the A silver metal layer 500 is formed on the photoresist layer 400 by patterning.

As shown in FIG. 8, the chromium electroforming device 7 is arranged at intervals on the silver spraying device 6 and adjacent to the optical table 1, and the chromium electroforming device 7 can be used to form a The chrome reprint layer 600 . Specifically, the chromium electroforming device 7 includes a second liquid storage barrel 71 arranged at intervals on the optical table 1 and a second liquid infusion part 72 connected to the second liquid storage barrel 71, the The second liquid storage barrel 71 stores a chromium metal solution 7S, and the second infusion part 72 can extract the chromium metal solution 7S from the second liquid storage barrel 71, and then distribute the chromium metal solution 7S in the The silver metal layer 500 is formed to correspond to the chromium reprint layer 600 .

Based on the above, the integrated wide-format plate-making equipment 100 can make the chrome reprinting layer 600 relatively easy to print through the technical means of "correspondingly forming the silver metal layer 500 on the patterned photoresist layer 400". completely peeled off from the substrate 200.

As shown in FIG. 9 , the board removal device 8 is arranged at intervals on the photolithography device 4, and the board removal device 8 can be used to disassemble the substrate 200 (such as: remove the chromium reprint layer 600 from the The substrate 200 is disassembled and separated). Specifically, the board removal device 8 includes a separating part 81 and a fixing part 82, the separating part 81 is arranged on the optical table 1 at intervals, and the separating part 81 can be used to be detachably connected to One side of the substrate 200 ; the fixing part 82 is detachably disposed on the optical table 1 , and the fixing part 82 can be used to fix the substrate 200 .

Further, the separating part 81 can be used to connect the chromium reprint layer 600 , and the fixing part 82 can be used to fix the patterned photoresist layer 400 . Wherein, the separating part 81 and the fixing part 82 can be separated from each other, so as to separate the chromium reprint layer 600 and the silver metal layer 500 from each other.

As shown in Figure 1, the moving device 9 is connected and can be used to move at least one of the first nozzle 21, at least one of the second nozzle 61, the first infusion part 53, the second infusion part 72 , the photomask or the interference element. Wherein, the moving device 9 can further connect and move the soft baking device 3 , the photolithography device 4 , and the board removing device 8 .

As shown in FIG. 1 , the rinsing devices 10 are arranged at intervals on the optical table 1 , and the rinsing devices 10 can be used to rinse the substrate 200 . Specifically, the rinsing device 10 is used to rinse the patterned photoresist layer 400 with water when the patterned photoresist layer 400 leaves the developer solution 5S in the container 51. The developer solution 5S.

It should be noted that the optical table 1, the photoresist spraying device 2, the soft baking device 3, the photolithography device 4, the developing device 5, the silver spraying device 6, the chromium electrode The casting device 7, the board removal device 8, the moving device 9, and the flushing device 10 are arranged in the dust-free chamber, and the grade of the dust-free chamber is the United States Federal Standard in this embodiment Grade 1 to 500 on the US Federal Standards. Wherein, the clean chamber is used to prevent the substrate 200 from being adhered by pollution sources in the environment.

[Advantageous Effects of Embodiment]

One of the beneficial effects of this creation is that the integrated wide-format plate-making equipment 100 provided by this creation can be arranged on the base plate 200 at intervals by surrounding the edge of the optical table 1; wherein, the The length of the substrate 200 is between 1.6 meters and 1.8 meters, and the width of the substrate 200 is between 1 meter and 1.2 meters", so that the integrated wide-format plate-making equipment 100 can be used to make large size template.

The content disclosed above is only the preferred feasible embodiment of this creation, and does not limit the scope of patent application for this creation. Therefore, all equivalent technical changes made by using the instructions and drawings of this creation are included in the application of this creation. within the scope of the patent.

100: Integrated wide-format plate-making equipment 1: Optical table 11: Platform 111: hole 12: pillar 121: shock-absorbing structure 2: Photoresist spraying device 21: The first nozzle 3: Soft baking device 31: Soft Bake Lamp 4: Photolithography device 41: Lithography light source 5: Developing device 51: container 52: The first liquid storage tank 53: The first infusion piece 54: Drain part 5S: developer 6: Silver spraying device 61: Second nozzle 7: Chromium electroforming device 71: Second liquid storage tank 72: The second infusion piece 7S: Chromium metal solution 8: Detaching device 81: Separate parts 82:Fixer 9:Mobile device 10: Flushing device 200: Substrate 300: photoresist layer 400: Patterned photoresist layer 500: silver metal layer 600: Chromium reprint layer

FIG. 1 is a three-dimensional schematic diagram of an integrated wide-format plate-making device according to an embodiment of the present invention.

Fig. 2 is a three-dimensional schematic view of the optical table of the present invention.

FIG. 3 is a schematic diagram of the action of the photoresist spraying device of the present invention.

Fig. 4 is a schematic diagram of the action of the soft-baking device of the embodiment of the present invention.

FIG. 5 is a schematic diagram of the action of the photolithography apparatus of the present invention.

FIG. 6 is a schematic diagram of the action of the developing device of the present invention.

Fig. 7 is a schematic diagram of the action of the silver spraying device of the present invention.

FIG. 8 is a schematic diagram of the operation of the chromium electroforming device of the present invention.

Fig. 9 is a schematic diagram of the action of the panel removal device of the present invention.

100: Integrated wide-format plate-making equipment

1: Optical table

11: Platform

12: pillar

2: Photoresist spraying device

21: The first nozzle

3: Soft baking device

31: Soft Bake Lamp

4: Photolithography device

41: Lithography light source

5: Developing device

51: container

52: The first liquid storage tank

53: The first infusion piece

54: Drain part

6: Silver spraying device

61: Second nozzle

7: Chromium electroforming device

71: Second liquid storage tank

72: The second infusion piece

8: Detaching device

9:Mobile device

10: Flushing device

200: Substrate

Claims (10)

An integrated wide-format plate-making equipment comprising: An optical table, used to carry a substrate, and the edge of the optical table is arranged around the substrate at intervals; wherein, the length of the substrate is between 1.6 meters and 1.8 meters, and the width of the substrate is Between 1 meter and 1.2 meters; A photoresist spraying device is arranged at intervals on the optical table, and the photoresist spraying device can be used to spray a photoresist liquid on the substrate; a developing device, arranged at intervals in the photoresist spraying device, and the substrate can be arranged in the developing device; A silver spraying device is arranged at intervals in the developing device, and the silver spraying device can be used to spray a nano-silver solution on the substrate; and A chromium electroforming device is arranged at intervals on the silver spraying device, and the chromium electroforming device can be used to form a chromium reprint layer on the substrate. The integrated wide-format plate-making equipment according to claim 1, the integrated wide-format plate-making equipment further includes a dust-free chamber, and the optical table, the photoresist spraying device, the developing device, the The silver spraying device and the chromium electroforming device are arranged in the dust-free cavity. The integrated wide-format plate-making equipment according to claim 1, wherein the integrated wide-format plate-making equipment further includes a flushing device arranged at intervals on the optical table, and the flushing device can be used to flush the substrate. The integrated wide-format plate-making equipment according to claim 1, wherein the photoresist spraying device includes at least one first nozzle arranged at intervals on the optical table, and the silver spraying device includes at least one first nozzle arranged at intervals on the optical table At least one second nozzle of the optical table; wherein, at least one of the first nozzles can be used to spray the photoresist liquid, and at least one of the second nozzles can be used to spray the nano-silver solution. The integrated wide-format plate-making equipment according to claim 1, wherein the developing device includes a first liquid infusion part arranged at intervals on the optical table, and the chromium electroforming device includes a first liquid infusion member arranged at intervals on the optical table A second liquid infusion part of the optical table; wherein, the first liquid infusion part can be used to output a developing solution, and the second liquid infusion part can be used to output a chromium metal solution. The integrated wide-format plate-making equipment according to claim 4, the integrated wide-format plate-making equipment further includes a moving device connected to and capable of moving at least one of the first nozzles and at least one of the second nozzles. The integrated wide-width plate-making equipment according to claim 5, the integrated wide-width plate-making equipment further includes a moving device connected to and capable of moving the first liquid infusion part and the second liquid infusion part. The integrated wide-format plate-making equipment according to claim 1, wherein the optical table includes a plurality of shock-absorbing structures and a plurality of holes, and the plurality of holes can be used to absorb and fix the substrate. The integrated wide-format plate-making equipment according to claim 5, wherein, the developing device includes an accommodating part arranged at intervals in the first infusion part, and the substrate can be arranged in the accommodating part Among them; wherein, the first infusion part can be used to set the developer solution in the accommodating part and on the substrate. The integrated wide-format plate-making equipment according to claim 9, wherein the developing device includes a liquid draining part disposed on the accommodating part, and the liquid draining part can be used to drain the developing solution.

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